A quick-change wafer carrier structure

Abstract

This utility model discloses a quick-change wafer carrier structure, including a carrier body. A cavity for placing a wafer is provided on the top surface of the carrier body. The cavity is hollowed out on the bottom surface of the carrier body. Steps for fixing the wafer are provided within the cavity. The front side of the wafer, which is the surface to be coated, is positioned in the hollowed-out area of ​​the cavity via the steps. The back side of the wafer is placed on the top surface of the carrier body. This utility model avoids contamination of the wafer's surface to be coated.

Description

Technical Field

[0001] This utility model relates to the technical field of wafer carrier structure, specifically to a quick-change wafer carrier structure for atmospheric pressure CVD coating equipment. Background Technology

[0002] A wafer is a silicon wafer used to manufacture silicon semiconductor circuits. During the manufacturing process, a coating is applied to the surface of the wafer.

[0003] In the prior art, when coating a wafer, the wafer is usually placed in a carrier tray with the coating side facing upwards to facilitate coating. However, with the coating side facing upwards, particles or impurities may adhere to the coating surface of the wafer due to gravity, which can easily contaminate the surface of the wafer to be coated. Utility Model Content

[0004] To overcome the aforementioned problems, the purpose of this utility model is to provide a quick-change wafer carrier structure to avoid contamination of the wafer surface to be coated.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is: a quick-change wafer carrier structure, including a carrier body, a cavity for placing wafers is provided on the top surface of the carrier body, and the cavity is hollowed out on the bottom surface of the carrier body.

[0006] The cavity is provided with a stepped structure for fixing the wafer.

[0007] The front side of the wafer is the surface to be coated, and it is positioned in the hollow area of ​​the cavity via a stepped structure.

[0008] The back side of the wafer is placed on the top surface of the carrier disk body.

[0009] Preferably, the distance from the top surface of the step body to the top surface of the carrier disk body is the same as the thickness of the wafer.

[0010] Preferably, the back surface of the wafer is on the same horizontal plane as the top surface of the carrier disk body.

[0011] Preferably, the step body has a ring-shaped structure.

[0012] Preferably, the upper end of the carrier plate body is transferred to the next process simultaneously by vacuum adsorption using a heated suction cup, and the heated suction cup simultaneously heats the back side of the wafer.

[0013] Preferably, the back side of the wafer is in direct contact with the heating suction cup.

[0014] The beneficial effects of this utility model are: since the hollow part is located at the bottom of the cavity (carrier disk body), particles or impurities are prevented from adhering to the wafer surface to be coated due to gravity, thus avoiding contamination of the wafer surface to be coated. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this embodiment;

[0016] Figure 2 This is a schematic diagram of the structure of the carrier disk body in this embodiment.

[0017] In the figure: 1. Carrier disk body; 2. Wafer; 3. Cavity; 4. Stepped body; 5. Heating chuck. Detailed Implementation

[0018] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the scope of protection of the present invention.

[0019] See Figures 1-2 This embodiment discloses a quick-change wafer carrier structure, including a carrier body 1. The top surface of the carrier body 1 is provided with a plurality of cavities 3 for placing wafers 2. There are two or more cavities 3. The number of cavities 3 can be set according to the size of the wafers 2. This application does not limit this.

[0020] The cavity 3 is designed with a hollow shape on the bottom surface of the carrier body 1.

[0021] The cavity 3 is provided with a stepped body 4 for fixing and placing the wafer 2. The distance from the top surface of the stepped body 4 to the top surface of the carrier body 1 is the same as the thickness of the wafer 2.

[0022] The front side of the wafer 2 is the surface to be coated, and it is positioned in the hollow area of ​​the cavity 3 via the stepped body 4.

[0023] The back surface of the wafer 2 is on the same horizontal plane as the top surface of the carrier disk body 1.

[0024] The cavity 3 is actually a through hole with a stepped body 4. The front side (the side to be coated) of the wafer 2 is placed at the bottom, i.e. the hollow part, and the back side of the wafer 2 is placed on the top surface of the carrier body 1. This is exactly the opposite of the wafer 2 placement position in the prior art. The front side of the wafer 2 is facing down, which avoids contact with other objects and thus prevents particles or impurities from adhering to the wafer surface to be coated due to gravity.

[0025] In one embodiment, the step body 4 is a ring structure.

[0026] In one embodiment, the upper end of the carrier body 1 is transferred to the next process simultaneously by vacuum adsorption using a heating suction cup 5. The heating suction cup 5 simultaneously heats the back side of the wafer 2, and the back side of the wafer 2 is in direct contact with the heating suction cup 5. Direct contact results in better temperature uniformity, ensuring a better process environment and process requirements. Compared with the prior art where there is no direct contact (no cutout), the temperature uniformity is significantly improved.

[0027] This structure is mainly used to accommodate wafers of different specifications on the same device. When the required wafer size changes, only the corresponding carrier plate and cavity size need to be replaced, ensuring that a single device can be compatible with multiple wafer specifications without the need to switch parts.

[0028] The above embodiments are only for illustrating the technical concept and features of this utility model. Their purpose is to enable those skilled in the art to understand the content of this utility model and implement it. They cannot be used to limit the protection scope of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be covered within the protection scope of this utility model.

Claims

1. A quick-change wafer carrier structure, comprising a carrier body, wherein a cavity for placing wafers is provided on the top surface of the carrier body, characterized in that, The cavity is designed with a hollow shape on the bottom surface of the carrier disk body. The cavity is provided with a stepped structure for fixing the wafer. The front side of the wafer is the surface to be coated, and it is positioned in the hollow area of ​​the cavity via a stepped structure. The back side of the wafer is placed on the top surface of the carrier disk body; The distance from the top surface of the step body to the top surface of the carrier body is the same as the thickness of the wafer, and the back surface of the wafer is on the same horizontal plane as the top surface of the carrier body. The upper end of the carrier plate body is transferred to the next process simultaneously by vacuum adsorption using a heated suction cup. The heated suction cup simultaneously heats the back side of the wafer, and the back side of the wafer is in direct contact with the heated suction cup.

2. The quick-change wafer carrier structure according to claim 1, characterized in that, The step body has a ring-shaped structure.

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