A wafer PECVD coating equipment

Abstract

This utility model discloses a wafer PECVD coating equipment, relating to the field of wafer coating. The equipment includes a reaction chamber, with a rotating rod rotatably connected to the center of the inner wall of the chamber via a rotating sealed bearing. A tray is fixed to one end of the rotating rod inside the reaction chamber, and a heating module, which is a planar spiral-shaped electric heating wire, is fixed to the bottom surface of the tray's inner wall. This wafer PECVD coating equipment achieves the connection between the nozzle and the cover plate using a screw, threaded sleeve, and connecting plate, allowing the distance between the nozzle and the cover plate to be adjusted. This, in turn, enables the distance between the nozzle and the wafer carrier to be adjustable, thus allowing the equipment to adapt to coating operations on wafers of different sizes and to accommodate different reaction mechanisms.

Description

Technical Field

[0001] This utility model relates to the field of wafer coating, and more particularly to a wafer PECVD coating equipment. Background Technology

[0002] Chemical vapor deposition (CVD) of wafers forms a coating on the wafer surface using CVD equipment. This equipment includes a reaction chamber and a cover plate mounted on the reaction chamber. The cover plate has multiple spray heads connected to a gas delivery system. After the cover plate is closed to seal the reaction chamber, the spray heads spray a mixed gas onto the wafer surface. The wafer is supported by a tray in the reaction chamber and driven to rotate by a rotating component to ensure uniform spray coating. However, in traditional technology, the distance between the spray heads and the tray is difficult to adjust, making it incompatible with different reaction mechanisms and unable to adapt to coating operations on wafers of different sizes, greatly reducing the adaptability of the entire equipment. Utility Model Content

[0003] To overcome the shortcomings of existing technologies, the purpose of this invention is to provide a wafer PECVD coating equipment that can adjust the distance between the nozzle and the wafer carrier, thereby improving the equipment's adaptability.

[0004] To address the problems in the existing technology, the technical solution of this utility model is as follows:

[0005] A wafer PECVD coating equipment includes a reaction chamber, a cover plate hinged to the top surface of the reaction chamber, a plurality of nozzles distributed on the cover plate, the lower ends of the nozzles extending into the reaction chamber and connected to a nozzle through a hose, a lifting structure installed on the inner wall of the cover plate, the lifting structure being used to adjust the distance between the nozzle and the wafer carrier in the reaction chamber, and a main air inlet pipe connected to the top of the plurality of nozzles.

[0006] Optionally, the main intake pipe extends spirally along a central axis to form a continuous multi-turn planar spiral structure, wherein there is a constant radial spacing between adjacent layers, and several nozzles are distributed at equal intervals along the extension path of the main intake pipe.

[0007] Optionally, the lifting structure includes a connecting plate disposed below the cover plate, the connecting plate being slidably connected to the inner wall of the cover plate, and several nozzles being fixed on the connecting plate. A threaded sleeve is fixed in the middle of the connecting plate, and a screw is rotatably connected to the axis of the cover plate via a rotating sealed bearing. The lower end of the screw is threadedly connected to the threaded sleeve, and a second motor is fixed on the top surface of the cover plate. The upper end of the screw extends above the scraper and is fixed to the output end of the second motor.

[0008] Optionally, the length extension path of the connecting plate is the same as the length extension path of the main intake pipe. Two sliding rods are symmetrically fixed on the top surface of the connecting plate, and two sliding sleeves are symmetrically fixed on the inner wall of the cover plate. The upper end of the sliding rod is slidably inserted into the sliding sleeve.

[0009] Optionally, the outer wall of the slide rod has multiple protruding teeth at equal intervals from top to bottom, and a lever is slidably connected to the side wall of the slide sleeve through a sliding hole. The end of the lever near the protruding teeth is tapered, and a spring is sleeved on the end of the lever away from the protruding teeth. One end of the spring is fixed to the outer wall of the slide sleeve, and the other end is fixed to the outer wall of the lever.

[0010] Compared with the prior art, the advantages of this utility model are as follows:

[0011] 1. This utility model achieves the connection between the nozzle and the cover plate by using a screw, threaded sleeve and connecting plate on the cover plate, so that the distance between the nozzle and the cover plate can be adjusted, thereby achieving the effect of adjustable distance between the nozzle and the wafer carrier. This allows the equipment to adapt to the coating work of wafers of different sizes. When the wafer size changes, the distance can be adjusted to maintain the same gas flow field characteristics. It also allows the equipment to adapt to different reaction mechanisms. For example, surface reaction control process requires a longer gas residence time and is suitable for a larger distance, while mass transfer control process requires a high gas flow rate and is suitable for a smaller distance.

[0012] 2. This utility model, by setting convex teeth and actuating rods on the sliding sleeve and sliding rod, allows the connecting plate to move back and forth towards the cover plate repeatedly after the wafer coating is completed and the cover plate is opened. This causes the actuating rod and convex teeth to vibrate the connecting plate, which cleans the nozzle, peels off the early loose deposits on the nozzle, delays nozzle clogging, and extends the manual cleaning cycle. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0014] Figure 2 This is a schematic diagram showing the position of the second motor in this utility model.

[0015] Figure 3 This is a schematic diagram showing the position of the first motor of this utility model.

[0016] Figure 4 This is a schematic diagram of the internal structure of the reaction chamber of this utility model.

[0017] Figure 5 This is a schematic diagram of the internal structure of the cover plate of this utility model.

[0018] Figure 6 This is a schematic diagram of the threaded sleeve structure of this utility model.

[0019] Figure 7 This is a schematic diagram of the spring structure of this utility model.

[0020] Figure 8 This is a schematic diagram of the shape of the lever of this utility model.

[0021] Reference numerals: 1. Reaction chamber; 2. Rotating rod; 3. Tray; 4. Heating module; 5. Wafer carrier; 6. First motor; 7. Cover plate; 8. Nozzle; 9. Hose; 10. Nozzle head; 11. Main air inlet pipe; 12. Connecting plate; 13. Sliding rod; 14. Sliding sleeve; 15. Threaded sleeve; 16. Screw; 17. Second motor; 18. Convex tooth; 19. Actuating rod; 20. Spring. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0023] Please see Figures 1 to 8 This embodiment provides a wafer PECVD coating apparatus, including a reaction chamber 1. A rotating rod 2 is rotatably connected to the middle of the inner wall of the reaction chamber 1 via a rotating sealed bearing. A tray 3 is fixed to one end of the rotating rod 2 located inside the reaction chamber 1. A heating module 4, which is a planar spiral-shaped electric heating wire, is fixed to the bottom surface of the inner wall of the tray 3. A wafer carrier 5 is inserted into the tray 3. The wafer carrier 5 is provided with multiple mounting positions. During coating, the wafer is placed in the mounting positions. A first motor 6 is fixed to the bottom surface of the reaction chamber 1. The lower end is fixed to the output end of the first motor 6. During the coating process, the first motor 6 is driven to rotate, which in turn drives the rotating rod 2 to rotate, causing the wafer carrier 5 to rotate. This allows multiple wafers to be uniformly sprayed with mixed gas and uniformly coated. At the same time, the heating module 4 is driven to work to heat the wafers. Before the operation, a vacuum pump is used to connect to the pipeline on the side wall of the reaction chamber 1 to evacuate the reaction chamber 1. This entire process is a mature existing technology for wafer chemical vapor deposition equipment, so it will not be described in detail here.

[0024] A cover plate 7 is hinged to the top surface of the reaction chamber 1. Multiple nozzles 8 are distributed on the cover plate 7. The lower ends of the nozzles 8 extend into the reaction chamber 1 and are connected to nozzles 10 through hoses 9. The tops of the nozzles 8 are connected to a main air inlet pipe 11. The main body of the main air inlet pipe 11 extends spirally along the axis of the reaction chamber 1, forming a continuous multi-turn planar spiral structure. There is a constant radial spacing between adjacent layers. The nozzles 8 are evenly distributed along the extension path of the main air inlet pipe 11. The outlet of the mixed gas pumping equipment is connected to the inlet of the main air inlet pipe 11. Then, the mixed gas enters the reaction chamber 1 through the main air inlet pipe 11 and is sprayed onto the wafer surface for chemical vapor deposition. When performing deposition, the cover plate 7 needs to be improved. After the cover plate 7 is closed, it can be fixed by bolt connection to lock and seal the reaction chamber 1.

[0025] A connecting plate 12 is slidably connected below the cover plate 7. The length extension path of the connecting plate 12 is the same as the length extension path of the main intake pipe 11. Two sliding rods 13 are symmetrically fixed on the top surface of the connecting plate 12. Two sliding sleeves 14 are symmetrically fixed on the inner wall of the cover plate 7. The upper end of the sliding rod 13 is slidably inserted into the sliding sleeve 14. The sliding connection between the connecting plate 12 and the cover plate 7 is realized by the sliding rods 13 and the sliding sleeves 14, which limits the sliding direction of the connecting plate 12 and ensures that the connecting plate 12 can only slide vertically up and down after the cover plate 7 is closed.

[0026] Several nozzles 10 are fixed on the connecting plate 12. A threaded sleeve 15 is fixed in the middle of the connecting plate 12. A screw 16 is rotatably connected to the axis of the cover plate 7 through a rotating sealed bearing. The lower end of the screw 16 is threadedly connected to the threaded sleeve 15. A second motor 17 is fixed on the top surface of the cover plate 7. The upper end of the screw 16 extends above the scraper and is fixed to the output end of the second motor 17. When the wafer size or coating process changes, the distance between the nozzles 10 and the wafer carrier needs to be adjusted accordingly. During adjustment, the second motor 17 is driven to rotate, which drives the screw 16 to rotate. Thus, under the cooperation of the screw 16 and the threaded sleeve 15, the connecting plate 12 can be moved relative to the cover plate 7 to achieve the adjustment effect, thereby greatly improving the adaptability of the equipment.

[0027] Multiple protruding teeth 18 are formed at equal intervals from top to bottom on the outer wall of the slide rod 13. A lever 19 is slidably connected to the side wall of the slide sleeve 14 through a sliding hole. The end of the lever 19 near the protruding teeth 18 is tapered. A spring 20 is fitted onto the end of the lever 19 away from the protruding teeth 18. One end of the spring 20 is fixed to the outer wall of the slide sleeve 14, and the other end is fixed to the outer wall of the lever 19. After completing one coating operation and opening the cover plate 7, the second motor 17 is driven to operate, causing the screw 16 to rotate continuously back and forth. The connecting plate 12 can repeatedly move away from and towards the cover plate 7, causing the slide bar 13 to slide repeatedly within the sliding sleeve 14. The protrusion 18 pushes the actuating rod 19, and the actuating rod 19 continuously vibrates under the force of the spring 20. The vibration is transmitted to the connecting plate 12, which vibrates the nozzle 10. The vibration cleans the nozzle 10, peels off the early loose deposit layer on the nozzle 10, delays the clogging time of the nozzle 10, extends the manual cleaning cycle, and saves manpower.

[0028] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wafer PECVD coating equipment, comprising a reaction cavity (1), a cover plate (7) is hinged to the top surface of the reaction cavity (1), characterized in that, The cover plate (7) is provided with multiple nozzles (8). The lower end of the nozzles (8) extends into the reaction chamber (1) and is connected to the nozzle (10) through the hose (9). The inner wall of the cover plate (7) is equipped with a lifting structure, which is used to adjust the distance between the nozzle (10) and the wafer carrier (5) in the reaction chamber (1). The top of the nozzles (8) is connected to the main air inlet pipe (11).

2. The wafer PECVD coater of claim 1, wherein, The main intake pipe (11) extends along a central axis in a spiral pattern, forming a continuous multi-turn planar spiral structure, wherein there is a constant radial spacing between adjacent layers.

3. The wafer PECVD coater of claim 2, wherein, Several nozzles (8) are evenly distributed along the extension path of the main air intake (11).

4. The wafer PECVD coater of claim 3, wherein, The lifting structure includes a connecting plate (12) located below the cover plate (7). The connecting plate (12) is slidably connected to the inner wall of the cover plate (7), and several nozzles (10) are fixed on the connecting plate (12). A threaded sleeve (15) is fixed in the middle of the connecting plate (12). A screw (16) is rotatably connected to the axis of the cover plate (7) through a rotating sealed bearing. The lower end of the screw (16) is threadedly connected to the threaded sleeve (15). A second motor (17) is fixed on the top surface of the cover plate (7). The upper end of the screw (16) extends to the top of the scraper and is fixed to the output end of the second motor (17).

5. The wafer PECVD coater of claim 4, wherein, The length extension path of the connecting plate (12) is the same as the length extension path of the main intake pipe (11).

6. The wafer PECVD coater of claim 4, wherein, The top surface of the connecting plate (12) is symmetrically fixed with two sliding rods (13), and the inner wall of the cover plate (7) is symmetrically fixed with two sliding sleeves (14). The upper end of the sliding rod (13) is slidably inserted into the sliding sleeve (14).

7. The wafer PECVD coater of claim 6, wherein, The outer wall of the slide rod (13) has multiple protruding teeth (18) at equal intervals from top to bottom. The side wall of the slide sleeve (14) is slidably connected to a lever (19) through a sliding hole. The end of the lever (19) near the protruding teeth (18) is tapered. The end of the lever (19) away from the protruding teeth (18) is fitted with a spring (20). One end of the spring (20) is fixed to the outer wall of the slide sleeve (14), and the other end is fixed to the outer wall of the lever (19).

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