An integrated high-efficiency fluid jet device

Abstract

This utility model discloses an integrated high-efficiency fluid jetting device, including an electroplating tank. A pipe is arranged inside the electroplating tank, and high-pressure nozzles are evenly arranged on one side of the pipe. An electroplating pump is installed at one end of the electroplating tank, and the output end of the electroplating pump is connected to the pipe. An inclined jetting mechanism is provided at one end of the high-pressure nozzle. The jetting mechanism includes a suction chamber detachably disposed at one end of the high-pressure nozzle, a suction hole on the side of the suction chamber, and a mixing chamber disposed away from the high-pressure nozzle. This integrated high-efficiency fluid jetting device, through its jetting mechanism, can create a negative pressure effect during the electroplating pump's jetting process. It actively draws in surrounding plating solution through the suction hole, performs turbulent mixing in the mixing chamber, and then decelerates and pressurizes through a diffuser for uniform output. This significantly enhances the exchange and renewal capacity of the plating solution in deep holes, effectively avoiding hole breakage defects caused by bubble retention.

Description

Technical Field

[0001] This utility model relates to the field of electroplating technology, and in particular to an integrated high-efficiency fluid jetting device. Background Technology

[0002] The fluid agitation technologies commonly used in existing electroplating operations mainly include two methods: one is the aeration agitation method, which involves immersing the anode titanium basket and the cathode PCB board into the electroplating bath, and then agitating upwards by connecting an aeration pipe to the bottom of the bath, combined with the horizontal swaying of the cathode PCB board, to promote the exchange of electroplating solution in the holes; the other is the jetting method, which uses a pump to spray the electroplating solution from nozzles arranged on both sides of the PCB board to achieve the flow and renewal of the solution in the holes and on the board surface.

[0003] However, the aforementioned existing technologies have obvious drawbacks. When processing PCBs with high aspect ratios (AR≥10:1), the air-aeration stirring method significantly reduces the exchange capacity of the chemical solution within the holes, resulting in poor filling effect. At the same time, air bubbles generated during the air-aeration process are easily trapped in the through holes, leading to hole breakage defects in copper plating. Furthermore, the large amount of air mixed in will accelerate the consumption of electroplating additives, increasing production costs. The jetting method, on the other hand, has limited jetting pressure, making it difficult to meet the electroplating requirements of high aspect ratio products. In addition, uneven jetting coverage can easily lead to inconsistent copper thickness distribution within the holes, posing a quality risk of insufficient copper in some holes.

[0004] Therefore, it is necessary to propose an integrated, high-efficiency fluid jetting device to solve the above problems. Utility Model Content

[0005] The main objective of this invention is to provide an integrated, high-efficiency fluid jetting device that can effectively solve the problems in the background art.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is as follows: An integrated high-efficiency fluid jetting device includes an electroplating tank with a pipe inside. High-pressure nozzles are uniformly arranged on one side of the pipe. An electroplating pump is installed at one end of the electroplating tank, and the output end of the electroplating pump is connected to the pipe. An inclined jetting mechanism is provided at one end of the high-pressure nozzle. The jetting mechanism includes a suction chamber detachably disposed at one end of the high-pressure nozzle. A suction hole is provided on the side of the suction chamber. A mixing chamber is disposed at the end of the suction chamber away from the high-pressure nozzle. A diffuser is disposed at the end of the mixing chamber away from the suction chamber. The diffuser is conical, with the inner diameter of the diffuser near the mixing chamber being the same as the inner diameter of the mixing chamber, and the inner diameter of the diffuser away from the mixing chamber being larger than the inner diameter of the mixing chamber.

[0007] Preferably, the diffusion angle of the diffuser is eleven degrees.

[0008] Preferably, the distance between the spraying mechanism and the bottom wall of the inner cavity of the electroplating tank is 100-150mm.

[0009] Preferably, the end of the pipe is provided with an adjustment mechanism, the adjustment mechanism including a first sleeve disposed at both ends of the inner cavity of the electroplating tank, both ends of the pipe being closed and movably connected to the inner side of the first sleeve, a guide block being provided on the side wall of the end of the pipe, a spiral guide groove being provided on the inner wall of the first sleeve, the guide block being movably connected to the inner side of the guide groove, and a drive source for driving the displacement of the pipe being installed on one side of the electroplating tank, and the output shaft of the drive source being rotatably connected to the end of the pipe.

[0010] Preferably, the drive source is a cylinder, and the output shaft of the drive source extends to the inner side of the first sleeve and is rotatably connected to the end of the pipe through a bearing.

[0011] Preferably, the output end of the electroplating pump is connected to the pipeline via a movable component. The movable component includes a connecting pipe disposed at the output end of the electroplating pump. A second sleeve is movably sealed on the outside of the pipeline. The connecting pipe is connected to the second sleeve. A sector-shaped groove corresponding to the second sleeve is disposed on one side of the pipeline, and the sector-shaped groove is connected to the connecting pipe.

[0012] Preferably, a bracket is provided on the side of the inhalation chamber, and a blind hole is provided at one end of the bracket near the inhalation chamber. A floating pin is movably provided inside the blind hole, and an elastic element is provided between one end of the floating pin and the inner wall of the blind hole. A lever is provided on one side of the floating pin, and a through groove corresponding to the lever is provided on one side of the bracket. One end of the lever extends outward through the through groove.

[0013] Compared with the prior art, this utility model provides an integrated high-efficiency fluid injection device, which has the following beneficial effects: 1. This integrated high-efficiency fluid jetting device consists of a diffuser, mixing chamber, suction chamber, and suction port. During the jetting process, the electroplating pump creates a negative pressure effect, actively drawing in the surrounding plating solution through the suction port. The solution undergoes turbulent mixing in the mixing chamber and is then decelerated and pressurized by the diffuser for uniform output. This significantly enhances the exchange and renewal capacity of the plating solution in deep holes, effectively avoiding hole breakage defects caused by air bubble retention. At the same time, the inclined setting reduces air bubbles adhering to the board surface. Its optimized fluid design and directional arrangement ensure that the solution can stably and uniformly cover the entire board surface, solving the problems of uneven electroplating and insufficient filling of high aspect ratio through holes. It also reduces the additional consumption of additives caused by air mixing, improving electroplating quality and production efficiency.

[0014] 2. This integrated high-efficiency fluid jetting device, through the set adjustment mechanism, can realize the axial reciprocating and swinging of the pipeline during the electroplating process. This not only improves the uniformity of the jetting and makes up for the gap between adjacent jetting mechanisms, but also reduces the adhesion of air bubbles to the plate surface due to the tilted swing, thus achieving uniform coverage. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a schematic diagram of the structure of the pipeline of this utility model; Figure 3 This is a structural diagram of one end of the pipe and the first sleeve of this utility model in a disassembled state; Figure 4 This is a cross-sectional structural diagram of the connection between the second sleeve and the pipeline of this utility model; Figure 5 This is a schematic diagram of the spraying mechanism of this utility model; Figure 6 This is a structural diagram of the floating pin and bracket of this utility model in their disassembled state.

[0016] In the diagram: 1. Electroplating tank; 2. Pipe; 3. Drive source; 4. Electroplating pump; 5. First sleeve; 6. Suction port; 7. High-pressure nozzle; 8. Connecting pipe; 9. Second sleeve; 10. Guide block; 11. Through hole; 12. Guide groove; 13. Fan-shaped groove; 14. Suction chamber; 15. Diffuser; 16. Mixing chamber; 17. Blind hole; 18. Through groove; 19. Elastic element; 20. Floating pin; 21. Lever; 22. Bracket. Detailed Implementation

[0017] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0018] like Figure 1-6As shown, an integrated high-efficiency fluid jetting device includes an electroplating tank 1, a pipe 2 arranged inside the electroplating tank 1, and high-pressure nozzles 7 evenly arranged on one side of the pipe 2. The inlet diameter of the high-pressure nozzles 7 is 3-5mm, the outlet diameter is 1-2mm, and the contraction ratio is 1:3-1:5. An electroplating pump 4 is installed at one end of the electroplating tank 1. The high-pressure nozzles 7 adopt a tapered design to reduce fluid resistance and lower the energy consumption of the electroplating pump 4. The output end of the electroplating pump 4 is connected to the pipe 2. An inclined jetting mechanism is provided at one end of the high-pressure nozzles 7. The jetting mechanism is evenly distributed along the length of the pipe 2 with a spacing of 200-600mm. The distance between the jetting mechanism and the bottom wall of the inner cavity of the electroplating tank 1 is 100-150mm to avoid agitating the bottom of the tank. The sediment injection mechanism includes a suction chamber 14 detachably mounted at one end of the high-pressure nozzle 7, with a diameter of 10-15 mm and a length of 15-20 mm. A suction hole 6 is provided on the side of the suction chamber 14. A mixing chamber 16 is provided at the end of the suction chamber 14 away from the high-pressure nozzle 7. The mixing chamber 16 has a diameter of 5-7 mm and a length of 25-35 mm, with a smooth inner wall to reduce turbulence loss. A diffuser 15 is provided at the end of the mixing chamber 16 away from the suction chamber 14. The diffuser 15 is conical. The inner diameter of the diffuser 15 at the end near the mixing chamber 16 is the same as the inner diameter of the mixing chamber 16, while the inner diameter of the diffuser 15 at the end away from the mixing chamber 16 is larger than the inner diameter of the mixing chamber 16. The outlet diameter is 10-15 mm, and the diffusion angle is 11°.

[0019] Furthermore, to improve spray uniformity and efficiency, an adjustment mechanism is provided at the end of the pipe 2. The adjustment mechanism includes a first sleeve 5 disposed at both ends of the inner cavity of the electroplating tank 1. Both ends of the pipe 2 are closed, and both ends of the pipe 2 are movably connected to the inner side of the first sleeve 5. A guide block 10 is provided on the side wall of the end of the pipe 2, and a spiral guide groove 12 is provided on the inner wall of the first sleeve 5. The guide block 10 is movably connected to the inner side of the guide groove 12. A drive source 3 for driving the displacement of the pipe 2 is installed on one side of the electroplating tank 1, and the output shaft of the drive source 3 is connected to the end of the pipe 2. Specifically, the driving source 3 is preferably a cylinder. The output shaft of the driving source 3 extends to the inner side of the first sleeve 5 and is rotatably connected to the end of the pipe 2 through a bearing. In order to accommodate the rotation and swing of the pipe 2, the output end of the electroplating pump 4 is connected to the pipe 2 through a movable component. The movable component includes a connecting pipe 8 set at the output end of the electroplating pump 4. The outer side of the pipe 2 is movably sealed with a second sleeve 9. The connecting pipe 8 is connected to the second sleeve 9. A sector groove 13 corresponding to the second sleeve 9 is provided on one side of the pipe 2, and the sector groove 13 is connected to the connecting pipe 8.

[0020] In addition, to increase the stability of the connection between the suction chamber 14 and the high-pressure nozzle 7, a bracket 22 is provided on the side of the suction chamber 14. A blind hole 17 is provided at one end of the bracket 22 near the suction chamber 14. A floating pin 20 is movably provided inside the blind hole 17. An elastic element 19 is provided between one end of the floating pin 20 and the inner wall of the blind hole 17. The elastic element 19 is preferably a spring. A lever 21 is provided on one side of the floating pin 20. A through groove 18 corresponding to the lever 21 is provided on one side of the bracket 22. One end of the lever 21 extends outward through the through groove 18.

[0021] During use, the high-pressure plating solution is sprayed out at high speed from the high-pressure nozzle 7, forming a negative pressure in the suction chamber 14. The surrounding plating solution is drawn in through the suction hole 6 and then mixed turbulently in the mixing chamber 16. The solution is decelerated and pressurized by the diffuser 15 and sprayed evenly onto the PCB surface at a distance of 100-200mm. During this process, the drive source 3 reciprocates to drive the axial displacement of the pipe 2, thereby causing the diffuser 15 to move back and forth to fill the gap. Under the action of the guide block 10 and the guide groove 12, the pipe 2 can swing up and down when it moves back and forth, thereby realizing the up and down swing of the diffuser 15 and increasing the coverage area. Since the second sleeve 9 is in a movable sealing fit with the pipe 2, the fan-shaped groove 13 can always be connected to the connecting pipe 8 when the pipe 2 is axially displaced and swings.

[0022] In addition, to increase the stability of the connection between the suction chamber 14 and the high-pressure nozzle 7, when the suction chamber 14 and the high-pressure nozzle 7 are connected, the lever 21 is moved to hide the floating pin 20 and the elastic element 19 is compressed. After the suction chamber 14 is connected to the electroplating pump 4, the lever 21 is released. At this time, one end of the floating pin 20 will abut against one end of the high-pressure nozzle 7. Under the action of the reverse force of the elastic element 19, the possibility of the suction chamber 14 and the high-pressure nozzle 7 becoming loose can be reduced.

[0023] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. An integrated high efficiency fluid jetting device comprising an electroplating bath (1), characterized in that: The electroplating tank (1) is provided with a pipe (2) inside. A high-pressure nozzle (7) is uniformly arranged on one side of the pipe (2). An electroplating pump (4) is installed at one end of the electroplating tank (1). The output end of the electroplating pump (4) is connected to the pipe (2). A spraying mechanism is provided at one end of the high-pressure nozzle (7). The spraying mechanism includes a suction chamber (14) detachably arranged at one end of the high-pressure nozzle (7). A suction hole (6) is provided on the side of the suction chamber (14). A mixing chamber (16) is provided away from the high-pressure nozzle (7) in the suction chamber (14). A diffuser (15) is provided at the end of the mixing chamber (16) away from the suction chamber (14). The diffuser (15) is conical. The inner diameter of the diffuser (15) near the mixing chamber (16) is the same as the inner diameter of the mixing chamber (16). The inner diameter of the diffuser (15) away from the mixing chamber (16) is larger than the inner diameter of the mixing chamber (16).

2. The integrated high efficiency fluid ejection device of claim 1, wherein: The diffusion angle of the diffuser (15) is eleven degrees.

3. The integrated high efficiency fluid ejection device of claim 1, wherein: The distance between the spraying mechanism and the bottom wall of the inner cavity of the electroplating tank (1) is 100-150mm.

4. The integrated high efficiency fluid ejection device of claim 1, wherein: The end of the pipe (2) is provided with an adjustment mechanism. The adjustment mechanism includes a first sleeve (5) disposed at both ends of the inner cavity of the electroplating tank (1). The two ends of the pipe (2) are closed, and the two ends of the pipe (2) are movably connected to the inner side of the first sleeve (5). The end side wall of the pipe (2) is provided with a guide block (10). The inner wall of the first sleeve (5) is provided with a spiral guide groove (12). The guide block (10) is movably connected to the inner side of the guide groove (12). A drive source (3) for driving the displacement of the pipe (2) is installed on one side of the electroplating tank (1), and the output shaft of the drive source (3) is rotatably connected to the end of the pipe (2).

5. The integrated high efficiency fluid ejection device of claim 4, wherein: The drive source (3) is a cylinder, and the output shaft of the drive source (3) extends to the inner side of the first sleeve (5) and is rotatably connected to the end of the pipe (2) through a bearing.

6. The integrated high-efficiency fluid jetting device according to claim 4, characterized in that: The output end of the electroplating pump (4) is connected to the pipe (2) through a movable component. The movable component includes a connecting pipe (8) disposed at the output end of the electroplating pump (4). A second sleeve (9) is movably sealed on the outside of the pipe (2). The connecting pipe (8) is connected to the second sleeve (9). A fan-shaped groove (13) corresponding to the second sleeve (9) is provided on one side of the pipe (2), and the fan-shaped groove (13) is connected to the connecting pipe (8).

7. The integrated high efficiency fluid ejection device of claim 1, wherein: A bracket (22) is provided on the side of the inhalation chamber (14). A blind hole (17) is provided at one end of the bracket (22) near the inhalation chamber (14). A floating pin (20) is movably provided on the inner side of the blind hole (17). An elastic element (19) is provided between one end of the floating pin (20) and the inner wall of the blind hole (17). A lever (21) is provided on one side of the floating pin (20). A through groove (18) corresponding to the lever (21) is provided on one side of the bracket (22). One end of the lever (21) extends outward through the through groove (18).

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