Light source device

Abstract

This application relates to a light source device, which includes an LED light source. The LED light source includes multiple LED units, and each LED unit includes a substrate, an LED chip, a first phosphor layer, a reflector cup, and a second phosphor layer. The LED chip is disposed on the substrate, and the first phosphor layer is disposed on the light-emitting surface of the LED chip. The reflector cup includes a reflector cup and a second phosphor layer. The reflector cup is disposed on the substrate and surrounds the LED chip to form a reflective cavity. The second phosphor layer is disposed on the side of the reflector cup facing the reflective cavity. The density of the first phosphor layer is greater than the density of the second phosphor layer. The above-mentioned light source device effectively solves the "yellow ring problem," reduces color tolerance, and optimizes color consistency.

Description

Technical Field

[0001] This application relates to the field of light source technology, and in particular to a light source device. Background Technology

[0002] Stage LED light sources refer to light-emitting diode systems specifically designed for stage lighting. They achieve artistic lighting effects through multispectral synthesis and dynamic control, replacing traditional halogen / discharge lamps. Currently, LED light sources in stage lighting fixtures generally use traditional packaging structures, typically involving coating a phosphor layer onto a chip before encapsulation. This type of LED light source in stage lighting fixtures generally suffers from uneven light mixing when achieving colored lighting effects, causing ring-shaped color spots in the emitted light, known in the industry as the "yellow ring effect," which negatively impacts the stage's visual appeal. Utility Model Content

[0003] This application provides a light source device, including an LED light source. The LED light source includes multiple LED units. Each LED unit includes a substrate, an LED chip, a first phosphor layer, a reflector cup, and a second phosphor layer. The LED chip is disposed on the substrate, and the first phosphor layer is disposed on the light-emitting surface of the LED chip. The reflector cup includes a reflector cup and a second phosphor layer. The reflector cup is disposed on the substrate and surrounds the LED chip to form a reflective cavity. The second phosphor layer is disposed on the side of the reflector cup facing the reflective cavity. The density of the first phosphor layer is greater than the density of the second phosphor layer.

[0004] In some alternative embodiments, the reflective cavity has opposing light inlet and light outlet, the light inlet being adjacent to the substrate, and the inner diameter of the reflective cavity increasing in the direction from the light inlet to the light outlet.

[0005] In some optional embodiments, the reflective cavity is filled with an encapsulating light guide colloid, the refractive index of which is greater than or equal to 1.5; a third phosphor layer is provided on the side of the encapsulating light guide colloid away from the LED chip, and the density of the third phosphor layer is equal to the density of the second phosphor layer.

[0006] In some alternative embodiments, the reflectivity of the reflector cup is greater than or equal to 95%, and the reflector cup includes any of the following structures: ceramic reflector cup, polycarbonate-silicone hybrid reflector cup.

[0007] In some alternative embodiments, multiple LED chips are connected one-to-one to multiple substrates, and multiple substrates are arranged in an array. Adjacent substrates are connected by thermally conductive adhesive; the substrate is an aluminum nitride ceramic copper-clad substrate.

[0008] In some alternative embodiments, the thickness of the first fluorescent layer is greater than the thickness of the second fluorescent layer; the thickness of the first fluorescent layer is greater than or equal to 19 μm and less than or equal to 25 μm, and the thickness of the second fluorescent layer is greater than or equal to 7 μm and less than or equal to 11 μm.

[0009] In some alternative embodiments, the light source device further includes a collecting lens group disposed on the light-emitting side of the LED light source, the collecting lens group being used to limit the maximum divergence angle of the light beam emitted by the LED light source to less than or equal to 60°.

[0010] In some alternative embodiments, the collecting lens group includes a first collecting lens, which includes a plurality of first lens units arranged in an array spaced apart from each other, and the plurality of first lens units are arranged in a one-to-one correspondence with a plurality of LED chips.

[0011] In some alternative embodiments, the collecting lens group further includes a second collecting lens, which is disposed on the light-emitting side of the first collecting lens. The second collecting lens includes a plurality of second lens units, which are integrally formed and connected.

[0012] In some alternative embodiments, the light source device further includes a converging lens disposed on the light-emitting side of the collecting lens group.

[0013] Compared to existing technologies, in the light-emitting device provided in this application embodiment, during the light-emitting process, the LED chip emits light, most of which directly excites the first phosphor layer to produce the desired color light. A portion of the light emitted by the LED chip illuminates the inner wall of the reflector cup, exciting the second phosphor layer to produce light. The density of the first phosphor layer on the surface of the LED chip is greater than the density of the second phosphor layer surrounding the LED chip. The light-emitting device provided in this application embodiment utilizes a portion of the light directly emitted by the LED chip to excite both the first and second phosphor layers. The light generated by the second phosphor layer is reflected by the reflector cup and then emitted again through the second phosphor layer, resulting in light mixing within the reflector cup to improve the light spot effect, effectively solving the "yellow ring problem," reducing color tolerance, and optimizing color consistency. Attached Figure Description

[0014] To more clearly illustrate the technical solution of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the structure of a light source device provided in an embodiment of this application.

[0016] Figure 2 yes Figure 1 A simplified structural diagram of the LED unit of the LED light source in the light source device shown.

[0017] Figure 3 yes Figure 2The diagram shows a simplified cross-sectional structure of the LED unit.

[0018] Figure 4 yes Figure 2 The diagram shows a simplified cross-sectional structure of the LED unit used to illustrate the encapsulated light guide colloid.

[0019] Figure 5 yes Figure 1 A simplified structural diagram of the LED light source of the light source device shown.

[0020] Labeling Explanation: 100, Light Source Device; 101, LED Light Source; 1012, LED Unit; 10, Substrate; 30, LED Chip; 34, First Phosphor Layer; 52, Reflector Cup; 521, Reflector Cavity; 5212, Light Inlet; 5214, Light Outlet; 54, Second Phosphor Layer; 56, Encapsulating Light Guide Glue; 561, Third Phosphor Layer; 70, Collecting Lens Group; 72, First Collecting Lens; 721, First Lens Unit; 74, Second Collecting Lens; 741, Second Lens Unit; 90, Converging Lens. Detailed Implementation

[0021] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of the present application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without creative effort are within the scope of protection of the present application.

[0022] If certain terms are used in the specification and claims to refer to specific components, those skilled in the art will understand that hardware manufacturers may use different names to refer to the same component. The specification and claims do not distinguish components based on differences in name, but rather on differences in function. For example, the term "comprising" used throughout the specification and claims is an open-ended term and should be interpreted as "including but not limited to"; "generally" means that those skilled in the art can solve the technical problem and basically achieve the technical effect within a certain margin of error.

[0023] Please also refer to the diagram. Figure 1 and Figure 2 This application provides a light source device 100, which can be applied to the stage lighting market. This specification does not limit the specific application type of the light source device 100; for example, it can be applied to lighting equipment such as stage imaging lights, spotlights, and photographic lights.

[0024] In this embodiment, the light source device 100 may include an LED light source 101, which may include multiple LED units 1012. Each LED unit 1012 may include a substrate 10, an LED chip 30, a first phosphor layer 34, a reflector cup 52, and a second phosphor layer 54. The LED chip 30 is disposed on the substrate 10, and the first phosphor layer 34 is disposed on the light-emitting surface of the LED chip 30. The reflector cup 52 is disposed on the substrate 10 and surrounds the LED chip 30 to form a reflective cavity 521. The second phosphor layer 54 is disposed on the side of the reflector cup 52 facing the reflective cavity 521. The density of the first phosphor layer 34 is greater than the density of the second phosphor layer 54. The "density" of the first phosphor layer 34 can be understood as the content of phosphor in the first phosphor layer 34, or as the thickness of the phosphor in the first phosphor layer 34; similarly, the "density" of the second phosphor layer 54 can be understood as the content of phosphor in the second phosphor layer 54, or as the thickness of the phosphor in the second phosphor layer 54.

[0025] During the light emission process of the light source device 100 provided in this application embodiment, the LED chip 30 emits light. The first phosphor layer 34 receives the excitation light emitted by the LED chip 30 and converts it to generate a laser beam. The unexcited excitation light and the laser beam are emitted together through the first phosphor layer 34. At this time, the unexcited excitation light and the laser beam reach the inner wall of the reflector cup 52. The density of the first phosphor layer 34 is greater than the density of the second phosphor layer 54. At this time, the excitation light continues to excite the second phosphor layer 54 and emits a laser beam. The light source device 100 provided in this application embodiment uses part of the light emitted directly from the LED chip 30 to excite the first phosphor layer 34 and the second phosphor layer 54. The light generated by the excitation of the second phosphor layer 54 is reflected by the reflector cup 52 and then emitted again through the second phosphor layer 54. The light emitted from the side of the LED chip 30 excites the second phosphor layer 54 on the inner wall of the reflector cup 53 to generate a laser beam, which compensates for the uneven light spot phenomenon of the emitted light of traditional light source devices, achieves the effect of improving the light spot, effectively solves the "yellow ring problem", reduces color tolerance, and optimizes color consistency.

[0026] In this embodiment, the substrate 10 is used to support the LED chip 30, which can dissipate heat and conduct heat to protect the LED chip 30. The substrate 10 may include a thermally conductive layer, an insulating layer, and a circuit layer. The thermally conductive layer may be made of an aluminum plate or a copper plate with good thermal conductivity. The insulating layer may be made of a polymer filled with special ceramics, responsible for heat conduction and insulation. The circuit layer may be a copper foil layer, in which copper foil is etched to form printed circuits, connecting the various components of each element to each other. This specification does not limit the specific type of substrate 10. For example, the substrate 10 may be a metal substrate with good thermal conductivity, such as a copper substrate or an aluminum substrate, or it may be a ceramic substrate or a composite substrate of a ceramic substrate and a metal substrate. In this embodiment, the substrate 10 uses a high thermal conductivity aluminum nitride ceramic copper-clad substrate (thermal conductivity ≈ 170 W / m·K), which has good heat dissipation performance.

[0027] LED chip 30 is disposed on substrate 10 and is used to emit light beam. LED chip 30 is fixed on substrate 10, and the side of LED chip 30 facing away from substrate 10 is the light-emitting surface. This specification does not limit the specific connection structure between LED chip 30 and substrate 10. The connection structure between LED chip 30 and substrate 10 may include any of the following structures: solder paste bonding structure, insulating adhesive bonding structure, and eutectic bonding structure.

[0028] Please also refer to Figure 2 and Figure 3 The first phosphor layer 34 is disposed on the light-emitting surface of the LED chip 30 and is used to convert the light emitted by the LED chip 30. This specification does not limit the specific structure of the first phosphor layer 34; the first phosphor layer 34 may include any of the following structures: a phosphor adhesive layer, a phosphor layer, a silicone phosphor film, a glass phosphor sheet, or a ceramic phosphor sheet. The phosphor adhesive layer can be coated on the light-emitting surface of the LED chip 30, the silicone phosphor film can be adhered to the light-emitting surface of the LED chip 30, the phosphor layer can be coated on the light-emitting surface of the LED chip 30 by powder spraying, and the glass phosphor sheet or ceramic phosphor sheet can be connected to the light-emitting surface of the LED chip 30 by bonding or encapsulation.

[0029] The color of the light emitted by the LED chip 30 is obtained by exciting the first phosphor layer 34 with the excitation light emitted by the LED chip 30. The LED chip 30 can be a blue LED chip, and the first phosphor layer 34 can be a yttrium aluminum garnet (YAG) yellow phosphor. By covering the blue LED chip with a layer of yellow phosphor, the emitted light of the LED light source is made to be white light.

[0030] In this embodiment, a reflector cup 52 is also disposed on the substrate 10 and surrounds the LED chip 30. The reflector cup 52 is used to reflect and converge the light emitted by the LED chip 30, reducing lateral light loss. A reflector cavity 521 is formed in the recess of the reflector cup 52. The reflector cavity 521 has an opposing light inlet 5212 and a light outlet 5214. The light inlet 5212 is adjacent to the substrate 10. The inner diameter of the reflector cavity 521 increases from the light inlet 5212 to the light outlet 5214. The reflector cup 52 is generally bowl-shaped. This specification does not limit the specific shape of the reflective surface of the reflector cup 52. For example, the reflective surface of the reflector cup 52 can be parabolic, spherical, or elliptical. In some embodiments, the cross-section of the reflective surface of the reflector cup 52 along the light emission direction can also be trapezoidal. The reflector cup 52 is connected to one end of the substrate 10 (the end of the reflector cup 52 near the light inlet 5212) as the bottom, and the other end (the end of the reflector cup 52 near the light outlet 5214) is a circular opening. The bottom of the reflector cup 52 can be provided with mounting holes and fixing structures for mounting the LED chip 30. The reflector cup 52 surrounds the LED chip 30, collects the light emitted from the side of the LED chip 30, improves light utilization, and directs and concentrates the light emitted by the LED chip 30 through concave reflection, thereby increasing the illumination distance.

[0031] In this embodiment, the reflective surface of the reflector cup 52 is parabolic or its cross-section along the light emission direction is trapezoidal, so as to concentrate and reflect the light emitted by the LED chip 30 directly upward (directly upward is understood as the open end of the reflector cup 52), thereby reducing lateral light loss. This specification does not limit the specific dimensions of the reflector cup 52. As an example, the height of the reflector cup 52 can be greater than or equal to 0.4 mm and less than or equal to 0.6 mm. For example, the height of the reflector cup 52 can be 0.4 mm, 0.45 mm, 0.5 mm, 0.55 mm, 0.6 mm, etc. The height of the reflector cup 52 is understood as the vertical distance from the bottom of the reflector cup 52 (the end where the LED chip 30 is mounted) to the edge of the top opening. The tilt angle of the reflector cup 52 can be greater than or equal to 40° and less than or equal to 50°. For example, the tilt angle of the reflector cup 52 can be 40°, 41°, 42°, 43°, 44°, 45°, 46°, 47°, 48°, 49°, 50°, etc. Here, the tilt angle of the reflector cup 52 is understood as the inclination angle of the sidewall of the reflector cup 52, that is, the angle between the sidewall of the reflector cup 52 and the central axis. In this embodiment, the height of the reflector cup 52 can be 0.5mm, and the tilt angle of the reflector cup 52 can be 45° to ensure good directional light focusing effect.

[0032] The LED chip 30 is disposed at the bottom of the reflector cup 52, which surrounds the LED chip 30. This specification does not limit the specific material of the reflector cup 52; as an example, the reflector cup 52 may include any of the following structures: a ceramic reflector cup, or a polycarbonate-silicone hybrid reflector cup. In this embodiment, the reflectivity of the reflector cup 52 is greater than or equal to 95%, significantly reducing light loss, stray light, and making the light more concentrated. The light source device 100 provided in this application reduces lateral light leakage through the reflector cup 52; testing has verified that the light extraction efficiency can be improved by 15%-20%.

[0033] The second fluorescent layer 54 is disposed on the side of the reflector 52 facing the reflector cavity 521, that is, on the inner wall of the reflector 52. It is used to absorb the laser light that has not been converted by the first fluorescent layer and convert it into emitted fluorescence. This specification does not limit the specific type of the second fluorescent layer 54. The second fluorescent layer 54 may include any of the following structures: a fluorescent adhesive layer, a phosphor layer, a silicone fluorescent film, a glass phosphor sheet, or a ceramic phosphor sheet. The fluorescent adhesive layer can be coated on the inner wall of the reflector 52, the silicone fluorescent film can be adhered to the inner wall of the reflector 52, the phosphor layer can be coated on the inner wall of the reflector 52 by powder spraying, and the glass phosphor sheet or ceramic phosphor sheet can be attached to the inner wall of the reflector 52 by bonding or encapsulation.

[0034] This specification does not limit the fluorescence produced by the second fluorescent layer 54. For example, the fluorescence produced by the second fluorescent layer 54 can be the same color as the fluorescence produced by the first fluorescent layer 34, that is, the second fluorescent layer 54 can also be a yellow fluorescent layer. When the fluorescence emitted by the second fluorescent layer 54 and the first fluorescent layer 34 is the same color, the phosphor content of the second fluorescent layer 54 is less than that of the first fluorescent layer 34, or the thickness of the second fluorescent layer 54 is less than that of the first fluorescent layer 34. In this case, the second fluorescent layer can solve the problem of uneven light spot emitted by the light source device. The excitation light generated by the laser excitation of the first fluorescent layer 34 further excites the second fluorescent layer 54 and generates excitation light. In other embodiments, the fluorescence generated by the second fluorescent layer 54 may also be different in color from the fluorescence generated by the first fluorescent layer 34. When the fluorescence emitted by the second fluorescent layer 54 is different from that of the first fluorescent layer 34, the content of phosphor in the second fluorescent layer 54 is less than that in the first fluorescent layer 34, or the thickness of the second fluorescent layer 54 is less than that in the first fluorescent layer 34. The excitation light generated by the laser excitation of the first fluorescent layer 34 continues to excite the second fluorescent layer 54 and generate excitation light. At this time, the second fluorescent layer can solve the problem of uneven color of the emitted light from the light source device.

[0035] As an example, the second fluorescent layer 54 is also a yellow fluorescent layer. The thickness of the first fluorescent layer 34 is greater than that of the second fluorescent layer 54. The first fluorescent layer 34 absorbs more blue light emitted by the LED chip 30 and converts it into yellow light, resulting in poor uniformity of the light spot emitted through the first fluorescent layer, i.e., the edges are bluish. The second fluorescent layer 54 is thinner, and it can absorb the blue light that has not been converted by the first fluorescent layer and convert it into emitted yellow light to compensate for the problem of the light spot edges being bluish. The light source device 100 provided in this application collects the blue light that is leaked from the side of the LED chip 30 through the reflector cup 52. After this part of the light is collected by the reflector cup 52, it excites the second fluorescent layer 54 on the inner wall of the reflector cup 52, which excites the emitted yellow light to compensate for the phenomenon of the light spot edges being bluish in the previous light source device, thereby improving the uniformity of the emitted light spot.

[0036] This specification does not limit the specific thickness of the first fluorescent layer 34 and the second fluorescent layer 54. In this embodiment, the thickness of the first fluorescent layer 34 is greater than or equal to 19 μm and less than or equal to 25 μm, and the thickness of the second fluorescent layer 54 is greater than or equal to 8 μm and less than or equal to 11 μm. For example, the thickness of the first fluorescent layer 34 can be 19 μm, 20 μm, 21 μm, 22 μm, 23 μm, 24 μm, 25 μm, etc.; and the thickness of the second fluorescent layer 54 can be 8 μm, 9 μm, 10 μm, 11 μm, etc. The first fluorescent layer 34 and the second fluorescent layer 54 effectively solve the traditional "yellow ring" problem. Testing has verified that the light source device 100 provided in this application improves the light extraction efficiency through the reflector cup, significantly increasing the luminous flux of the light source device, achieving an efficiency of over 85%, which is about 15 percentage points higher than the luminous efficacy of traditional similar products. The color tolerance SDCM ≤ 3 and the color uniformity > 90%.

[0037] In this embodiment, the reflective cavity 521 is filled with an encapsulating light guide colloid 56. The refractive index of the encapsulating light guide colloid 56 is greater than or equal to 1.5. The encapsulating light guide colloid 56 further uniformly scatters light and improves light extraction efficiency. The encapsulating light guide colloid 56 filling the reflective cavity 521 can reduce total internal reflection loss at the interface of the LED chip 30, the first phosphor layer 34, and the second phosphor layer 54, and also protect the LED chip 30. This specification does not limit the specific type of the encapsulating light guide colloid 56. For example, the encapsulating light guide colloid 56 may include at least one of the following structures: white wall adhesive and fluorescent adhesive. White wall adhesive is a high-reflectivity white adhesive that can improve the luminous efficacy and brightness of the LED chip 30. White wall adhesive is a phenyl silicone resin with high reflectivity, high hardness, good adhesion, and low moisture and oxygen permeability and anti-sulfurization properties based on phenyl silicone resin. The white wall adhesive filling the reflective cavity 521 can block stray light, thereby reducing light leakage from the LED chip 30. The encapsulating light guide colloid 56 can also be a fluorescent colloid with the same color as the first fluorescent layer 34 and the second fluorescent layer 54.

[0038] Please also refer to Figure 3 and Figure 4 In this embodiment, the encapsulating light guide colloid 56 is a translucent white wall adhesive. This translucent white wall adhesive fills the reflective cavity 521 and, after curing, forms a smooth surface at the light exit port 5214. The translucent white wall adhesive is a white reflective encapsulating silicone with a thermal conductivity ≥0.8 W / m·K, higher than ordinary encapsulating adhesives, assisting in heat dissipation of the LED chip 30 and reducing the junction temperature by 5-8℃. A third phosphor layer 561 is also provided on the side of the encapsulating light guide colloid 56 facing away from the LED chip 30. The density of the third phosphor layer 561 is equal to the density of the second phosphor layer 54. The thickness of the third phosphor layer 561 is also the same as the thickness of the second phosphor layer 54. The third phosphor layer 561 is provided on the light exit side of the encapsulating light guide colloid 56 for secondary light mixing, improving color uniformity. Please also refer to Figure 3 and Figure 5 LED unit 1012 (e.g.) Figure 1 As shown, if there are multiple LED chips 30, there are also multiple substrates 10. Multiple LED chips 30 are connected one-to-one to multiple substrates 10, and the multiple substrates 10 are arranged in an array. This specification does not limit the specific arrangement of the multiple substrates 10. For example, the multiple substrates 10 can be arranged orthogonally at equal intervals on a circuit board, or they can be arranged in a honeycomb array, concentric circle array, random distributed array, etc. Adjacent substrates 10 are connected by thermally conductive adhesive. This specification does not limit the specific type of thermally conductive adhesive; for example, it can be nano-silver sintered adhesive, nano-copper sintered adhesive, carbon material composite adhesive, etc. In this embodiment, adjacent substrates 10 are interconnected using nano-silver sintered adhesive, which has a thermal conductivity of ≈200 W / m·K. The high thermal conductivity aluminum nitride ceramic copper-clad substrate and the high thermal conductivity nano-silver sintered adhesive form a composite heat dissipation structure, effectively improving the heat dissipation efficiency of the light source device 100.

[0039] Correspondingly, multiple reflector cups 52 and encapsulating light guide colloids 56 are provided. Multiple reflector cups 52 are disposed on multiple substrates 10 in a one-to-one correspondence and surround the corresponding LED chip 30. Multiple encapsulating light guide colloids 56 are filled in the reflector cups 52 in a one-to-one correspondence.

[0040] Please also refer to Figure 1 and Figure 3 In this embodiment, the light source device 100 may further include a collecting lens group 70, which is disposed on the light-emitting side of the LED light source 101 and is used to collimate the light emitted by the LED light source 101. In this embodiment, the collecting lens group 70 is used to collect the light beam emitted by the LED light source 101 and collimate it for emission.

[0041] This specification does not limit the specific structure of the collecting lens group 70. For example, the collecting lens group 70 may include a spherical condensing lens or an aspherical condensing lens, and the collecting lens group 70 may also be a composite lens group. In this embodiment, the collecting lens group 70 may include a first collecting lens 72, and the first collecting lens 72 may include a plurality of first lens units 721. The plurality of first lens units 721 are arranged in an array spaced apart from each other, and the plurality of first lens units 721 are arranged in a one-to-one correspondence with a plurality of LED chips 30.

[0042] Each first lens unit 721 is individually matched with a corresponding LED chip 30. The first collecting lens 72 collimates and emits light emitted from each LED chip 30 through multiple first lens units 721, which can reduce light interference between adjacent LED chips 30 and achieve efficient control and spatial redistribution of light energy. This specification does not limit the specific structure of the first lens unit 721. For example, the first lens unit 721 may include at least one of the following structures: a spherical condensing lens, an aspherical condensing lens, or a Fresnel lens.

[0043] The collecting lens group 70 may also include a second collecting lens 74, which is disposed on the light-emitting side of the first collecting lens 72. The second collecting lens 74 may include a plurality of second lens units 741, which are integrally formed and connected.

[0044] In this embodiment, the light source device 100 may further include a converging lens 90, which is disposed on the light-emitting side of the collecting lens group 70. The converging lens is used to converge the light beam emitted from the collecting lens group and project it onto the imaging surface.

[0045] During the light emission process of the light source device 100 provided in this application embodiment, the LED chip 30 emits light. The first phosphor layer 34 receives the excitation light emitted by the LED chip 30 and converts it to generate a laser beam. The unexcited excitation light and the laser beam are emitted together through the first phosphor layer 34. At this time, the unexcited excitation light and the laser beam reach the inner wall of the reflector cup 52. The density of the first phosphor layer 34 is greater than the density of the second phosphor layer 54. At this time, the excitation light continues to excite the second phosphor layer 54 and emits a laser beam. The light source device 100 provided in this application embodiment uses part of the light emitted directly from the LED chip 30 to excite the first phosphor layer 34 and the second phosphor layer 54. The light generated by the excitation of the second phosphor layer 54 is reflected by the reflector cup 52 and then emitted again through the second phosphor layer 54. The light emitted from the side of the LED chip 30 excites the second phosphor layer 54 on the inner wall of the reflector cup 53 to generate a laser beam, which compensates for the uneven light spot phenomenon of the emitted light of traditional light source devices, achieves the effect of improving the light spot, effectively solves the "yellow ring problem", reduces color tolerance, and optimizes color consistency.

[0046] Terminology Explanation In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0047] In this application, unless otherwise expressly specified or limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or merely surface contact. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0048] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0049] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A light source device, characterized in that, The system includes an LED light source comprising multiple LED units. Each LED unit includes a substrate, an LED chip, a first phosphor layer, a reflector cup, and a second phosphor layer. The LED chip is disposed on the substrate, and the first phosphor layer is disposed on the light-emitting surface of the LED chip. The reflector cup is disposed on the substrate and surrounds the LED chip to form a reflective cavity. The second phosphor layer is disposed on the side of the reflector cup facing the reflective cavity. The density of the first phosphor layer is greater than the density of the second phosphor layer.

2. The light source device as described in claim 1, characterized in that, The reflective cavity has an opposing light inlet and a light outlet. The light inlet is adjacent to the substrate, and the inner diameter of the reflective cavity increases in the direction from the light inlet to the light outlet.

3. The light source device as described in claim 1, characterized in that, The reflective cavity is filled with an encapsulating light guide colloid, the refractive index of which is greater than or equal to 1.5; a third phosphor layer is provided on the side of the encapsulating light guide colloid away from the LED chip, and the density of the third phosphor layer is equal to the density of the second phosphor layer.

4. The light source device as described in claim 1, characterized in that, The reflective cup has a reflectivity greater than or equal to 95%, and the reflective cup includes any one of the following structures: ceramic reflective cup, polycarbonate-silicone hybrid reflective cup.

5. The light source device as described in claim 1, characterized in that, Multiple LED chips are connected one-to-one to multiple substrates, and the multiple substrates are arranged in an array. Adjacent substrates are connected by thermally conductive adhesive; the substrate is an aluminum nitride ceramic copper-clad substrate.

6. The light source device as described in claim 1, characterized in that, The thickness of the first fluorescent layer is greater than the thickness of the second fluorescent layer; the thickness of the first fluorescent layer is greater than or equal to 19 μm and less than or equal to 25 μm, and the thickness of the second fluorescent layer is greater than or equal to 7 μm and less than or equal to 11 μm.

7. The light source device as described in claim 5, characterized in that, The light source device further includes a collecting lens group, which is disposed on the light-emitting side of the LED light source and is used to collimate the light beam emitted by the LED light source.

8. The light source device as described in claim 7, characterized in that, The collecting lens group includes a first collecting lens, which includes a plurality of first lens units. The plurality of first lens units are arranged in an array spaced apart from each other, and the plurality of first lens units are arranged in a one-to-one correspondence with the plurality of LED chips.

9. The light source device as described in claim 8, characterized in that, The collecting lens group further includes a second collecting lens, which is disposed on the light-emitting side of the first collecting lens. The second collecting lens includes a plurality of second lens units, which are integrally formed and connected.

10. The light source device as claimed in claim 7, characterized in that, The light source device further includes a converging lens, which is disposed on the light-emitting side of the collecting lens group.

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