A high-power, high-brightness parallel coaxial light source with good heat dissipation performance
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-11
- Publication Date
- 2026-08-14
AI Technical Summary
[0005]但是,上述这种平行同轴光源的散热装置的缺点很明显,即该平行同轴光源依靠散热板和散热鳍片进行被动散热,散热性能差,从而导致平行同轴光源无法实现高功率高亮运行
[0018]1.本实用新型的光源装置的主动散热方式为:
Smart Images

Figure CN224635366U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of parallel coaxial light sources, and in particular to a high-power, high-brightness parallel coaxial light source with good heat dissipation performance. Background Technology
[0002] The existing parallel coaxial light source operates on the following optical principle: a. Illuminating the object under test: The light source emits light rays, which are collimated into several parallel rays by a collimating lens. These parallel rays then pass through the reflecting surface of a beam splitter (which has two sides with different optical properties, one side being a reflective surface and the other a transparent surface) set at a certain angle. The parallel rays from the reflecting surface of the beam splitter pass through the illumination window and illuminate the object under test; b. Detecting the object under test: The camera lens is aligned with the observation window, and the camera takes a picture of the object under test by passing through the observation window -> the transparent surface of the beam splitter -> the illumination window.
[0003] If the brightness of the illumination on the object to be measured needs to be increased, the power of the existing parallel coaxial light source needs to be increased; if the power of the light source needs to be increased, the heat dissipation capacity of the light source needs to be improved.
[0004] Currently, the heat dissipation device for parallel coaxial light sources is as follows: one end of the housing acts as a heat sink, one end of the light source device is attached to a silicone rubber thermal pad, and then the light source device is attached to the heat sink. The outer end of the heat sink has several heat dissipation fins. Therefore, the heat dissipation path of this parallel coaxial light source is: light source device -> silicone rubber thermal pad -> heat sink -> heat dissipation fins. (For reference, see patent document number CN218064489U, patent title: A Utility Model Patent for a Parallel Coaxial Light Source)
[0005] However, the heat dissipation device of the above-mentioned parallel coaxial light source has obvious drawbacks. The parallel coaxial light source relies on heat sinks and heat sink fins for passive heat dissipation, which results in poor heat dissipation performance and makes it impossible for the parallel coaxial light source to achieve high power and high brightness operation. Utility Model Content
[0006] The purpose of this invention is to overcome the above-mentioned defects in the prior art and provide a high-power, high-brightness parallel coaxial light source with good heat dissipation performance. The light source device of this parallel coaxial light source is an active heat dissipation device with good heat dissipation performance, thereby ensuring that the parallel coaxial light source can achieve stable operation with high power and high brightness.
[0007] To achieve the above objectives, this utility model provides a high-power, high-brightness parallel coaxial light source with good heat dissipation performance, comprising a housing, a light source device installed at one end inside the housing, a collimating lens installed on one side of the light source device, a beam splitter installed on one side of the collimating lens, an illumination window on one side of the beam splitter, and an observation window on the other side. A light-transmitting lens is provided on the illumination window. The light source device includes a fixing component inserted into one end inside the housing, a heat sink installed inside the fixing component, a PCB substrate installed at one inner end of the heat sink, LED beads installed on the PCB substrate, a heat-conducting rod installed at one end of the PCB substrate and inserted into the heat sink, and a heat dissipation shell provided at one outer end of the heat sink. A cooling fan is installed inside the heat dissipation shell, and a plurality of heat dissipation holes are provided on the heat dissipation shell.
[0008] Preferably, the LED is an ultraviolet LED and the collimating lens is a Fresnel lens.
[0009] Preferably, the PCB substrate is a thermoelectrically separated copper substrate, which includes a copper base layer, a heat sink protruding from the middle of the copper base layer, an insulating layer disposed at one end of the copper base layer, and a PCB pad layer disposed at one end of the copper base layer. The LED beads are disposed on the heat sink and are electrically connected to the PCB pad layer.
[0010] Preferably, a power cord is connected to the heat sink housing, and a through hole is provided on one side of the heat sink base, through which the power cord passes and is electrically connected to the PCB pad layer.
[0011] Preferably, the housing has a positioning hole at one end, and the fixing component includes a fixing ring seat installed at the outer end of the positioning hole and a lampshade seat that passes through the positioning hole and is sleeved on the fixing ring seat, and the heat dissipation body is sleeved on the lampshade seat.
[0012] Preferably, the fixing ring seat is connected to one end of the housing by bolts; the inner end of the lampshade seat is provided with a snap-fit ring, the diameter of which is larger than the diameter of the mounting hole, and the lampshade is snapped onto the snap-fit ring; the lampshade seat is connected to the fixing ring seat by bolts; the heat sink is connected to the lampshade seat by bolts.
[0013] Preferably, the heat dissipation housing has an internal air guiding cavity, a cover plate is installed at one end of the heat dissipation housing, the cooling fan is installed inside the cover plate, and air guiding holes are opened on the cover plate. The air guiding holes, the air guiding cavity and the heat dissipation holes are connected.
[0014] Preferably, the heat dissipation housing is provided with a plurality of heat dissipation fins, and the plurality of heat dissipation fins and a plurality of heat dissipation holes are arranged alternately.
[0015] Preferably, the heat sink and the heat sink housing are integrally formed.
[0016] Preferably, the heat-conducting rod is made of copper, and the heat sink and heat sink housing are made of aluminum or aluminum alloy.
[0017] Compared with the prior art, the beneficial effects of this utility model are as follows:
[0018] 1. The active heat dissipation method of the light source device of this utility model is as follows:
[0019] LED lamp beads high power high brightness heat generation -> PCB substrate -> heat conduction rod -> heat sink -> heat sink housing -> cooling fan that blows the heat from the tail of the heat conduction rod and the heat sink housing outward through the heat dissipation holes.
[0020] The active heat dissipation method of the above-mentioned light source device has good heat dissipation performance, thereby ensuring that the parallel coaxial light source can achieve high power, high brightness and stable operation.
[0021] 2. In summary, the present invention provides a high-power, high-brightness parallel coaxial light source with good heat dissipation performance. Its light source device can achieve active heat dissipation, has good heat dissipation performance, a larger heat dissipation area, and is compact and small, which can be adapted to narrower light source detection and installation spaces, and has wider applicability. Attached Figure Description
[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0023] Figure 1 This is a side-section schematic diagram of a high-power, high-brightness parallel coaxial light source with good heat dissipation performance provided in Embodiment 1 of this utility model;
[0024] Figure 2 This is a front cross-sectional view of a high-power, high-brightness parallel coaxial light source with good heat dissipation performance provided in Embodiment 1 of this utility model;
[0025] Figure 3 This is an exploded structural diagram of a high-power, high-brightness parallel coaxial light source with good heat dissipation performance provided in Embodiment 1 of this utility model. Figure 3 (The side panel on one side of the casing has been omitted).
[0026] Figure 4 This is an exploded structural diagram of the light source device provided in Embodiment 1 of this utility model;
[0027] Figure 5 This is a front sectional view of the light source device provided in Embodiment 1 of this utility model.
[0028] The diagram includes:
[0029] 1. Housing; 11. Positioning hole; 2. Light source device; 20. Fixing component; 201. Fixing ring seat; 202. Lamp cover seat; 2021. Snap-fit ring; 21. LED lamp bead; 22. PCB substrate; 221. Copper base layer; 2210. Heat sink; 222. PCB pad layer; 23. Heat conduction rod; 24. Heat sink body; 240. Mounting hole; 241. Through hole; 25. Heat sink shell; 26. Heat sink fins; 27. Cooling fan; 28. Cover plate; 3. Collimating lens; 4. Beam splitter; 5. Illumination window; 6. Transmitting lens; 7. Observation window; 8. Power cord; 91. Air duct; 92. Air duct cavity; 93. Heat dissipation hole. Detailed Implementation
[0030] The technical solution of this embodiment of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiment is one embodiment of the present invention, and not all embodiments thereof. Based on this embodiment of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0031] Example 1:
[0032] Please see Figures 1 to 5 Embodiment 1 of this utility model provides a high-power, high-brightness parallel coaxial light source with good heat dissipation performance, including a housing 1. A light source device 2 is installed at one end inside the housing 1. A collimating lens 3 is installed on one side of the light source device 2. A beam splitter 4 is installed on one side of the collimating lens 3. An illumination window 5 is opened on one side of the beam splitter 4, and an observation window 7 is opened on the other side. A light-transmitting lens 6 is provided on the illumination window 5. The light source device 2 includes a fixing component 20 inserted into one end inside the housing 1, a heat sink 24 installed inside the fixing component 20, a PCB substrate 22 installed at one end of the heat sink 24, LED beads 21 installed on the PCB substrate 22, a heat-conducting rod 23 installed at one end of the PCB substrate 22 and inserted into the heat sink 24, and a heat sink shell 25 provided at one end of the heat sink 24. A cooling fan 27 is installed inside the heat sink shell 25, and a plurality of heat dissipation holes 93 are opened on the heat sink shell 25.
[0033] The heat-conducting rod 23 is made of copper. The copper heat-conducting rod 23 not only has higher thermal conductivity than silicone rubber heat-conducting pads, but it can also be inserted into the heat sink 24, allowing for a larger heat dissipation area and thus conducting more heat.
[0034] PCB substrate 22 has the following two implementation methods:
[0035] The first type is the traditional PCB substrate 22, namely FR-4 board or aluminum substrate. The heat conduction efficiency of this type of traditional PCB substrate 22 in contact with the heat conduction rod 23 is generally low.
[0036] The second type: The PCB substrate 22 is a thermoelectrically separated copper substrate, which includes a copper base layer 221, a heat sink 2210 protruding from the middle of the copper base layer 221, an insulating layer (not shown in the drawings) at one end of the copper base layer 221, and a PCB pad layer 222 at one end of the copper base layer 221. The LED beads 21 are disposed on the heat sink 2210 and are electrically connected to the PCB pad layer 222. For a reference, see Chinese invention patent CN111246656B, entitled "A Thermoelectrically Separated Copper-Based Circuit Board for LEDs and its Preparation Method Thereof." The copper base layer 221 of the thermoelectrically separated copper substrate has extremely high heat conduction efficiency in contact with the copper heat-conducting rod 23, which can rapidly conduct the heat dissipated by the LED beads 21.
[0037] A power cable 8 is connected to the heat sink housing 25. A through hole 241 is opened on one side of the heat sink base 24. The power cable 8 passes through the through hole 241 and is electrically connected to the PCB pad layer 222.
[0038] The housing 1 has a positioning hole 11 at one end. The fixing component 20 includes a fixing ring seat 201 installed at the outer end of the positioning hole 11 and a lampshade seat 202 that passes through the positioning hole 11 and is sleeved on the fixing ring seat 201. The heat dissipation seat 24 is sleeved on the lampshade seat 202.
[0039] The fixing ring seat 201 is connected to one end of the housing 1 by bolts; the inner end of the lampshade seat 202 is provided with a snap-fit ring part 2021, the diameter of which is larger than the diameter of the mounting hole 240, and a lampshade (the lampshade is prior art and is not shown in the attached drawings) is snapped onto the snap-fit ring part 2021; the lampshade seat 202 is connected to the fixing ring seat 201 by bolts; the heat sink 24 is connected to the lampshade seat 202 by bolts.
[0040] The heat sink 24 and the heat sink housing 25 are made of aluminum or aluminum alloy.
[0041] The heat sink 24 and the heat sink housing 25 are integrally formed.
[0042] A mounting hole 240 is provided through the heat sink 24, and a heat conduction rod 23 is inserted into the mounting hole 240.
[0043] The heat sink 25 has an air guide cavity 92 inside. A cover plate 28 is installed at one end of the heat sink 25. The cooling fan 27 is installed inside the cover plate 28. An air guide hole 91 is opened on the cover plate 28. The air guide hole 91, the air guide cavity 92 and the heat dissipation hole 93 are connected.
[0044] The heat dissipation housing 25 is provided with a number of heat dissipation fins 26, and the number of heat dissipation fins 26 and the number of heat dissipation holes 93 are arranged alternately.
[0045] The optical path principle of the high-power, high-brightness parallel coaxial light source with good heat dissipation provided in Embodiment 1 of this utility model is existing technology, which has been described in detail in the background section above, and will not be repeated here.
[0046] The specific heat dissipation principle of the high-power, high-brightness parallel coaxial light source with good heat dissipation performance provided in Embodiment 1 of this utility model is as follows:
[0047] LED bead 21 -> Heat sink 2210 of copper substrate with thermoelectric separation -> Copper base 221 -> Copper heat conduction rod 23 -> Heat sink 24 -> Heat sink shell 25 -> Heat sink fins 26 -> Heat accumulates at the tail of heat conduction rod 23, heat sink shell 25 and heat sink fins 26.
[0048] Air enters through the air vents 91 on the cover plate 28 -> the cooling fan 27 blows the incoming air into the air vent 92 -> the airflow in the air vent 92 carries the heat from the tail of the heat conduction rod 23 and the heat sink 25 to the heat dissipation holes 93, i.e., the heat dissipation holes 93 exhaust air -> the heat dissipation fins 26 and the heat dissipation holes 93 are staggered, and the airflow from each heat dissipation hole 93 will carry away the heat from its adjacent heat dissipation fins 26.
[0049] Therefore, the technical advantages of the high-power, high-brightness parallel coaxial light source with good heat dissipation performance in Embodiment 1 of this utility model are: its light source device 2 can achieve active heat dissipation, has a larger heat conduction and heat dissipation area, excellent heat dissipation performance, and its light source device 2 is small and compact, which can be adapted to narrower light source detection installation spaces, and has wider applicability.
[0050] Example 2:
[0051] Embodiment 2 of this utility model provides a high-power, high-brightness parallel coaxial light source with good heat dissipation performance. The high-power, high-brightness parallel coaxial light source of Embodiment 2 is based on the high-power, high-brightness parallel coaxial light source of Embodiment 1, but with a specific application limitation. That is, the LED lamp bead 21 is an ultraviolet LED lamp bead 21, and the collimating lens 3 is a Fresnel lens. The Fresnel lens collimates the point light source of the ultraviolet LED lamp bead 21 into parallel light rays. The high-power, high-brightness parallel coaxial light source of Embodiment 2 is a high-power, high-brightness ultraviolet parallel coaxial light source with good heat dissipation performance.
[0052] Therefore, the high-power, high-brightness ultraviolet parallel coaxial light source of this embodiment 2 has excellent heat dissipation performance, which can effectively dissipate the high heat emitted by the ultraviolet LED beads 21 quickly, thereby achieving clearer and higher contrast semiconductor defect detection, PCB micro-circuit detection, screen glass micro-scratch detection, and fluorescent anti-counterfeiting code reading detection.
[0053] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model shall be included within the protection scope of the present utility model.
Claims
1. A high-power, high-brightness parallel coaxial light source with good heat dissipation performance, comprising a housing (1), wherein a light source device (2) is installed at one end inside the housing (1), a collimating lens (3) is installed on one side of the light source device (2), a beam splitter (4) is installed on one side of the collimating lens (3), an illumination window (5) is opened on one side of the beam splitter (4), an observation window (7) is opened on the other side, and a light-transmitting lens (6) is provided on the illumination window (5), characterized in that, The light source device (2) includes a fixing component (20) inserted into one end of the housing (1), a heat sink (24) installed inside the fixing component (20), a PCB substrate (22) installed at one end of the heat sink (24), LED beads (21) installed on the PCB substrate (22), a heat-conducting rod (23) installed at one end of the PCB substrate (22) and inserted into the heat sink (24), and a heat sink housing (25) provided at one end of the heat sink (24). The heat sink housing (25) is equipped with a cooling fan (27) and has a plurality of heat dissipation holes (93) on it.
2. A high power high intensity parallel coaxial light source with good heat dissipation according to claim 1, characterized in that, The LED bead (21) is an ultraviolet LED bead (21), and the collimating lens (3) is a Fresnel lens.
3. A high power high intensity parallel coaxial light source with good heat dissipation according to claim 1, characterized in that, The PCB substrate (22) is a thermoelectrically separated copper substrate, which includes a copper base layer (221), a heat sink (2210) protruding from the middle of the copper base layer (221), an insulating layer at one end of the copper base layer (221), and a PCB pad layer (222) at one end of the copper base layer (221). The LED beads (21) are disposed on the heat sink (2210), and the LED beads (21) are electrically connected to the PCB pad layer (222).
4. A high power high intensity parallel coaxial light source with good heat dissipation according to claim 3, characterized in that, A power cord (8) is connected to the heat sink housing (25). A through hole (241) is provided on one side of the heat sink base (24). The power cord (8) passes through the through hole (241) and is electrically connected to the PCB pad layer (222).
5. A high power high intensity parallel coaxial light source with good heat dissipation according to claim 1, characterized in that, The housing (1) has a positioning hole (11) at one end. The fixing component (20) includes a fixing ring seat (201) installed at the outer end of the positioning hole (11) and a lampshade seat (202) that passes through the positioning hole (11) and is sleeved on the fixing ring seat (201). The heat dissipation seat (24) is sleeved on the lampshade seat (202).
6. A high power high intensity parallel coaxial light source with good heat dissipation according to claim 5, characterized in that, The fixing ring seat (201) is connected to one end of the housing (1) by bolts; the inner end of the lampshade seat (202) is provided with a snap-fit ring part (2021), the diameter of the snap-fit ring part (2021) is larger than the diameter of the mounting hole (240), and a lampshade is snapped onto the snap-fit ring part (2021); the lampshade seat (202) is connected to the fixing ring seat (201) by bolts; the heat dissipation base (24) is connected to the lampshade seat (202) by bolts.
7. A high power high intensity parallel coaxial light source with good heat dissipation according to claim 1, characterized in that, The heat dissipation housing (25) has an air guide cavity (92) inside. A cover plate (28) is installed at one end of the heat dissipation housing (25). The cooling fan (27) is installed inside the cover plate (28). An air guide hole (91) is opened on the cover plate (28). The air guide hole (91), the air guide cavity (92) and the heat dissipation hole (93) are connected.
8. A high power high intensity parallel coaxial light source with good heat dissipation according to claim 1, characterized in that, The heat dissipation housing (25) is provided with a plurality of heat dissipation fins (26), and the plurality of heat dissipation fins (26) and a plurality of heat dissipation holes (93) are arranged alternately.
9. A high power high intensity parallel coaxial light source with good heat dissipation according to claim 1, characterized in that, The heat sink (24) and the heat sink housing (25) are integrally formed.
10. A high power high intensity parallel coaxial light source with good heat dissipation according to claim 1, characterized in that, The heat-conducting rod (23) is a copper material component, and the heat-dissipating seat body (24) and the heat-dissipating shell (25) are aluminum material components or aluminum alloy material components.
Citation Information
Patent Citations
Thermoelectric Separation Copper-Based Circuit Board for LEDs and its Fabrication Method
CN111246656B
Parallel coaxial light source
CN218064489U