Tilt vibration sensor and its mounting structure

Abstract

This application relates to a tilt vibration sensor and its mounting structure. The tilt vibration sensor includes: a top cover, a bottom shell, a triaxial MEMS sensor, a circuit board, and a battery. The top of the bottom shell is open, and the top cover is fastened to the top opening of the bottom shell and detachably connected to the bottom shell. A battery baffle is provided inside the cavity of the bottom shell. The circuit board and the battery are both disposed inside the cavity of the bottom shell and are located on both sides of the battery baffle. The triaxial MEMS sensor is disposed on the circuit board. The bottom of the bottom shell has two or more mounting holes for mounting the bottom shell at the desired position. A planar rectangular coordinate system is marked on the bottom of the bottom shell. Compared with liquid pendulum vibration sensors, this application is less affected by environmental temperature, humidity, air pressure, etc.; it also eliminates concerns about liquid leakage, has a longer service life, and a wider range of applications.

Description

Technical Field

[0001] This application relates to the field of vibration sensor technology, and in particular to a tilt vibration sensor and its mounting structure. Background Technology

[0002] An tilt vibration sensor is a device used to measure the tilt angle of an object relative to the direction of gravity. It is widely used in industries such as manufacturing, transportation, construction, and aerospace. Its core function is to detect and monitor changes in the attitude of objects, ensuring the stability, safety, and precise control of equipment or structures.

[0003] Existing tilt vibration sensors include liquid pendulum tilt vibration sensors, which are devices that measure tilt angles based on the characteristic that the liquid surface always remains horizontal. Their core principle utilizes the natural horizontal property of a liquid under gravity, reflecting the tilt angle by detecting changes in the liquid surface relative to the sensor body. While they have the advantage of simple structure, they are easily affected by environmental interference in practical applications. For example, liquid viscosity and density change with temperature (e.g., low-temperature solidification, high-temperature evaporation), requiring additional temperature compensation or isothermal design, increasing structural complexity. Furthermore, insufficient sealing can cause changes in air pressure, altering the liquid surface tension and introducing measurement errors. Summary of the Invention

[0004] In view of this, this application proposes a tilt vibration sensor.

[0005] According to one aspect of this application, a tilt vibration sensor is provided, comprising: an upper cover, a bottom shell, a triaxial MEMS sensor, a circuit board, and a battery; The top of the bottom shell has an open structure, and the top cover is fastened to the top opening of the bottom shell and is detachably connected to the bottom shell. A battery baffle is installed inside the cavity of the bottom shell; Both the circuit board and the battery are located inside the cavity of the bottom shell and are respectively located on both sides of the battery baffle. The triaxial MEMS sensor is mounted on the circuit board; The bottom of the base shell has two or more mounting holes for mounting the base shell in the installation position; The bottom of the base shell is marked with a Cartesian coordinate system.

[0006] In one possible implementation, the main body of the upper cover is a hemispherical structure with cavities, and the main body of the bottom shell is a cylindrical structure with cavities.

[0007] In one possible implementation, the inner wall of the top cover has a threaded structure, and the outer wall of the bottom shell has a matching threaded structure, with the top cover and the bottom shell being threadedly connected.

[0008] In one possible implementation, the side wall of the bottom shell protrudes with a limiting part, and the bottom surface of the top cover abuts against the top surface of the limiting part.

[0009] In one possible implementation, a sealing ring is provided between the top cover and the bottom shell.

[0010] In one possible implementation, there are three mounting holes, which are arranged sequentially along the circumference of the bottom shell.

[0011] According to another aspect of this application, a mounting structure is provided for mounting a tilt vibration sensor, comprising: a mounting plate; The mounting plate has two or more connection holes, and the number of connection holes is the same as the number of mounting holes, and they are set one-to-one.

[0012] In one possible implementation, the mounting plate has two or more fixing holes for mounting the mounting plate to the installation position through the fixing holes.

[0013] Beneficial Effects: The base shell provides installation space for the triaxial MEMS sensor, circuit board, and battery. The top cover seals the interior of the base shell, effectively protecting the electronic components. The triaxial MEMS sensor measures the tilt angle of the base shell along the X, Y, and Z axes and uploads the data to the main control chip on the circuit board. The main control chip analyzes the output signal and, combined with spatial analysis algorithms, accurately calculates the object's posture and tilt angle in three-dimensional space. The battery provides power to the various electronic components on the circuit board. This application features a simple overall structure and small size, enabling real-time monitoring and uploading of tilt and vibration changes. It is applicable to various monitoring industries, including hazardous buildings, cultural relic protection, bridge tilting, and structural safety. Compared to liquid pendulum vibration sensors, the triaxial MEMS sensor measurement method used in this application is less affected by environmental factors such as temperature, humidity, and air pressure; it also eliminates concerns about liquid leakage, has a longer service life, and a wider range of applications.

[0014] Other features and aspects of this application will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0015] The accompanying drawings, which are included in and form part of this specification, illustrate exemplary embodiments, features, and aspects of this application together with the specification and serve to explain the principles of this application.

[0016] Figure 1 An exploded view of the tilt vibration sensor according to an embodiment of this application is shown; Figure 2 An internal view of the tilt vibration sensor according to an embodiment of this application is shown; Figure 3This diagram illustrates the main structural structure of the bottom shell according to an embodiment of this application. Figure 4 This diagram illustrates the main structural structure of the upper cover according to an embodiment of this application. Figure 5 This diagram shows the main structure of the tilt vibration sensor according to an embodiment of this application; Figure 6 This diagram shows the main structure of the tilt vibration sensor according to an embodiment of this application; Figure 7 A bottom view of the tilt vibration sensor according to an embodiment of this application is shown; Figure 8 This is a front layout view of a circuit board according to an embodiment of this application; Figure 9 A reverse layout view of the circuit board according to an embodiment of this application is shown; Figure 10 The circuit diagram of the main control chip in an embodiment of this application is shown; Figure 11 A circuit diagram of a 4G communication module according to an embodiment of this application is shown; Figure 12 A partial circuit diagram of a circuit board according to an embodiment of this application is shown; Figure 13 A circuit diagram illustrating the network state circuit of an embodiment of this application is shown; Figure 14 A partial circuit diagram of a circuit board according to an embodiment of this application is shown; Figure 15 A partial circuit diagram of a circuit board according to an embodiment of this application is shown; Figure 16 A partial circuit diagram of a circuit board according to an embodiment of this application is shown; Figure 17 The circuit diagram of the SIM card according to an embodiment of this application is shown; Figure 18 A circuit diagram of a memory chip according to an embodiment of this application is shown; Figure 19 The circuit diagram of the guard chip in an embodiment of this application is shown; Figure 20 A circuit diagram of a triaxial MEMS sensor according to an embodiment of this application is shown; Figure 21 A circuit diagram of an accelerometer according to an embodiment of this application is shown; Figure 22 A circuit diagram of the MEMS power control circuit according to an embodiment of this application is shown; Figure 23 A circuit diagram showing the interface circuit of an embodiment of this application is provided. Figure 24 A circuit diagram of a reed switch according to an embodiment of this application is shown; Figure 25This application shows a circuit diagram of a buzzer according to an embodiment of the present application; Figure 26 A circuit diagram showing an indicator light according to an embodiment of this application; Figure 27 A circuit diagram of a crystal oscillator circuit according to an embodiment of this application is shown; Figure 28 A circuit diagram showing the reset circuit according to an embodiment of this application is provided. Figure 29 A circuit diagram showing the filtering circuit of an embodiment of this application is provided. Figure 30 A circuit diagram of a battery voltage detection circuit according to an embodiment of this application is shown; Figure 31 A circuit diagram of a 4G power detection circuit according to an embodiment of this application is shown; Figure 32 A circuit diagram of the debugging voltage detection circuit according to an embodiment of this application is shown; Figure 33 This diagram shows the main structure of the mounting plate according to the first embodiment of this application; Figure 34 This diagram illustrates the installation structure of a first embodiment of the present application; Figure 35 An unfolded view of the mounting plate according to the second embodiment of this application is shown; Figure 36 A side view of the mounting plate according to a second embodiment of this application is shown; Figure 37 This diagram illustrates the installation structure of a second embodiment of the present application. Figure 38 This diagram illustrates the installation structure of a second embodiment of the present application. Detailed Implementation

[0017] Various exemplary embodiments, features, and aspects of the present invention will now be described in detail with reference to the accompanying drawings. The same reference numerals in the drawings denote elements that have the same or similar functions. Although various aspects of the embodiments are shown in the drawings, they are not necessarily drawn to scale unless specifically indicated otherwise.

[0018] It should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model or simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0019] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0020] The term “exemplary” as used herein means “serving as an example, embodiment, or illustration.” Any embodiment illustrated herein as “exemplary” is not necessarily to be construed as superior to or better than other embodiments.

[0021] Furthermore, to better illustrate this utility model, numerous specific details are provided in the following detailed embodiments. Those skilled in the art should understand that this utility model can be implemented even without certain specific details. In some instances, methods, means, components, and circuits well-known to those skilled in the art have not been described in detail, in order to highlight the main points of this utility model.

[0022] Figure 1 An exploded view of the tilt vibration sensor according to an embodiment of this application is shown; Figure 2 An internal view of the tilt vibration sensor according to an embodiment of this application is shown; as follows: Figure 1 As shown, this tilt vibration sensor includes: an upper cover 100, a bottom shell 200, a triaxial MEMS sensor U7, a circuit board 300, and a battery 400; the top of the bottom shell 200 has an open structure, and the upper cover 100 is fastened to the top opening of the bottom shell 200 and detachably connected to the bottom shell 200; a battery baffle 210 is provided inside the cavity of the bottom shell 200; the circuit board 300 and the battery 400 are both disposed inside the cavity of the bottom shell 200 and are respectively located on both sides of the battery baffle 210; the triaxial MEMS sensor U7 is disposed on the circuit board 300 and is electrically connected to the main control chip U4; the bottom of the bottom shell 200 has two or more mounting holes 260 for mounting the bottom shell 200 in the desired position; a planar rectangular coordinate system mark 240 is engraved on the bottom of the bottom shell 200.

[0023] It should be noted that the bottom shell 200 provides installation space for the triaxial MEMS sensor U7, circuit board 300, and battery 400, while the top cover 100 covers the bottom shell 200 to seal its interior, effectively protecting the triaxial MEMS sensor U7, circuit board 300, battery 400, and other electronic components. The triaxial MEMS sensor U7 measures the tilt angle of the bottom shell 200 along the X, Y, and Z axes and uploads the data to the main control chip U4 on the circuit board 300. The main control chip U4 on the circuit board 300 can accurately calculate the object's posture and tilt angle in three-dimensional space by analyzing the output signal and combining it with spatial analysis algorithms. The battery 400 provides operating voltage for the electronic components on the circuit board 300. This application has a simple overall structure and small size, and can monitor and upload tilt and vibration changes in real time. It is applicable to various monitoring industries such as dangerous buildings, cultural relic protection, bridge tilt, and structural safety. Compared to liquid pendulum vibration sensors, this application is less affected by environmental factors such as temperature, humidity, and air pressure; it also eliminates concerns about liquid leakage and has a longer service life and a wider range of applications.

[0024] In one possible implementation, the main body of the upper cover 100 is a hemispherical structure with cavities, and the main body of the bottom shell 200 is a cylindrical structure with cavities. This effectively reduces the overall structural volume, minimizes usable space, and effectively prevents the upper cover 100 from being bumped or knocked.

[0025] In one possible implementation, the inner wall of the top cover 100 is provided with a threaded structure 120, and the outer wall of the bottom shell 200 is provided with a matching threaded structure 201, with the top cover 100 and the bottom shell 200 being threadedly connected. It should be noted that when internal electronic components need maintenance, the top cover 100 can be directly rotated to remove it from the bottom shell 200, exposing the internal circuit board 300 and battery 400. After maintenance, the top cover 100 is screwed back onto the bottom shell 200. The threaded connection between the top cover 100 and the bottom shell 200 effectively ensures the secure connection between them and facilitates disassembly.

[0026] In one possible implementation, the side wall of the bottom shell 200 protrudes with a limiting portion 270, and the bottom surface of the top cover 100 abuts against the top surface of the limiting portion 270. For example... Figure 7 As shown, the main body of the limiting part 270 is in the form of a ring structure and is coaxially arranged with the bottom shell 200. Two or more connecting parts 271 are provided between the inner side of the limiting part 270 and the bottom shell 200 to install the limiting part 270 on the outer side of the bottom shell 200. Preferably, the limiting part 270, the two or more connecting parts 271 and the bottom shell 200 are integrally formed. The limiting part 270 is suitable for supporting the upper cover 100 and preventing the upper cover 100 from rotating excessively.

[0027] In one possible implementation, a sealing ring 110 is provided between the top cover 100 and the bottom shell 200. The sealing ring 110 is an O-ring rubber sealing ring 110, which seals the gap between the top cover 100 and the bottom shell 200 to prevent external rainwater, dust and other impurities from entering the bottom shell 200 and affecting the service life of electronic components.

[0028] In one possible implementation, three mounting holes 260 are provided, and the three mounting holes 260 are arranged evenly in sequence along the circumference of the bottom shell 200.

[0029] In one possible implementation, such as Figure 7 As shown, each mounting hole 260 is provided with a pre-embedded nut 261; the pre-embedded nut 261 is mainly used to fix the equipment and enhance the stability of the structure, and is suitable for installing the bottom shell 200 in the position to be installed by cooperating with the expansion bolt 700.

[0030] In one possible implementation, the bottom of the base shell 200 has two or more injection grooves 250, into which adhesive can be injected so that the base shell 200 can be fixed to the installation position by adhesive bonding.

[0031] In one possible implementation, such as Figure 6 As shown, the bottom of the bottom shell 200 is engraved with a Cartesian coordinate system mark 240. The Cartesian coordinate system mark 240 is used to indicate the XYZ coordinate system direction defined by the device body, so that the sensor output data can be intuitively understood.

[0032] A magnetic sensing element 230 is provided on the outer wall of the bottom shell 200, and the X-axis of the Cartesian coordinate system marker 240 points to the magnetic sensing element 230. The magnetic sensing element 230 is used to assist in the debugging of the sensor. For example: if you use a magnet to attract the tip of the magnetic sensing element 230 and immediately remove the magnet, you will hear a "beep" sound. After about 40 seconds, you will hear two "beep" sounds, indicating that the communication is successful. At this time, a data message will be reported: record the installation position and sensor SN code, installation is complete. Then, bring the magnet close to the tip of the magnetic sensing element 230 again. This time, you will hear a short "beep" sound. Do not remove the magnet. After hearing two long "beep" sounds, remove the magnet. The device is set to the "installed" state, the trigger function is turned on, and the encryption function is turned on. Repeat the communication test steps once, and check the setting results through the reported device status data.

[0033] Furthermore, the magnetic sensing element 230 adopts a Hall sensor TMR1148S.

[0034] In one possible implementation, it also includes a GPS antenna 310 and a 4G antenna 320, both of which are electrically connected to the 4G communication module U2 on the circuit board 300 in order to receive satellite signals and mobile base station signals.

[0035] In one possible implementation, the main body of the battery baffle 210 is a "Π"-shaped plate structure, which is vertically arranged inside the bottom shell 200. The battery 400 is located inside the opening of the "Π"-shaped structure, and the circuit board 300 is located outside the opening of the "Π"-shaped structure.

[0036] In one possible implementation, the bottom shell contains two or more support columns 211 and threaded cylinders 220, with the length direction of both the support columns 211 and the threaded cylinders 220 perpendicular to the bottom of the bottom shell. The support columns 211 are used to support the circuit board, and bolts are inserted into the threaded cylinders 220 to fix the circuit board 300 to the threaded cylinders 220, preventing the circuit board 300 from shifting or tipping over during installation or use, thus affecting the normal operation of the equipment.

[0037] In one possible implementation, the circuit board 300 integrates a main control chip U4, a three-axis MEMS sensor U7, and a 4G communication module U2; furthermore, the main control chip U4 is an STM32L43xCxT6; the three-axis MEMS sensor U7 is an ADXL5335BEZ; and the 4G communication module U2 is an EC600N-CN.

[0038] like Figure 20As shown, pin 1 (CS terminal) of the triaxial MEMS sensor U7 is electrically connected to pin 14 of the main control chip U4; pin 2 (SCLK terminal) of the triaxial MEMS sensor U7 is electrically connected to pin 15 of the main control chip U4; pin 3 (MOSI terminal) of the triaxial MEMS sensor U7 is electrically connected to pin 17 of the main control chip U4; pin 4 (MISO terminal) of the triaxial MEMS sensor U7 is electrically connected to pin 16 of the main control chip U4; and pin 5 (VDDIO terminal) of the triaxial MEMS sensor U7 is connected to the main control chip U4 via capacitor C50 and capacitor... C49 is connected to VDDA-3V; pin 6 (VSSIO terminal) of the triaxial MEMS sensor U7 is grounded; pin 8 of the triaxial MEMS sensor U7 is grounded through capacitors C47 and C48; pin 9 (VSS terminal) of the triaxial MEMS sensor U7 is grounded; pin 10 (VIP8ANA terminal) of the triaxial MEMS sensor U7 is grounded through capacitors C42 and C43; pin 11 (VSUPPLY terminal) of the triaxial MEMS sensor U7 is electrically connected to pin 2 (OUT terminal) of the voltage reference chip U8. One terminal of capacitor C39 and one terminal of capacitor C40 are electrically connected to pin 11 (VSUPPLY terminal) of the triaxial MEMS sensor U7, and the other terminals of capacitors C39 and C40 are grounded. The voltage reference chip U8 is model REF3325AIDBZR.

[0039] One end of resistor R30 is electrically connected to pin 19 of the main control chip U4, and the other end of resistor R30 is connected to VCC_3.0.

[0040] like Figure 11As shown, pin 46 of the 4G communication module U2 is electrically connected to the ANT terminal of the RF interface J2; pins 38, 35, 18, and 74 of the 4G communication module U2 are all grounded; pin 37 (VBAT_RF terminal) of the 4G communication module U2 is electrically connected to pin 3 of MOSFET Q2; pin 36 (VBAT_RF terminal) of the 4G communication module U2 is electrically connected to pin 3 of MOSFET Q2; pin 32 (MAIN_TXD terminal) of the 4G communication module U2 is electrically connected to the emitter of transistor T4; pin 31 (MAIN_RXD terminal) of the 4G communication module U2 is electrically connected to the collector of transistor T3; 4G communication... Pin 29 (VBAT_BB) of module U2 is grounded through capacitors C8, C5, C6, and C7; pin 5 (USIM_CLK) of 4G communication module U2 is electrically connected to pin C3 (CLK) of SIM card J5; pin 6 (USIM-DATA) of 4G communication module U2 is electrically connected to pin C7 (I0) of SIM card J5; pin 7 (USIM_RST) of 4G communication module U2 is electrically connected to pin C2 (RST) of SIM card J5; pin 8 (USIM_VDD) of 4G communication module U2 is electrically connected to pin C1 (VCC) of SIM card J5. The model of SIM card J5 is SIM-CARD-4.

[0041] In one possible implementation, such as Figure 12 As shown, circuit board 300 integrates digital transistor T1 and MOSFETs Q1 and Q2. Furthermore, pin 1 of MOSFET Q1 is electrically connected to pin 3 of digital transistor T1 via resistor R5. Pin 2 of MOSFET Q1 is connected to 3.8V. Pin 3 of MOSFET Q1 is electrically connected to pin 3 of MOSFET Q2. Pin 2 of MOSFET Q2 is connected to 3.8V. Pin 3 of MOSFET Q2 is electrically connected to the 4G communication module U2. Pin 1 of MOSFET Q2 is electrically connected to pin 3 of digital transistor T1 via resistor R5. Pin 2 of digital transistor T1 is grounded. Pin 1 of digital transistor T1 is electrically connected to pin 29 of the main control chip U4. The model of digital transistor T1 is MMUN2233LTIG.

[0042] In one possible implementation, such as Figure 13 As shown, a network status circuit is integrated on the circuit board 300. The network status circuit includes: a resistor R6 connected in series with a light-emitting diode D3; one end of the resistor R6 is electrically connected to pin 3 of the MOSFET Q2, the other end of the resistor R6 is connected to the positive terminal of the light-emitting diode D3, and the negative terminal of the light-emitting diode is electrically connected to pin 55 of the 4G communication module U2.

[0043] In one possible implementation, a DC 3.6V to 3.8V converter circuit is integrated on circuit board 300; the voltage conversion chip U1 of this circuit is model AP2005. For example... Figure 15 As shown, pin 3 (VIN) of voltage converter chip U1 is connected to DC 3.6V, and pin 8 (LX) of voltage converter chip U1 outputs the converted 3.8V voltage; pin 4 (EN) of voltage converter chip U1 is electrically connected to pin 32 of main control chip U4; pin 2 (OC) of voltage converter chip U1 is grounded through resistor R2, and pins 1, 5, and 6 of voltage converter chip U1 are grounded; pin 8 of voltage converter chip U1 is electrically connected to the positive terminal of diode D1, the negative terminal of diode D1 is electrically connected to one terminal of capacitors C1, C2, and C3, and the other terminal of capacitors C1, C2, and C3 is grounded; one end of resistor R1 is electrically connected to pin 8 of voltage converter chip U1, and the other end of resistor R1 is grounded.

[0044] In one possible implementation, such as Figure 14 As shown, circuit board 300 integrates a DC 3.6V to 3.0V circuit; the voltage conversion chip U3 in this circuit is model TPS70930DBVR; pin 1 (VIN terminal) of voltage conversion chip U3 is connected to the battery output voltage VBAT to be converted, pin 2 of voltage conversion chip U3 is grounded, and pin 5 (VOUT terminal) of voltage conversion chip U3 outputs VCC_3.0V voltage. One terminal of capacitor C14 is electrically connected to pin 5 (VOUT terminal) of voltage conversion chip U3, and the other terminal of capacitor C14 is grounded; one terminal of capacitor C15 is electrically connected to pin 5 (VOUT terminal) of voltage conversion chip U3, and the other terminal of capacitor C15 is grounded; one terminal of capacitor C16 is electrically connected to pin 1 (VIN terminal) of voltage conversion chip U3, and the other terminal of capacitor C16 is grounded.

[0045] In one possible implementation, such as Figure 16 As shown, circuit board 300 integrates a level conversion circuit, which includes transistors T3 and T4. The base of transistor T3 is connected to VDD_EXT through resistor R10, the emitter of transistor T3 is electrically connected to pin 30 of the main control chip U4, and the collector of transistor T3 is electrically connected to the 4G communication module U2. The base of transistor T4 is connected to VDD_EXT through resistor R11, the emitter of transistor T3 is electrically connected to the 4G communication module U2, and the collector of transistor T4 is electrically connected to pin 31 of the main control chip U4.

[0046] In one possible implementation, such as Figure 19As shown, the circuit board 300 integrates a monitor chip U5 (model ADXL362BCCZ). Pin 1 (VDD terminal) of the monitor chip U5 is electrically connected to pin 42 of the main control chip U4. Pin 4 (SCLK terminal) of the monitor chip U5 is electrically connected to pin 39 of the main control chip U4. Pin 6 (MOSI terminal) of the monitor chip U5 is electrically connected to pin 41 of the main control chip U4. Pin 7 (MISO terminal) of the monitor chip U5 is electrically connected to pin 40 of the main control chip U4. Pin 8 (CS terminal) of the monitor chip U5 is electrically connected to pin 38 of the main control chip U4. Pin 9 (INT2 terminal) of the monitor chip U5 is electrically connected to pin 45 of the main control chip U4. Pins 12, 13, and 16 of the monitor chip U5 are grounded. Pin 1 of MOSFET Q3 is electrically connected to pin 43 of the main control chip U4, pin 2 of MOSFET Q3 is grounded, and pin 3 of MOSFET Q3 is electrically connected to pin 1 (VDD terminal) of the monitoring chip U5 through resistor R21.

[0047] In one possible implementation, such as Figure 18 As shown, the circuit board 300 integrates a memory chip U6 (model: W25Q64). Pin 1 (CS terminal) of memory chip U6 is electrically connected to pin 25 of main control chip U4, pin 2 (DO terminal) of memory chip U6 is electrically connected to pin 27 of main control chip U4, pin 5 (DI terminal) of memory chip U6 is electrically connected to pin 28 of main control chip U4, pin 6 (CLK terminal) of memory chip U6 is electrically connected to pin 26 of main control chip U4, pin 4 of memory chip U6 is grounded, and pin 8 of memory chip U6 is connected to a 3.0V voltage.

[0048] In one possible implementation, such as Figure 22 As shown, the circuit board 300 is equipped with a MEMS power control circuit, which includes a transistor T5, a resistor R27, and a MOSFET Q4. The base of transistor T5 is electrically connected to pin 2 of the main control chip, and the emitter of transistor T5 is grounded. Pin 3 of transistor Q5 is electrically connected to pin 1 of MOSFET Q4 through resistor R27. Pin 2 of MOSFET Q4 is connected to VCC_3.0, and pin 3 of MOSFET Q4 is connected to VCDDA_3.0. One end of resistor R26 is electrically connected to pin 2 of MOSFET Q4, and the other end of resistor R26 is electrically connected to one end of resistor R27. Capacitor C38 is connected in parallel with resistor R26.

[0049] In one possible implementation, such as Figure 21As shown, it also includes: accelerometer U9, the model of which is SCA3300. The accelerometer U9 has the following pins connected: pin 1 (AVSS terminal) grounded, pin 2 (A-EXTC terminal) grounded through capacitor C41, pin 4 (VDD terminal) connected to VDDA 3.0V, pin 5 (CSB terminal) electrically connected to pin 14 of main control chip U4, pin 6 (MISO terminal) electrically connected to pin 16 of main control chip U4, pin 7 (MOSI terminal) electrically connected to pin 17 of main control chip U4, pin 8 (SCK terminal) electrically connected to pin 15 of main control chip U4, pin 9 (DVIO terminal) connected to VDDA 3.0V, pin 10 grounded through capacitor C44, and pins 11 and 12 grounded.

[0050] One end of resistor R28 is electrically connected to pin 18 of the main control chip U4, and the other end of resistor R28 is connected to VCC_3.0.

[0051] In one possible implementation, such as Figure 23 As shown, pin 1 of programming interface J4 is connected to VCC3.0; pin 2 of programming interface J4 is electrically connected to pin 34 of main control chip U4; pin 3 of programming interface J4 is electrically connected to pin 37 of main control chip U4; pin 4 of programming interface J4 is electrically connected to pin 2 of interface J1; pin 5 of programming interface J4 is electrically connected to pin 12 of main control chip U4; and pin 6 of programming interface J4 is electrically connected to pin 13 of main control chip U4.

[0052] In one possible implementation, pin 1 of USB interface J3 is connected to USB-5V, pin 2 (NC terminal) and pin 4 (RXD terminal) of USB interface J3 are both electrically connected to pin 12 of the main control chip U4, pin 3 (TXD terminal) of USB interface is electrically connected to pin 13 of the main control chip U4, and pin 5 of USB interface is grounded.

[0053] In one possible implementation, pin 1 of interface J1 of the main control chip U4 is electrically connected to the power supply terminal of the battery 400, thereby accessing the output voltage of the battery 400, and pin 2 of interface J1 of the main control chip U4 is grounded.

[0054] In one possible implementation, such as Figure 24As shown, it also includes: a reed switch B2, one end of which is connected to VCC_3.0V, and the other end of which is electrically connected to pin 21 of the main control chip U4; one end of a resistor R12 is electrically connected to one end of the reed switch B2, and the other end of the resistor R12 is grounded; and a capacitor C23 is connected in parallel with the resistor R12.

[0055] In one possible implementation, such as Figure 25 As shown, it also includes: a buzzer B1, with pin 1 of buzzer B1 connected to VCC_3.0V, pin 2 of buzzer B1 electrically connected to the collector of transistor T2, the base of transistor T2 electrically connected to pin 46 of the main control chip U4, and the emitter of transistor T2 grounded. One terminal of capacitor C17 is electrically connected to pin 1 of buzzer B1, and the other terminal of capacitor C17 is grounded. The anode of diode D5 is electrically connected to pin 2 of buzzer B1, and the cathode of diode D5 is electrically connected to pin 1 of buzzer B1. This is suitable for the main control chip U4 to control buzzer B1 to sound an alarm in an emergency.

[0056] In one possible implementation, such as Figure 26 As shown, it also includes an indicator light circuit; the indicator light circuit includes: a light-emitting diode D4 and a resistor R8; the negative terminal of the light-emitting diode D4 is grounded, the positive terminal of the light-emitting diode D4 is electrically connected to one end of the resistor R8, and the other end of the resistor R8 is electrically connected to pin 22 of the main control chip U4. This is suitable for use in emergency situations where the main control chip U4 illuminates the light-emitting diode D4. It should be noted that the light-emitting diode D4 is located on the inner top of the upper cover 100 and protrudes through a small hole in the top of the upper cover 100, thus facilitating external observation of the status of the light-emitting diode D4.

[0057] In one possible implementation, such as Figure 27 As shown, circuit board 300 has crystal oscillators Y1 and Y2. Pin 1 of crystal oscillator Y1 is electrically connected to pin 4 of main control chip U4, and pin 2 of crystal oscillator Y1 is electrically connected to pin 3 of main control chip U4. One terminal of capacitor C25 is electrically connected to pin 1 of crystal oscillator Y1, and the other terminal of capacitor C25 is grounded; one terminal of capacitor C26 is electrically connected to pin 2 of crystal oscillator Y1, and the other terminal of capacitor C26 is grounded. Pin 1 of crystal oscillator Y2 is electrically connected to pin 5 of main control chip U4, and pin 2 of crystal oscillator Y2 is electrically connected to pin 6 of main control chip U4. One terminal of capacitor C27 is electrically connected to pin 1 of crystal oscillator Y2, and the other terminal of capacitor C27 is grounded; one terminal of capacitor C28 is electrically connected to pin 2 of crystal oscillator Y2, and the other terminal of capacitor C28 is grounded. The two ends of resistor R16 are electrically connected to the two terminals of crystal oscillator Y2 respectively.

[0058] In one possible implementation, such as Figure 28As shown, a reset circuit is provided on the circuit board 300. One end of the resistor R17 is connected to VCC 3.0V, and the other end of the resistor R17 is electrically connected to pin 7 of the main control chip U4.

[0059] In one possible implementation, such as Figure 29 As shown, the circuit board 300 is equipped with a filter circuit, which includes capacitors C29, C30, C31, and C32 connected in parallel in sequence; one terminal of each of capacitors C29, C30, C31, and C32 is electrically connected to the output terminal of the DC 3.6V to 3.0V circuit, and the other terminal of each of capacitors C29, C30, C31, and C32 is grounded.

[0060] In one possible implementation, such as Figure 30 As shown, the circuit board 300 is equipped with a battery voltage detection circuit. One end of resistor R2 is electrically connected to pin 1 of interface J1 to access VBAT. The other end of resistor R22 is electrically connected to pin 10 of the main control chip U4. One end of resistor R24 ​​is electrically connected to resistor R22, and the other end of resistor R24 ​​is grounded. Capacitor C36 is connected in parallel with resistor R24.

[0061] In one possible implementation, such as Figure 31 As shown, the circuit board 300 has a 4G power detection circuit. One end of resistor R23 is electrically connected to pin 3 of MOSFET Q2, and the other end of resistor R23 is electrically connected to pin 11 of the main control chip U4. One end of resistor R25 is electrically connected to resistor R23, and the other end of resistor R25 is grounded. Capacitor C37 is connected in parallel with resistor R25.

[0062] In one possible implementation, such as Figure 32 As shown, the circuit board 300 is equipped with a debugging voltage detection circuit. One end of resistor R18 is connected to USB-5V, and the other end of resistor R18 is electrically connected to pin 2 of the main control chip U4. One end of resistor R19 is electrically connected to resistor R18, and the other end of resistor R19 is grounded. Capacitor C35 is connected in parallel with resistor R19.

[0063] An installation structure suitable for mounting a tilt vibration sensor includes: a mounting plate 500; the mounting plate 500 has two or more connection holes 510, the number of connection holes 510 being the same as the number of mounting holes 260 and corresponding one-to-one. The mounting plate 500 serves as a connecting bridge between the building structure and the tilt vibration sensor, improving the installation stability of the tilt vibration sensor.

[0064] Example 1: The main body of the mounting plate 500 is a circular plate structure.

[0065] In this embodiment 1, the two or more connecting holes 510 are all circular holes, and the two or more connecting holes 510 are arranged sequentially along the circumference of the mounting plate 500, and the two or more connecting holes 510 are located inside the two or more fixing holes 520.

[0066] In this embodiment 1, there are three connection holes 510.

[0067] In this embodiment 1, the mounting plate 500 has two or more fixing holes 520, and bolts 600 are suitable for passing through the fixing holes 520. The bolts 600 pass through the fixing holes 520 to install the mounting plate 500 in the position to be installed. Further, as... Figure 33 As shown, the fixing holes 520 are all arc-shaped holes; the arc-shaped hole structure is suitable for adjusting the mounting plate 500 to rotate within a certain range when the mounting plate 500 is installed, so as to adjust the installation state of the tilt vibration sensor at any time.

[0068] Furthermore, there are three fixing holes 520.

[0069] It should be noted that, as Figure 34 As shown, the mounting plate 500 of this embodiment 1 is suitable for mounting tilt vibration sensors on a horizontal surface of a building or platform.

[0070] Example 2: The main body of the mounting plate 500 is an L-shaped folded plate structure, and two or more connecting holes 510 are opened on the horizontal side of the mounting plate 500.

[0071] In this embodiment 2, as Figure 35 As shown, the connecting holes 510 are all arc-shaped holes; the arc-shaped hole structure is suitable for adjusting the tilt vibration sensor to produce a certain range of rotation when installing the tilt vibration sensor, so as to adjust the installation state of the tilt vibration sensor at any time.

[0072] Furthermore, there are six connecting holes 510 in total, and the six connecting holes 510 are arranged in a ring.

[0073] In this embodiment 2: the vertical side of the mounting plate 500 has two or more fixing holes 520, suitable for installing the mounting plate 500 at the installation position through the fixing holes 520. Further, as... Figure 35 As shown, the main body of the fixing hole 520 has an elongated oval hole structure, and the length directions of two or more fixing holes 520 are parallel to each other.

[0074] Furthermore, there are two fixing holes 520.

[0075] It should be noted that, as Figure 38As shown, bolt 600 passes through the fixing hole 520 of mounting plate 500 to fix mounting plate 500 to the wall, and bolt 700 passes through the connection hole 510 of mounting plate 500 to fix tilt vibration sensor on mounting plate 500. The mounting plate 500 of this embodiment 2 is suitable for installing tilt vibration sensor on the vertical surface of building or wall.

[0076] The various embodiments of the present invention have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles, practical application, or improvement of the technology in the market, or to enable others skilled in the art to understand the embodiments disclosed herein.

Claims

1. A tilt vibration sensor, characterized in that, include: Top cover, bottom shell, triaxial MEMS sensor, circuit board and battery; The top of the bottom shell has an open structure, and the top cover is fastened to the top opening of the bottom shell and is detachably connected to the bottom shell. A battery baffle is provided inside the cavity of the bottom shell; Both the circuit board and the battery are disposed inside the cavity of the bottom shell and are located on both sides of the battery baffle. The bottom shell is provided with two or more support columns, and the circuit board is placed on the support columns. The triaxial MEMS sensor is mounted on the circuit board, and the triaxial MEMS sensor is electrically connected to the main control chip on the circuit board to transmit the detection data to the main control chip. The bottom of the base shell has two or more mounting holes for installing the base shell in the installation position; The bottom of the base shell is marked with a Cartesian coordinate system.

2. The tilt vibration sensor according to claim 1, characterized in that, The main body of the upper cover is a hemispherical structure with a cavity, and the main body of the bottom shell is a cylindrical structure with a cavity.

3. The tilt vibration sensor according to claim 2, characterized in that, The inner wall of the top cover is provided with a threaded structure, and the outer wall of the bottom shell is provided with a matching threaded structure. The top cover and the bottom shell are threadedly connected.

4. The tilt vibration sensor according to claim 2, characterized in that, The side wall of the bottom shell has a protruding limiting part, and the bottom surface of the top cover abuts against the top surface of the limiting part.

5. The tilt vibration sensor according to claim 1, characterized in that, A sealing ring is provided between the top cover and the bottom shell.

6. The tilt vibration sensor according to claim 2, characterized in that, The mounting holes are provided in three places, and the three mounting holes are arranged sequentially along the circumference of the bottom shell.

7. A mounting structure suitable for mounting the tilt vibration sensor according to any one of claims 1-6, characterized in that, include: Mounting plate; The mounting plate has two or more connection holes, and the number of connection holes is the same as the number of mounting holes and they are arranged in a one-to-one correspondence.

8. The installation structure according to claim 7, characterized in that, The mounting plate has two or more fixing holes, which are used to install the mounting plate at the installation position.

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