A performance testing device for high-density electronic circuit boards

Abstract

This utility model relates to the field of circuit board testing, and in particular to a performance testing device for high-density electronic circuit boards. It includes a support mechanism comprising a support portion and a movable portion disposed on the support portion; a placement mechanism comprising an adjustment portion disposed on the support portion and two placement portions disposed on the adjustment portion; and a testing mechanism comprising a support portion disposed on the support portion and a testing portion disposed on the support portion. This high-density electronic circuit board performance testing device works by activating a second motor, causing two rotating shafts to approach each other and placing the circuit board in the middle; activating a first motor, causing the circuit board to reciprocate and impact the placement box, simulating the impact during circuit board transportation; extending a telescopic rod downwards, causing a counterweight ball to contact the circuit board and gradually press down, performing a three-point bending test to test the circuit board's bending strength; retracting the telescopic rod upwards, moving the counterweight ball to different heights; and deactivating the electromagnet, causing the counterweight ball to fall and impact the circuit board, testing the circuit board's impact strength.

Description

Technical Field

[0001] This utility model relates to the field of circuit board testing, and in particular to a performance testing device for high-density electronic circuit boards. Background Technology

[0002] High-density electronic circuit boards (HDPCBs) are printed circuit boards that employ fine lines, micro-apertures, and high-density wiring technology. They are primarily used to meet the demands of miniaturization, thinning, and high integration in electronic devices. Their core characteristics are significantly higher line density, via density, and component packaging density per unit area compared to traditional PCBs. They are widely used in high-end fields such as smartphones, tablets, laptops, 5G communication equipment, and aerospace electronics.

[0003] High-density electronic circuit boards require numerous performance tests before leaving the factory, including appearance and dimensional inspection, electrical performance inspection, mechanical performance inspection, and environmental adaptability inspection. Among these, mechanical performance inspection includes bending strength testing, impact resistance testing, and collision resistance testing, which are used to check whether their mechanical performance meets the standards.

[0004] Existing performance testing devices for high-density electronic circuit boards generally use different equipment for various mechanical performance tests. This method requires moving the circuit board multiple times, which is inconvenient and has low testing efficiency.

[0005] Therefore, we propose a device for rapidly performing various mechanical performance tests on circuit boards. Utility Model Content

[0006] In view of the problems existing in the prior art, this utility model is proposed.

[0007] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a performance testing device for high-density electronic circuit boards, comprising a support mechanism, including a support part and a movable part disposed on the support part;

[0008] The placement mechanism includes an adjustment part disposed on the support part and two placement parts disposed on the adjustment part;

[0009] The testing mechanism includes a support portion disposed on the support portion and a testing portion disposed on the support portion;

[0010] The placement part places the circuit board, and the moving part drives it to move back and forth to simulate the stability of the circuit board after transportation. The midpoint of the circuit board moves to below the detection part, and the detection part performs a three-point bending test. The detection part is located at different heights to perform a ball drop impact test.

[0011] In a preferred embodiment of the performance testing device for high-density electronic circuit boards of this utility model, the supporting part includes a supporting plate and a sliding groove disposed on the upper wall of the supporting plate.

[0012] In a preferred embodiment of the performance testing device for high-density electronic circuit boards of this utility model, the moving part includes a first screw rotatably disposed in the sliding groove, a sliding block slidably disposed in the sliding groove, and a first motor disposed on the side wall of the support plate. The first screw passes through the sliding block and is threadedly connected to it, and the first motor drives the first screw to rotate.

[0013] In a preferred embodiment of the performance testing device for high-density electronic circuit boards of this utility model, the adjustment part includes a horizontal plate fixedly disposed on the upper wall of the sliding block, and a moving groove disposed on the upper wall of the horizontal plate.

[0014] As a preferred embodiment of the performance testing device for the high-density electronic circuit board of this utility model, the adjustment unit further includes a bidirectional screw rotatably disposed in the moving slot and a second motor disposed on the side wall of the horizontal plate, the second motor driving the bidirectional screw to rotate.

[0015] As a preferred embodiment of the performance testing device for high-density electronic circuit boards of this utility model, the placement part includes a movable block slidably disposed in the movable groove, a vertical rod fixedly disposed on the upper wall of the movable block, and a bidirectional screw passing through two of the movable blocks and threadedly connected to both of them, with the thread directions at the connection points being opposite.

[0016] As a preferred embodiment of the performance testing device for high-density electronic circuit boards of this utility model, the placement part further includes a placement box fixedly mounted on the vertical rod, a rotating shaft rotatably mounted inside the placement box, and no sidewall is provided on the opposite side of the placement box.

[0017] In a preferred embodiment of the performance testing device for high-density electronic circuit boards of this utility model, the support part includes two support rods fixedly disposed on the upper wall of the support plate, and a crossbeam disposed above the support plate, wherein the crossbeam is fixedly connected to the support plate through the two support rods.

[0018] In a preferred embodiment of the performance testing device for high-density electronic circuit boards of this utility model, the testing unit includes a telescopic rod disposed on the lower wall of the crossbeam and an electromagnet fixedly disposed at the lower end of the telescopic rod.

[0019] In a preferred embodiment of the performance testing device for the high-density electronic circuit board of this utility model, the testing unit further includes a counterweight ball disposed below the electromagnet, the counterweight ball being configured in conjunction with the electromagnet and being attracted by a magnet.

[0020] The beneficial effects of this invention are as follows: This high-density electronic circuit board performance testing device activates a second motor, bringing two rotating shafts closer together to a suitable distance. A circuit board is placed in the middle of this distance. Activating the first motor drives a sliding block and a horizontal plate to reciprocate, causing the circuit board to reciprocate and impact the placement box, simulating the impact during circuit board transportation. A telescopic rod extends downwards, causing a counterweight ball to contact the circuit board and gradually press down, performing a three-point bending test to assess the circuit board's bending strength. The telescopic rod retracts upwards, moving the counterweight ball to different heights. Turning off the electromagnet causes the counterweight ball to fall and impact the circuit board, testing its impact resistance. This device can perform impact resistance, bending strength, and shock resistance tests on circuit boards without requiring multiple moves of the circuit board, thus improving testing efficiency. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them:

[0022] Figure 1 This is a top view of the overall structure of this utility model.

[0023] Figure 2 This is a top view of the overall structure of this utility model.

[0024] Figure 3 This is a front view schematic diagram of the overall structure of this utility model.

[0025] Figure 4 This utility model Figure 1 Enlarged schematic diagram of the structure at point A in the middle. Detailed Implementation

[0026] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0027] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0028] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that excludes other embodiments.

[0029] Example 1, referring to 1-4, is the first embodiment of this utility model, providing a performance testing device for high-density electronic circuit boards. This device includes a support mechanism 1, including a support part 11, the support part 11 including a support plate 111, and a sliding groove 112 disposed on the upper wall of the support plate 111.

[0030] The support portion 11 is provided with a movable portion 12, which includes a first screw 121 rotatably disposed in the sliding groove 112, a sliding block 122 slidably disposed in the sliding groove 112, and a first motor 123 disposed on the side wall of the support plate 111. The first screw 121 passes through the sliding block 122 and is threadedly connected to it. The first motor 123 drives the first screw 121 to rotate.

[0031] A placement mechanism 2 is provided on the support portion 11. The placement mechanism 2 includes an adjustment portion 21 provided on the support portion 11. The adjustment portion 21 includes a horizontal plate 211 fixedly provided on the upper wall of the sliding block 122 and a moving groove 212 provided on the upper wall of the horizontal plate 211. The adjustment portion 21 also includes a bidirectional screw 213 rotatably provided in the moving groove 212 and a second motor 214 provided on the side wall of the horizontal plate 211. The second motor 214 drives the bidirectional screw 213 to rotate.

[0032] The adjustment section 21 is provided with two placement sections 22. Each placement section 22 includes a movable block 221 slidably disposed in a movable groove 212, a vertical rod 222 fixedly disposed on the upper wall of the movable block 221, and a bidirectional screw 213 passing through the two movable blocks 221 and threadedly connected to both of them, with the threads at the connection points in opposite directions. The placement section 22 also includes a placement box 223 fixedly disposed on the vertical rod 222, and a rotating shaft 224 rotatably disposed in the placement box 223. The placement box 223 does not have a side wall on one side. The placement box 223 and the rotating shaft 224 cooperate to facilitate the placement of the circuit board.

[0033] The support part 11 is provided with a detection mechanism 3. The detection mechanism 3 includes a support part 31 provided on the support part 11. The support part 31 includes two support rods 311 fixedly provided on the upper wall of the support plate 111 and a crossbeam 312 provided above the support plate 111. The crossbeam 312 is fixedly connected to the support plate 111 through the two support rods 311.

[0034] A detection unit 32 is provided on the support part 31. The detection unit 32 includes a telescopic rod 321 disposed on the lower wall of the crossbeam 312, and an electromagnet 322 fixedly disposed at the lower end of the telescopic rod 321. The detection unit 32 also includes a counterweight ball 323 disposed below the electromagnet 322. The counterweight ball 323 is configured to cooperate with the electromagnet 322, and the counterweight ball 323 can be attracted by a magnet. The counterweight ball 323 can be replaced with different weights, and the counterweight balls 323 of different weights are located at different heights to achieve a wider range of impact strength testing.

[0035] It is worth mentioning that the three-point bending test involves placing a strip specimen on two support points and applying a concentrated load in the middle of the specimen, causing it to bend and deform until it breaks. After the circuit board is placed on two rotating shafts 224, a concentrated load is applied to its middle, constituting a three-point bending test. The force sensor of this invention is located at the connection between the lower end of the telescopic rod 321 and the electromagnet 322. After the pressure is transmitted to the counterweight ball 323 and the electromagnet 322, the force sensor deforms and detects the load in real time.

[0036] It is important to note that the falling ball impact test is a test method that evaluates the impact resistance of a sample by dropping a ball of specified mass freely from a specific height to impact the surface of the sample. Its core purpose is to simulate the impact strength, surface hardness, brittleness, and other properties of a material or product when it is subjected to an accidental impact.

[0037] In practical use, the second motor 214 is first started, bringing the two rotating shafts 224 closer together to a suitable distance, allowing the circuit board to be placed smoothly in the middle with sufficient margin on both sides for bending strength testing. The first motor 123 is then started, driving the sliding block 122 and the horizontal plate 211 to move back and forth, causing the circuit board to reciprocate and impact the placement box 223, simulating the impact during circuit board transportation. The telescopic rod 321 extends downward, and the counterweight ball 323 contacts the circuit board and gradually presses it down. The force sensor at the connection between the electromagnet 322 and the telescopic rod 321 detects the load in real time, performing a three-point bending test to test the bending strength of the circuit board. The telescopic rod 321 retracts upward, moving the counterweight ball 323 to different heights. The electromagnet 322 is then turned off, causing the counterweight ball 323 to fall and impact the circuit board, testing its impact strength. This device can perform impact resistance testing, bending strength testing, and impact strength testing of circuit boards without requiring multiple moves of the circuit board, thus improving testing efficiency.

[0038] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., changes in the size, dimensions, structure, shape and proportion of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application). For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise altered, and the nature or number or position of discrete elements may be changed or altered. Therefore, all such modifications are intended to be included within the scope of this utility model. The order or sequence of any process or method steps may be changed or reordered according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and not only structural equivalents but also equivalent structures. Without departing from the scope of this invention, other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments. Therefore, this invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0039] Furthermore, in order to provide a concise description of exemplary embodiments, not all features of actual embodiments (i.e., those features that are not relevant to the best mode of carrying out the present invention as currently considered, or those features that are not relevant to the implementation of the present invention) may be omitted.

[0040] It should be understood that numerous specific implementation decisions can be made during the development of any practical implementation, such as in any engineering or design project. Such development efforts may be complex and time-consuming, but for those skilled in the art who benefit from this disclosure, the development effort will be a routine work of design, manufacturing, and production without requiring much experimentation.

[0041] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A performance testing device for high-density electronic circuit boards, characterized in that: include, The support mechanism (1) includes a support part (11) and a movable part (12) disposed on the support part (11). The placement mechanism (2) includes an adjustment part (21) disposed on the support part (11) and two placement parts (22) disposed on the adjustment part (21). The testing mechanism (3) includes a support (31) disposed on the support (11) and a testing part (32) disposed on the support (31). The placement part (22) places the circuit board, and the moving part (12) drives it to move back and forth to simulate the stability of the circuit board after transportation. The center point of the circuit board moves to below the detection part (32), and the detection part (32) performs a three-point bending test. The detection part (32) is located at different heights to perform a ball drop impact test.

2. The performance testing device for high-density electronic circuit boards as described in claim 1, characterized in that: The support part (11) includes a support plate (111) and a sliding groove (112) disposed on the upper wall of the support plate (111).

3. The performance testing apparatus for high-density electronic circuit boards as claimed in claim 2, wherein: The moving part (12) includes a first screw (121) rotatably disposed in the sliding groove (112), a sliding block (122) slidably disposed in the sliding groove (112), and a first motor (123) disposed on the side wall of the support plate (111). The first screw (121) passes through the sliding block (122) and is threadedly connected to it. The first motor (123) drives the first screw (121) to rotate.

4. The performance testing apparatus for high-density electronic circuit boards as claimed in claim 3, wherein: The adjustment part (21) includes a horizontal plate (211) fixedly disposed on the upper wall of the sliding block (122) and a moving groove (212) disposed on the upper wall of the horizontal plate (211).

5. The performance testing device for high-density electronic circuit boards as described in claim 4, characterized in that: The adjustment unit (21) further includes a bidirectional screw (213) rotatably disposed in the moving groove (212) and a second motor (214) disposed on the side wall of the horizontal plate (211), the second motor (214) driving the bidirectional screw (213) to rotate.

6. The performance testing apparatus for high-density electronic circuit boards as claimed in claim 5, wherein: The placement part (22) includes a movable block (221) slidably disposed in the movable groove (212), a vertical rod (222) fixedly disposed on the upper wall of the movable block (221), and a bidirectional screw (213) passing through the two movable blocks (221) and threadedly connected to both of them, with the thread directions at the connection points being opposite.

7. The performance testing apparatus for high density electronic circuit boards as claimed in claim 6, wherein: The placement part (22) also includes a placement box (223) fixedly mounted on the vertical rod (222), a rotating shaft (224) rotatably mounted inside the placement box (223), and no side wall is provided on the opposite side of the placement box (223).

8. The performance testing apparatus for high-density electronic circuit boards as claimed in any one of claims 2 to 7, wherein: The support part (31) includes two support rods (311) fixedly disposed on the upper wall of the support plate (111) and a crossbeam (312) disposed above the support plate (111). The crossbeam (312) is fixedly connected to the support plate (111) through the two support rods (311).

9. The performance testing apparatus for high density electronic circuit boards as recited in claim 8, wherein: The detection unit (32) includes a telescopic rod (321) disposed on the lower wall of the crossbeam (312) and an electromagnet (322) fixedly disposed at the lower end of the telescopic rod (321).

10. The performance testing apparatus for high density electronic circuit boards as recited in claim 9, wherein: The detection unit (32) also includes a counterweight ball (323) disposed below the electromagnet (322). The counterweight ball (323) is disposed in cooperation with the electromagnet (322), and the counterweight ball (323) can be attracted by a magnet.

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