An auxiliary device for acoustic emission detection of high-temperature containers

Abstract

This invention discloses an auxiliary device for acoustic emission detection of high-temperature containers, comprising a waveguide rod, a cooling device, and a fixing device. The lower end of the waveguide rod is connected to the surface of the high-temperature container via the fixing device, and the upper end is coupled to an acoustic emission sensor. The cooling device is arranged around the outside of the waveguide rod, and a cooling medium circulates from bottom to top within the cooling device to rapidly exchange the heat absorbed by the waveguide rod. The middle and lower sections of the waveguide rod penetrate the cooling device and are in close contact with it. The cooling device has one or more sets, and the cooling devices use the same or different cooling media. This invention, by setting a cooling device outside the waveguide rod, allows the heat absorbed by the waveguide rod from the surface of the high-temperature container to be rapidly released through heat exchange with the cooling medium, thereby shortening the length of the waveguide rod. It features short acoustic emission signal transmission distance, reduced acoustic emission signal attenuation, and high accuracy of detection results.

Description

Technical Field

[0001] This utility model belongs to the field of acoustic emission detection technology, and specifically relates to an auxiliary device for acoustic emission detection of high-temperature containers. Background Technology

[0002] During the online operation or pressure test of pressure equipment, several highly sensitive sensors are arranged on the outer wall of the container. A certain pressure is applied to the container, and the internal defects of the material can be determined by the received acoustic emission signals. This is because the initiation and propagation of cracks, the yielding and plastic deformation of materials, and the fracture of materials all release acoustic emission signals of different intensities. Further analysis and processing of these signals can reveal internal defects of the material and identify their location and severity.

[0003] Most existing acoustic emission sensors can only be used in ambient temperature environments. When the test specimen is in a high-temperature container, the maximum operating temperature of the sensor and coupling agent is limited, and a waveguide is usually needed to transmit the acoustic emission wave from the high-temperature end of the specimen surface to the sensor at the ambient temperature. During use, the interface between the waveguide and the specimen surface, the interface between the waveguide and the acoustic emission sensor, and the transmission distance within the waveguide all contribute to transmission attenuation and waveform distortion, resulting in acoustic emission signal attenuation. Therefore, controlling the amount of acoustic emission signal attenuation during transmission from the specimen surface to the acoustic emission sensor is the primary prerequisite for ensuring the accuracy of the detection results.

[0004] In existing technologies, due to the high temperature of the specimen surface, a relatively long waveguide rod is typically used to ensure the stability of the acoustic emission sensor. The lower end of the waveguide rod is fixed to the specimen surface by a fixing device, while the upper end is coupled to the acoustic emission sensor. However, due to the large length of the waveguide rod, firstly, the center of gravity of the waveguide rod is far from the fixing device, making it difficult to control the degree of contact between the lower end of the waveguide rod and the specimen surface, resulting in increased acoustic emission signal loss. This loss is particularly severe when the specimen is a small high-temperature container with a large curvature. Secondly, the long transmission distance of the acoustic emission signal within the waveguide rod leads to a high degree of attenuation of the acoustic emission wave, resulting in poor signal quality received by the sensor and making it impossible to effectively monitor the equipment. Thirdly, the excessive length also makes it difficult to fix and control the coupling between the upper end of the waveguide rod and the coupling surface of the acoustic emission sensor, which is also not conducive to controlling the signal attenuation. Consequently, the reliability of the detection results cannot be effectively guaranteed. Utility Model Content

[0005] The purpose of this invention is to propose an auxiliary device for acoustic emission detection of high-temperature containers, in order to solve the problem that existing acoustic emission detection processes for high-temperature containers require the setting of a large-length waveguide rod, which makes it impossible to effectively control the attenuation of acoustic emission signals.

[0006] To achieve the above objectives, this utility model is realized through the following technical solution: This utility model proposes an acoustic emission detection auxiliary device for high-temperature containers, including a waveguide rod. The lower end of the waveguide rod is connected to the surface of the high-temperature container through a fixing device, and the upper end is coupled to an acoustic emission sensor. A cooling device is also provided, which is arranged around the outside of the waveguide rod. A cooling medium circulates from bottom to top in the cooling device to quickly exchange the heat absorbed by the waveguide rod. The middle and lower section of the waveguide rod passes through the cooling device and is in close contact with the cooling device. The waveguide rod is fixed to the upper end of the cooling device by a limiting structure. The cooling device is provided in one or more sets, and the same or different cooling media circulate in the cooling device.

[0007] Based on the above technical solutions, by setting a cooling device outside the waveguide rod, the heat absorbed by the waveguide rod from the surface of the high-temperature container can be quickly released through heat exchange with the cooling medium, thereby shortening the length of the waveguide rod, reducing the acoustic emission signal transmission distance, reducing signal attenuation, and also facilitating a stable connection between the waveguide rod and the surface of the high-temperature container.

[0008] Preferably, the cooling device is a hollow cylinder coaxial with the waveguide rod, the hollow cylinder is filled with the cooling medium, the middle and lower section of the waveguide rod penetrates the hollow cylinder and directly contacts the cooling medium for heat exchange, a sealing element is provided at the connection between the hollow cylinder and the waveguide rod, and the upper end of the waveguide rod and the hollow cylinder are fixedly connected by the limiting structure. The cooling device designed in this way has a simple structure and a large contact surface between the cooling medium and the vacuum tube, which is conducive to improving the heat exchange efficiency.

[0009] Preferably, the cooling device is a spiral coil or a spiral half-tube, with a hollow channel formed inside the spiral coil or spiral half-tube. The waveguide rod is disposed in the hollow channel and closely attached to the cooling device. The waveguide rod is fixedly connected to the upper end of the cooling device through the limiting structure. The cooling medium circulates inside the spiral coil or spiral half-tube. This design of the cooling device facilitates the adjustment of the circulation speed of the cooling medium and provides higher controllability of heat exchange efficiency.

[0010] More preferably, the cooling medium is cooling water, ethylene glycol, or a phase change material.

[0011] Preferably, the cooling device is provided in multiple sets. The cooling device near the high-temperature container end has a cooling medium with a high thermal conductivity circulating inside, while the cooling device near the acoustic emission sensor end has a cooling medium with a low thermal conductivity circulating inside. The purpose of this design is to set up cooling devices with different heat exchange degrees according to the temperature distribution of the waveguide rod, so that the high-temperature area near the container can quickly exchange heat to achieve rapid cooling, while the relatively low-temperature area near the sensor end can exchange heat gently, so as to avoid excessive heat exchange that would cause performance loss of the coupling agent between the acoustic emission sensor and the waveguide rod.

[0012] Preferably, a vacuum anti-fading structure is also provided. The vacuum anti-fading structure is located between the cooling device and the waveguide rod and is fixedly connected to the cooling device. The vacuum anti-fading structure is a vacuum tube with a vacuum source connected to it and closed at the upper end. The inner diameter of the vacuum tube is slightly larger than the outer diameter of the waveguide rod. The waveguide rod is installed through the vacuum tube but does not contact the tube wall. A limiting structure is located at the upper end of the vacuum tube. The limiting structure is used to fix the waveguide rod and the vacuum tube. A sealing element is provided at the contact surface between the upper end of the vacuum tube and the waveguide rod. A suction cup is provided at the lower end of the vacuum tube. The suction cup is adsorbed onto the surface of the high-temperature container to seal the lower end of the vacuum tube and assist in fixing the waveguide rod. A fixing device is located at the lower part of the cooling device to provide support and fixation for the waveguide rod.

[0013] Based on the above settings, the vacuum level around the waveguide rod is controlled by the vacuum anti-attenuation structure, which ensures that the acoustic emission signal can only be transmitted from inside the waveguide rod and will not be lost outward, thereby further reducing the signal attenuation. At the same time, the distance between the vacuum tube and the waveguide rod is controlled so that the waveguide rod can conduct heat over a short distance through thermal radiation inside the vacuum tube before exchanging heat with the cooling device, thus ensuring effective heat dissipation of the waveguide rod.

[0014] Furthermore, a guide ring is provided inside the vacuum tube, and the waveguide rod passes through the guide ring and is coaxially arranged with the vacuum tube to ensure that the waveguide rod is always in the position of the detection device axis, thereby ensuring that when installed on a high-temperature container, the lower end of the waveguide rod is in close contact with the surface of the container.

[0015] Preferably, the fixing device includes a support plate and an adsorption assembly. The support plate is fixed on the cooling device. Several adsorption assemblies are provided. The upper end of each adsorption assembly is located on the support plate, and the lower end is adsorbed and connected to the surface of the high-temperature container. The adsorption assemblies are distributed in a ring around the waveguide rod. This design, through the ring-shaped distribution of adsorption assemblies, can form a circumferential fixation on the outer periphery of the waveguide rod, which is more conducive to the adhesion between the waveguide rod and the container surface.

[0016] More preferably, the adsorption assembly includes a guide rod, a spring, and an adsorption head. The upper end of the guide rod is movably mounted on the support plate, and the spring is sleeved on the guide rod. One end of the spring is fixedly connected to the lower surface of the support plate, and the other end is fixedly connected to the adsorption head. The adsorption head is a magnetic block or a vacuum suction cup. This design allows the adsorption assembly to better adapt to the curvature changes of the container surface, enhances the adsorption effect, and helps to further ensure the tight fit between the waveguide rod and the container surface. It is particularly suitable for acoustic emission detection of small high-temperature containers with large curvature changes in the body.

[0017] Preferably, the upper end of the waveguide rod is provided with a mounting platform for mounting and fixing the acoustic emission sensor. The mounting platform includes a C-shaped frame and a fastening structure. The inner diameter of the C-shaped frame is the same as the outer diameter of the acoustic emission sensor. The bottom surface of the C-shaped frame is a placement plane. The placement plane is flush with the upper surface of the waveguide rod and extends through the placement plane. The fastening structure includes a T-shaped shaft and a fastening spring. The lower end of the T-shaped shaft extends through the top surface of the C-shaped frame and into the C-shaped frame. The fastening spring is fixed between the upper end of the T-shaped shaft and the top surface of the C-shaped frame. In use, the acoustic emission sensor is placed in the placement plane and clamped and fixed by the fastening structure. The purpose of this design is to maintain a stable connection between the acoustic emission sensor and the waveguide rod in a fixed position, which is beneficial to the coupling stability between the two and to reducing the detection error between different detection points caused by the connection state during the acoustic emission detection process, thereby further improving the reliability of the detection results.

[0018] Preferably, the waveguide rod is made of a material that is the same as or similar in properties to the test piece, so as to reduce or eliminate the loss of acoustic emission detection signal caused by the difference in acoustic impedance of the materials.

[0019] Beneficial effects One of the above technical solutions has the following advantages or beneficial effects: (1) By setting a cooling device outside the waveguide rod, the heat absorbed by the waveguide rod from the surface of the high-temperature container can be quickly released through heat exchange with the cooling medium, thereby shortening the length of the waveguide rod, reducing the acoustic emission signal transmission distance, reducing the signal attenuation, and also facilitating the stable connection between the waveguide rod and the surface of the high-temperature container.

[0020] (2) By setting up a vacuum anti-attenuation structure, the vacuum level around the waveguide rod is controlled, so that the acoustic emission signal can only be transmitted from inside the waveguide rod and will not be lost outward, thereby further reducing the signal attenuation. At the same time, the distance between the vacuum tube and the waveguide rod is controlled, so that the waveguide rod can conduct heat through short distance in the vacuum tube by thermal radiation and then exchange heat with the cooling device, ensuring effective heat dissipation of the waveguide rod. The detection device has the characteristics of short acoustic emission signal transmission distance and less signal loss during transmission, and thus has the characteristics of small signal attenuation and high reliability of detection results.

[0021] (3) By setting a fixing device including a ring-shaped distributed adsorption component, and a combination structure of guide rod, spring and adsorption head in the adsorption component, circumferential fixing is achieved on the outer periphery of the waveguide rod, which better adapts to the curvature change of the container surface, enhances the adsorption effect, and further ensures the tight fit between the waveguide rod and the container surface. It is especially suitable for acoustic emission detection of small high-temperature containers with large curvature changes in the body.

[0022] (4) By setting up an installation platform including a C-shaped frame and a fastening structure at the upper end of the waveguide rod, the acoustic emission sensor and the waveguide rod are always kept in a stable connection with a relatively fixed position. This not only helps to improve the coupling stability between the two, but also helps to reduce the detection error between different detection points caused by the connection status during the acoustic emission detection process, thereby further improving the reliability of the detection results. Attached Figure Description

[0023] Other features, objects, and advantages of this invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings: Figure 1 This is a schematic diagram of the overall structure of Embodiment 1 of the present utility model; Figure 2 This is a cross-sectional structural diagram of Embodiment 1 of the present utility model; Figure 3 This is a schematic diagram of the fixing device according to Embodiment 1 of this utility model; Figure 4 This is a schematic diagram of the cooling device structure according to Embodiment 2 of this utility model; Figure 5 This is a schematic diagram of the cooling device structure according to Embodiment 3 of this utility model; Figure 6 This is a cross-sectional structural diagram of Embodiment 3 of the present invention; In the diagram: 1. Mounting platform; 11. C-shaped frame; 111. Placement plane; 12. Fastening structure; 121. T-shaped shaft; 122. Fastening spring; 2. Waveguide rod; 3. Cooling device; 31. Hollow column; 32. Spiral half tube; 4. Fixing device; 41. Support plate; 42. Adsorption assembly; 421. Guide rod; 422. Reinforcing spring; 423. Adsorption head; 5. Seal; 6. Vacuum tube; 61. Guide ring; 7. Limiting structure; 8. Suction cup. Detailed Implementation

[0024] The present invention will be further described in detail below with reference to the embodiments, but the implementation of the present invention is not limited thereto.

[0025] Example 1 like Figure 1 and Figure 2 As shown, this embodiment provides an acoustic emission detection auxiliary device for high-temperature containers, including a waveguide rod 2, a cooling device 3, and a fixing device 4. The lower end of the waveguide rod 2 is connected to the surface of the high-temperature container through the fixing device 4, and the upper end is coupled to an acoustic emission sensor (not shown in the figure).

[0026] The cooling device 3 is arranged around the outside of the waveguide rod 2. A cooling medium circulates within the cooling device 3 from bottom to top to rapidly exchange the heat absorbed by the waveguide rod 2. The lower middle section of the waveguide rod 2 passes through the cooling device 3 and is in close contact with it. The waveguide rod is fixed to the upper end of the cooling device by a limiting structure 7. The cooling device 3 can be provided in one or more sets, and can use the same or different cooling media. When there are multiple sets of cooling devices 3, they are interconnected, and the waveguide rod 2 is fixedly connected to the uppermost cooling device 3.

[0027] Preferably, the cooling device 3 is provided in a set, covering the middle and lower sections of the waveguide rod 2 (i.e., the end near the surface of the high-temperature container); the cooling device 3 is a hollow cylindrical shape 31 coaxial with the waveguide rod 2, the hollow cylindrical shape 31 is filled with the cooling medium, the middle and lower sections of the waveguide rod 2 penetrate the hollow cylindrical shape 31 and directly contact the cooling medium for heat exchange, a sealing element 5 is provided at the connection between the hollow cylindrical shape 31 and the waveguide rod 2, and the cooling medium is cooling water, ethylene glycol or phase change material, which is specifically selected according to the surface temperature of the high-temperature container being tested.

[0028] like Figure 3 As shown, the fixing device 4 is located at the lower part of the cooling device 3 and is used to provide support and fixation for the waveguide rod 2. The fixing device 4 includes a support plate 41 and an adsorption assembly 42. The support plate 41 is fixed on the cooling device 3. Several adsorption assemblies 42 are provided. The upper end of each adsorption assembly 42 is located on the support plate 41, and the lower end is adsorbed and connected to the surface of the high-temperature container. The adsorption assemblies 42 are distributed in a ring around the waveguide rod 2 to form a circumferential fixation on the outer periphery of the waveguide rod 2. Each adsorption assembly 42 includes a guide rod 421, a reinforcing spring 422, and an adsorption head 423. The upper end of the guide rod 421 is movably located on the support plate 41. The reinforcing spring 422 is sleeved on the guide rod 421. One end of the reinforcing spring 422 is fixedly connected to the lower surface of the support plate 41, and the other end is fixedly connected to the adsorption head 423. The adsorption head 423 is a magnetic block or a vacuum suction cup 8 to better adapt to the curvature changes of the container surface and to promote a tight fit between the waveguide rod 2 and the container surface.

[0029] The acoustic emission sensor can be coupled to the upper end of the waveguide rod 2 by means of adhesive, magnetic attraction, etc. Preferably, in this embodiment, the upper end of the waveguide rod 2 is provided with a mounting platform 1 for mounting and fixing the acoustic emission sensor. The mounting platform 1 includes a C-shaped frame 11 and a fastening structure 12. The inner diameter of the C-shaped frame 11 is the same as the outer diameter of the acoustic emission sensor. The inner bottom surface of the C-shaped frame 11 is a placement plane 111. The placement plane 111 is flush with the upper surface of the waveguide rod 2 and extends through the placement plane 111. The fastening structure 12 includes a T-shaped shaft 121 and a fastening spring 122. The lower end of the T-shaped shaft 121 passes through the upper top surface of the C-shaped frame 11 and extends... Extending into the C-shaped frame 11, the fastening spring 122 is fixed between the upper end of the T-shaped shaft 121 and the top surface of the C-shaped frame 11. In use, the acoustic emission sensor is placed on the placement plane 111 inside the C-shaped frame 11 and is clamped and fixed by the fastening structure 12. Specifically, when the acoustic emission sensor is not inserted, the fastening spring 122 is in a free state, and the distance between the lower end of the T-shaped shaft 121 and the placement plane 111 is less than the thickness of the acoustic emission sensor. After the acoustic emission sensor is inserted, the fastening spring 122 is in a compressed state, which drives the T-shaped shaft 121 to press down on the acoustic emission sensor to achieve fixation.

[0030] Furthermore, the waveguide rod 2 is made of a material that is the same as or similar in properties to the test piece, in order to reduce or eliminate the loss of acoustic emission detection signal caused by the difference in acoustic impedance of the materials. For example, when the high-temperature container to be tested is a high-temperature container made of stainless steel, a waveguide rod 2 made of 316L stainless steel is used for testing.

[0031] The advantages of this embodiment are as follows: by setting a cooling device 3 outside the waveguide rod, the heat absorbed by the waveguide rod 2 from the surface of the high-temperature container can be quickly released through heat exchange with the cooling medium, thus shortening the installation length of the waveguide rod 2; at the same time, by setting the annular adsorption component 42 of the fixing device 4 and the mounting platform 1 at the upper end of the waveguide rod 2, the attenuation of the acoustic emission signal can be controlled at each stage from the receiving end of the waveguide rod 2, the transmission inside the rod, and the transmission end to the acoustic emission sensor, thereby effectively improving the signal strength received by the acoustic emission sensor and thus improving the accuracy of the detection results.

[0032] Example 2 like Figure 4 As shown, this embodiment provides an acoustic emission detection auxiliary device for high-temperature containers, which differs from Embodiment 1 in that: The cooling device 3 is configured as a set, and the cooling device 3 is a spiral coil or spiral half-tube 32. A hollow channel is formed inside the spiral coil or spiral half-tube 32. In this embodiment, a spiral half-tube 32 with a larger contact surface is used. The waveguide rod is disposed in the hollow channel and is set close to the spiral half-tube 32. The cooling medium circulates inside the spiral half-tube 32. The cooling medium flows from the side near the surface of the high-temperature container and flows out from the side near the acoustic emission sensor, circulating from bottom to top. The heat of the waveguide rod 2 is rapidly dissipated through heat exchange at the contact point with the spiral coil.

[0033] The advantage of this embodiment is that by setting the cooling device 3 as a spiral coil or spiral half-tube 32 structure, it is easier to adjust the circulation speed of the cooling medium, and the heat exchange efficiency is more controllable.

[0034] Example 3 This embodiment provides an auxiliary device for acoustic emission detection of high-temperature containers, which differs from embodiments one and two in that: The cooling device 3 is provided in multiple sets, and the cooling device 3 can adopt the structure of Embodiment 1 or Embodiment 2, such as... Figure 5 As shown, this embodiment includes two interconnected cooling devices 3. The cooling devices 3 adopt the spiral half-tube 32 structure of Embodiment 2. The waveguide rod 2 is connected to the upper end of the cooling device 3 near the high-temperature container end via a limiting structure 7. The cooling device 3 near the high-temperature container end circulates a cooling medium with high thermal conductivity, such as ethylene glycol, fluorinated liquid, or other phase change materials. The cooling device 3 near the acoustic emission sensor end circulates a cooling medium with low thermal conductivity, such as cooling water. The cooling medium inlet of each cooling device 3 is located at the lower end, and the outlet is located at the upper end, circulating from bottom to top. The initial temperature of the cooling medium also increases from bottom to top. The number of cooling device 3 sets is determined based on the surface temperature of the high-temperature container and the operating temperature of the acoustic emission sensor.

[0035] The advantage of this embodiment is that: cooling devices 3 with different heat exchange degrees can be set according to the temperature distribution of the waveguide rod 2, so that the high temperature area near the container can quickly exchange heat to achieve rapid cooling, while the relatively low temperature area near the sensor end can exchange heat gently, so as to avoid excessive heat exchange leading to performance loss of the coupling agent between the acoustic emission sensor and the waveguide rod 2.

[0036] Example 4 like Figure 6 As shown, this embodiment provides an auxiliary device for acoustic emission detection of high-temperature containers, which differs from the previous embodiments in that: A vacuum anti-attenuation structure is also provided. The vacuum anti-attenuation structure is located between the cooling device 3 and the waveguide rod 2 and is fixedly connected to the cooling device 3. The vacuum anti-attenuation structure is a vacuum tube 6 with a vacuum source connected to its upper end and closed. The vacuum tube 6 and the vacuum source can be connected through a quick connector. The inner diameter of the vacuum tube 6 is slightly larger than the outer diameter of the waveguide rod 2. The waveguide rod 2 is laid through the vacuum tube 6 but does not contact the tube wall of the vacuum tube 6, so that there is a vacuum section between the waveguide rod 2 and the cooling device 3 to prevent the acoustic emission signal from escaping, but without reducing the thermal radiation efficiency in the vacuum section due to the excessive distance. This ensures that the waveguide rod 2 can still quickly exchange heat through the cooling device 3. That is, the difference between the inner diameter of the vacuum tube 6 and the outer diameter of the waveguide rod 2 is determined according to the acoustic emission signal blocking distance and the vacuum thermal radiation efficiency.

[0037] The limiting structure 7 is located at the upper end of the vacuum tube 6. The limiting structure 7 is used to fix the waveguide rod 2 to the vacuum tube 6. The limiting structure 7 can be a fastening nut fixed to the upper surface of the vacuum tube 6, or a clamp, or other conventional connection method. A sealing element 5 is provided at the contact surface between the upper end of the vacuum tube 6 and the waveguide rod 2 to prevent pressure leakage between the contact surfaces from affecting the vacuum level inside the vacuum tube 6. A suction cup 8 is provided at the lower end of the vacuum tube 6. The suction cup 8 is made of a high-temperature resistant flexible material and is adsorbed onto the surface of a high-temperature container to seal the lower end of the vacuum tube 6 and assist in fixing the waveguide rod 2. Preferably, a guide ring 61 is provided inside the vacuum tube 6. The waveguide rod 2 passes through the guide ring 61 and is coaxially arranged with the vacuum tube 6, so that the waveguide rod 2 is always in the axial position of the entire detection device, thereby ensuring that when installed on the high-temperature container, the lower end of the waveguide rod 2 is tightly fitted to the container surface.

[0038] When the cooling device 3 adopts the structure of Embodiment 1, the wall of the vacuum tube 6 is in contact with the cooling medium, that is, the cooling medium fills the space between the hollow cylindrical 31 and the vacuum tube 6. The heat of the waveguide rod 2 is transferred to the wall of the vacuum tube 6 through thermal radiation and then rapidly exchanged by the cooling medium, thereby keeping the temperature inside the vacuum tube 6 relatively low, promoting the thermal radiation transfer of the waveguide rod 2, and finally achieving heat dissipation of the waveguide rod 2.

[0039] When the cooling device 3 adopts the structure of Embodiment 2, the vacuum tube 6 is located in the hollow channel formed by the spiral coil and is tightly fitted to the inner side of the spiral coil, so that the heat dissipation method of the waveguide rod 2 is the same as that of the cooling device 3 in Embodiment 1.

[0040] The advantage of this embodiment is that: By setting up a vacuum anti-attenuation structure, the vacuum level around the waveguide rod 2 is controlled, ensuring that the acoustic emission signal can only be transmitted from inside the waveguide rod 2 and will not be lost outwards, further reducing the signal attenuation and thus weakening the influence of the length of the waveguide rod 2 on the signal attenuation. At the same time, by controlling the distance between the vacuum tube 6 and the waveguide rod 2, the waveguide rod 2 can conduct heat over a short distance in the vacuum tube 6 through thermal radiation before exchanging heat with the cooling device 3, ensuring effective heat dissipation of the waveguide rod 2.

[0041] The above description is merely a preferred embodiment of the present utility model and does not constitute any limitation on the technical scope of the present utility model. Therefore, any minor modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model shall still fall within the protection scope of the present utility model.

Claims

1. An auxiliary device for acoustic emission detection of a high-temperature container, comprising a waveguide rod, wherein the lower end of the waveguide rod is connected to the surface of the high-temperature container through a fixing device, and the upper end is coupled to an acoustic emission sensor; Its features are: A cooling device is also provided, which is arranged around the outside of the waveguide rod. A cooling medium circulates from bottom to top in the cooling device to quickly exchange the heat absorbed by the waveguide rod. The middle and lower section of the waveguide rod passes through the cooling device and is in close contact with the cooling device. The waveguide rod is fixed to the upper end of the cooling device by a limiting structure. The cooling device is provided in one or more sets, and the same or different cooling media circulate in the cooling device.

2. The acoustic emission detection auxiliary device for high-temperature vessels according to claim 1, characterized in that: The cooling device is a hollow cylinder coaxial with the waveguide rod. The hollow cylinder is filled with the cooling medium. The middle and lower sections of the waveguide rod penetrate the hollow cylinder and directly contact the cooling medium for heat exchange. A sealing element is provided at the connection between the hollow cylinder and the waveguide rod. The waveguide rod and the upper end of the hollow cylinder are fixedly connected by the limiting structure.

3. The acoustic emission detection auxiliary device for high temperature vessel according to claim 1, characterized in that: The cooling device is a spiral coil or a spiral half-tube, with a hollow channel formed inside the spiral coil or spiral half-tube. The waveguide rod is disposed in the hollow channel and closely attached to the cooling device. The waveguide rod is fixedly connected to the upper end of the cooling device through the limiting structure. The cooling medium circulates inside the spiral coil or spiral half-tube.

4. The acoustic emission detection auxiliary device for high temperature vessel according to claim 1, characterized in that: The cooling device is provided in multiple sets. The cooling device near the high-temperature container end has a cooling medium with a high thermal conductivity circulating inside, while the cooling device near the acoustic emission sensor end has a cooling medium with a low thermal conductivity circulating inside.

5. The acoustic emission detection auxiliary device for high temperature vessel according to claim 1, characterized in that: A vacuum anti-fading structure is also provided, which is located between the cooling device and the waveguide rod and is fixedly connected to the cooling device. The vacuum anti-fading structure is a vacuum tube with a vacuum source connected to it and its upper end closed. The inner diameter of the vacuum tube is larger than the outer diameter of the waveguide rod. The waveguide rod is installed through the vacuum tube but does not contact the tube wall. A limiting structure is located at the upper end of the vacuum tube and is used to fix the waveguide rod and the vacuum tube. A sealing element is provided at the contact surface between the upper end of the vacuum tube and the waveguide rod. A suction cup is provided at the lower end of the vacuum tube and is attached to the surface of the high-temperature container to seal the lower end of the vacuum tube and assist in fixing the waveguide rod. A fixing device is located at the lower part of the cooling device and is used to provide support and fixation for the waveguide rod.

6. The acoustic emission detection auxiliary device for high-temperature vessels according to claim 5, characterized in that: The vacuum tube is provided with a guide ring, and the waveguide rod passes through the guide ring and is coaxially arranged with the vacuum tube.

7. The acoustic emission detection auxiliary device for high temperature vessel according to claim 1, characterized in that: The fixing device includes a support plate and an adsorption assembly. The support plate is fixed on the cooling device. Several adsorption assemblies are provided. The upper end of each adsorption assembly is located on the support plate, and the lower end is adsorbed and connected to the surface of the high-temperature container. The adsorption assemblies are distributed in a ring around the waveguide rod.

8. The acoustic emission detection auxiliary device for high-temperature containers according to claim 7, characterized in that: The adsorption assembly includes a guide rod, a spring, and an adsorption head. The upper end of the guide rod is movably mounted on the support plate. The spring is sleeved on the guide rod. One end of the spring is fixedly connected to the lower surface of the support plate, and the other end is fixedly connected to the adsorption head. The adsorption head is a magnetic block or a vacuum suction cup.

9. The acoustic emission detection auxiliary device for high temperature vessel according to claim 1, characterized in that: The upper end of the waveguide rod is provided with a mounting platform for installing and fixing the acoustic emission sensor. The mounting platform includes a C-shaped frame and a fastening structure. The inner diameter of the C-shaped frame is the same as the outer diameter of the acoustic emission sensor. The bottom surface of the C-shaped frame is a placement plane. The placement plane is flush with the upper surface of the waveguide rod and extends through the placement plane. The fastening structure includes a T-shaped shaft and a fastening spring. The lower end of the T-shaped shaft extends through the top surface of the C-shaped frame and into the C-shaped frame. The fastening spring is fixed between the upper end of the T-shaped shaft and the top surface of the C-shaped frame. In use, the acoustic emission sensor is placed in the placement plane and fixed by the fastening structure.

10. The acoustic emission detection auxiliary device for high temperature vessels according to claim 1, characterized in that: The waveguide rod is made of a material that is the same as or similar in properties to the specimen.

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