A system-in-package positioning chip, receiving device, and receiver

Abstract

This invention provides a system-in-package (SIPP) positioning chip, receiving device, and receiver. The positioning chip includes at least the following components: an RF front-end module, an RF processing module, a baseband processing module, an application processing module, a storage module, a clock module, and a power supply module. The RF front-end module includes an antenna connection port and a tripeller. The antenna connection port is connected to the input of the tripeller. The tripeller is configured to separate the GNSS signals received from the antenna connection port into the LFL, LFH, and MFH bands, forming three GNSS signals, which are then output from the first, second, and third outputs of the tripeller and transmitted to the corresponding channels of the RF processing module. This invention achieves multi-frequency positioning with a single antenna by encapsulating the RF front-end module within the chip, thus miniaturizing the positioning chip.

Description

Technical Field

[0001] This utility model relates to the field of satellite navigation, and in particular to a system-in-package positioning chip, receiving device and receiver. Background Technology

[0002] GNSS receivers are used to achieve self-positioning and navigation by receiving GNSS signals transmitted by satellites in the aforementioned GNSS system. GNSS receivers are widely used in various types of electronic devices.

[0003] With the development of electronic technology, various electronic devices have generated a demand for miniaturization. A GNSS receiver solution mainly includes an RF front-end module, a baseband chip, and a processor chip. The RF front-end module is responsible for receiving GNSS signals, the baseband chip for signal acquisition, tracking, and message demodulation, and finally the processor chip for positioning calculation. The GNSS signals of the aforementioned global navigation satellite systems are distributed across numerous different frequency bands. To support multi-band GNSS signals, traditional multi-band solutions require power dividers and multiple sets of surface acoustic wave (SAW) filters in the RF front-end module, using bandpass filtering across multiple frequency bands to achieve multi-band GNSS signal reception. However, this approach requires a large design area, severely restricting the development of smaller product sizes. Utility Model Content

[0004] Based on the above situation, the main purpose of this utility model is to provide a system-in-package positioning chip that can achieve multi-frequency positioning with a single antenna while miniaturizing the chip.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0006] The first aspect of this utility model provides a system-in-package (SIPP) positioning chip, which encapsulates at least:

[0007] The radio frequency front-end module includes an antenna connection port and a tripod. The antenna connection port is connected to the input terminal of the tripod. The tripod is configured to separate the signals in the LFL, LFH and MFH bands from the GNSS signals received from the antenna connection port to form three GNSS signals, which are output from the first output terminal, the second output terminal and the third output terminal of the tripod, respectively.

[0008] The radio frequency processing module is connected to the radio frequency front-end module and is configured to receive three GNSS signals output by the radio frequency front-end module.

[0009] The baseband processing module is connected to the radio frequency processing module to receive the signal output by the radio frequency processing module;

[0010] The application processing module is connected to the baseband processing module to receive signals output by the baseband processing module;

[0011] The storage module is connected to the baseband processing module and the application processing module.

[0012] The clock module connects to the RF processing module, the baseband processing module, and the application processing module.

[0013] The power module is connected to the RF processing module, baseband processing module, application processing module, storage module, and clock module, respectively.

[0014] Optionally, the RF processing module, the baseband processing module, and the application processing module are three modules within the same receiver die.

[0015] Optionally, the positioning chip also includes:

[0016] An IC carrier board includes a first mounting surface and a second mounting surface for packaging electronic components, and an electrical connection path disposed between the first mounting surface and the second mounting surface; wherein, a power module, a clock module, an RF front-end module, and a memory module are packaged in a plastic encapsulation on the first mounting surface of the IC carrier board; a receiver die is packaged in a plastic encapsulation on the second mounting surface of the IC carrier board; the power module is connected to the clock module, the memory module, and the receiver die through electrical connection paths; the receiver die is connected to the memory module through electrical connection paths, the clock module is connected to the receiver die through electrical connection paths, and the RF front-end module is connected to the receiver die through electrical connection paths.

[0017] Multiple electrical connectors connect corresponding parts of the electrical connection path to the multiple external interfaces of the positioning chip one by one; wherein, a part of a single electrical connector is encapsulated in the second loading surface by a plastic package, and another part is exposed outside the plastic package.

[0018] Optionally, the storage module is disposed in a first region of the first loading surface, the first region being the projection of the receiver die onto the first loading surface in the vertical direction.

[0019] Optionally, the storage module includes: a dynamic random access memory unit and a non-volatile memory unit;

[0020] The non-volatile memory cell is disposed on the first loading surface and is connected to the receiver die by wire bonding or electrical connection.

[0021] The dynamic random access memory (DRAM) unit is located above the non-volatile memory unit, and the DRAM unit is connected to the receiver die via wire bonding.

[0022] Optionally, the tripod is a Tri-Saw filter, which has a first output terminal, a second output terminal, and a third output terminal.

[0023] Optionally, the tripod includes: a duplex filter, a first surface acoustic wave (SAW) filter, a second SAW filter, and a power divider; wherein the duplex filter has a high-frequency output terminal and a low-frequency output terminal, the high-frequency output terminal is connected to the input terminal of the first SAW filter, and the output terminal of the first SAW filter serves as the first output terminal; the low-frequency output terminal is connected to the input terminal of the second SAW filter, the output terminal of the second SAW filter is connected to the input terminal of the power divider, and the two output terminals of the power divider serve as the second output terminal and the third output terminal, respectively.

[0024] The second aspect of this utility model provides a system-in-package positioning chip, which at least encapsulates:

[0025] The radio frequency front-end module has an antenna connection port and a tripper. The tripper has one input and three outputs. The antenna connection port is connected to the input of the tripper. The tripper is configured to separate the GNSS signals received from the antenna connection port that are in the LFL, LFH and MFH bands to form three GNSS signals, which are output from the first, second and third outputs of the tripper, respectively.

[0026] The radio frequency processing module is connected to the radio frequency front-end module and is configured to receive three GNSS signals output by the radio frequency front-end module.

[0027] The baseband processing module is connected to the radio frequency processing module to receive the signal output by the radio frequency processing module;

[0028] The application processing module is connected to the baseband processing module to receive signals output by the baseband processing module;

[0029] The storage module is connected to the baseband processing module and the application processing module.

[0030] The clock module connects to the RF processing module, the baseband processing module, and the application processing module.

[0031] The power module is connected to the RF processing module, baseband processing module, application processing module, storage module, and clock module, respectively.

[0032] The receiving device provided in the third aspect of this utility model includes a positioning chip in a system-in-package as described in the second or third aspect.

[0033] The receiver for the satellite navigation system provided in the fourth aspect of this utility model includes a single antenna and a receiving device in the third aspect. The single antenna is connected to the antenna connection port of the positioning chip in the system-in-package of the receiving device. The single antenna is a multi-band active antenna.

[0034] Firstly, this invention encapsulates the RF front-end module, RF processing module, baseband processing module, application processing module, power supply module, clock module, and storage module all within a single chip, reducing the need for external components and facilitating miniaturization and thinner design. Secondly, the RF front-end module encapsulated within the chip includes a tripeller with a first output terminal, a second output terminal, and a third output terminal. The tripeller divides the GNSS signal received from the antenna connection port into three RF channels (LFL, LFH, and MFH bands) for processing and outputs them in parallel from the first, second, and third output terminals to subsequent functional modules for further processing. This enables multi-band positioning with a single antenna, improving the positioning accuracy of the receiver.

[0035] Other beneficial effects of this utility model will be explained in detail through the introduction of specific technical features and technical solutions in the specific embodiments. Those skilled in the art should be able to understand the beneficial technical effects brought about by the technical features and technical solutions through the introduction of these technical features and technical solutions. Attached Figure Description

[0036] The preferred embodiments of the present invention will now be described with reference to the accompanying drawings.

[0037] Figure 1 This diagram illustrates an architecture of the positioning chip in an embodiment of the present invention.

[0038] Figure 2 This diagram illustrates the distribution of various signal types in the LF band in an embodiment of the present invention.

[0039] Figure 3 This diagram illustrates the distribution of various signal types in the MF band in an embodiment of the present invention.

[0040] Figure 4 This diagram illustrates the distribution of various signal types in the HF band in an embodiment of the present invention.

[0041] Figure 5 This diagram illustrates a specific architecture of the positioning chip in an embodiment of the present invention.

[0042] Figure 6 This diagram illustrates another specific architecture of the positioning chip in an embodiment of the present invention.

[0043] Figure 7This diagram shows a packaging structure of the positioning chip in an embodiment of the present invention.

[0044] Reference numerals: 10, RF front-end module; 101, antenna connection port; 102, tripeller; 1021, duplex filter; 1022, first surface acoustic wave filter; 1023, second surface acoustic wave filter; 1024, power divider; 20, RF processing module; 30, baseband processing module; 40, application processing module; 50, storage module; 501, dynamic random access memory unit; 502, non-volatile memory unit; 60, power supply module; 70, clock module; 80, active antenna; 90, IC carrier board; 901, molding compound; 902, electrical connector; 903, electrical connection path. Detailed Implementation

[0045] The present invention will now be described based on embodiments, but the present invention is not limited to these embodiments. In the following detailed description of the present invention, some specific details are described in detail, but well-known methods, processes, procedures, and elements are not described in detail in order to avoid obscuring the essence of the present invention.

[0046] Furthermore, those skilled in the art should understand that the accompanying drawings provided herein are for illustrative purposes only and are not necessarily drawn to scale.

[0047] Unless the context explicitly requires it, the words "comprising," "including," and similar terms throughout the specification and claims should be interpreted as encompassing rather than being exclusive or exhaustive; that is, meaning "including but not limited to."

[0048] In the description of this utility model, it should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, in the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0049] As mentioned earlier, traditional multi-band solutions require power dividers and multiple sets of surface acoustic wave (SAW) filters in the RF front-end module, which occupies a large design area and severely restricts the development of products to smaller sizes. In view of this, this utility model embodiment proposes a system-in-package (SIPP) positioning chip that can encapsulate the RF front-end module 10 within the chip and achieve multi-frequency positioning with a single antenna.

[0050] Figure 1 This diagram illustrates an architecture of the positioning chip in an embodiment of the present invention. Please refer to [link / reference needed]. Figure 1This invention discloses a system-in-package (SIP) positioning chip, which includes at least: a radio frequency (RF) front-end module 10, an RF processing module 20, a baseband processing module 30, an application processing module 40, a storage module 50, a clock module 70, and a power supply module 60. Each of these modules can be a separate die, or at least some of them can be separate dies while several other modules are integrated into a single die, facilitating the integration of existing functional modules to achieve the chip functionality of this invention.

[0051] Among them, see Figure 5 The RF front-end module 10 includes an antenna connection port 101 and a tripeller 102. The antenna connection port 101 is connected to the input terminal of the tripeller 102. The tripeller 102 is configured to separate the GNSS signals received from the antenna connection port 101 into three GNSS signals located in the LFL, LFH, and MFH bands, respectively, and output them from the first, second, and third output terminals of the tripeller 102. The RF processing module 20 is connected to the RF front-end module 10 and is configured to receive the three GNSS signals output by the RF front-end module 10. The baseband processing module 30 is connected to the RF processing module 20 to receive the signals output by the RF processing module 20. The application processing module 40 is connected to the baseband processing module 30 to receive the signals output by the baseband processing module 30. The storage module 50 is connected to the baseband processing module 30 and the application processing module 40, and the clock module 70 is connected to the radio frequency processing module 20, the baseband processing module 30 and the application processing module 40; the power supply module 60 is connected to the radio frequency processing module 20, the baseband processing module 30, the application processing module 40, the storage module 50 and the clock module 70 respectively, providing operating voltage for the above modules.

[0052] Specifically, the antenna connection port 101 of the RF front-end module 10 is connected to the active antenna 80 and configured to amplify and filter the GNSS signal. The RF processing module 20 is configured to down-convert the GNSS signal to generate a low-IF or zero-IF analog signal, which is then output to subsequent modules for processing. In one embodiment, the RF processing module 20 may also include a signal conversion unit configured to perform analog-to-digital converter (ADC) sampling on the low-IF or zero-IF analog signal. The baseband processing module 30 is configured to capture, track, and demodulate the received signal. If the signal received from the RF processing module 20 is an analog signal, the baseband processing module 30 also needs to include a signal conversion unit to perform analog-to-digital conversion and sampling on the analog signal. The application processing module 40 is the control core of the positioning chip, configured to schedule and configure the RF processing module 20, and also configured to perform positioning, speed measurement, and time synchronization based on the observations reported by the baseband processing module 30.

[0053] In practical applications, please refer to the table below for the signal types supported by mainstream navigation satellite systems:

[0054] Table 1

[0055] system signal type BeiDou Navigation Satellite System B2a / B2b / B2I / B3I / B1I / B1C / S1 / S2C GPS L5 / L2C / L1CA / L1C GLONASS G1 / G2 Galileo E5a / E5b / E6 / E1 QZSS L5 / L6 / L1CA / L1C / L1S NavIC L5(I) / L1 / S(I) SBAS L1 Maritime satellites, etc. LBAND

[0056] Existing satellite navigation systems mainly include Global Navigation Satellite Systems (GNSS), regional satellite navigation systems, and Satellite Based Augmentation Systems (SBAS). Among them, the Global Navigation Satellite Systems include: BeiDou Navigation Satellite System, GPS (Global Positioning System), GLONASS (Global Navigation Satellite System), and Galileo, collectively known as the four major global navigation satellite systems. Regional satellite navigation systems mainly include Japan's Quasi-Zenith Satellite System (QZSS) and India's Indian Regional Navigation Satellite System (IRNSS, NAVIC).

[0057] In the table, to distinguish it from the S-band signal of the BeiDou Navigation Satellite System and the L5 of GPS / QZSS, NAVIC's S-band signal is denoted as S(I) and its L5 signal is denoted as L5(I).

[0058] The signals listed in Table 1 are mainly distributed in three regions within the maximum frequency range, labeled as the low-frequency (LF) band, mid-frequency (MF) band, and high-frequency (HF) band, respectively. Please refer to... Figures 2 to 4 , Figure 2 This diagram illustrates the distribution of various signal types in the LF band in an embodiment of the present invention. Figure 3 This diagram illustrates the distribution of various signal types in the MF band in an embodiment of the present invention. Figure 4 This invention illustrates the distribution of various signal types in the HF band in an embodiment of the present invention. Specifically:

[0059] The frequency range of the LF band is from 1166.220MHz to 1283.865MHz, that is: f LF,min =1166.220MHz, f LF,max=1283.865MHz. The LF band can be further subdivided into the LFL band and the LFH band. The frequency range of the LFL band is from 1166.220MHz to 1237.830MHz, and the frequency range of the LFH band is from 1237.830MHz to 1283.865MHz.

[0060] The frequency range of the MF band is 1530.000MHz to 1605.886MHz, that is: f MF,min =1530.000MHz, f MF,max = 1605.886MHz. The MF band includes the LBAND band and the MFH band. The LBAND band's frequency range is 1530.000MHz to 1545.000MHz; the MFH band's frequency range is 1559.052MHz to 1605.886MHz, i.e.: f MFH,min =1559.052MHz, f MFH,max =1605.886MHz.

[0061] The HF band has a frequency range of 2483.590MHz to 2499.910MHz, i.e.: f HF,min =2483.590MHz, f HF,max =2499.910MHz.

[0062] In practical applications, the RF front-end module 10 needs to be designed based on the performance of the receiver die and the functions it implements. A reasonable RF front-end design can reduce signal loss, reduce performance loss, and ensure the normal operation of subsequent modules / chips. In this embodiment, because the LF band is relatively wide (approximately 1166MHz to 1284MHz), the minimum ADC sampling rate is approximately 120MHz, resulting in a large computational load on the subsequent RF processing module 20. Therefore, in order to reasonably reduce the minimum ADC sampling rate, this embodiment divides the LF band into two paths for filtering. Furthermore, considering the coverage of commonly used frequency bands, this embodiment uses a tripeller 102 to filter the received GNSS signal, enabling parallel output of three signals: LFL band, LFH band, and MFH band. Dividing the LFL and LFH bands in the LF band into two paths for processing can reduce the minimum sampling rate of each processing channel in a single ADC sampling, improving the efficiency and accuracy of signal processing. Meanwhile, by utilizing the remaining channel of tripeller 102 to filter signals in the MFH band, it can cover most commonly used frequency bands, improving the positioning chip's compatibility with various navigation satellite systems. Specifically, the configuration of the three RF channels in tripeller 102 can be referenced as follows:

[0063] For the LFL band, define the lower limit frequency f.LFL,min and upper limit frequency f LFL,max They respectively satisfy:

[0064] f LFL，min =1166.220MHz

[0065] f LFL，max ≥1225.0425MHZ

[0066] For the LFH band, a lower limit frequency f is defined. LFH,min and upper limit frequency f LFH,max They respectively satisfy:

[0067] f LFH，min ≤1225.0425MHZ

[0068] f LFL，max =1283.865MHz

[0069] f LFL,max and f LFH,min The value is not fixed. The main consideration is that the L2C signal is in the middle of the LF band, so at least one of the LFL band or LFH bands needs to contain the L2C signal. Secondly, the local oscillator value of the RF module may not be in the exact middle of the band.

[0070] The local oscillator frequency f of the RF channel corresponding to the LFL band. LFL,LO satisfy:

[0071]

[0072] The local oscillator frequency f of the RF channel corresponding to the LFH band LFH,LO satisfy:

[0073]

[0074] The local oscillator frequency f of the RF channel corresponding to the MFH band MFH,L0 satisfy:

[0075]

[0076] Among them, f MFH,min Approximately 1559.052MHz, f MFH,max It is approximately equal to 1605.886MHz.

[0077] In one implementation, please refer to Figure 5The aforementioned tripartite 102 can employ a Tri-Saw filter. A Tri-Saw filter is a high-performance radio frequency filter based on tri-mode SAW (Surface Acoustic Wave) technology. It can simultaneously excite three acoustic wave modes in different in-plane directions of a heterogeneous substrate, and obtain filter responses of three different frequency bands in different in-plane directions. This allows for the simultaneous implementation of filtering of three different frequency bands in a small device, which is beneficial for packaging the radio frequency front-end module 10 into a positioning chip.

[0078] In another implementation, please refer to Figure 6 The aforementioned tripod 102 can also adopt a scheme of "one duplex filter, two surface acoustic wave (SAW) filters, and one power divider". Specifically, the duplex filter 1021 has a high-frequency output terminal and a low-frequency output terminal. The high-frequency output terminal is connected to the input terminal of the first SAW filter 1022, and the output terminal of the first SAW filter 1022 serves as the first output terminal. The low-frequency output terminal is connected to the input terminal of the second SAW filter 1023, and the output terminal of the second SAW filter 1023 is connected to the input terminal of the power divider 1024. The two output terminals of the power divider 1024 serve as the second output terminal and the third output terminal, respectively. Among them, the first SAW filter 1022 corresponds to the output signal of the MFH frequency band, the second SAW filter 1023 corresponds to the output signal of the LF frequency band, and the power divider 1024 further divides the LF frequency band into two signal outputs: the LFL frequency band and the LFH frequency band. The 1021 duplex filter can be a diplexer filter, which integrates a high-pass filter and a low-pass filter. It has three ports: one port receives the RF signal transmitted from the active antenna 80, and the other two ports connect to two surface acoustic wave (SAW) filters, outputting high-frequency and low-frequency RF signals respectively (it should be noted that "high-frequency" and "low-frequency" here refer to the relative frequency ranges of the two output signals, not absolute frequency ranges). Compared to the Tri-Saw filter solution, this solution has relatively lower insertion loss for RF information; however, due to the increased number of components, it requires a relatively larger design area, resulting in a larger packaged chip size.

[0079] In one embodiment, the radio frequency processing module 20, the baseband processing module 30, and the application processing module 40 can be three independent dies, each packaged in an IC carrier board 90, and interconnected through an electrical connection path 903 within the IC carrier board 90.

[0080] In another embodiment, the RF processing module 20, the baseband processing module 30, and the application processing module 40 can be three functional modules of the same receiver die. The following description uses the same receiver die as an example to illustrate the packaging method of the positioning chip in this embodiment of the invention. Please refer to [link to relevant documentation]. Figure 7 , Figure 7 This diagram shows a packaging structure of the positioning chip in an embodiment of the present invention.

[0081] like Figure 7 As shown, the power module 60, clock module 70, RF front-end module 10, and storage module 50 in the positioning chip are encapsulated on the first mounting surface of the IC carrier board 90 by a molding compound 901, and the receiver die is encapsulated on the second mounting surface of the IC carrier board 90 by a molding compound 901. For example, the molding compound 901 can be a molding compound, and the IC carrier board 90 can be an organic IC carrier board. Organic IC carrier boards have advantages such as low dielectric constant, low mass density, simple processing technology, high production efficiency, and low cost, which can better meet the needs of miniaturization and micronization of wearable electronic devices.

[0082] It should be noted that, in the embodiments of this utility model, [the following text is incomplete and requires further context to translate accurately] Figure 7 From the perspective of the IC carrier board 90, the direction in which the first loading surface faces is upward, and the direction in which the second loading surface faces is downward.

[0083] Specifically, an electrical connection path 903 is provided between the first and second mounting surfaces of the IC carrier board 90. The power module 60 is connected to the clock module 70, the storage module 50, and the receiver die via the electrical connection path 903. The receiver die is connected to the storage module 50 via the electrical connection path 903. The clock module 70 is connected to the receiver die via the electrical connection path 903, and the RF front-end module 10 is connected to the receiver die via the electrical connection path 903. For example, the electrical connection path 903 can be referenced... Figure 7 The IC carrier 90 includes an electrical connection path 903, where a portion may be located on a first mounting surface, a portion on a second mounting surface, and a portion in a sandwich layer within the IC carrier 90. Each external interface of the positioning chip connects a corresponding portion of the electrical connection path 903 to a plurality of electrical connectors 902 located on the second mounting surface. A portion of the electrical connectors 902 is exposed outside the molding compound 901. For example, the electrical connector 902 may be a solder ball.

[0084] To shorten the transmission distance between the receiver die and the storage module 50, the storage module 50 can be disposed within a first region of the first loading surface. This first region is the projection area of ​​the receiver die onto the first loading surface in the vertical direction. This results in a shorter physical distance between the receiver die and the storage module, which helps improve the efficiency and stability of data transmission. Further, the storage module 50 in this embodiment includes a dynamic random access memory unit 501 (e.g., HyperRAM) and a non-volatile memory unit 502 (e.g., FLASH). Figure 7 As shown, the non-volatile memory cell 502 is disposed on the first mounting surface of the IC carrier 90. The non-volatile memory cell 502 is connected to the receiver die via wire bonding and / or electrical connection path 903. The dynamic random access memory cell 501 is disposed above the non-volatile memory cell 502. The dynamic random access memory cell 501 is connected to the electrical connection path 903 via wire bonding, and thus connected to the receiver die. In practical applications, since the non-volatile memory cell 502 needs to store more data, its cross-sectional area is larger than that of the dynamic random access memory cell 501. Therefore, the dynamic random access memory cell 501 can be disposed above the non-volatile memory cell 502 via wire bonding, which saves the physical space occupied by the storage module 50 and allows it to be placed close to the receiver die.

[0085] In this embodiment of the invention, on the one hand, by packaging components on the first and second loading surfaces of the IC carrier board 90 respectively, product area can be saved, and product miniaturization can be better achieved; moreover, the double-sided packaging structure has higher structural strength and reliability. On the other hand, by placing the storage module 50 in the first area of ​​the first loading surface, the physical distance between the storage module 50 and the receiver die can be shortened, which helps to improve the efficiency and stability of data transmission.

[0086] This invention also provides a receiving device comprising a system-in-package (SiP) chip for global satellite navigation as described above. The SiP chip provided in this invention highly integrates the radio frequency front-end, receiver die, etc., significantly reducing the chip's size and weight. For example, the receiving device in this invention can be a receiving device in a smart home system. By equipping it with the aforementioned SiP chip, it can simultaneously receive signals from different satellites and rapidly process and analyze these signals to achieve intelligent control of home devices. The receiving device in this invention can also be a receiving device in a vehicle communication system. By equipping it with the aforementioned SiP chip, it can stably receive and process wireless signals in complex electromagnetic environments, ensuring that the vehicle can achieve accurate and stable positioning and navigation functions.

[0087] This utility model embodiment also provides a receiver for a satellite navigation system, which includes a single antenna and a receiving device as described above. The single antenna is connected to the signal input port of a system-in-package (SiP) chip in the receiving device. The single antenna is a multi-band active antenna. For the structure and function of the SiP chip described above, please refer to the embodiments of the SiP chip, which will not be repeated here.

[0088] This utility model embodiment also provides an electronic device, which includes a receiver for a satellite navigation system as described above. The electronic device can be a wearable device, smart home device, smartphone, smartwatch, tablet computer, navigator, dashcam, logistics tracker, and drone, etc.

[0089] Those skilled in the art will understand that, without conflict, the above-mentioned preferred solutions can be freely combined and superimposed.

[0090] It should be understood that the above-described embodiments are merely exemplary and not restrictive. Without departing from the basic principles of this utility model, any obvious or equivalent modifications or substitutions made by those skilled in the art regarding the above details will be included within the scope of the claims of this utility model.

Claims

1. A system-in-package positioning chip, characterized in that, The positioning chip is at least packaged with: The radio frequency front-end module includes an antenna connection port and a triplet; the antenna connection port is connected to the input terminal of the triplet, and the triplet is configured to separate the signals in the LFL band, LFH band and MFH band from the GNSS signals received from the antenna connection port to form three GNSS signals, which are output from the first output terminal, the second output terminal and the third output terminal of the triplet respectively; A radio frequency processing module, connected to the radio frequency front-end module, is configured to receive three GNSS signals output by the radio frequency front-end module; A baseband processing module is connected to the radio frequency processing module to receive the signal output by the radio frequency processing module; An application processing module is connected to the baseband processing module to receive signals output by the baseband processing module; A storage module is connected to the baseband processing module and the application processing module; A clock module is connected to the radio frequency processing module, the baseband processing module, and the application processing module; The power supply module is connected to the radio frequency processing module, the baseband processing module, the application processing module, the storage module, and the clock module, respectively.

2. The positioning chip in a system-in-package as described in claim 1, characterized in that, The radio frequency processing module, the baseband processing module, and the application processing module are three modules within the same receiver die.

3. The system-in-a-package positioning chip of claim 2, wherein, The positioning chip also includes: An IC carrier board includes a first mounting surface and a second mounting surface for packaging electronic components, and an electrical connection path disposed between the first mounting surface and the second mounting surface; wherein, the power module, the clock module, the RF front-end module, and the storage module are encapsulated in a molding compound on the first mounting surface of the IC carrier board; the receiver die is encapsulated in a molding compound on the second mounting surface of the IC carrier board; the power module is connected to the clock module, the storage module, and the receiver die respectively through the electrical connection path; the receiver die is connected to the storage module through the electrical connection path, the clock module is connected to the receiver die through the electrical connection path, and the RF front-end module is connected to the receiver die through the electrical connection path; Multiple electrical connectors connect corresponding parts of the electrical connection path to multiple external interfaces of the positioning chip; wherein, a portion of a single electrical connector is encapsulated in the second loading surface by the molding compound, and another portion is exposed outside the molding compound.

4. The positioning chip in a system-in-package as described in claim 3, characterized in that, The storage module is disposed in a first region of the first loading surface, and the first region is the projection area of ​​the receiver die onto the first loading surface in the vertical direction.

5. The positioning chip in a system-in-package as described in claim 4, characterized in that, The storage module includes: a dynamic random access memory unit and a non-volatile memory unit; The non-volatile memory cell is disposed on the first mounting surface, and the non-volatile memory cell is connected to the receiver die by wire bonding or by the electrical connection path. The dynamic random access memory unit is disposed above the non-volatile memory unit, and the dynamic random access memory unit is connected to the receiver die by wire bonding.

6. The positioning chip in a system-in-package as described in claim 1, characterized in that, The tripod is a Tri-Saw filter, which has a first output terminal, a second output terminal, and a third output terminal.

7. The positioning chip in a system-in-package as described in claim 1, characterized in that, The tripod includes a duplex filter, a first surface acoustic wave (SAW) filter, a second SAW filter, and a power divider. The duplex filter has a high-frequency output terminal and a low-frequency output terminal. The high-frequency output terminal is connected to the input terminal of the first SAW filter, and the output terminal of the first SAW filter serves as the first output terminal. The low-frequency output terminal is connected to the input terminal of the second SAW filter, and the output terminal of the second SAW filter is connected to the input terminal of the power divider. The two output terminals of the power divider serve as the second output terminal and the third output terminal, respectively.

8. A positioning chip of a system in package, characterized by, The positioning chip is at least packaged with: The radio frequency front-end module has an antenna connection port and a triplet. The triplet has an input terminal and three output terminals. The antenna connection port is connected to the input terminal of the triplet. The triplet is configured to separate the GNSS signals received from the antenna connection port that are in the LFL band, LFH band and MFH band, forming three GNSS signals, which are output from the first output terminal, the second output terminal and the third output terminal of the triplet, respectively. A radio frequency processing module, connected to the radio frequency front-end module, is configured to receive three GNSS signals output by the radio frequency front-end module; A baseband processing module is connected to the radio frequency processing module to receive the signal output by the radio frequency processing module; An application processing module is connected to the baseband processing module to receive signals output by the baseband processing module; A storage module is connected to the baseband processing module and the application processing module; A clock module is connected to the radio frequency processing module, the baseband processing module, and the application processing module; The power supply module is connected to the radio frequency processing module, the baseband processing module, the application processing module, the storage module, and the clock module, respectively.

9. A receiving device, characterized by This includes the positioning chip in a system-in-package as described in any one of claims 1-8.

10. A receiver of a satellite navigation system, characterized in that It includes a single antenna and a receiving device as described in claim 9, wherein the single antenna is connected to the antenna connection port of the positioning chip in the system-in-package of the receiving device, and the single antenna is a multi-band active antenna.

Images