A wafer photoresist control device

Abstract

This utility model discloses a wafer photoresist control device, relating to the field of wafer spin coaters. The device includes a machine base with a retaining ring protruding from the top surface of the top plate. A wafer adsorption assembly is installed in the middle of the machine base, comprising a rotating component, a lifting component, and a suction cup. The rotating component is installed at the extended end of the lifting component. This wafer photoresist control device, by adding a pressure sensor and its position adjustment mechanism, drives the wafer to rotate for testing before coating. If unstable adsorption causes the wafer to shift and collide with the sensor, an alarm is triggered and the machine stops, effectively preventing wafer slippage and ensuring the safety of the equipment and the wafer.

Description

Technical Field

[0001] This utility model relates to the field of wafer spin coaters, and more particularly to a wafer photoresist control device. Background Technology

[0002] Wafer photoresist coating is performed by a spin coater, which mainly consists of a wafer adsorption assembly (including a suction cup), a transfer assembly, and a coating assembly. After the robotic arm centers the wafer on the suction cup's support surface, the adsorption assembly adsorbs the wafer and drives its lifting and rotation. The transfer assembly adjusts the position of the coating assembly so that the spray nozzle is aligned with the center of the wafer, and then the photoresist is sprayed. The wafer's rotation achieves uniform coating.

[0003] However, when using a chuck to pick up wafers, unstable adsorption often occurs due to chuck wear, clogged pores, or vacuum pump instability. Current technology lacks corresponding adsorption status detection devices. If the wafer is directly driven to spin and apply adhesive when adsorption is unstable, it can easily cause wafer displacement or even ejection, resulting in loss. Utility Model Content

[0004] To overcome the shortcomings of existing technologies, the purpose of this utility model is to provide a wafer photoresist control device that solves the problem of existing technologies lacking suction cup adsorption state detection, which easily leads to wafers flying out when adsorption is unstable.

[0005] To address the problems in the existing technology, the technical solution of this utility model is as follows: A wafer photoresist control device includes a machine base, a wafer adsorption assembly installed in the middle of the machine base, a drive device installed on the top plate of the machine base, and a coating device and an offset detection device respectively provided at the output end of the drive device. The drive device consists of a rotating assembly mounted on the top plate and a lifting assembly mounted on the rotating assembly. The glue applicator and the offset detection device are both connected to the moving end of the lifting assembly. The offset detection device is located on the side of the moving end of the lifting assembly closer to the wafer adsorption assembly. When the wafer is adsorbed onto the wafer adsorption assembly, the driving device drives the offset detection device to approach the wafer, the wafer adsorption assembly drives the wafer to rotate, and the offset detection device detects whether the wafer has undergone radial offset, thereby determining whether the wafer adsorption assembly has stably adsorbed the wafer.

[0006] Optionally, the rotating assembly includes a sleeve rotatably mounted on a corner of the top plate, a lifting rod slidably inserted into the sleeve, the upper end of the lifting rod being located above the machine base and fixed with a crossbar, an adhesive applicator and an offset detection device being connected to the end of the crossbar away from the lifting rod, a gear ring being fixed to the outer side of the end of the sleeve located below the top plate, a first servo motor being fixed to the top surface of the top plate, the output end of the first servo motor extending through the top plate to the inner side of the machine base and fixed with a gear, the gear meshing with the gear ring.

[0007] Optionally, the lifting assembly includes an electric push rod fixed to the outer wall of one end of the sleeve located below the top plate, with the extended end of the electric push rod pointing vertically downward and connected to the lower end of the lifting rod.

[0008] Optionally, a support block is fixed to one end of the crossbar away from the lifting rod, the adhesive applicator includes a longitudinally arranged screw valve fixed to the support block, and the offset detection device is installed on the side of the support block near the wafer adsorption assembly.

[0009] Optionally, the offset detection device includes a base installed on the side of the support block near the wafer adsorption assembly. A pressure sensor is fixed on the outer wall of the base near the wafer adsorption assembly. The outer wall of the base near the wafer adsorption assembly has a normal perpendicular to the rotation axis when the wafer adsorption assembly drives the wafer to rotate.

[0010] Optionally, a connecting plate is fixed to the middle of the top surface of the base, and a rotating shaft is fixed to the end of the connecting plate away from the base. The rotating shaft is rotatably connected to the support block through a bearing. The rotating shaft is driven by a driving device to drive the base to rotate, and the angle of the base on the support block is adjusted according to the change of the wafer size.

[0011] Optionally, the driving device includes a second servo motor fixed to the outer wall of the support block, with the upper end of the rotating shaft fixed to the output end of the second servo motor.

[0012] Compared with the prior art, the advantages of this utility model are as follows: 1. This utility model, by adding a pressure sensor and its position adjustment mechanism, drives the wafer to rotate for testing before applying adhesive. If the adsorption is unstable and causes the wafer to shift and hit the sensor, an alarm will be triggered and the machine will stop, effectively preventing wafer flying and ensuring the safety of the equipment and the wafer.

[0013] 2. This utility model utilizes a first servo motor to adjust the horizontal position of the sensor, a second servo motor to adjust the sensor angle, and an electric push rod to adjust the height, ensuring that the sensor is always accurately aligned with the edge of wafers of different sizes and maintains a set gap, thus guaranteeing detection reliability. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0015] Figure 2 This utility model Figure 1 Enlarged diagram of point A.

[0016] Figure 3 This is a schematic diagram showing the positional relationship between the gear and the gear ring of this utility model.

[0017] Figure 4 This is a schematic diagram of the sleeve structure of this utility model.

[0018] Reference numerals: 1. Machine base; 101. Top plate; 2. Retaining ring; 3. Wafer adsorption assembly; 4. Sleeve; 5. Lifting rod; 6. Crossbar; 7. Support block; 8. Screw valve; 9. Gear ring; 10. First servo motor; 11. Gear; 12. Electric push rod; 13. Base; 14. Connecting plate; 15. Rotating shaft; 16. Second servo motor; 17. Pressure sensor. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0020] Please see Figures 1 to 4 This embodiment provides a wafer photoresist control device, including a machine base 1. A retaining ring 2 protruding from the top surface of the top plate 101 of the machine base 1 is formed in the middle of the top plate 101. A wafer adsorption assembly 3 is installed in the middle of the machine base 1. The wafer adsorption assembly 3 consists of a rotating component, a lifting component, and suction cups. The rotating component is installed at the extended end of the lifting component, and multiple suction cups are usually arranged in a ring array on the rotating end of the rotating component. This enables the adsorption and positioning of the wafer, driving the wafer to rise and fall, so that the wafer enters the inner side of the retaining ring 2, and driving the wafer to rotate inside the retaining ring 2. During the coating process, the adhesive is dropped onto the middle position of the wafer, and the rotating component drives the wafer to rotate, using centrifugal force to perform the coating operation. This is a conventional technology of existing wafer photoresist coating machines and is a publicly disclosed mature prior art, so it will not be described in detail here.

[0021] A sleeve 4 is rotatably mounted on a corner of the top plate 101 via a bearing. A lifting rod 5 is slidably inserted into the sleeve 4. A rib is formed on the inner wall of the sleeve 4, extending along the axial direction of the sleeve 4. A groove is formed on the outer wall of the lifting rod 5, extending along the axial direction of the lifting rod 5. The rib is inserted into the groove, so that the lifting rod 5 can only slide up and down along the inner wall of the sleeve 4 and cannot rotate relative to the sleeve 4. The upper end of the lifting rod 5 is located above the machine base 1 and is fixed with a crossbar 6. A support block 7 is fixed at the end of the crossbar 6 away from the lifting rod 5. A screw valve 8 arranged longitudinally is fixed on the support block 7.

[0022] The screw valve 8 is the working component of the glue spraying system. When it is running, the pump is connected to the feed end of the screw valve 8 through a hose, which drives the pump to work and pump glue into the screw valve 8. The screw valve 8 controls the amount of glue extruded to realize the glue spraying operation.

[0023] A gear ring 9 is fixed to the outer side of one end of the sleeve 4 located below the top plate 101. A first servo motor 10 is fixed to the top surface of the top plate 101. The output end of the first servo motor 10 extends through the top plate 101 to the inner side of the machine base 1 and is fixed with a gear 11. The gear 11 meshes with the gear ring 9. An electric push rod 12 is fixed to the outer wall of one end of the sleeve 4 located below the top plate 101. The extended end of the electric push rod 12 is vertically downward and connected to the lower end of the lifting rod 5. The adjustment of the position of the screw valve 8 is divided into two directions. First, in the vertical direction, by driving the electric push rod 12 to extend, the lifting rod 5 can be pushed to slide downward inside the sleeve 4. Driving the electric push rod 12 to retract pulls the lifting rod 5 upward, thereby achieving the effect of driving the screw valve 8 to lift. The rotation adjustment of the screw valve 8 is achieved by driving the first servo motor 10 to rotate, which drives the side wall wheel to move the gear ring 9, thereby driving the sleeve 4, the lifting rod 5, the crossbar 6, and the screw valve 8 to rotate, adjusting the horizontal position of the screw valve 8.

[0024] The position of the screw valve 8 is adjusted by the cooperation of the electric push rod 12 and the first servo motor 10. The position of the screw valve 8 above the machine 1 is adjusted. When applying the coating, it is adjusted to face the center of the wafer rotation. If the wafer is placed correctly, it is facing the center of the wafer surface.

[0025] A base 13 is provided on the side of the support block 7 near the wafer adsorption assembly 3. The height of the base 13 is much higher than the height of the lowest end of the screw valve 8. A connecting plate 14 is fixed in the middle of the top surface of the base 13. A rotating shaft 15 is fixed at the end of the connecting plate 14 away from the base 13. The rotating shaft 15 is rotatably connected to the support block 7 through a bearing. A second servo motor 16 is fixed on the outer wall of the support block 7. The upper end of the rotating shaft 15 is fixed to the output end of the second servo motor 16. By driving the second servo motor 16 to rotate, the rotating shaft 15 is driven to rotate, thereby adjusting the angle between the base 13 and the support block 7.

[0026] A pressure sensor 17 is fixed on the outer wall of the base 13 near the wafer adsorption assembly 3. By adjusting the angle between the base 13 and the support block 7, the angle of the pressure sensor 17 can be adjusted according to the change of wafer size. This ensures that no matter how the wafer diameter changes, the outer wall of the base 13 near the wafer adsorption assembly 3 always has a normal perpendicular to the axis of rotation when the wafer adsorption assembly 3 drives the wafer to rotate.

[0027] The adsorption stability test of the above structure on the wafer specifically includes the following steps: 1. First, the robotic arm picks up the wafer and places it on the suction cup, where it is attracted by the suction cup. At this time, the suction cup is positioned above the retaining ring 2. The wafer's axis coincides with the wafer's rotation axis. Displacement will only occur when the suction is unstable and the wafer rotates. 2. Drive the first servo motor 10 to work, so that the support block 7 follows the sleeve 4 to rotate to a position close to the outer wall of the wafer. At the same time, the second servo motor 16 works to adjust the angle of the pressure sensor 17, so as to ensure that there is a certain gap between the pressure sensor 17 and the outer periphery of the wafer. The base 13 has a normal line perpendicular to the rotation axis of the wafer adsorption assembly 3 when it drives the wafer to rotate. At this time, the pressure sensor 17 is facing the outer periphery of the wafer, and the gap between the two is y, which is usually set to 3mm. 3. Then, the drive rotating component drives the wafer to rotate at a certain speed. This speed ensures that if the wafer is not stably attracted by the suction cup, it will be radially offset. When the wafer is driven to rotate, if it is not stably attracted, the offset will hit the pressure sensor 17. The pressure signal is fed back to the controller, which can determine that the suction cup is not stable. Then it is reported to the staff to achieve the effect of judging the stability of the suction.

[0028] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wafer photoresist control equipment, comprising a machine table (1), a wafer adsorption assembly (3) is installed in the middle of the machine table (1), characterized in that, A drive device is installed on the top plate (101) of the machine (1), and the output end of the drive device is respectively equipped with a glue applicator and a displacement detection device. The drive device consists of a rotating assembly mounted on the top plate (101) and a lifting assembly mounted on the rotating assembly. The glue applicator and the offset detection device are both connected to the moving end of the lifting assembly. The offset detection device is located on the side of the moving end of the lifting assembly close to the wafer adsorption assembly (3). When the wafer is adsorbed on the wafer adsorption assembly (3), the driving device drives the offset detection device to approach the wafer, the wafer adsorption assembly (3) drives the wafer to rotate, and the offset detection device detects whether the wafer has radially offset, thereby determining whether the wafer adsorption assembly (3) stably adsorbs the wafer.

2. The wafer photoresist controlling equipment according to claim 1, wherein, The rotating assembly includes a sleeve (4) rotatably mounted on a corner of the top plate (101). A lifting rod (5) is slidably inserted into the sleeve (4). The upper end of the lifting rod (5) is located above the machine base (1) and is fixed with a crossbar (6). The glue applicator and the offset detection device are both connected to the end of the crossbar (6) away from the lifting rod (5). A gear ring (9) is fixed on the outer side of the end of the sleeve (4) located below the top plate (101). A first servo motor (10) is fixed on the top surface of the top plate (101). The output end of the first servo motor (10) extends through the top plate (101) to the inner side of the machine base (1) and is fixed with a gear (11). The gear (11) meshes with the gear ring (9).

3. The wafer photoresist controlling equipment according to claim 2, wherein, The lifting assembly includes an electric push rod (12) fixed on the outer wall of one end of the sleeve (4) located below the top plate (101). The extended end of the electric push rod (12) is vertically downward and connected to the lower end of the lifting rod (5).

4. The wafer photoresist controlling equipment according to claim 2, wherein, The crossbar (6) is fixed with a support block (7) at one end away from the lifting rod (5). The adhesive applicator includes a screw valve (8) arranged longitudinally on the support block (7). The offset detection device is installed on the side of the support block (7) near the wafer adsorption assembly (3).

5. The wafer photoresist control equipment according to claim 4, wherein, The offset detection device includes a base (13) installed on the side of the support block (7) near the wafer adsorption assembly (3). A pressure sensor (17) is fixed on the outer wall of the base (13) near the wafer adsorption assembly (3). The outer wall of the base (13) near the wafer adsorption assembly (3) has a normal perpendicular to the rotation axis when the wafer adsorption assembly (3) drives the wafer to rotate.

6. The wafer photoresist control equipment according to claim 5, wherein, A connecting plate (14) is fixed in the middle of the top surface of the base (13). A rotating shaft (15) is fixed at one end of the connecting plate (14) away from the base (13). The rotating shaft (15) is rotatably connected to the support block (7) through a bearing. The rotating shaft (15) is driven by a driving device to drive the base (13) to rotate. The angle of the base (13) on the support block (7) is adjusted according to the change of the wafer size.

7. The wafer photoresist control equipment according to claim 6, wherein, The drive device includes a second servo motor (16) fixed on the outer wall of the support block (7), and the upper end of the rotating shaft (15) is fixed to the output end of the second servo motor (16).

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