Heat exchange device with radiators arranged at an angle

Abstract

This utility model discloses a heat exchange device with an inclined radiator, comprising: a housing, a radiator, a circuit board, an inlet pipe, an outlet pipe, a pair of fans, and a water pump; wherein, the radiator is inclinedly installed inside the housing; the circuit board is inclinedly installed inside the housing, with one end connected to the bottom of the housing and the other end connected to the radiator; one end of the inlet pipe is connected to a heat source and the other end is connected to the radiator; one end of the outlet pipe is connected to the radiator and the other end is connected to the heat source; a pair of fans are located at the rear end of the housing; the water pump is connected to the cooling pipe of the radiator and an external heat source respectively through the outlet pipe. This utility model solves the problem of insufficient heat dissipation capacity of traditional heat dissipation devices in space-constrained scenarios, optimizes the heat transfer path, improves heat exchange efficiency, and ensures stable heat dissipation for devices such as switches and servers.

Description

Technical Field

[0001] This utility model relates to the field of heat exchange technology, and in particular to a heat exchange device with an inclined radiator arrangement. Background Technology

[0002] With the development of big data and artificial intelligence technologies, the number of switches and servers in use is increasing rapidly, which in turn leads to a significant increase in the demand for heat dissipation devices.

[0003] Most existing cooling systems employ a rear-mounted cooling method, with the typical heat dissipation path being heat source → heat sink → rear exhaust. While this method can directly expel heat from the chassis, it has certain limitations. For example, in some servers, due to space constraints, the cooling system must be located at the bottom. Consequently, the height and width of the heat exchanger are limited. Traditional linear heat sinks have a small effective heat dissipation area at the bottom, resulting in insufficient cooling capacity and making it difficult to meet the cooling requirements of high-power devices. Summary of the Invention

[0004] According to an embodiment of the present invention, a heat exchange device with an inclined radiator is provided, comprising: case; The radiator is installed at an angle inside the housing; The circuit board is installed at an angle inside the housing, with one end connected to the bottom of the housing and the other end connected to the heat sink. The liquid inlet pipe has one end connected to the heat source and the other end connected to the radiator. The liquid outlet pipe is connected to the radiator at one end and to the heat source at the other end. A pair of fans are located at the rear end of the casing. The water pump is connected to the cooling pipe of the radiator and an external heat source through its outlet pipe.

[0005] Furthermore, the circuit board and the heat sink form a continuous slope within the housing.

[0006] Furthermore, an isolation net is provided at the front end of the shell.

[0007] Furthermore, it also includes a central control screen, which is located in the middle of the isolation net and electrically connected to the circuit board.

[0008] Furthermore, it also includes a quick interface, which is disposed on the housing and electrically connected to the circuit board for connection to an external power source.

[0009] Furthermore, a pair of handles are provided at the front end of the housing.

[0010] The heat exchange device with an inclined radiator according to the embodiment of the present invention solves the problem of insufficient heat dissipation capacity of traditional heat dissipation devices in space-constrained scenarios, optimizes the heat transfer path, improves heat exchange efficiency, and ensures stable heat dissipation of equipment such as switches and servers.

[0011] It should be understood that both the foregoing general description and the following detailed description are exemplary and intended to provide further illustration of the claimed technology. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of a principle according to an embodiment of the present utility model; Figure 2 This is a perspective view schematic diagram according to an embodiment of the present utility model; Figure 3 This is a schematic front view diagram according to an embodiment of the present utility model; Figure 4 This is a rear view schematic diagram according to an embodiment of the present utility model; Figure 5 Internal structure according to embodiments of the present utility model Figure 1 ; Figure 6 Internal structure according to embodiments of the present utility model Figure 2 . Detailed Implementation

[0013] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, further illustrating the present invention.

[0014] First, combine Figures 1-6 The present invention describes a heat exchange device with an inclined radiator arrangement according to an embodiment of the present invention, which is used for heat dissipation of servers and switches and has a wide range of applications.

[0015] like Figures 1-6 As shown, the heat exchange device with an inclined radiator arrangement according to an embodiment of the present invention includes: Casing 1; Radiator 2 is installed at an angle inside the housing 1. This angled arrangement breaks the traditional straight layout and can make full use of the bottom space to increase the effective heat dissipation area of ​​radiator 2. Circuit board 3 is installed at an angle inside housing 1. One end is connected to the bottom of housing 1 and the other end is connected to heat sink 2. Circuit board 3 and heat sink 2 form a continuous slope inside housing 1, which optimizes the heat transfer path and reduces the obstruction of air by the space formed between the front end of heat sink 2 and the bottom of housing 1. At the same time, circuit board 3 can dissipate heat quickly. Liquid inlet pipe 4, one end of which is connected to a heat source and the other end of which is connected to radiator 2; The liquid outlet pipe 5 is connected at one end to the radiator 2 and at the other end to the heat source. A pair of fans 6 are located at the rear end of the housing 1. When the fans 6 are working, they accelerate airflow and enhance the heat dissipation effect of the radiator 2. Under the action of the fans 6, the air flows quickly across the surface of the radiator 2, carrying away the heat dissipated by the radiator 2 and ensuring the efficient operation of the radiator 2.

[0016] Water pump 7 is connected to the cooling pipe of radiator 2 and an external heat source through the liquid outlet pipe 5, providing power for the circulation of coolant and ensuring that the coolant flows stably and quickly in the cooling circulation system, so as to transfer and dissipate heat in a timely and effective manner.

[0017] Furthermore, such as Figures 5-6 As shown, in this embodiment, the angle between the radiator 2 and the bottom of the housing 1 is reasonably set according to different spaces.

[0018] Furthermore, such as Figures 2-3 As shown, in this embodiment, an isolation net 8 is provided at the front end of the housing 1 to prevent large external debris from entering the device and protect the internal components, while not affecting air circulation and ensuring the heat dissipation effect of the device.

[0019] Furthermore, such as Figures 2-3 As shown, this embodiment also includes a central control screen 9 (existing technology), which is located in the middle of the isolation net 8 and electrically connected to the circuit board 3. Users can intuitively view and control the operating parameters of the heat exchange device, such as coolant temperature, fan speed 6, and water pump 7 working status, through the central control screen 9, thereby realizing intelligent operation and management.

[0020] Furthermore, such as Figure 3 As shown, in this embodiment, it also includes: a quick interface 10, which is disposed on the housing 1 and electrically connected to the circuit board 3 for connecting to an external power source; the quick interface 10 facilitates quick connection and disconnection of the device from the external power source, improves ease of use, and facilitates the installation and disassembly of the device.

[0021] Furthermore, such as Figures 2-3 As shown, in this embodiment, a pair of handles 11 are provided at the front end of the housing 1 to facilitate the handling and movement of the device and to facilitate the operation of the device during installation, maintenance and replacement.

[0022] Working principle: When in use, the fan 6 and water pump 7 work. The fan accelerates the airflow inside the casing 1, carrying away the heat dissipated by the coolant in the radiator 2, thus lowering the coolant temperature. The water pump 7 delivers the coolant to the cooling pipe on the heat source and causes the heated coolant to flow back from the heat source to the corresponding radiator 2, and so on.

[0023] Above, refer to Figures 1-6 This invention describes a heat exchange device with an inclined radiator arrangement according to an embodiment of the present invention. This device solves the problem of insufficient heat dissipation capacity of traditional heat dissipation devices in space-constrained scenarios, optimizes the heat transfer path, improves heat exchange efficiency, and ensures stable heat dissipation for devices such as switches and servers.

[0024] It should be noted that, in this specification, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes that element.

[0025] Although the present invention has been described in detail through the above preferred embodiments, it should be understood that the above description should not be considered as a limitation of the present invention. Various modifications and substitutions to the present invention will be apparent to those skilled in the art after reading the above content. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. A heat exchanger device of heat sink tilting arrangement, characterized by, Include: case; A radiator is installed at an angle inside the housing; A circuit board, which is installed at an angle inside the housing, with one end connected to the bottom of the housing and the other end connected to the heat sink; The liquid inlet pipe has one end connected to a heat source and the other end connected to the radiator. The liquid outlet pipe has one end connected to the radiator and the other end connected to the heat source. A pair of fans, wherein the pair of fans are disposed at the rear end of the housing; A water pump is connected to the cooling pipe of the radiator and an external heat source through the liquid outlet pipe.

2. The heat exchanger device with the heat sink tilting arrangement according to claim 1, characterized in that, The circuit board and the heat sink form a continuous slope within the housing.

3. The heat exchanger device of claim 1, wherein An isolation net is provided at the front end of the shell.

4. The heat exchanger device with the heat sink tilting arrangement according to claim 3, characterized in that, It also includes: a central control screen, which is disposed in the middle of the isolation net and electrically connected to the circuit board.

5. The heat exchanger device of claim 1, wherein It also includes a quick interface, which is disposed on the housing and electrically connected to the circuit board for connection to an external power source.

6. The heat exchanger device of claim 1, wherein The front end of the housing is provided with a pair of handles.

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