Composite heat dissipation system
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-24
- Publication Date
- 2026-08-14
AI Technical Summary
[0003]但是,上述现有的各种散热元件可以设置在电子产品或伺服器的热源上,仅遵循主电路板或处理器发出的指令运转以进行散热,无法依据热源的功耗变化即时调控散热性能,另外,现有的散热模组未监控热管、散热鳍片、风扇、均温水路等散热元件的温度上升情形,而无法进一步判断散热效率是否能够带走瞬间产生的热能,导致电子产品或伺服器在高效运转时,无法即时带走大量热能;或是,在电子产品或伺服器在一般作业或休眠状态时,空转及浪费散热效能
[0011] Therefore, the composite heat dissipation system of this utility model can increase heat dissipation and cooling efficiency by absorbing heat energy from multiple hot spots through multiple heat dissipation modules. In addition, by detecting the temperature at multiple points and analyzing the temperature rise trend of the high-power system, the heat dissipation efficiency of the corresponding heat dissipation module can be improved in real time, and the speed of the heat dissipation module can be reduced when the system is operating normally or idling, which has the effects of energy saving and noise reduction.
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Figure CN224636811U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a heat dissipation technology, and more particularly to a composite heat dissipation system that integrates different heat dissipation methods and can adjust the heat dissipation efficiency according to the power consumption of the heat source. Background Technology
[0002] Existing heat dissipation modules can be air-cooled cooling fans with heat sinks, or water-cooled circulating water circuits with water pumps. Components such as heat pipes, vapor chambers, and peltiers can also be added to improve the efficiency of heat conduction, heat diffusion, and heat transfer, thereby quickly and in large quantities removing heat energy from the heat source.
[0003] However, the aforementioned existing heat dissipation components can be placed on the heat source of electronic products or servers, and operate only according to the instructions issued by the main circuit board or processor to dissipate heat. They cannot adjust the heat dissipation performance in real time according to the power consumption changes of the heat source. In addition, existing heat dissipation modules do not monitor the temperature rise of heat pipes, heat sinks, fans, and heat exchange channels, and therefore cannot further determine whether the heat dissipation efficiency can remove the instantaneously generated heat energy. This results in electronic products or servers not being able to remove a large amount of heat energy in time when operating at high efficiency; or, when electronic products or servers are in normal operation or sleep mode, they idle and waste heat dissipation efficiency.
[0004] Therefore, there is indeed a need to improve the existing heat dissipation modules. Utility Model Content
[0005] To address the aforementioned problems, the purpose of this invention is to provide a composite heat dissipation system that can improve heat dissipation efficiency and heat removal capacity.
[0006] A further objective of this invention is to provide a composite heat dissipation system that can monitor temperature changes at multiple points.
[0007] The directions or similar terms used throughout this utility model, such as "left", "right", "up (top)", "down (bottom)", "inner", "outer", etc., are mainly based on the directions in the accompanying drawings. These directions or similar terms are only used to assist in explaining and understanding the various embodiments of this utility model and are not intended to limit this utility model.
[0008] The term "a" is used to describe the elements and components described throughout this utility model, but only for convenience and to provide the general meaning of the scope of this utility model; it should be interpreted in this utility model as including one or at least one, and the concept of a single one also includes multiple cases, unless it clearly means otherwise.
[0009] The terms "combination," "integration," or "assembly" used throughout this utility model mainly include those that allow for separation without damaging the components after connection, or those that make the components inseparable after connection. Those skilled in the art can choose the appropriate term based on the material of the components to be connected or the assembly requirements.
[0010] The present invention discloses a composite heat dissipation system comprising: a liquid cooling module that thermally contacts and cools a heat source; an air cooling module that thermally contacts and cools the heat source; a plurality of sensing units located respectively in the liquid cooling module, the air cooling module, and the heat source, each sensing unit measuring a temperature value; and a control unit coupled to the liquid cooling module, the air cooling module, and the plurality of sensing units, the control unit receiving the plurality of temperature values and regulating the heat dissipation efficiency of the liquid cooling module and the air cooling module.
[0011] Therefore, the composite heat dissipation system of this utility model can increase heat dissipation and cooling efficiency by absorbing heat energy from multiple hot spots through multiple heat dissipation modules. In addition, by detecting the temperature at multiple points and analyzing the temperature rise trend of the high-power system, the heat dissipation efficiency of the corresponding heat dissipation module can be improved in real time, and the speed of the heat dissipation module can be reduced when the system is operating normally or idling, which has the effects of energy saving and noise reduction.
[0012] The liquid cooling module includes a vapor chamber and a water pump. The vapor chamber is in thermal contact with the heat source, and the water pump drives a working fluid to circulate within the vapor chamber through a temperature-controlled water path. In this way, the vapor chamber can remove heat energy through heat conduction and diffusion, thereby improving heat transfer and heat dissipation efficiency.
[0013] The multiple sensing units measure the temperature of the vapor chamber and / or the working fluid of the liquid cooling module. In this way, each sensing unit can monitor the temperature rise of the liquid cooling module in real time, thereby determining the heat dissipation of each component and assisting in heat dissipation control and improving operational safety.
[0014] The air-cooled module includes a heat pipe, a heat sink fin, and a fan. The heat pipe is in thermal contact with the heat source, and one end of the heat pipe is connected to the heat sink fin. The fan's exhaust port faces the heat sink fin. In this way, the heat pipe can transfer and disperse the heat energy from the heat source to the heat sink fin, and the fan pushes cool air to carry away the heat energy from the heat sink fin, thus dispersing heat energy and improving heat dissipation efficiency.
[0015] The multiple sensing units measure the temperature of the heat pipe, the heat sink fins, and / or the air outlet of the fan in the air-cooled module. In this way, each sensing unit can monitor the temperature rise of the air-cooled module in real time, thereby determining the heat dissipation status of each component and assisting in heat dissipation control and improving operational safety.
[0016] The control unit is coupled to a motherboard where the heat source is located. This motherboard can provide power, set heat dissipation control programs and conditions, or directly regulate the control unit, enabling rapid execution and adjustment of heat dissipation.
[0017] This novel composite heat dissipation system further includes a cooling chip module located on the heat source and coupled to the control unit. Thus, the control unit can operate the cooling chip module to absorb heat energy from the heat source, providing auxiliary heat dissipation. Attached Figure Description
[0018] Figure 1 : System block diagram of a preferred embodiment of this utility model; Figure 2 : A combined perspective view of a preferred embodiment of this utility model; Figure 3 : A top view of the preferred embodiment of this utility model; Figure 4 : Control flowchart of a preferred embodiment of this utility model.
[0019] Explanation of reference numerals in the attached figures: 1: Liquid cooling module 11: Heat spreader 12: Water pump 2: Air-cooled module 21: Heat pipe 22: Heat dissipation fins 23: Fan 3: Sensing Unit 4: Control Unit 5: Cooling chip module H: Heat source m: slope of temperature change. Detailed Implementation
[0020] While preferred embodiments have been disclosed to achieve the above-mentioned objectives, they are not intended to limit the structural features of the present invention. Anyone skilled in the art will understand that any easily conceived variations or modifications are possible within the spirit of the present invention and are all covered by the claims of the present invention. To make the above and other objectives, features, and advantages of the present invention more apparent and understandable, preferred embodiments of the present invention are described below in detail with reference to the accompanying drawings; furthermore, reference numerals in different drawings are considered identical and their descriptions will be omitted.
[0021] Please refer to Figure 1As shown, this is a preferred embodiment of the composite heat dissipation system of this utility model, including a liquid cooling module 1, an air cooling module 2, multiple sensing units 3, and a control unit 4. The liquid cooling module 1, the air cooling module 2, and the multiple sensing units 3 are coupled to the control unit 4. The liquid cooling module 1 and the air cooling module 2 are used to cool a heat source H. The multiple sensing units 3 can detect temperature changes of the liquid cooling module 1, the air cooling module 2, and the heat source H, respectively. The heat source H can come from high-power products such as host computers, laptops, and servers.
[0022] Please refer to Figure 2 and Figure 3 As shown, the liquid cooling module 1 may have a heat spreader 11 and a water pump 12. The heat spreader 11 is preferably made of a metal shell or other material with high thermal conductivity. The heat spreader 11, through thermal contact with the heat source H, can remove heat energy through thermal conduction and thermal diffusion. In addition, the water pump 12 can drive a working fluid to circulate in the isothermal water path within the heat spreader 11, which can improve the amount of heat transfer and heat dissipation efficiency. In this embodiment, one heat spreader 11 and one water pump 12 are respectively arranged for one heat source H; however, the number and configuration of components in the liquid cooling module 1 of this utility model are not limited thereto.
[0023] The air-cooled module 2 may have a heat pipe 21, a heat sink fin 22, and a fan 23. By making the heat pipe 21 in thermal contact with the heat source H, and connecting one end of the heat pipe 21 to the heat sink fin 22, and then directing the air outlet of the fan 23 toward the heat sink fin 22, the heat energy of the heat source H can be transferred and dispersed to the heat sink fin 22, and then the fan 23 pushes cold air to carry away the heat energy on the heat sink fin 22. In this embodiment, the middle section of the heat pipe 21 makes thermal contact with the heat source H, and the two ends of the heat pipe 21 make thermal contact with the two heat sink fins 22 to the left and right, respectively. The two heat sink fins 22 are located at the air outlets of the two fans 23. However, the air-cooled module 2 of this invention is not limited to the shape and configuration of the heat pipe 21, or the number and position of the heat sink fins 22 and the fan 23.
[0024] In addition, in this embodiment, the liquid cooling module 1 and the air cooling module 2 are in thermal contact with the same heat source H. However, the liquid cooling module 1 and the air cooling module 2 may also be in thermal contact with multiple different heat sources H. This utility model is not limited to the number of heat sources H and the thermal contact configuration.
[0025] The multiple sensing units 3 can be electronic components such as thermocouples and thermistors, which can convert the temperature changes around each sensing unit 3 into electrical signals. By analyzing the temperature values corresponding to the electrical signals, they can be used as thermometers. These multiple sensing units 3 can directly measure the temperature of the heat source H, and can also measure the temperature of the vapor chamber 11 and / or the working fluid in the liquid cooling module 1, or the temperature of the heat pipe 21, the heat sink 22, and / or the air outlet of the fan 23 in the air cooling module 2. However, this invention is not limited to the number and arrangement of the multiple sensing units 3. Thus, by using each sensing unit 3, possible abnormal temperature rises of various components can be detected in real time. In addition to adjusting the corresponding heat dissipation performance accordingly, it can also prevent safety issues such as component damage or heat-related injuries.
[0026] The control unit 4 can be a microcontroller unit (MCU). When the system is operating, the control unit 4 starts to receive the electrical signals of the multiple sensing units 3 and analyzes the temperature changes distributed in various parts of the composite heat dissipation system of this utility model. In this embodiment, the control unit 4 is coupled to the water pump 12 and the two fans 23. The control unit 4 can adjust the heat dissipation efficiency of the liquid cooling module 1 and the air cooling module 2 according to the preset control conditions to meet the large heat dissipation demand of the heat source H when it is operating at high efficiency; and reduce the heat dissipation of the heat source H during normal operation, idling, or when some components are not in use to achieve the effects of noise reduction and energy saving.
[0027] In addition, the control unit 4 can also be coupled to the motherboard where the heat source H is located. Besides providing power to the control unit 4, the control unit 4 can also have its heat dissipation control program and conditions preset, or can be notified of changes in the operating power of the heat-generating device, enabling the control unit 4 to quickly execute heat dissipation efficiency adjustment steps. The control unit 4 can automatically control the heat dissipation operation based on the detection results, or it can be subject to the settings and adjustments of the motherboard; however, this invention is not limited thereto.
[0028] In addition, the composite heat dissipation system of this utility model may also include a cooling chip module 5, which may be located on the heat source H and coupled to the control unit 4. The control unit 4 operates the cooling chip module 5 to absorb the heat energy of the heat source H to assist in heat dissipation.
[0029] Please refer to Figure 1 , Figure 2 and Figure 4As shown, this is a preferred embodiment of the control method of the composite heat dissipation system of this utility model. Before the system is started, a system origin and a system temperature slope are preset. After the system is started, the temperature measurement values and their changes at various points in the system are collected. The operating efficiency of the corresponding heat dissipation module is adjusted according to the temperature change. Temperature measurement and heat dissipation efficiency control are repeatedly executed.
[0030] In this embodiment, the system temperature slope is set. First, the initial temperature and initial values of the control parameters are selected as the system origin. The control parameters can be the pulse-width modulation (PWM) signal driving the water pump 12 and / or the fan 23, or the flow rate of the water pump 12 and / or the air volume of the fan 23. Then, the ratio of the control parameters to the temperature change is used as the slope. A straight line passing through the system origin is drawn on the relationship graph of control parameters and temperature, which is the system temperature slope. Thus, if a system temperature slope with a larger slope is selected, the heat dissipation speed is faster; conversely, if a system temperature slope with a smaller slope is selected, the heat dissipation speed is slower. The appropriate system origin and system temperature slope can be selected according to the operating power and heat generation of the heat-generating device.
[0031] After the system starts up, the multiple sensing units 3 collect the temperature changes of the liquid cooling module 1, the air cooling module 2, and the heat source H. Each sensing unit 3 can measure the temperature value at sampling intervals. The control unit 4 subtracts the previous temperature value from each temperature value and divides it by the sampling time to obtain a temperature change slope m. In addition, the control unit 4 can also take the average of multiple consecutive temperature change slopes m to determine the system's heat dissipation status and adjust the heat dissipation accordingly to avoid possible erroneous temperature measurement results that could lead to system misjudgments.
[0032] When the slope of temperature change m is greater than zero, it indicates that the system temperature is rising and heat dissipation efficiency needs to be increased. The control unit 4 increases the corresponding control parameter. When the slope of temperature change m is less than zero, it indicates that the system temperature is falling and the heat dissipation capacity is excessive. The control unit 4 decreases the corresponding control parameter to save energy. When the slope of temperature change m is equal to zero, it indicates that the system temperature is stable, and the control unit 4 can maintain the current control parameter. For example, if the temperature of the heat sink fin 22 located at the air outlet of the fan 23 is measured and the temperature value is found to be rising continuously, that is, the slope of temperature change m is greater than zero for a period of time, it means that the airflow cooling effect of the fan 23 is insufficient to cool down the system. The pulse width modulation signal driving the fan 23 can be increased to increase the fan speed and airflow, which can accelerate the removal of heat energy on the heat sink fin 22 and improve the system heat dissipation efficiency until the slope of temperature change m drops to zero or less than zero.
[0033] In summary, the composite heat dissipation system and its control method of this utility model can increase heat dissipation and cooling efficiency by absorbing heat energy from multiple hot spots through multiple heat dissipation modules. In addition, by detecting the temperature at multiple points and analyzing the temperature rise trend of the high-power system, the heat dissipation efficiency of the corresponding heat dissipation modules can be improved in real time, and the speed of the heat dissipation modules can be reduced when the system is operating normally or idling, which has the effects of energy saving and noise reduction.
[0034] Although the present invention has been disclosed using the above preferred embodiments, it is not intended to limit the present invention. Any modifications and alterations made by those skilled in the art to the above embodiments without departing from the spirit and scope of the present invention shall still fall within the technical scope protected by the present invention. Therefore, the scope of protection of the present invention shall be determined by the claims.
Claims
1. A hybrid heat dissipation system, comprising: include: A liquid-cooled module that thermally contacts and cools a heat source; An air-cooled module thermally contacts and cools the heat source. The air-cooled module has a heat pipe, a heat sink fin, and a fan. The heat pipe thermally contacts the heat source, one end of the heat pipe is connected to the heat sink fin, and the air outlet of the fan faces the heat sink fin. Multiple sensing units are located in the liquid cooling module, the air cooling module and the heat source respectively. The multiple sensing units measure the temperature of the heat pipe, the heat dissipation fins and / or the air outlet of the fan in the air cooling module. Each sensing unit measures a temperature value. and A control unit is coupled to the liquid cooling module, the air cooling module, and the multiple sensing units, and the control unit receives multiple temperature values.
2. The composite heat dissipation system as described in claim 1, characterized in that, The liquid cooling module has a vapor chamber and a water pump. The vapor chamber is in thermal contact with the heat source, and the water pump drives a working fluid to circulate in the vapor chamber through a vapor chamber water channel.
3. The hybrid heat dissipation system of claim 2, wherein, The multiple sensing units measure the temperature of the vapor chamber and / or the working fluid of the liquid cooling module.
4. The hybrid heat dissipation system of claim 1, wherein, The control unit is coupled to a main board where the heat source is located.
5. The composite heat dissipation system according to any one of claims 1 to 4, further comprising a cooling chip module located on the heat source and coupled to the control unit.