A heat dissipation module

Abstract

This utility model provides a heat dissipation module, relating to the field of computer heat dissipation equipment technology, to solve the problem of limited heat dissipation effect in existing air-cooled devices due to the limited airflow path. The heat dissipation module includes a water-cooling mechanism, a heat sink, and a cooling fan. The water-cooling mechanism is connected to the heat sink and can remove heat from the heat sink. The cooling fan is positioned facing one side of the heat sink and has an air outlet on the other side of the heat sink. The airflow from the cooling fan flows along the surface of the heat sink in its longitudinal direction and exits from the air outlet. This utility model's heat dissipation module effectively increases the path of the cooling fan's airflow along the surface of the heat sink, increases the contact time between the airflow and the heat sink surface, and improves the heat dissipation effect.

Description

Technical Field

[0001] This utility model relates to the field of computer heat dissipation equipment technology, and in particular to a heat dissipation module. Background Technology

[0002] With the continuous development of computer technology, graphics cards, as high-performance components in computers, are constantly improving in performance. Their core components, such as GPUs and video memory, generate a lot of heat during high-intensity operations. If the heat cannot be dissipated in time, it will cause the graphics card to overheat, thereby affecting its performance and stability, and may also shorten its lifespan.

[0003] Traditional graphics card cooling systems typically use fan modules to generate airflow, which is then dissipated through heatsinks. For example, patent application number 202422278485.2 discloses an easily assembled computer graphics card cooling module. This module includes a fin module, metal strips, a fan housing, and fan blades. The metal strips are connected to the upper surface of the fin module, and the fan housing is mounted on the surface of the fin module. The fan blades are embedded inside the fan housing. This single-sided airflow design allows the fan blades to blow air directly onto the fin module, with the airflow passing through the heatsink and exiting from its back. Cooling is achieved through the combination of fins and fans. However, this cooling method requires multiple fans positioned to blow air onto the fins in order to increase the heat dissipation area. The large number of fans and the short airflow path result in a short time of airflow across the fin surface, limiting the cooling effect of the module and impacting the user experience. Utility Model Content

[0004] The purpose of this invention is to provide a heat dissipation module to solve the problem of limited heat dissipation effect at the flow path of air-cooled air in the prior art. The heat dissipation module of this invention can effectively increase the path of the exhaust fan along the surface of the heat sink, increase the contact time between the exhaust air and the surface of the heat sink, and improve the heat dissipation effect.

[0005] The present invention provides a heat dissipation module, including a water-cooled heat dissipation mechanism, a heat sink, and a cooling fan. The water-cooled heat dissipation mechanism is connected to the heat sink and can remove the heat on the heat sink. The cooling fan is disposed on one side facing the heat sink and has an air outlet on the other side of the heat sink. The air from the cooling fan flows through the surface of the heat sink in the longitudinal direction and then flows out from the air outlet.

[0006] As a preferred embodiment of this utility model, it also includes an air guide cover, which covers the heat dissipation plate and forms an air guide channel between the air guide cover and the heat dissipation plate. An installation port and an air outlet are respectively provided on both sides of the air guide cover. The cooling fan is installed at the installation port, and both the installation port and the air outlet are connected to the air guide channel.

[0007] As a preferred embodiment of this utility model, the water-cooled heat dissipation mechanism includes a cold head, water-cooling pipes and a radiator. The cold head is connected to the radiator through the water-cooling pipes, and a circulation loop is formed between the cold head, the water-cooling pipes and the radiator. The cold head is mounted on the heat dissipation plate.

[0008] As a preferred embodiment of this utility model, it also includes a side baffle plate, which is installed on the end of the air guide cover plate near the mounting opening and closes the end of the air guide channel near the cooling fan.

[0009] As a preferred embodiment of this utility model, connecting edges are respectively provided on the front and rear sides of the heat sink, the connecting edges are arranged along the length direction of the heat sink, and a plurality of heat sinks are provided on the heat sink, the heat sinks being parallel to the connecting edges.

[0010] As a preferred embodiment of this utility model, it also includes a circuit board, which is mounted on the side of the heat sink away from the air guide cover.

[0011] As a preferred embodiment of this utility model, it includes a back plate, which is mounted on the side of the circuit board away from the heat sink.

[0012] In a preferred embodiment of this utility model, the heat sink is made of aluminum alloy sheet.

[0013] Compared with the prior art, the present invention has the following positive effects: The heat dissipation module provided by this utility model includes a water-cooling mechanism, a heat sink, and a cooling fan. The water-cooling mechanism is connected to the heat sink and can remove heat from the heat sink. The cooling fan is positioned on one side of the heat sink and has an air outlet on the other side. The air from the cooling fan flows along the surface of the heat sink in its longitudinal direction and exits from the air outlet. This utility model's heat dissipation module dissipates heat from the heat sink by using a water-cooling mechanism connected to the heat sink. Furthermore, by positioning the cooling fan and air outlet on opposite sides of the heat sink, the air from the cooling fan flows along the surface of the heat sink in its longitudinal direction and exits from the air outlet. This effectively increases the path of the airflow along the surface of the heat sink and increases the contact time between the airflow and the surface of the heat sink. This allows the airflow from the cooling fan to effectively remove heat from the heat sink through air cooling, improving the heat dissipation effect. The water-cooling mechanism further enhances the heat dissipation effect of the heat sink. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the heat dissipation module of this utility model. In the diagram: 1. Water cooling mechanism; 11. Radiator; 12. Water cooling pipe; 13. Cold block; 2. Heat sink; 21. Connecting edge; 22. Heat sink fin; 3. Cooling fan; 41. Air guide cover; 411. Mounting port; 412. Air outlet; 42. Back plate; 43. Side baffle; 5. Circuit board. Detailed Implementation

[0016] In the description of this utility model, it should be noted that, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and for simplification, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0017] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0018] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings.

[0019] Example 1: This embodiment provides a heat dissipation module, such as Figure 1As shown, it includes a water-cooling heat dissipation mechanism 1, a heat sink 2, and a cooling fan 3. The water-cooling heat dissipation mechanism 1 is connected to the heat sink 2 and can remove heat from the heat sink 2. The cooling fan 3 is positioned facing one side of the heat sink 2 and has an air outlet 412 on the other side of the heat sink 2. The air from the cooling fan 3 flows along the surface of the heat sink 2 in the longitudinal direction and then flows out from the air outlet 412.

[0020] In this embodiment, the heat dissipation module uses a water-cooling mechanism 1 connected to a heat sink 2 to dissipate heat through water cooling. Furthermore, by placing the cooling fan 3 and the air outlet 412 on opposite sides of the heat sink 2, the air from the cooling fan 3 flows along the surface of the heat sink 2 along its length before exiting through the air outlet 412. This effectively increases the path of the airflow from the cooling fan 3 along the surface of the heat sink 2, increasing the contact time between the airflow and the surface of the heat sink 2. This allows the airflow from the cooling fan 3 to effectively remove heat from the heat sink 2 through air cooling, improving the heat dissipation effect. Combined with the water cooling mechanism 1, the heat dissipation effect of the heat sink 2 is further enhanced.

[0021] In a preferred embodiment, the heat dissipation module further includes an air guide cover 41, which covers the heat sink 2 and forms an air guide channel between the air guide cover 41 and the heat sink 2. An installation port 411 and an air outlet 412 are respectively provided on both sides of the air guide cover 41, and the cooling fan 3 is installed at the installation port 411. Both the installation port 411 and the air outlet 412 are connected to the air guide channel. The water-cooled heat dissipation mechanism 1 is connected to the heat sink 2 on the side near the air guide cover 41. The installation port 411 can be circular, square, or other shapes. The air outlet 412 can be formed by arranging multiple air outlets. The air guide channel is arranged along the length of the heat sink 2. The air guide cover 41 can be made of metal, which has good thermal conductivity and heat dissipation effects.

[0022] In this embodiment, after the cooling fan 3 is started, the exhaust air enters the air guide channel from the mounting port 411 and flows along the air guide channel to the air outlet 412, thereby removing the heat from the heat sink 2 through air cooling.

[0023] In a preferred embodiment, the water-cooled heat dissipation mechanism 1 includes a cold head 13, water-cooling pipes 12, and a radiator 11. The cold head 13 is connected to the radiator 11 via the water-cooling pipes 12, forming a circulation loop between the cold head 13, the water-cooling pipes 12, and the radiator 11. The cold head 13 is mounted on a heat dissipation plate 2. The radiator 11 is located on the outer side of the heat dissipation plate 2. A water pump is located inside the cold head 13.

[0024] The inlet and outlet of the radiator 11 are both located at the same end of the radiator 11, and the inlet and outlet of the cold head 13 are both located on the same side of the cold head 13, so as to reduce the length of the water cooling pipe 12 connecting the radiator 11 and the cold head 13, reduce the space occupied, and facilitate the connection between the cold head 13 and the radiator 11.

[0025] In this embodiment, when the water-cooled heat dissipation mechanism 1 is in use, the heat generated by the heat dissipation plate 2 is conducted to the liquid inside it through the cold head 13. Under the action of the water pump, the liquid flows to the radiator 11 through the water cooling pipe 12 on one side. The heat is dissipated and cooled by the radiator 11. Then the liquid flows back to the cold head 13 through the water cooling pipe 12 on the other side, thereby realizing the circulation flow and providing water cooling for the heat dissipation plate 2.

[0026] In a preferred embodiment, the heat dissipation module further includes a side baffle 43. The side baffle 43 is installed on the end of the air guide cover 41 near the mounting opening 411 and closes the end of the air guide channel near the cooling fan 3. The side baffle 43 closes the end of the air guide channel near the cooling fan 3, causing the air from the cooling fan 3 to flow towards the air outlet 412.

[0027] In a preferred embodiment, connecting edges 21 are provided on the front and rear sides of the heat sink 2, and the connecting edges 21 are arranged along the length direction of the heat sink 2. The connecting edges 21 are connected to the two sides of the air guide cover 41, so that the air guide cover 41 between the heat sink and the air guide cover 41 has sufficient space.

[0028] Multiple heat sinks 22 are provided on the heat sink 2, and the heat sinks 22 are parallel to the connecting edge 21. There is a gap between two adjacent heat sinks 22. The heat sinks 22 play a certain guiding role in the airflow of the cooling fan 3. The heat sinks can increase the heat dissipation area of ​​the heat sink 2, so that it can make full contact with the airflow of the cooling fan 3, and further improve the heat dissipation effect of the heat sink.

[0029] In one preferred embodiment, the heat sink 2 is made of aluminum alloy sheet, which has good thermal conductivity and further improves the heat dissipation effect.

[0030] In a preferred embodiment, the heat dissipation module further includes a circuit board 5, which is mounted on the side of the heat sink 2 away from the air guide cover 41. The circuit board 5, by being positioned on the back side of the heat sink 2, dissipates heat through the heat sink 2.

[0031] In a preferred embodiment, the heat dissipation module of this embodiment further includes a back plate 42, which is mounted on the side of the circuit board away from the heat sink 2. The back plate 42 can be made of metal, has good thermal conductivity and heat dissipation effects, and is used to protect the back side of the circuit board 5.

[0032] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any modifications and improvements made by those skilled in the art without departing from the inventive concept of the present utility model should be covered within the protection scope of the present utility model.

Claims

1. A heat dissipation module, characterized in that, It includes a water-cooled heat dissipation mechanism (1), a heat sink (2) and a cooling fan (3). The water-cooled heat dissipation mechanism (1) is connected to the heat sink (2) and can remove the heat on the heat sink (2). The cooling fan (3) is set on one side of the heat sink (2) and has an air outlet (412) on the other side of the heat sink (2). The air from the cooling fan (3) flows through the surface of the heat sink (2) in the length direction and then flows out from the air outlet (412). It also includes an air guide cover (41), which covers the heat sink (2) and forms an air guide channel between the air guide cover (41) and the heat sink (2). An installation port (411) and an air outlet (412) are respectively provided on both sides of the air guide cover (41). The cooling fan (3) is installed at the installation port (411). Both the installation port (411) and the air outlet (412) are connected to the air guide channel. The air guide channel is arranged along the length of the heat sink. It also includes a side baffle (43), which is installed on one end of the air guide cover (41) near the mounting port (411) and closes the air guide channel to the end near the cooling fan (3); Connecting edges (21) are provided on the front and rear sides of the heat sink (2), and the connecting edges (21) are arranged along the length direction of the heat sink (2). Multiple heat sinks (22) are provided on the heat sink (2), and the heat sinks (22) are parallel to the connecting edges (21).

2. The heat dissipation module of claim 1, wherein, The water-cooled heat dissipation mechanism (1) includes a cold head (13), a water-cooling pipe (12) and a radiator (11). The cold head (13) is connected to the radiator (11) through the water-cooling pipe (12) and forms a circulation loop between the cold head (13), the water-cooling pipe (12) and the radiator (11). The cold head (13) is mounted on the heat dissipation plate (2).

3. The heat dissipation module of claim 1, wherein, It also includes a circuit board, which is mounted on the side of the heat sink (2) away from the air guide cover (41).

4. The heat dissipation module of claim 3, wherein, Includes a backplate (42), which is mounted on the side of the circuit board away from the heat sink (2).

5. The heat dissipation module of claim 1, wherein, The heat sink (2) is made of aluminum alloy sheet.

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