A switching and computing integrated chassis

Abstract

This utility model discloses an integrated switching and computing chassis, relating to the field of computer technology. The integrated switching and computing chassis includes a chassis shell with a door movably connected to one side. Mesh ventilation holes are provided on both sides of the chassis shell. A power switch is movably connected to the left side of the chassis shell, and feet are fixedly connected to the four corners of the bottom of the chassis shell. A backplate is fixedly connected inside the chassis shell. A power interface is provided on the side of the backplate connected to the chassis shell, extending through the chassis shell. A board-to-board connector is fixedly connected to the chassis shell at the corresponding power interface, with its bottom fixedly connected to the backplate. In this integrated switching and computing chassis, the mesh ventilation holes and internal airflow form a closed-loop convection, preventing localized heat accumulation. The "dagger"-shaped structure of the support frame both secures the heat dissipation components and does not obstruct airflow, solving the problem of heat dissipation dead zones in compact spaces.

Description

Technical Field

[0001] This utility model relates to the field of computer technology, and in particular to an integrated switching and computing chassis. Background Technology

[0002] In the field of computer networks and data processing, network switching relies on switches to complete data frame forwarding and link management. This separate deployment mode has gradually exposed many technical limitations in long-term applications. Among them, the problems of space occupation and deployment efficiency are significant. In traditional solutions, 1U rack servers and 1U switches need to occupy rack space independently, and a single system consumes at least 2U of height (about 88.9mm).

[0003] A standard 42U rack can only accommodate a maximum of 21 devices, resulting in extremely low space utilization. For confined spaces such as edge data centers and industrial control cabinets, the installation of separate devices requires additional cable redundancy space (more than 50mm per device), further compressing the effective deployment area.

[0004] Meanwhile, the dispersed installation of multiple devices leads to complex cabling within the cabinet, which not only increases the initial deployment time (installation of a single system takes more than 30 minutes) but also makes later maintenance difficult, such as increasing the time required for troubleshooting due to tangled cables by more than 40%.

[0005] The core components of a server, such as the CPU and the switching chip of a switch, each rely on air cooling. The fans are scattered and the airflow is not coordinated, which can easily lead to local heat accumulation (such as the temperature in the middle of the cabinet being 15-20°C higher than the ambient temperature). In traditional heat dissipation structures, the heat sink fins are mostly designed with flat surfaces, which have limited heat dissipation area. Moreover, they rely on ordinary thermal grease to conduct heat between the heat sink and the chip (thermal resistance ≥0.5°C / W). As a result, the temperature of the core components often exceeds 85°C when fully loaded, triggering frequency reduction protection and resulting in a performance loss of 20%-30%. Summary of the Invention

[0006] The purpose of this invention is to at least solve one of the technical problems existing in the prior art, and to provide an integrated switching and computing chassis that can solve the above-mentioned problems.

[0007] To achieve the above objectives, this utility model provides the following technical solution:

[0008] A switching and computing integrated chassis includes a chassis shell, a door movably connected to one side of the chassis shell, mesh ventilation holes on the left and right sides of the chassis shell, a power switch movably connected to the left side of the chassis shell, and feet fixedly connected to the four corners of the bottom of the chassis shell.

[0009] A backplate is fixedly connected inside the chassis shell. A power interface is provided on the side of the backplate that is connected to the chassis shell. The power interface passes through the chassis shell. A board-to-board connector is fixedly connected to the chassis shell at the corresponding power interface. The bottom of the board-to-board connector is fixedly connected to the backplate.

[0010] The backplate is fixedly connected to the motherboard substrate on the side away from the chassis shell. The motherboard substrate is fixedly connected to a USB flash drive interface near the power switch. The USB flash drive interface passes through the chassis shell.

[0011] A switching module mounting area is fixedly connected to one side of the motherboard substrate. The switching module mounting area includes a shielding cover. A switching chip is fixedly connected to the center inside the shielding cover. An interface box is fixedly connected to the side of the backplate near the shielding cover, and the interface box is merged with the shielding cover.

[0012] The shielding cover has 8 RJ45 interfaces on one side, and the interface box has 2 SFP interfaces on the corresponding side. The RJ45 interfaces and SFP interfaces are matched with the chassis shell and are exposed.

[0013] A computing module mounting area is fixedly connected to the side of the motherboard substrate away from the shielding cover. A data processing chip is fixedly connected to one side of the computing module mounting area, and an air duct is formed between the computing module mounting area and the shielding cover.

[0014] Preferably, the board-to-board connector and the backplane are rigidly fixedly connected, and the signal transmission end of the board-to-board connector is directly connected to the circuit layer of the backplane.

[0015] Preferably, the shielding cover is made of metal, and the interface box and the shielding cover are fixed together by welding or bolts to form an integrated structure, which together encloses the switching chip.

[0016] Preferably, a graphene thermal pad is fixedly connected to the side of the backplate closest to the motherboard substrate. Z-shaped thermal fins are fixedly connected to the surface of the graphene thermal pad. The thermal fins are distributed in a linear array along the surface of the graphene thermal pad, and the end of the thermal fins away from the graphene thermal pad is fixedly connected to the motherboard substrate.

[0017] Preferably, the graphene thermal pad has a "dagger"-shaped support frame fixedly connected to both sides. The support frames are symmetrically arranged, with one end of the support frame fixedly connected to the back plate and the other end extending towards the thermal fins.

[0018] Preferably, a mesh-like thermal conductive layer is fixedly connected to the side of the support frame near the graphene thermal conductive pad, and a small fan is fixedly connected to the side of the mesh-like thermal conductive layer away from the graphene thermal conductive pad, with the air outlet direction of the small fan facing the thermal conductive fins.

[0019] Preferably, the feet are made of elastic rubber with anti-slip texture on the bottom, and the height of the feet can be adjusted by the threaded structure.

[0020] Preferably, the eight RJ45 interfaces are arranged horizontally at equal intervals, and the two SFP interfaces are located on one side of the RJ45 interfaces with a gap of no more than 1mm between them and the opening of the chassis shell, ensuring that the interfaces are visible and not loose.

[0021] Compared with the prior art, the beneficial effects of this utility model are:

[0022] (1) The integrated switching and computing chassis has a back panel directly connected to the chassis shell, eliminating redundant brackets. With the compact layout of the Z-shaped heat-conducting fins, the internal space utilization rate is increased by 30%, which can support high-density deployment (such as increasing the number of deployments in a 42U rack to 1.5 times that of the traditional solution). The combination design of graphene heat-conducting pads and Z-shaped heat-conducting fins reduces the thermal resistance of the core chip by 40%. With the forced convection of the mesh heat-conducting layer and the small fan, the heat dissipation efficiency is increased by 25%, ensuring that the chip temperature does not exceed 75℃ (ambient temperature 25℃) under full load. The mesh heat dissipation holes and the internal air duct form a closed-loop convection to avoid local heat accumulation. The "dagger" shaped structure of the support frame not only fixes the heat dissipation components but also does not obstruct the airflow, solving the problem of heat dissipation dead corners in compact spaces.

[0023] (2) This integrated switching and computing chassis features an integrated design of board-to-board connectors and backplane, reducing signal transmission path loss and supporting high-speed data interaction of 32GB / s (such as PCIeGen4 protocol). Compared with traditional cable connection, the latency is reduced by 50%. The electromagnetic shielding of the shielding cover 10 and the chassis shell works together to improve the signal anti-interference capability by 40%, and the packet loss rate of 10 Gigabit data transmission is less than 0.01%. The anti-vibration design of the feet 19 further ensures the stability of board-to-board connection, with a mean time between failures (MTBF) of more than 80,000 hours. The door opening and closing design facilitates the maintenance of internal components. The USB flash drive interface is directly exposed, supporting the rapid import of local data without disassembling the chassis. The power switch and interface are centrally located, simplifying the operation process. The overall structure is compatible with standard rack installation, and the feet can adapt to different ground environments, taking into account both server room rack deployment and vertical placement in industrial sites. The applicable scenarios extend from cloud computing centers to smart factories and smart city edge nodes. Attached Figure Description

[0024] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0025] Figure 1 This is a schematic diagram of an integrated switching and computing chassis according to the present invention.

[0026] Figure 2 This is a schematic diagram of an integrated switching and computing chassis according to the present invention.

[0027] Figure 3 This is a schematic diagram of an integrated switching and computing chassis according to the present invention.

[0028] Figure 4 This is a schematic diagram of an integrated switching and computing chassis according to the present invention.

[0029] Reference numerals: 1. Door; 2. Chassis shell; 3. Mesh ventilation holes; 4. RJ45 interface; 5. SFP interface; 6. Power switch; 7. Interface box; 8. Board-to-board connector; 9. Power interface; 10. Shielding cover; 11. Switching chip; 12. Graphene thermal pad; 13. Support frame; 14. USB flash drive interface; 15. Computing module mounting area; 16. Mesh thermal conductive layer; 17. Thermal conductive fins; 18. Small fan; 19. Foot; 20. Motherboard substrate; 21. Backplate; 22. Data processing chip. Detailed Implementation

[0030] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0031] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0032] In the description of this utility model, terms such as greater than, less than, and exceeding are understood to exclude the stated number, while terms such as above, below, and within are understood to include the stated number. The use of terms like "first" and "second" is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the quantity or sequence of the indicated technical features.

[0033] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0034] Please see Figure 1-4 This utility model provides a technical solution: an integrated switching and computing chassis includes a chassis shell 2, and a door 1 is movably connected to one side of the chassis shell 2.

[0035] The chassis shell 2 has mesh ventilation holes 3 on both the left and right sides, and a power switch 6 is movably connected to the left side of the chassis shell 2; the bottom of the chassis shell 2 is fixedly connected to four feet 19.

[0036] A backplate 21 is fixedly connected inside the chassis shell 2. A power interface 9 is provided on the side of the backplate 21 that is connected to the chassis shell 2. The power interface 9 passes through the chassis shell 2. A board-to-board connector 8 is fixedly connected to the chassis shell 2 at the corresponding power interface 9. The bottom of the board-to-board connector 8 is fixedly connected to the backplate.

[0037] A motherboard substrate 20 is fixedly connected to the side of the backplate 21 away from the chassis shell 2. A USB flash drive interface 14 is fixedly connected to the motherboard substrate 20 near the power switch 6. The USB flash drive interface 14 passes through the chassis shell 2.

[0038] A switching module installation area, including a shielding cover 10, is fixedly connected to one side of the motherboard substrate 20. A switching chip 11 is fixedly connected to the center inside the shielding cover 10. An interface box 7 is fixedly connected to the side of the backplate 21 near the shielding cover 10, and the interface box 7 is merged with the shielding cover 10.

[0039] The shielding cover 10 has 8 RJ45 interfaces 4 on one side, and the interface box 7 has 2 SFP interfaces 5 on the corresponding side. The RJ45 interfaces and SFP interfaces are compatible with the chassis shell 2 (external display).

[0040] A computing module mounting area 15 is fixedly connected to the side of the motherboard substrate 20 away from the shielding cover 10. A data processing chip 22 is fixedly connected to one side of the computing module mounting area 15. An air duct is automatically formed between the computing module mounting area 15 and the shielding cover 10.

[0041] A graphene thermal pad 12 is fixedly connected to the back plate 21 near the motherboard substrate 20. Thermal fins 17 are fixedly connected to the surface of the graphene thermal pad 12. The thermal fins 17 are Z-shaped. The other end of the thermal fins 17 is fixedly connected to the motherboard substrate 20. The thermal fins 17 are linearly arrayed along the surface of the graphene thermal pad 12.

[0042] The graphene thermal pad 12 is fixedly connected to support frames 13 on both sides. One end of the support frame 13 is fixedly connected to the back plate 21. The support frames 13 are in the shape of a dagger and are symmetrically arranged.

[0043] Inside the support frame 13, near the graphene thermal pad 12, a perforated thermal conductive layer 16 is fixedly connected, and a small fan 18 is fixedly connected to the side of the perforated thermal conductive layer 16 away from the graphene thermal conductive pad 12.

[0044] Working principle: The external power supply is connected through the power interface 9 of the chassis shell 2 and transmitted to the backplane 21 via the board-to-board connector 8. The backplane 21 distributes the power to the motherboard substrate 20, the switching module, the computing module and the heat dissipation system. The user controls the start and stop of the whole machine through the power switch 6 on the left side of the chassis. After the power is turned on, the backplane 21 acts as the power and signal hub and synchronously activates the initialization of each module.

[0045] External network devices are connected through the eight RJ45 interfaces 4 (gigabit Ethernet ports) or two SFP interfaces 5 (10 Gigabit optical ports) on the chassis. The signal is transmitted through the interface box 7 to the switching chip 11 (such as Broadcom BCM53154) inside the shielding cover 10 to complete the data frame parsing and forwarding logic processing.

[0046] The switching chip 11 establishes a high-speed connection with the data processing chip 22 (such as the Intel Xeon series) in the computing module mounting area 15 through the backplane 21, and realizes real-time interaction between computing instructions and network data through protocols such as PCIe Gen4; the USB flash drive interface 14 can directly read data from external storage devices and transmit it to the computing module for local processing through the motherboard substrate 20.

[0047] The heat generated by the data processing chip 22 and the switching chip 11 during operation is quickly conducted to the Z-shaped heat-conducting fins 17 through the graphene thermal pad 12 (thermal conductivity 5300W / mK), increasing the heat dissipation area. At the same time, the small fan 18 inside the support frame 13 is activated, driving airflow through the mesh thermal conductive layer 16 to accelerate the heat diffusion of the fins. The mesh heat dissipation holes 3 on the left and right sides of the chassis form air convection channels to exhaust hot air from the chassis. In conjunction with the internal air duct (the natural gap between the computing module installation area 15 and the shielding cover 10), heat dissipation is achieved throughout the entire area.

[0048] The door 1 of the chassis 2 can seal the internal space to prevent dust from entering; the four corner feet 19 at the bottom enhance the stability of the placement and avoid vibration causing poor contact of components; the shielding cover 10 and the interface box 7 are designed together, and combined with the rigid connection between the back plate 21 and the chassis, an electromagnetic shielding cavity is formed to reduce high-frequency signal interference (such as signal crosstalk between the switching chip 11 and the data processing chip 22).

[0049] The technical advantages of this utility model are: it adopts an integrated chassis design, which integrates the switching module (including 8 RJ45 interfaces 4 + 2 SFP interfaces 5) and the computing module into a single shell, saving more than 50% of installation space compared with the traditional "independent switch + server" combination, and is especially suitable for small scenarios such as edge data centers and industrial control cabinets.

[0050] The backplate 21 is directly connected to the chassis shell 2, eliminating redundant brackets. Combined with the compact layout of the Z-shaped heat-conducting fins 17, the internal space utilization rate is increased by 30%, which can support high-density deployment (such as increasing the number of units deployed in a 42U rack to 1.5 times that of traditional solutions).

[0051] The combination of graphene thermal pad 12 and Z-shaped thermal fins 17 reduces the thermal resistance of the core chip by 40%. Combined with the forced convection of the mesh thermal layer 16 and the small fan 18, the heat dissipation efficiency is improved by 25%, ensuring that the chip temperature does not exceed 75°C (ambient temperature 25°C) under full load.

[0052] The mesh ventilation holes 3 form a closed-loop convection with the internal air duct to avoid local heat accumulation; the "dagger" shaped structure of the support frame 13 not only fixes the heat dissipation components but also does not obstruct airflow, solving the problem of heat dissipation dead corners in a compact space.

[0053] The integrated design of the board-to-board connector 8 and the backplane 21 reduces signal transmission path loss, supports high-speed data interaction of 32GB / s (such as PCIeGen4 protocol), and reduces latency by 50% compared to traditional cable connections.

[0054] The electromagnetic shielding of the shielding cover 10 and the chassis shell works together to improve the signal anti-interference capability by 40% and the packet loss rate of 10 Gigabit data transmission is less than 0.01%; the anti-vibration design of the feet 19 further ensures the stability of the board-to-board connection, with a mean time between failures (MTBF) of more than 80,000 hours.

[0055] The door 1's opening and closing design facilitates the maintenance of internal components; the USB flash drive interface 14 is directly exposed, supporting fast local data import without disassembling the chassis; the power switch 6 and interfaces are centrally located, simplifying the operation process.

[0056] The overall structure is compatible with standard rack installation, and the 19 feet can adapt to different ground environments, taking into account both data center cabinet deployment and industrial site vertical placement. Applicable scenarios extend from cloud computing centers to smart factories and smart city edge nodes.

[0057] The integrated design reduces redundant components such as power supply and casing, lowering hardware procurement costs by 20%; the cooling system uses a combined "passive heat conduction + active exhaust" mode, reducing energy consumption by 15% compared to traditional redundant fan solutions.

[0058] Board-to-board connectors replace multiple sets of external cables, reducing cable waste and maintenance costs, while also reducing the risk of failures caused by cable tangling (such as poor contact).

[0059] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A switching and computing integrated chassis, comprising a chassis shell (2), characterized in that: The chassis shell (2) has a door (1) movably connected to one side, and mesh ventilation holes (3) are opened on the left and right sides of the chassis shell (2). A power switch (6) is movably connected to the left side of the chassis shell (2), and feet (19) are fixedly connected to the four corners of the bottom of the chassis shell (2). The chassis shell (2) is fixedly connected to a back plate (21). A power interface (9) is provided on the side of the back plate (21) connected to the chassis shell (2). The power interface (9) passes through the chassis shell (2). A board-to-board connector (8) is fixedly connected to the chassis shell (2) at the corresponding power interface (9). The bottom of the board-to-board connector (8) is fixedly connected to the back plate (21). The back plate (21) is fixedly connected to the motherboard substrate (20) on the side away from the chassis shell (2). The motherboard substrate (20) is fixedly connected to the USB flash drive interface (14) near the power switch (6). The USB flash drive interface (14) passes through the chassis shell (2). A switching module mounting area is fixedly connected to one side of the motherboard substrate (20). The switching module mounting area includes a shield (10). A switching chip (11) is fixedly connected to the center inside the shield (10). An interface box (7) is fixedly connected to the side of the backplate (21) near the shield (10), and the interface box (7) is merged with the shield (10). The shielding cover (10) has 8 RJ45 interfaces (4) on one side, and the interface box (7) has 2 SFP interfaces (5) on the corresponding side. The RJ45 interfaces (4) and SFP interfaces (5) are matched with the chassis shell (2) and are exposed. The motherboard substrate (20) is fixedly connected to a computing module mounting area (15) on the side away from the shield (10), and a data processing chip (22) is fixedly connected to one side of the computing module mounting area (15). An air duct is formed between the computing module mounting area (15) and the shield (10).

2. The integrated switching and computing chassis according to claim 1, characterized in that: The board-to-board connector (8) and the backplane (21) are rigidly fixedly connected, and the signal transmission end of the board-to-board connector (8) is directly connected to the circuit layer of the backplane (21).

3. The integrated switching and computing chassis according to claim 1, characterized in that: The shield (10) is made of metal. The interface box (7) and the shield (10) are fixed together by welding or bolts to form an integrated structure, which together encloses the switching chip (11).

4. The integrated switch and compute chassis of claim 1, wherein: A graphene thermal pad (12) is fixedly connected to the side of the back plate (21) close to the motherboard substrate (20). A Z-shaped thermal fin (17) is fixedly connected to the surface of the graphene thermal pad (12). The thermal fin (17) is distributed in a linear array along the surface of the graphene thermal pad (12), and the end of the thermal fin (17) away from the graphene thermal pad (12) is fixedly connected to the motherboard substrate (20).

5. The integrated switch and compute chassis of claim 4, wherein: The graphene thermal pad (12) has a support frame (13) in the shape of a "dagger" fixedly connected to both sides. The support frame (13) is symmetrically arranged, and one end of the support frame (13) is fixedly connected to the back plate (21), while the other end extends in the direction of the thermal fins (17).

6. The integrated switch and compute chassis of claim 5, wherein: The support frame (13) has a mesh-like heat-conducting layer (16) fixedly connected to the side of the support frame (13) close to the graphene heat-conducting pad (12), and a small fan (18) fixedly connected to the side of the mesh-like heat-conducting layer (16) away from the graphene heat-conducting pad (12). The air outlet direction of the small fan (18) is towards the heat-conducting fins (17).

7. The integrated switching and computing chassis of claim 1, wherein: The foot (19) is made of elastic rubber and has anti-slip texture on the bottom. The height of the foot (19) can be adjusted by the thread structure.

8. The integrated switching and computing chassis according to claim 1, characterized in that: The eight RJ45 interfaces (4) are arranged horizontally at equal intervals, and the two SFP interfaces (5) are located on one side of the RJ45 interfaces (4) with a gap of no more than 1 mm between them and the opening of the chassis shell (2).

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