A membrane structure, a thin-film capacitor core, and a thin-film capacitor.

Abstract

This utility model discloses a membrane structure, a thin-film capacitor core, and a thin-film capacitor. It includes a single membrane unit formed by a thin-film base layer and a metal plating layer stacked on the thin-film base layer. One end of the membrane unit forms a gold-plated end, and the end face of the gold-plated end has an uneven bonding surface. Because the uneven bonding surface at the gold-plated end of the membrane unit increases the contact area compared to the bonding surface of a conventional planar gold-plated end, it improves the bonding ability between the gold-plated end and the gold plating layer. This effectively enhances the bonding strength between the gold-plated end and the gold plating layer, improving product quality stability. Furthermore, the stronger bonding between the gold-plated end and the gold plating layer also helps improve the pulse voltage withstand capability of the capacitor product.

Description

Technical Field

[0001] This utility model relates to the field of capacitor technology, specifically to a membrane structure, a thin-film capacitor core, and a thin-film capacitor. Background Technology

[0002] The internal structure of existing polypropylene film capacitors consists of two film structures arranged vertically to form a metallized film laminate, with gold-plated ends at both ends. A gold-plated layer is formed at each end through a gold-plating process. However, the end faces of the metallized film in existing polypropylene film capacitors are straight-cut. This results in poor bonding between the subsequently formed gold-plated layer and the gold-plated ends, leading to an unstable product structure and an inability to maximize the capacitor's pulse voltage withstand capability. Utility Model Content

[0003] To address the shortcomings of existing technologies, this invention provides a membrane structure in which an uneven bonding surface is formed at the end face of the gold-sprayed end of the membrane monomer, which can improve the bonding ability between the gold-sprayed layer and the gold-sprayed end of the membrane monomer.

[0004] To achieve the above objectives, this utility model is implemented through the following technical solution: A membrane structure for use in a thin-film capacitor includes a single membrane unit formed by a combination of a thin-film substrate and a metal plating layer stacked on the thin-film substrate. One end of the single membrane unit is formed as a gold-plated end, and the end face of the gold-plated end has an uneven bonding surface.

[0005] Furthermore, a thickened layer is provided on the side of the metal plating layer near the gold spraying end, and the width of the thickened layer is greater than 1 mm.

[0006] Furthermore, the cross-section of the thickened layer is a right-angled trapezoidal structure with a top base width of 1mm to 3mm. The thickened layer has a straight waist section and an inclined waist section. The straight waist section is flush with the end faces of the thin film base layer and the metal coating, while the inclined waist section faces the middle area of ​​the membrane monomer.

[0007] Furthermore, the thickened layer has a pure zinc plating structure.

[0008] Furthermore, the film substrate is a polypropylene film layer structure.

[0009] Furthermore, the metal coating is a zinc-aluminum coating structure.

[0010] Furthermore, an anti-oxidation layer is provided on the surface of the thickened layer and the metal plating layer, which is formed by anti-oxidation oil coated on the surface of the thickened layer and the metal plating layer.

[0011] Furthermore, the uneven bonding surface is configured to increase the contact area of ​​the gold sputtering end, thereby improving the bonding ability between the gold sputtering end of the film monomer and the gold sputtering layer.

[0012] Furthermore, the cross-section of the uneven joint surface has a wavy or serrated cut surface structure. This is acceptable as long as it has a larger contact area compared to a planar structure.

[0013] Based on the same inventive concept, this utility model also provides a thin-film capacitor core, comprising two of the above-mentioned film structures, wherein the two film units are arranged vertically to form a metallized thin-film laminate structure, and the two ends of the metallized thin-film laminate structure are formed into gold-plated ends.

[0014] Based on the same inventive concept, this utility model also provides a thin film capacitor, including the aforementioned thin film capacitor core, wherein a gold-plated layer is formed at both ends of the thin film capacitor core through a gold-plating process.

[0015] The above technical solution has the following advantages or beneficial effects:

[0016] In the membrane structure, thin-film capacitor core, and thin-film capacitor described in this utility model, an uneven bonding surface is formed at the gold-plated end of the membrane unit. Compared with the bonding surface of the gold-plated end of a normal planar structure, the uneven bonding surface can increase the contact area, thereby improving the bonding ability between the gold-plated end and the gold-plated layer. On the one hand, it can effectively improve the bonding firmness between the gold-plated end and the gold-plated layer and enhance the quality stability. On the other hand, the stronger bonding between the gold-plated end and the gold-plated layer is also conducive to improving the pulse voltage withstand capability of the capacitor product. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of the thin-film capacitor core according to an embodiment of the present invention.

[0018] Figure 2 This is a top view of the membrane structure according to an embodiment of the present invention.

[0019] Label Explanation:

[0020] 1. Membrane monomer, 2. Gold sputtering layer, 3. Anti-oxidation layer, 11. Thin film base layer, 12. Metal plating layer, 13. Thickening layer, 14. Uneven bonding surface. Detailed Implementation

[0021] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0022] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0023] Please refer to the appendix. Figure 1 Appendix Figure 2 One embodiment of this utility model provides a membrane structure for use in a thin-film capacitor. It includes a membrane unit 1 formed by a thin-film base layer 11 and a metal plating layer 12 stacked on the thin-film base layer 11. One end of the membrane unit 1 forms a gold-plated end, and the end face of the gold-plated end has an uneven bonding surface 14. It is understood that in this embodiment, because the uneven bonding surface 14 is formed at the gold-plated end of the membrane unit 1, compared to the bonding surface of a conventional planar gold-plated end, the uneven bonding surface can increase the contact area, thereby improving the bonding ability between the gold-plated end and the gold-plated layer 2. On the one hand, this can effectively improve the bonding firmness between the gold-plated end and the gold-plated layer 2, enhancing the quality stability; on the other hand, the stronger bonding between the gold-plated end and the gold-plated layer 2 also helps to improve the pulse voltage withstand capability of the capacitor product.

[0024] Please refer to the appendix. Figure 1 Appendix Figure 2 In one preferred embodiment, a thickened layer 13 is provided on the side of the metal plating layer 12 near the gold-spraying end, and the width of the thickened layer 13 is greater than 1 mm. The thickened layer 13, the metal plating layer 12, and the thin film base layer 11 are stacked to form the film monomer 1. In another preferred embodiment, preferably, the cross-section of the thickened layer 13 is a right-angled trapezoidal structure with a top base width of 1 mm to 3 mm. The thickened layer 13 has a straight waist section and an inclined waist section. The straight waist section is flush with the end faces of the thin film base layer 11 and the metal plating layer 12, and the inclined waist section faces the middle region of the film monomer 1. In this embodiment, since an uneven bonding surface 14 needs to be formed at the gold spraying end, in addition to the conventional design requirements, special attention needs to be paid to the structural damage that may be caused when forming the uneven bonding surface 14. Therefore, in this embodiment, by cleverly setting the upper bottom width of the thickened layer to 1mm to 3mm, it can be effectively ensured that the overall structure of the thickened layer 13 is not damaged when forming the uneven bonding surface 14, and the thickened layer 13 can play its normal role.

[0025] Please refer to the appendix. Figure 1 Appendix Figure 2In one preferred embodiment, the thickened layer 13 is a pure zinc plating structure, the thin film base layer 11 is a polypropylene thin film layer structure, and the metal plating layer 12 is a zinc-aluminum plating structure.

[0026] Please refer to the appendix. Figure 1 Appendix Figure 2 In one preferred embodiment, an anti-oxidation layer 3 is provided on the surface of the thickened layer 13 and the metal plating layer 12. The anti-oxidation layer 3 is formed by anti-oxidation oil coated on the surface of the thickened layer and the metal plating layer.

[0027] Please refer to the appendix. Figure 1 Appendix Figure 2 In one preferred embodiment, the uneven bonding surface 14 is configured to increase the contact area of ​​the gold sputtering end, thereby improving the bonding ability between the gold sputtering end of the film monomer 1 and the gold sputtering layer 2. In this embodiment, preferably, the cross-section of the uneven bonding surface 14 has a wavy or serrated cut surface structure. However, those skilled in the art should understand that in other embodiments, the cross-sectional shape of the uneven bonding surface 14 is not limited to the specific implementation disclosed in this embodiment, and can also be other forms of uneven structure, as long as it has a larger contact area than a planar structure. Those skilled in the art can make adaptive design changes according to specific needs.

[0028] Based on the same inventive concept, this utility model also provides a thin film capacitor core, including two of the above-mentioned film structures, wherein the two film units 1 are arranged vertically to form a metallized thin film laminate structure, and the two ends of the metallized thin film laminate structure are formed into gold-plated ends.

[0029] Based on the same inventive concept, this utility model also provides a thin film capacitor, including the aforementioned thin film capacitor core, wherein a gold-plated layer 2 is formed at both ends of the thin film capacitor core through a gold-plating process.

[0030] The above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model. Therefore, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

Claims

1. A film body structure applied to a thin film capacitor, characterized by: It includes a membrane monomer (1) formed by combining a thin film substrate (11) and a metal plating layer (12) stacked on the thin film substrate (11), one end of the membrane monomer (1) is formed with a gold sputtering end, and the end face of the gold sputtering end is formed with an uneven bonding surface (14).

2. The membrane structure of claim 1, wherein: A thickened layer (13) is provided on the side of the metal plating layer (12) near the gold spraying end, and the width of the thickened layer (13) is greater than 1 mm.

3. The membrane structure of claim 2, wherein: The cross section of the thickened layer (13) is a right-angled trapezoidal structure with a width of 1mm to 3mm at the top. The thickened layer (13) has a straight waist section and an inclined waist section. The straight waist section is flush with the end face of the film substrate (11) and the metal coating (12), and the inclined waist section faces the middle area of ​​the film monomer (1).

4. The membrane structure of claim 3, wherein: The thickened layer (13) is a pure zinc coating structure.

5. The membrane structure of claim 2, wherein: An anti-oxidation layer (3) is provided on the surface of the thickened layer (13) and the metal plating layer (12).

6. The membrane structure of claim 1, wherein: The film substrate (11) is a polypropylene film layer structure, and the metal coating (12) is a zinc-aluminum coating structure.

7. The membrane structure according to any one of claims 1 to 6, characterized in that: The uneven bonding surface (14) is configured to increase the contact area of ​​the gold sputtering end, thereby improving the bonding ability between the gold sputtering end of the film monomer (1) and the gold sputtering layer (2).

8. The membrane structure of claim 7, wherein: The cross-section of the uneven joint surface (14) has a wavy or sawtooth-shaped cutting surface structure.

9. A thin film capacitor core, characterized by: It includes the membrane structure according to any one of claims 1 to 8, wherein two membrane monomers (1) are arranged vertically to form a metallized thin film laminate structure, and the two ends of the metallized thin film laminate structure are formed into gold sputtering ends.

10. A thin film capacitor characterized by: The thin-film capacitor core as described in claim 9 has a gold-plated layer (2) formed at both ends of the thin-film capacitor core by a gold-plating process.

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