Battery devices and electrical equipment

Abstract

This application provides a battery device and an electrical appliance. The battery device includes: multiple battery cells; multiple chips, each chip being connected to a portion of the multiple battery cells, the chips being disposed on the end face of at least one of the battery cells, each chip including a package housing for housing a first component and a control component; a control component for collecting and processing the status information of the battery cells; and a first component connected between the battery cells and the control component, including a protective component for eliminating interference signals superimposed on the input signal of the control component. This reduces the aging rate and failure rate of devices in the sampling circuit, improves the reliability and stability of the sampling circuit, and thus improves the reliability and stability of the battery device.

Description

Technical Field

[0001] This application relates to the field of battery technology, and in particular to battery devices and electrical equipment. Background Technology

[0002] This section is intended to provide background or context for embodiments of this application. The description herein is not intended to imply that it is prior art simply because it is included in this section.

[0003] New energy batteries are being used more and more widely in daily life and industry. For example, new energy vehicles equipped with batteries are already widely used. In addition, batteries are being used more and more in the field of energy storage.

[0004] In battery devices, chips are typically used to collect and process state information such as voltage and temperature of the battery cells. The sampling circuits in related technologies usually utilize discrete electronic components to assist the chip in collecting and processing the cell's state information. These discrete components are difficult to integrate into the chip due to their large size and are usually located outside the chip; they are also called peripheral devices. However, in practical applications, discrete peripheral devices age rapidly and have a high failure rate, affecting the reliability and stability of the battery device. Utility Model Content

[0005] In view of this, the present application aims to provide a battery device and electrical equipment that can reduce the aging rate and failure rate of devices in the sampling circuit, improve the reliability and stability of the sampling circuit, and thus improve the reliability and stability of the battery device.

[0006] The technical solution of this application embodiment is implemented as follows:

[0007] This application provides a battery device, including:

[0008] Multiple battery cells;

[0009] Multiple chips, each chip is connected to a portion of the multiple battery cells, the chip is disposed on the end face of at least one of the battery cells, and each chip includes a package housing for accommodating a first component and a control component;

[0010] Control components are used to collect and process the status information of the battery cells;

[0011] The first component, connected between the battery cell and the control component, includes a protection component for eliminating interference signals superimposed on the input signal of the control component.

[0012] In the battery device of this application embodiment, multiple chips are used to encapsulate control components to collect and process the state information of the cells connected to the chips. Each chip is connected to a portion of the cells in the battery device. This reduces the parameter requirements of the protection devices in the sampling circuit compared to a single chip managing all cells, allowing for the selection of smaller protection devices. Furthermore, due to the small size of the protection devices, the protection devices and control components can be integrated together within the chip. Protected by the chip's encapsulation, the adverse effects of environmental factors such as moisture and conductive foreign matter on the first component are reduced, decreasing the aging rate and failure rate of the first component, thereby improving the reliability and stability of the sampling circuit, and consequently, the reliability and stability of the battery device. In addition, the reduced physical distance between the control components and the first component lowers parasitic parameters of resistance, capacitance, and inductance, improving the protection capability of the first component and thus enhancing the stability of the sampling circuit.

[0013] In some embodiments, the chip further includes:

[0014] The die, encapsulated inside the package housing, is used to integrate control components.

[0015] In the above embodiments, since the circuit devices integrated in the die are less susceptible to adverse effects from environmental factors, by integrating the control components into the die inside the package, the adverse effects of environmental factors on the control components can be reduced, thereby improving the reliability and stability of the sampling circuit and increasing the integration of the sampling circuit.

[0016] In some embodiments, each chip further includes:

[0017] The packaging frame, mounted on the package housing, is used to connect the circuit leads of the die to the pins of the chip.

[0018] In the above embodiments, the circuit leads of the die and the pins of the chip are connected by a packaging frame. This simplifies the chip packaging process, improves the connection strength between the circuit leads of the die and the pins of the chip, thereby enhancing the reliability and stability of the sampling circuit. Furthermore, the packaging frame is typically made of a metal material with excellent thermal conductivity, and by connecting it to the outwardly extending chip pins, the heat dissipation area can be increased, thus improving the chip's heat dissipation performance.

[0019] In some embodiments, a portion of the devices in the first component are integrated on the die, while another portion of the devices in the first component are disposed between the package frame and the die.

[0020] In the above embodiments, by integrating a portion of the devices in the first component onto the die, the adverse effects of environmental factors on that portion of the devices in the first component can be reduced, thereby improving the reliability and stability of the sampling circuit and increasing the integration of the sampling circuit. By placing another portion of the devices in the first component between the package frame and the die, the die volume can be reduced, the die formation process can be simplified, and compared to integrating all the devices in the first component onto the die, placing some devices between the package frame and the die can improve the heat dissipation performance of the chip and facilitate the adjustment of the protection capability of the first component, thereby adapting to different application scenarios.

[0021] In some embodiments, the protective component includes:

[0022] A first protective capacitor is provided for each battery cell. The first protective capacitor is connected in parallel with the corresponding battery cell. The connection point between the first protective capacitor and the corresponding battery cell is located at the connection end between the battery cell and the control component, close to the battery cell. The first protective capacitor is used to eliminate surge interference signals generated at both ends of the corresponding battery cell.

[0023] In the above embodiments, multiple chips are connected to portions of the battery cells in the battery device, and each chip encapsulates a control component to collect and process the status information of the battery cells to which the chip is connected. This reduces the surge protection requirements at both ends of each battery cell in the sampling circuit compared to a single chip managing all cells, allowing for the selection of a smaller first protection capacitor. Furthermore, due to the small size of the first protection capacitor, it can be integrated with the control component within the chip. Protected by the chip's encapsulation, the adverse effects of environmental factors such as moisture and conductive foreign matter on the first protection capacitor are reduced, decreasing its aging rate and device failure rate, thereby improving the reliability and stability of the battery device.

[0024] In some embodiments, the first protection capacitor is integrated on the die.

[0025] In the above embodiments, by integrating the first protective capacitor and the control component together in the die inside the package, the adverse effects of environmental factors on the first protective capacitor can be reduced, the physical distance between the control component and the first protective capacitor can be reduced, the parasitic parameters of resistance, capacitance and inductance can be reduced, and the protection capability of the first protective capacitor can be improved.

[0026] In some embodiments, the protective component includes:

[0027] A second protective capacitor is provided for each battery cell. The second protective capacitor is connected in parallel with the corresponding battery cell. The connection point between the second protective capacitor and the corresponding battery cell is located at the connection end between the battery cell and the control component, close to the control component. The second protective capacitor is used to clamp the input signal of the control component below the target voltage.

[0028] In the above embodiments, since multiple chips are connected to portions of the battery cells in the battery device, a control component encapsulated in each chip is used to collect and process the status information of the cells to which the chip is connected. This reduces the need for clamping and protecting the input signals of the control component in the sampling circuit compared to a single chip managing all cells, allowing for the selection of a smaller second protection capacitor. Furthermore, because the second protection capacitor is small, it can be integrated with the control component within the chip. Protected by the chip's encapsulation, the adverse effects of environmental factors such as moisture and conductive foreign matter on the second protection capacitor are reduced, decreasing its aging rate and device failure rate, thereby improving the reliability and stability of the battery device.

[0029] In some embodiments, the second protection capacitor is integrated on the die.

[0030] In the above embodiments, by integrating the second protective capacitor and the control component together in the die inside the package, the adverse effects of environmental factors on the second protective capacitor can be reduced, the physical distance between the control component and the second protective capacitor can be reduced, the parasitic parameters of resistance, capacitance and inductance can be reduced, and the protection capability of the second protective capacitor can be improved.

[0031] In some embodiments, the protective component includes:

[0032] The first protection diode is connected between the battery cell and the control component to eliminate interference signals superimposed on the input signal of the control component, thereby protecting the control component.

[0033] In the above embodiments, since multiple chips are connected to portions of the battery cells in the battery device, control components encapsulated in each chip are used to collect and process the status information of the cells connected to the chip. This reduces the surge protection requirements at both ends of each cell in the sampling circuit compared to a single chip managing all cells, allowing for the selection of a smaller first protection diode. Furthermore, due to the reduced size of the first protection diode, it can be integrated with the control components within the chip. Protected by the chip's encapsulation, the adverse effects of environmental factors such as moisture and conductive foreign matter on the first protection diode are reduced, decreasing its aging rate and device failure rate, thereby improving the reliability and stability of the battery device.

[0034] In some embodiments, a first protection diode is disposed between the package frame and the die.

[0035] In the above embodiments, since diodes are generally larger than capacitors and resistors under the same protection requirements, by placing the first protection diode between the die and the package frame in the chip, the aging rate and device failure rate of the first protection diode can be reduced, and the first protection diode can be easily integrated into the chip, saving chip manufacturing costs.

[0036] In some embodiments, the first component further includes a filtering component connected between the battery cell and the control component, used to filter the state information of the battery cell and transmit the filtered state information to the control component.

[0037] In the above embodiments, multiple chips are used to encapsulate control components, which collect and process the status information of the cells connected to the chips. Each chip connects to a portion of the cells in the battery device. This reduces the parameter requirements of the filtering components in the sampling circuit compared to a single chip managing all cells, allowing for the selection of smaller filtering components. Furthermore, due to the smaller size of the filtering components, they can be integrated with the control and protection components within the chip. Protected by the chip's encapsulation, the adverse effects of environmental factors such as moisture and conductive foreign matter on the filtering components are reduced, decreasing the aging rate and failure rate of the filtering components, thereby improving the reliability and stability of the battery device. In addition, the reduced physical distance between the filtering components and the control and protection components lowers parasitic parameters (RCI), improves the protection capability of the protection components and the filtering capability of the filtering components, thus enhancing the stability of the sampling circuit.

[0038] In some embodiments, the filtering component includes:

[0039] A first filter capacitor is provided for each battery cell. One end of the first filter capacitor is connected between the positive terminal of the corresponding battery cell and the control component, and the other end of the first filter capacitor is grounded.

[0040] In the above embodiments, one end of the first filter capacitor is connected between the positive terminal of the corresponding battery cell and the control component, and the other end of the first filter capacitor is grounded. This allows for filtering of the positive terminal electrical signal of the battery cell collected by the control component. Furthermore, since multiple chips are connected to portions of the battery cells in the battery device, a control component encapsulated in each chip collects and processes the status information of the battery cells connected to that chip. Compared to a single chip managing all battery cells, this reduces the filtering requirements for the positive terminal electrical signals of the battery cells collected by each chip in the sampling circuit, allowing for the selection of a smaller first filter capacitor. Moreover, due to the small size of the first filter capacitor, it can be integrated with the control component within the chip. Protected by the chip's encapsulation, the adverse effects of environmental factors such as moisture and conductive foreign matter on the first filter capacitor are reduced, decreasing its aging rate and device failure rate, thereby improving the reliability and stability of the battery device.

[0041] In some embodiments, the first filter capacitor is integrated on the die.

[0042] In the above embodiments, by integrating the first filter capacitor and the control component together in the die inside the package, the adverse effects of environmental factors on the first filter capacitor can be reduced, the physical distance between the control component and the first filter capacitor can be reduced, the parasitic parameters of resistance, capacitance and inductance can be reduced, and the filtering capability of the first filter capacitor can be improved.

[0043] In some embodiments, the filtering component includes:

[0044] A first filter capacitor is set for each battery cell;

[0045] A filter resistor is set for each battery cell. One end of the filter resistor is connected to the positive terminal of the corresponding battery cell, and the other end of the filter resistor is connected to the control component and grounded through the first filter capacitor.

[0046] In the above embodiments, a resistor-capacitor filter circuit can be formed by setting a first filter capacitor and a filter resistor corresponding to each battery cell to filter the positive electrode electrical signal of the battery cell collected by the control component. Furthermore, since multiple chips are connected to some of the battery cells in the battery device, and the control component encapsulated in each chip collects and processes the status information of the battery cells connected to the chip, compared to a single chip managing all battery cells, the filtering requirements for the positive electrode electrical signal of the battery cell collected by each chip in the sampling circuit can be reduced, allowing for the selection of smaller first filter capacitors and filter resistors. Further, since the first filter capacitor and filter resistor are small, they can be integrated together with the control component inside the chip. Under the protection of the chip package, the adverse effects of environmental factors such as moisture and conductive foreign matter on the first filter capacitor and filter resistor can be reduced, decreasing the aging rate and device failure rate of the first filter capacitor and filter resistor, thereby improving the reliability and stability of the battery device.

[0047] In some embodiments, the first filter capacitor and the filter resistor are both integrated on the die.

[0048] In the above embodiments, by integrating the first filter capacitor, filter resistor, and control components together on a die inside the package, the adverse effects of environmental factors on the first filter capacitor and filter resistor can be reduced, and the physical distance between the control components and the first filter capacitor and filter resistor can be shortened. This reduces the parasitic parameters of resistance, capacitance, and inductance, thereby improving the filtering capability of the first filter capacitor and filter resistor. Furthermore, since the filter resistor is integrated on the die within the chip, a filter resistor with a larger resistance value can be selected without increasing the resistor's size. Therefore, while achieving the same filtering effect at the cutoff frequency, a first filter capacitor with a smaller capacitance value can be selected, meaning a smaller first filter capacitor can be chosen. Thus, it is convenient to integrate the first filter capacitor onto the die within the chip.

[0049] In some embodiments, the filtering component includes:

[0050] The filter inductor is connected between the battery cell and the control components to filter the status information of the battery cell.

[0051] In the above embodiments, the filter inductor is connected between the battery cell and the control component, and can be used to filter the state information of the battery cell. Since multiple chips are connected to some of the battery cells in the battery device, the control component encapsulated in each chip collects and processes the state information of the battery cells connected to the chip. In this way, compared with a single chip managing all the battery cells, the filtering requirements for the state information of the battery cells collected by each chip in the sampling circuit can be reduced, so as to support the selection of a smaller filter inductor. Furthermore, since the filter inductor is small in size, the filter inductor and the control component can be integrated together inside the chip. Under the protection of the chip package, the adverse effects of environmental factors such as moisture and conductive foreign objects on the filter inductor can be reduced, the aging rate of the filter inductor and the device failure rate can be reduced, thereby improving the reliability and stability of the battery device.

[0052] In some embodiments, the filter inductor is disposed between the package frame and the die.

[0053] In the above embodiments, since the volume of an inductor is usually larger than that of a capacitor or resistor under the same filtering requirements, by placing the filter inductor between the die and the package frame in the chip, the filter inductor can be easily integrated into the chip while reducing the aging rate and device failure rate, thus saving chip manufacturing costs.

[0054] In some embodiments, the grain also integrates:

[0055] Power management components are used to supply power to the control components.

[0056] In the above embodiments, since multiple chips are connected to portions of the battery cells in the battery device, a control component encapsulated in each chip is used to collect and process the status information of the cells to which the chip is connected. This reduces the power management capability requirements of the power management component in the sampling circuit compared to a single chip managing all cells, allowing for the selection of a smaller power management component. Furthermore, due to the small size of the power management component, it can be integrated with the control component within the chip. Protected by the chip package, the adverse effects of environmental factors on the power management component are reduced, decreasing its aging rate and failure rate, thereby improving the reliability and stability of the battery device and increasing the integration of the sampling circuit.

[0057] In some embodiments, the chip further includes:

[0058] The second component, connected between the battery cell and the power management component, is used to eliminate interference signals superimposed on the input signal of the power management component.

[0059] In the above embodiments, since multiple chips are connected to portions of the battery cells in the battery device, a control component encapsulated in each chip is used to collect and process the status information of the connected cells. This reduces the protection requirements for the power management components in the sampling circuit compared to a single chip managing all cells, allowing for the selection of a smaller second component. Furthermore, due to the smaller size of the second component, it can be integrated with the control and first components within the chip. This reduces the adverse effects of environmental factors such as moisture and conductive foreign matter on the second component, slowing its aging rate and device failure rate, thereby improving the reliability and stability of the battery device. In addition, the reduced physical distance between the second component and the control and first components lowers the parasitic parameters of resistance, capacitance, and inductance, improving the protection capability of the second component and thus enhancing the stability of the sampling circuit.

[0060] In some embodiments, a portion of the devices in the second component are integrated on the die, while another portion of the devices in the second component are disposed between the package frame and the die.

[0061] In the above embodiments, by integrating a portion of the devices in the second component onto the die, the adverse effects of environmental factors on that portion of the devices in the second component can be reduced, thereby improving the reliability and stability of the sampling circuit and increasing the integration of the sampling circuit. By placing another portion of the devices in the second component between the package frame and the die, the die volume can be reduced, the die formation process can be simplified, and compared to integrating all the devices in the second component onto the die, placing some devices between the package frame and the die can improve the chip's heat dissipation performance and facilitate the adjustment of the protection capability of the second component, thereby adapting to different application scenarios.

[0062] In some embodiments, the second component includes:

[0063] The third protection capacitor has one end connected between the positive terminal of the target cell and the voltage input terminal of the power management component, and the other end grounded, in order to eliminate the surge interference signal superimposed on the input signal of the power management component.

[0064] Among them, the target cell is the one with the highest potential among all the cells connected to the chip to which the third protection capacitor belongs.

[0065] In the above embodiments, since multiple chips are connected to portions of the battery cells in the battery device, control components encapsulated in each chip are used to collect and process the status information of the cells to which the chip is connected. This reduces the surge protection requirements of the power management components in the sampling circuit compared to a single chip managing all cells, allowing for the selection of a smaller third protection capacitor. Furthermore, due to the small size of the third protection capacitor, the third protection resistor and control components can be integrated together inside the chip. Protected by the chip's encapsulation, the adverse effects of environmental factors such as moisture and conductive foreign matter on the third protection capacitor are reduced, decreasing its aging rate and device failure rate, thereby improving the reliability and stability of the battery device.

[0066] In some embodiments, the third protection capacitor is integrated on the die.

[0067] In the above embodiments, by integrating the third protection capacitor and the control component together in the die inside the package, the adverse effects of environmental factors on the third protection capacitor can be reduced, the physical distance between the control component and the third protection capacitor can be reduced, the parasitic parameters of resistance, capacitance and inductance can be reduced, and the protection capability of the third protection capacitor can be improved.

[0068] In some embodiments, the second component includes:

[0069] The second protection diode is connected between the battery cell and the power management component. It is used to eliminate interference signals superimposed on the input signal of the power management component, thereby protecting the power management component.

[0070] In the above embodiments, since multiple chips are connected to portions of the battery cells in the battery device, a control component encapsulated in each chip is used to collect and process the status information of the cells connected to the chip. This reduces the surge protection requirements of the power management components in the sampling circuit compared to a single chip managing all cells, allowing for the selection of a smaller second protection diode. Furthermore, due to the smaller size of the second protection diode, it can be integrated with the control component and the first component into the chip. Protected by the chip's encapsulation, the adverse effects of environmental factors such as moisture and conductive foreign matter on the second protection diode are reduced, decreasing its aging rate and device failure rate, thereby improving the reliability and stability of the battery device.

[0071] In some embodiments, a second protective diode is disposed between the package frame and the die.

[0072] In the above embodiments, since diodes are generally larger than capacitors and resistors under the same protection requirements, by placing the second protection diode between the die and the package frame in the chip, the second protection diode can be easily integrated into the chip while reducing the aging rate and device failure rate, thus saving chip manufacturing costs.

[0073] In some embodiments, the battery device further includes:

[0074] Each battery cell is equipped with a corresponding equalization switch, equalization resistor, and second filter capacitor.

[0075] Each cell is connected in series with a corresponding equalization switch and a corresponding equalization resistor.

[0076] The second filter capacitor for each cell is connected in parallel with the corresponding equalization switch to filter out noise at both ends of the corresponding equalization switch;

[0077] The control component is used to control the closing of the equalization switch corresponding to the battery cell, thereby connecting the battery cell to the corresponding equalization resistor.

[0078] In the above embodiments, on the one hand, when the equalization switch corresponding to a battery cell is closed, the battery cell and the corresponding equalization resistor form a circuit, which can dissipate the battery cell's electrical energy, causing the battery cell's voltage to drop; on the other hand, by setting a second filter capacitor corresponding to each battery cell in parallel with the corresponding equalization switch, the second filter capacitor can be used to filter out noise at both ends of the corresponding equalization switch, reducing the probability of false triggering of the equalization switch. In this way, relatively accurate equalization control of each battery cell can be achieved.

[0079] In some embodiments, the equalization switch and the second filter capacitor are integrated on the die, and the equalization resistor is disposed between the package frame and the die.

[0080] In the above embodiments, by integrating the equalization switch and the second filter capacitor onto the die, the adverse effects of environmental factors on the equalization switch and the second filter capacitor can be reduced, thereby improving the reliability and stability of the sampling circuit and increasing the integration level of the sampling circuit. Furthermore, since the equalization resistor generates heat during the process of consuming the battery cell's electrical energy, placing the equalization resistor between the package frame and the die can reduce heat generation inside the die, thereby slowing down the chip aging process and improving the accuracy of the battery cell's status information acquisition.

[0081] In some embodiments, the battery device further includes:

[0082] The sampling circuit is connected between the chip and the corresponding battery cell;

[0083] A circuit board for carrying a chip and sampling lines, so that the chip is connected to at least one of the battery cells via the sampling lines.

[0084] In the above embodiments, by mounting the chip and sampling circuit on a circuit board, the connection between the chip and the sampling circuit can be made more stable, thereby improving the stability of cell status information acquisition and thus improving the reliability and stability of the battery device.

[0085] In some embodiments, each chip connects to multiple battery cells;

[0086] In the sampling circuit between the chip and the multiple connected battery cells, the difference between the trace lengths of any two sampling circuits is within the target difference range.

[0087] In the above embodiments, by setting the difference in the trace length of the sampling line between the chip and any two connected battery cells to be within the target difference range, the trace length of the sampling line between the chip and each connected battery cell can be made to be consistent. This makes the parasitic parameters (such as parasitic capacitance) between the electrical signal acquisition points of the chip and each connected battery cell more consistent, thereby making the acquired battery cell status information more reliable.

[0088] In some embodiments, the chip is disposed between the battery cell and the circuit board.

[0089] In the above embodiments, by placing the chip between the battery cell and the circuit board, the battery cell and the circuit board can jointly protect the chip to a certain extent, thereby reducing the adverse effects of environmental factors such as moisture and conductive foreign objects on the chip, thus reducing the aging rate and failure rate of the components in the chip, and improving the reliability and stability of the battery device.

[0090] In some embodiments, the positive and negative electrodes of the battery cell are disposed on the same end face, and the chip is disposed on that end face.

[0091] In the above embodiments, since the positive and negative electrodes of the battery cell are located on the same end face, the length of the sampling lines between the chip and the positive and negative electrodes of the battery cell can be shortened, thereby reducing the parasitic parameters on the corresponding sampling lines. Because the parasitic parameters of the sampling lines are relatively small, the parameter requirements of the protection devices in the sampling circuit can be reduced, allowing for the selection of smaller protection devices and their integration within the chip, thus reducing the volume occupied by the first component within the chip.

[0092] In some embodiments, the chip is disposed between the positive and negative electrodes of the corresponding battery cell.

[0093] In the above embodiments, by placing the chip between the positive and negative electrodes of the corresponding battery cell, the length of the sampling lines between the chip and the positive and negative electrodes of the battery cell can be made more moderate, thereby reducing the parasitic parameters on the corresponding sampling lines of the positive and negative electrodes of the battery cell to a certain extent. In this way, the parameter requirements of the protection device in the sampling circuit of the battery cell can be reduced, so as to support the selection of smaller protection devices and reduce the volume occupied by the first component inside the chip.

[0094] In some embodiments, a positive electrode is provided on the first end face of the battery cell, a negative electrode is provided on the second end face of the battery cell, the first end face and the second end face are disposed opposite each other, the third end face of the battery cell is adjacent to the first end face and the second end face, and a chip is disposed on the third end face.

[0095] In the above embodiments, since the third end face of the battery cell is adjacent to the first end face where the positive electrode is provided and the second end face where the negative electrode is provided, by placing the chip on the third end face of the battery cell, the length of the sampling line between the chip and the positive and negative electrodes of the battery cell can be made more moderate. This can reduce the parasitic parameters on the corresponding sampling lines of the positive and negative electrodes of the battery cell to a certain extent. In this way, the parameter requirements of the protection device in the sampling circuit of the battery cell can be reduced, so as to support the selection of smaller protection devices and integrate the protection devices inside the chip, thereby reducing the volume occupied by the first component inside the chip.

[0096] In some embodiments, a positive electrode is provided on the end face of the battery cell, the end face is negatively charged, and the chip is disposed on the end face.

[0097] In the above embodiments, since the positive electrode of the battery cell is located on the negatively charged end face, by placing the chip on this end face, the length of the sampling lines used by the chip to collect the positive and negative electrical signals of the battery cell can be moderate. This reduces the parasitic parameters on the corresponding sampling lines of the positive and negative electrical signals of the battery cell to a certain extent. In this way, the parameter requirements of the protection device in the sampling circuit of the battery cell can be reduced, so as to support the selection of smaller protection devices and integrate the protection devices inside the chip, thereby reducing the volume occupied by the first component inside the chip.

[0098] In some embodiments, a negative electrode is provided on the end face of the battery cell, the end face is positively charged, and the chip is disposed on the end face.

[0099] In the above embodiments, since the negative electrode of the battery cell is located on the positively charged end face, by placing the chip on this end face, the length of the sampling lines used by the chip to collect the positive and negative electrical signals of the battery cell can be moderate. This reduces the parasitic parameters on the corresponding sampling lines of the positive and negative electrical signals of the battery cell to a certain extent. In this way, the parameter requirements of the protection device in the sampling circuit of the battery cell can be reduced, so as to support the selection of smaller protection devices and integrate the protection devices inside the chip, thereby reducing the volume occupied by the first component inside the chip.

[0100] This application provides an electrical device that includes the battery device described in the above embodiments. Attached Figure Description

[0101] Figure 1 A schematic diagram of the composition structure of a battery device provided in this application embodiment. Figure 1 ;

[0102] Figure 2 A schematic diagram of the chip composition structure in a battery device provided in this application embodiment. Figure 1 ;

[0103] Figure 3 A circuit structure diagram of a battery device provided in this application embodiment. Figure 1 ;

[0104] Figure 4 A schematic diagram of the composition structure of a battery device provided in this application embodiment. Figure 2 ;

[0105] Figure 5 A circuit structure diagram of a battery device provided in this application embodiment. Figure 2 ;

[0106] Figure 6 A circuit structure diagram of a battery device provided in this application embodiment. Figure 3 ;

[0107] Figure 7 A circuit structure diagram of a battery device provided in this application embodiment. Figure 4 ;

[0108] Figure 8 A schematic diagram of the chip composition structure in a battery device provided in this application embodiment. Figure 2 ;

[0109] Figure 9 A circuit structure diagram of a battery device provided in this application embodiment. Figure 5 ;

[0110] Figure 10A circuit structure diagram of a battery device provided in this application embodiment. Figure 6 ;

[0111] Figure 11 A circuit structure diagram of a battery device provided in this application embodiment. Figure 7 ;

[0112] Figure 12 A circuit structure diagram of a battery device provided in this application embodiment. Figure 8 ;

[0113] Figure 13 A circuit structure diagram of a battery device provided in this application embodiment. Figure 9 ;

[0114] Figure 14 A circuit structure diagram of a battery device provided in this application embodiment. Figure 10 ;

[0115] Figure 15 A circuit structure diagram of a battery device provided in this application embodiment. Figure 10 one;

[0116] Figure 16 A circuit structure diagram of a battery device provided in this application embodiment. Figure 10 two;

[0117] Figure 17 A circuit structure diagram of a battery device provided in this application embodiment. Figure 10 three;

[0118] Figure 18 A circuit structure diagram of a battery device provided in this application embodiment. Figure 10 Four;

[0119] Figure 19 A schematic diagram of the composition structure of a battery device provided in this application embodiment. Figure 3 ;

[0120] Figure 20 A schematic diagram illustrating the positional relationship between a chip and a battery cell in a battery device provided in this application embodiment. Figure 1 ;

[0121] Figure 21 A schematic diagram illustrating the positional relationship between a chip and a battery cell in a battery device provided in this application embodiment. Figure 2 ;

[0122] Figure 22 A schematic diagram illustrating the positional relationship between a chip and a battery cell in a battery device provided in this application embodiment. Figure 3 ;

[0123] Figure 23 A schematic diagram illustrating the positional relationship between a chip and a battery cell in a battery device provided in this application embodiment. Figure 4 ;

[0124] Figure 24 This is a schematic diagram of the composition structure of an electrical device provided in an embodiment of this application. Detailed Implementation

[0125] It should be noted that, unless otherwise specified, the embodiments and technical features in the embodiments of this application can be combined with each other, and the detailed descriptions in the specific implementation should be understood as explanations of the purpose of this application and should not be regarded as undue limitations on this application.

[0126] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having” and any variations thereof are intended to cover non-exclusive inclusion.

[0127] In the description of the embodiments of this application, technical terms such as "first," "second," and "third" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0128] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0129] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects are in an "or" relationship.

[0130] In the description of the embodiments of this application, the technical terms "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "circumferential", "height direction", "first direction", "second direction", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed, operated or used in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0131] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0132] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the technical term "contact" should be interpreted broadly, and can be direct contact, contact through an intermediate medium layer, contact between two contacting parties with substantially no interaction force, or contact between two contacting parties with interaction force.

[0133] With the development of clean energy, more and more devices are using electricity as their driving force, leading to the rapid development of power batteries, such as lithium-ion batteries, which can store large amounts of electrical energy and can be repeatedly charged and discharged. These power batteries are not only used in energy storage systems such as hydropower, thermal power, wind power, and solar power plants, but also widely used in electric vehicles such as electric bicycles, electric motorcycles, and electric cars, as well as in aerospace and other fields. As the application areas of power batteries continue to expand, the market demand is also constantly increasing.

[0134] In this embodiment, the battery device can be manufactured from battery cells and / or battery modules. A battery cell refers to a single battery cell, which is the basic unit capable of converting chemical energy into electrical energy. It can be used to manufacture battery modules or battery devices to supply power to electrical devices. A single battery cell can be a primary battery or a secondary battery. A secondary battery is a battery cell that can be recharged after discharge to reactivate its active materials and continue to be used. Battery cells can be lithium-ion batteries, sodium-ion batteries, sodium-lithium-ion batteries, lithium metal batteries, sodium metal batteries, lithium-sulfur batteries, magnesium-ion batteries, nickel-metal hydride batteries, nickel-cadmium batteries, or lead-acid batteries, etc., and this embodiment is not limited to these types. A single battery cell can be cylindrical, cuboid, or other shapes.

[0135] A battery cell includes an electrode assembly, which comprises a positive electrode, a negative electrode, and a separator. During the charging and discharging process of the battery cell, active ions (such as lithium ions) repeatedly insert and extract between the positive and negative electrodes. The separator is positioned between the positive and negative electrodes to prevent short circuits while allowing active ions to pass through.

[0136] In some embodiments, the separator is a separator membrane. This application does not impose any particular limitation on the type of separator membrane; any known porous separator membrane with good chemical and mechanical stability can be selected.

[0137] As an example, the main material of the separator can be selected from at least one of glass fiber, non-woven fabric, polyethylene, polypropylene, polyvinylidene fluoride, and ceramic. The separator can be a single-layer film or a multi-layer composite film, without particular limitation. When the separator is a multi-layer composite film, the materials of each layer can be the same or different, without particular limitation. The separator can be a separate component located between the positive and negative electrodes, or it can be attached to the surfaces of the positive and negative electrodes.

[0138] In some embodiments, the separator is a solid electrolyte. The solid electrolyte is disposed between the positive and negative electrodes, serving both to transport ions and to isolate the positive and negative electrodes.

[0139] In some embodiments, the battery cell also includes an electrolyte, which acts as a conductor of ions between the positive and negative electrodes. This application does not impose specific limitations on the type of electrolyte; it can be selected according to requirements. The electrolyte can be liquid, gel, or solid.

[0140] Liquid electrolytes include electrolyte salts and solvents.

[0141] In some embodiments, the electrolyte salt may be selected from at least one of lithium hexafluorophosphate, lithium tetrafluoroborate, lithium perchlorate, lithium hexafluoroarsenate, lithium bis(fluorosulfonyl)imide, lithium bis(trifluoromethanesulfonyl)imide, lithium trifluoromethanesulfonate, lithium difluorophosphate, lithium difluorooxalate borate, lithium dioxalate borate, lithium difluorodioxalate phosphate, and lithium tetrafluorooxalate phosphate.

[0142] In some embodiments, the solvent may be selected from at least one of ethylene carbonate, propylene carbonate, methyl ethyl carbonate, diethyl carbonate, dimethyl carbonate, dipropyl carbonate, methyl propyl carbonate, ethyl propyl carbonate, butyl carbonate, fluoroethylene carbonate, methyl formate, methyl acetate, ethyl acetate, propyl acetate, methyl propionate, ethyl propionate, propyl propionate, methyl butyrate, ethyl butyrate, 1,4-butyrolactone, sulfolane, dimethyl sulfone, methyl ethyl sulfone, and diethyl sulfone. The solvent may also be an ether solvent. Ether solvents may include one or more of ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol dimethyl ether, triethylene glycol dimethyl ether, tetraethylene glycol dimethyl ether, 1,3-dioxolane, tetrahydrofuran, methyl tetrahydrofuran, diphenyl ether, and crown ethers.

[0143] Among them, the gel electrolyte includes a polymer as the electrolyte backbone network, combined with an ionic liquid - lithium salt.

[0144] Solid electrolytes include polymer solid electrolytes, inorganic solid electrolytes, and composite solid electrolytes.

[0145] In some implementations, the electrode assembly is a wound structure. The positive and negative electrode sheets are wound into a wound structure.

[0146] In some implementations, the electrode assembly is a stacked structure.

[0147] In battery devices, chips are typically used to collect and process state information such as voltage and temperature of the battery cells. The sampling circuits in related technologies usually utilize discrete electronic components to assist the chip in collecting and processing the cell's state information. These include protective devices for shielding components within the chip, and / or filtering devices for filtering the chip's input signals. These discrete components, due to their large size, are difficult to integrate into the chip and are therefore placed outside the chip; they are also called peripheral devices. However, in practical applications, these discrete peripheral devices are susceptible to environmental factors such as moisture and conductive foreign matter (e.g., solder slag), leading to corrosion, short circuits, and other problems. For example, moisture can easily condense within the cell's containment space, and long-term accumulation of condensate can seep into the circuit structure, causing open circuits or corrosion in electronic components. Furthermore, conductive foreign matter such as solder slag can easily accumulate in this containment space, potentially causing short circuits. These problems result in faster device aging, higher device failure rates, and affect the reliability and stability of the sampling circuit, thereby impacting the reliability and stability of the battery device. Furthermore, when there are many discrete peripheral components, the overall volume occupied by the sampling circuit is large, which reduces the energy density of the battery device.

[0148] This application provides a battery device, such as... Figure 1 and Figure 2 As shown, the battery device 100 includes:

[0149] Multiple battery cells 11;

[0150] Multiple chips 12 are connected to a portion of the multiple battery cells 11. Each chip 12 is disposed on the end face 11a of at least one of the connected battery cells 11. Each chip 12 includes a package housing 121 for accommodating a first component 122 and a control component 123.

[0151] Control component 123 is used to collect and process the status information of battery cell 11;

[0152] The first component 122 is connected between the battery cell 11 and the control component 123, and is used to protect the control component 123 and / or to filter the input signal of the control component 123.

[0153] Here, the battery device 100 may include, but is not limited to, a power battery device and / or an energy storage battery device, etc., and the embodiments of this application do not limit this.

[0154] The battery cell 11 can be in any suitable form, and this application embodiment does not limit it. For example, the battery cell 11 can be at least one of the following: prismatic battery cell, cylindrical battery cell, blade battery cell, and pouch battery cell.

[0155] Chip 12 can be any suitable sampling chip. For example, chip 12 can be, but is not limited to, an analog front end (AFE) chip, also known as a battery sampling chip, which can be used to collect and process information such as the voltage and temperature of the battery cell.

[0156] The shape of chip 12 may include, but is not limited to, at least one of square, circular, irregular shapes, etc.

[0157] The status information of cell 11 may include, but is not limited to, at least one of voltage, temperature, current, etc.

[0158] In some embodiments, each chip 12 is disposed on the end face 11a of at least one connected cell 11. It is understood that each chip 12 can be disposed on the end face 11a of any one or more cells 11 among the connected chips. This shortens the length of the sampling lines between the chip 12 and each connected cell 11 compared to one chip managing all cells, thereby reducing the parasitic RC parameters in the sampling lines. Due to the reduced parasitic RC parameters in the sampling lines, interference signals such as parasitic noise, electrostatic signals, and / or surge signals in the sampling circuit are correspondingly reduced. Therefore, the requirements for protection and / or filtering device parameters in the sampling circuit can be further reduced to support the integration of the first component into the chip.

[0159] In some embodiments, each chip 12 can be connected to a battery cell 11, and the control component 123 in the chip 12 is used to collect and process the status information of the battery cell 11. It is understood that each chip 12 can be respectively disposed on the end face 11a of the individual battery cell 11 to which it is connected. In this way, the length of the sampling line between the chip 12 and the battery cell 11 can be shortened, thereby reducing the parasitic parameters of resistance, capacitance and inductance in the sampling line, and further reducing the device parameter requirements for protection and / or filtering in the sampling circuit, so as to support the selection of smaller device parameters for the first component, thereby further facilitating the integration of the first component into the chip.

[0160] In some embodiments, each chip 12 can connect to at least two battery cells 11. The control component 1221 in the chip 12 is used to collect and process the status information of the at least two battery cells 11. Each chip 12 can be disposed on the end face 11a of any one or more of the at least two connected battery cells 11. The number of battery cells 11 connected to a single chip 12 can be set according to the actual situation, and this application embodiment does not limit this. For example, each chip 12 can connect to 2 to 5 battery cells 11. As another example, the number of battery cells 11 connected to each chip 12 can be 3, 4, 6, 8, etc.

[0161] In some implementations, each chip 12 can be connected to at least two adjacent cells 11. It is understood that each chip 12 can be disposed on the end face 11a of any one or more of the connected adjacent cells 11. In this way, compared to one chip managing at least two non-adjacent cells 11, the length of the sampling line between the chip 12 and each connected cell 11 can be shortened, thereby reducing the parasitic parameters of resistance, capacitance, and inductance in the sampling line, and further reducing the device parameter requirements for protection and / or filtering in the sampling circuit, so as to support the integration of the first component into the chip.

[0162] In some embodiments, the chip 12 may contact the end face 11a of at least one of the connected battery cells 11. In this way, since the end face 11a of the battery cell 11 is usually formed of a material such as a metal with high thermal conductivity, the heat dissipation effect of the chip 12 can be improved by setting the chip 12 to contact the end face 11a of the battery cell 11.

[0163] In some embodiments, the chip 12 does not contact the end face 11a of at least one of the connected battery cells 11. For example, the chip 12 and the end face 11a of the battery cell 11 can be separated by thermally conductive adhesive, a circuit board, and / or air. In this way, since the chip 12 and the end face 11a of the battery cell 11 do not contact each other, the impact of battery cell expansion stress on the chip 12 can be reduced, and the stability of the connection between the chip 12 and the battery cell 11 can be improved.

[0164] In some embodiments, multiple chips 12 are arranged at a certain distance and are physically independent of each other. Each chip 12 can be connected to one or more battery cells 11. The multiple chips 12 can be integrated on the same circuit board or not; this application does not limit this.

[0165] In some embodiments, each battery cell 11 and each chip 12 can be housed in a receiving compartment. The shape of the receiving compartment can be set according to the actual situation, and this application embodiment does not limit it. The receiving compartment can be sealed, semi-sealed, or unsealed.

[0166] In some embodiments, the battery device 100 may also include a housing having a receiving compartment.

[0167] Chip 12 can be a package, and the first component 122 and the control component 123 can be packaged inside the package housing 121 using any suitable packaging method. For example, the packaging methods that can be used include, but are not limited to, at least one of the following: leadframe structure package, system-in-package (SIP package), dual in-line package (DIP package), and plastic quad flat package (PQF package).

[0168] The materials used to form the encapsulation shell may include, but are not limited to, at least one of ceramics, plastics, resins, etc., and the embodiments of this application do not limit this.

[0169] In some embodiments, the material used to form the encapsulation housing may include epoxy resin, which can better protect the devices inside the encapsulation housing and isolate moisture from the outside of the encapsulation housing.

[0170] It is understood that the first component 122 is used to protect the control component 123 and / or to filter the input signal of the control component 123. The specific circuit structure and device model used in the control component 123, as well as the electronic components included in the first component 122 and the connection relationships between these electronic components, can be flexibly selected according to the actual application scenario, and this application embodiment does not limit this. For example, the first component 122 may include, but is not limited to, at least one of the following: a protective capacitor, a protective diode, a filter capacitor, a filter resistor, and a filter inductor. The protective capacitor, protective diode, and filter capacitor can be connected in parallel with the battery cell 11, and the filter resistor and filter inductor can be connected in series with the battery cell 11.

[0171] In some implementations, such as Figure 3 As shown, the control component 123 in chip 12 may include an information acquisition component 1231 and an information processing component 1232. The information acquisition component 1231 is used to acquire the status information of the connected battery cells, and the information processing component 1232 is used to process the status information of the battery cells acquired by the information acquisition component 1231. The information processing may include, but is not limited to, at least one of fault diagnosis, communication transmission, etc. The information acquisition component 1231 and the information processing component 1232 may be implemented as the same component or as two separate components; this embodiment does not limit this.

[0172] In some implementations, the information acquisition component 1231 may include at least one of the following:

[0173] A voltage acquisition component is used to acquire the voltage of at least one battery cell connected to the chip;

[0174] A current acquisition component is used to acquire the current of at least one battery cell connected to the chip.

[0175] A temperature acquisition component is used to acquire the temperature of at least one battery cell connected to the chip.

[0176] In some implementations, such as Figure 4 and Figure 5 As shown, the battery device 100 may also include a battery management unit (BMU) 13, and the chip 12 may communicate with the battery management unit 13 and / or other chips 12 via wired or wireless means.

[0177] In some implementations, see also Figure 4 and Figure 5 The battery device 100 may also include a communication link 14, through which the chip 12 can communicate with the battery management unit 13 to transmit the collected cell status information to the battery management unit. For example, the communication link 14 may include, but is not limited to, a daisy-chain communication line, which can transmit the cell status information collected by the chip 12 to the battery management unit.

[0178] In some implementations, when there are multiple chips 12, the multiple chips 12 can also be connected to each other via a communication link 14. For example, the communication link 14 includes a daisy-chain communication line that connects the individual chips 12 in series and connects the series-connected chips 12 to the battery management unit 13.

[0179] For example, the battery management unit 13 can obtain the temperature, voltage, current and other status information of each cell in real time through the daisy-chain communication line. It can use this status information to estimate the state of charge (SOC) and state of health (SOH) of the cells, estimate the overall SOC and SOH of the battery device, monitor the battery working status, and control the charging and discharging of the connected cells. When the cell parameters are abnormal, the fault is reported to the vehicle controller.

[0180] In some embodiments, each chip 12 is connected to multiple battery cells 11.

[0181] For example, see continue. Figure 1 and Figure 2 The battery device 100 includes multiple chips 12, and the control component 123 in each chip 12 can be used to collect and process the status information of the multiple connected cells 11.

[0182] In the above embodiments, by setting each chip to connect to multiple battery cells, the total number of chips required in the battery device can be reduced, costs can be reduced, the overall device failure rate in the battery device can be reduced, and the energy density of the battery device can be improved.

[0183] In some embodiments, a cooling component is also provided within the housing 10 to cool the battery cell 11. It is understood that because a cooling component is provided within the housing, the temperature within the housing is typically low, and placing the chip 12 and the battery cell 11 within this housing can improve the heat dissipation of the chip 12. Furthermore, since the cooling component can be used to cool the battery cell 11, placing the chip on the end face of the battery cell can further improve the chip's heat dissipation. This allows for the encapsulation of more first components within the chip's package, thereby providing protection for more first components through encapsulation and further improving the stability and reliability of the sampling circuit.

[0184] In some embodiments, the battery device 100 includes a housing, within which a high-voltage compartment and a battery compartment are disposed. The battery compartment can serve as a housing for accommodating multiple battery cells 11 and at least one chip 12, as described in the above embodiments. The high-voltage compartment can house devices such as a BMU, relays, fuses, pre-charge resistors, current sensors, and / or DC-to-DC converters. It is understood that since heat-generating devices such as relays and fuses are located in the high-voltage compartment, the temperature inside the high-voltage compartment is typically higher than that inside the battery compartment. Therefore, placing the chip 12 within the battery compartment facilitates heat dissipation for the chip 12, thereby enabling the encapsulation of more first components within the chip's encapsulation housing. This provides protection for more first components through encapsulation, extends the lifespan of the chip 12, further improves the stability and reliability of the sampling circuit, and enhances the overall stability and reliability of the battery device.

[0185] In the battery device of this application embodiment, multiple chips are used to encapsulate control components to collect and process the status information of the cells connected to the chips. Each chip is connected to a portion of the cells in the battery device. This reduces the parameter requirements for protection and / or filtering devices in the sampling circuit compared to a single chip managing all cells, allowing for the selection of smaller protection and / or filtering devices. Furthermore, because the protection and / or filtering devices are smaller, the volume occupied by the first component can be reduced, allowing the first component and control components to be integrated within the chip. Protected by the chip's encapsulation, the adverse effects of environmental factors such as moisture and conductive foreign matter on the first component are reduced, decreasing the aging rate and failure rate of the first component, thereby improving the reliability and stability of the sampling circuit, and ultimately enhancing the reliability and stability of the battery device. Furthermore, since the first component and the control component are integrated in the same package, the physical distance between the control component and the first component can be reduced, thereby reducing the parasitic parameters of resistance, capacitance, and inductance, improving the protection and / or filtering capabilities of the first component, thereby improving the stability of the sampling circuit, increasing the integration of the sampling circuit, reducing the volume occupied by the circuit, and thus increasing the energy density of the battery device.

[0186] In some embodiments, such as Figure 6 As shown, the first component 122 includes at least one of the following:

[0187] The protection component 1221 is connected between the battery cell 11 and the control component 123 and is used to eliminate interference signals superimposed on the input signal of the control component 123.

[0188] The filter component 1222 is connected between the battery cell 11 and the control component 123. It is used to filter the status information of the battery cell 11 and transmit the filtered status information to the control component 123.

[0189] Here, the input signals of the control component 123 may include, but are not limited to, cell status signals corresponding to the cell status information. These signals may be superimposed with interference signals such as electrostatic discharge (ESD) signals and / or surge signals when they enter the control component. The protection component 1221 can be used to eliminate the interference signals superimposed on the input signals of the control component 123, thereby reducing damage to the control component 123 from interference signals and protecting the control component 123. For example, the protection component 1221 may include, but is not limited to, at least one of an anti-static circuit and a surge protection circuit.

[0190] In some implementations, the surge protection circuit in the protection component 1221 can be located externally to the chip. This allows for easy adjustment of the surge protection circuit model to meet the surge protection requirements of different application scenarios, thereby improving system reliability.

[0191] In some embodiments, the protection component 1221 can be used to absorb and / or discharge interference signals superimposed on the input signal of the control component 123, thereby eliminating the interference signals superimposed on the input signal of the control component 123. For example, the protection component 1221 may include at least one absorption device (such as a capacitor, transient voltage suppressor diode, resistor-capacitor (RC) absorption network, etc.), which can absorb the interference signals superimposed on the input signal of the control component 123. Alternatively, the protection component 1221 may include at least one discharge device (such as a freewheeling diode, transistor, or other element with unidirectional conduction or switching characteristics), which can discharge the interference signals superimposed on the input signal of the control component 123 to ground or other low potential terminals.

[0192] In some implementations, the cell status signal corresponding to the status information of the cell 11 collected by the chip 12 enters the control component 123 via a sampling line. Noise may be present in the cell status signal entering the control component 123. This cell status signal may include, but is not limited to, voltage signals, current signals, and / or temperature signals. The filtering component 1222 can be used to suppress and filter noise in the voltage, current, and / or temperature signals of the cell 11.

[0193] In some implementations, the status information of the battery cell 11 can be filtered by methods such as ground low-pass filtering, multi-stage low-pass filtering, band-pass filtering, and / or digital filtering.

[0194] In some embodiments, the first component 122 includes the protection component 1221 and the filtering component 1222 described above. The protection component 1221 and the filtering component 1222 can be connected in parallel or in series; this application embodiment does not limit this connection.

[0195] For example, both the protection component 1221 and the filter component 1222 can be connected in parallel with the corresponding battery cell 11. The protection component 1221 is connected in parallel between the battery cell 11 and the control component 123, and the filter component 1222 is connected in parallel between the protection component 1221 and the control component 123. In this way, the protection component 1221 can first eliminate the interference signal superimposed on the signal corresponding to the state information of the battery cell 11, and then the filter component 1222 can filter the state information of the battery cell 11 after the interference signal is eliminated. The filtered state information is then transmitted to the control component 123 as the input signal.

[0196] For example, both the protection component 1221 and the filter component 1222 can be connected in parallel with the corresponding battery cell 11. The protection component 1221 is connected in parallel between the protection component and the control component 123, and the filter component 1222 is connected in parallel between the battery cell 11 and the protection component 1221. In this way, the state information of the battery cell 11 can be filtered first using the filter component 1222, and then the interference signal superimposed on the battery cell state signal corresponding to the filtered state information of the battery cell 11 can be eliminated using the protection component 1221. The state information of the battery cell 11 after the interference signal elimination is then transmitted to the control component 123 as the input signal.

[0197] For example, both the protection component 1221 and the filtering component 1222 can be connected in series with the corresponding battery cell 11. The protection component 1221 is connected in series between the battery cell 11 and the control component 123, and the filtering component 1222 is connected in series between the protection component 1221 and the control component 123. In this way, the protection component 1221 can first eliminate the interference signal superimposed on the signal corresponding to the state information of the battery cell 11, and then the filtering component 1222 can filter the state information of the battery cell 11 after the interference signal is eliminated. The filtered state information is then transmitted to the control component 123 as the input signal.

[0198] For example, both the protection component 1221 and the filter component 1222 can be connected in series with the corresponding battery cell 11. The protection component 1221 is connected in series with the control component 123, and the filter component 1222 is connected in series between the battery cell 11 and the protection component 1221. In this way, the state information of the battery cell 11 can be filtered first using the filter component 1222, and then the interference signal superimposed on the battery cell state signal corresponding to the filtered state information of the battery cell 11 can be eliminated using the protection component 1221. The state information of the battery cell 11 after the interference signal is eliminated can then be transmitted to the control component 123 as the input signal.

[0199] In the above embodiments, the first component includes a protective component for eliminating interference signals superimposed on the input signal of the control component to protect the control component, and / or a filtering component for filtering the state information of the battery cells and transmitting the filtered state information to the control component. In the battery device of this application embodiment, multiple chips are used to encapsulate the control component, collecting and processing the state information of the battery cells connected to the chips. Each chip is connected to a portion of the battery cells in the battery device. This reduces the parameter requirements of the protective and filtering devices in the sampling circuit compared to a single chip managing all the cells, allowing for the selection of smaller protective and filtering devices. Because the protective and / or filtering devices are smaller, they can be encapsulated within the chip. This reduces the adverse effects of environmental factors such as moisture and conductive foreign matter on the protective and / or filtering components, lowers the aging rate and failure rate of the protective and / or filtering components, thereby improving the reliability and stability of the battery device. Furthermore, it increases the integration of the sampling circuit, reduces the circuit's volume, and further improves the energy density of the battery device.

[0200] In some embodiments, the first component 122 includes a protection component 1221; the battery device 100 further includes a filter component 1222, connected between the battery cell 11 and the control component 123, for filtering the state information of the battery cell 11 and transmitting the filtered state information to the control component 123. The filter component 1222 can be located externally to the chip. This facilitates matching the circuit structure and / or device model of the filter component 1222 to different application scenarios and adjusting the filter cutoff frequency.

[0201] In some embodiments, such as Figure 7 and Figure 8 As shown, chip 12 also includes:

[0202] The die 124 is encapsulated inside the package housing 121 and is used to integrate the control component 123.

[0203] Here, at least one control component 123 is integrated in the die 124. The die 124 can be encapsulated inside the package housing 121 using any suitable packaging method. This application embodiment does not limit this.

[0204] In the above embodiments, since the circuit devices integrated in the die are less susceptible to adverse effects from environmental factors, by integrating the control components into the die inside the package, the adverse effects of environmental factors on the control components can be reduced, thereby improving the reliability and stability of the sampling circuit and further increasing the integration of the sampling circuit.

[0205] In some embodiments, see continue to see Figure 7 and Figure 8 Each chip 12 also includes:

[0206] The packaging frame 125 is disposed on the packaging housing 121 and is used to connect the circuit lead 1241 of the die 124 to the pins of the chip.

[0207] Here, the package frame 125 refers to the metal frame used to connect the circuit lead 1241 of the die 124 and the chip pins, and is usually called the lead frame.

[0208] The circuit lead 1241 of the die 124 may include, but is not limited to, at least one of the circuit input terminal, circuit output terminal, etc.

[0209] In some embodiments, the circuit leads 1241 of the die 124 may include, but are not limited to, the circuit leads of the control component 123.

[0210] In some embodiments, the die 124 also integrates a power management component, and the circuit lead-out terminal 1241 of the die 124 may include, but is not limited to, the circuit lead-out terminal of the control component 123, the circuit lead-out terminal of the power management component, etc.

[0211] In the above embodiments, the circuit leads of the die and the pins of the chip are connected by a packaging frame. This simplifies the chip packaging process, improves the connection strength between the circuit leads of the die and the pins of the chip, thereby enhancing the reliability and stability of the sampling circuit. Furthermore, the packaging frame is typically made of a metal material with excellent thermal conductivity, and by connecting it to the outwardly extending chip pins, the heat dissipation area can be increased, thus improving the chip's heat dissipation performance.

[0212] In some embodiments, the first component 122 is integrated on the die 124 and / or disposed between the package frame 125 and the die 124.

[0213] In some embodiments, each device in the first component 122 may be integrated on the die 124.

[0214] In some embodiments, each device in the first component 122 may be encapsulated between the die 124 and the package frame 125, and connected to the control component 123 integrated in the die 124 through the circuit lead-out terminal 1241 of the die 124.

[0215] In the above embodiments, by integrating the first component onto the die, the adverse effects of environmental factors on the first component can be further reduced, thereby further improving the reliability and stability of the sampling circuit and further improving the integration of the sampling circuit. By placing the first component between the packaging frame and the die, the die formation process can be simplified, the heat dissipation performance of the chip can be improved, and the protection and / or filtering capabilities of the first component can be easily adjusted to adapt to different application scenarios.

[0216] In some embodiments, some devices in the first component 122 may be integrated on the die 124, while other devices in the first component 122 may be disposed between the die 124 and the package frame 125. For example, some devices in the first component 122 connected in parallel with the cell 11 (such as at least one of a parallel-connected filter capacitor, protection capacitor, protection diode, etc.) may be integrated on the die 124, while some devices in the first component 122 connected in series with the cell 11 (such as at least one of a series-connected filter resistor, filter inductor, etc.) may be disposed between the die 124 and the package frame 125. As another example, capacitors and / or resistors in the first component 122 may be integrated on the die 124, while inductors and / or diodes in the first component 122 may be disposed between the die 124 and the package frame 125.

[0217] In the above embodiments, by integrating a portion of the devices in the first component onto the die, the adverse effects of environmental factors on that portion of the devices in the first component can be reduced, thereby improving the reliability and stability of the sampling circuit and increasing the integration of the sampling circuit. By placing another portion of the devices in the first component between the package frame and the die, the die volume can be reduced, the die formation process can be simplified, and compared to integrating all the devices in the first component onto the die, placing some devices between the package frame and the die can improve the heat dissipation performance of the chip and facilitate the adjustment of the protection capability of the first component, thereby adapting to different application scenarios.

[0218] In some embodiments, such as Figure 9 As shown, the protective component 1221 may include:

[0219] A first protection capacitor C11 is provided corresponding to each battery cell 11. The first protection capacitor C11 is connected in parallel with the corresponding battery cell 11. The connection point between the first protection capacitor C11 and the corresponding battery cell 11 is located at the connection end between the battery cell 11 and the control component 123 near the battery cell 11. The first protection capacitor C11 is used to eliminate the surge interference signal generated at both ends of the corresponding battery cell 11.

[0220] Here, a corresponding first protection capacitor C11 is provided for each battery cell 11. By connecting the first protection capacitor C11 in parallel with the corresponding battery cell 11, and setting the connection point between the first protection capacitor C11 and the corresponding battery cell 11 at the connection end between the battery cell 11 and the control component 123 near the battery cell 11, the surge interference signal generated at both ends of the corresponding battery cell 11 can be eliminated by the first protection capacitor C11, so as to reduce the damage of the surge interference signal to the control component 123.

[0221] In some embodiments, the first protective capacitor C11 can be used to absorb interference signals superimposed on the input signal of the control component 123, thereby eliminating interference signals superimposed on the input signal of the control component 123.

[0222] The selection of the first protective capacitor C11 can be predetermined by those skilled in the art based on the actual application scenario, and this application embodiment does not limit this.

[0223] In the above embodiments, multiple chips are connected to portions of the battery cells in the battery device, and each chip encapsulates a control component to collect and process the status information of the battery cells to which the chip is connected. This reduces the surge protection requirements at both ends of each battery cell in the sampling circuit compared to a single chip managing all cells, allowing for the selection of a smaller first protection capacitor. Furthermore, due to the small size of the first protection capacitor, it can be integrated with the control component within the chip. Protected by the chip's encapsulation, the adverse effects of environmental factors such as moisture and conductive foreign matter on the first protection capacitor are reduced, decreasing its aging rate and device failure rate, thereby improving the reliability and stability of the battery device.

[0224] In some embodiments, the first protective capacitor C11 can be integrated on the die 124 in the chip 12. This can further improve the chip's integration density, and by integrating the first protective capacitor and the control components together on the die inside the package, the adverse effects of environmental factors on the first protective capacitor can be reduced, the physical distance between the control components and the first protective capacitor can be reduced, the parasitic parameters of resistance, capacitance, and inductance can be lowered, and the protection capability of the first protective capacitor can be improved.

[0225] In some implementations, the first protective capacitor C11 can be integrated between the die 124 and the package frame 125 in the chip 12. This facilitates matching the model and specifications of the first protective capacitor according to different application scenarios.

[0226] In some embodiments, see continue to see Figure 9 The protective component 1221 may include:

[0227] A second protective capacitor C12 is provided corresponding to each battery cell 11. The second protective capacitor C12 is connected in parallel with the corresponding battery cell 11. The connection point between the second protective capacitor C12 and the corresponding battery cell 11 is located at the connection end between the battery cell 11 and the control component 123 near the control component 123. The second protective capacitor C12 is used to clamp the input signal of the control component 123 below the target voltage.

[0228] Here, the selection of the second protective capacitor C12 and the value of the target voltage can be predetermined by those skilled in the art based on the actual application scenario, and this application embodiment does not limit this. It is understood that by clamping the input signal of the control component 123 below the target voltage through the second protective capacitor C12, damage to the control component 123 caused by excessively high input voltage can be reduced.

[0229] In the above embodiments, since multiple chips are connected to portions of the battery cells in the battery device, a control component encapsulated in each chip is used to collect and process the status information of the cells connected to the chip. This reduces the need for clamping and protecting the input signals of the control component in the sampling circuit compared to a single chip managing all cells, allowing for the selection of a smaller second protection capacitor. Furthermore, due to the small size of the second protection capacitor, it can be integrated with the control component within the chip. Protected by the chip's encapsulation, the adverse effects of environmental factors such as moisture and conductive foreign matter on the second protection capacitor are reduced, decreasing its aging rate and device failure rate, thereby further improving the reliability and stability of the battery device.

[0230] In some embodiments, the second protection capacitor C12 can be integrated on the die 124 in the chip 12. This can further improve the chip integration, and by integrating the second protection capacitor and the control components together on the die inside the package, the adverse effects of environmental factors on the second protection capacitor can be reduced, the physical distance between the control components and the second protection capacitor can be reduced, the parasitic parameters of resistance, capacitance, and inductance can be reduced, and the protection capability of the second protection capacitor can be improved.

[0231] In some implementations, the second protective capacitor C12 can be integrated between the die 124 and the package frame 125 in the chip 12. This facilitates matching the model and specifications of the second protective capacitor according to different application scenarios.

[0232] In some embodiments, such as Figure 10 As shown, the protective component 1221 may include:

[0233] The first protection diode Z1 is connected between the battery cell 11 and the control component 123 to eliminate the interference signal superimposed on the input signal of the control component 123, thereby protecting the control component 123.

[0234] The first protection diode Z1 can be predetermined by those skilled in the art based on the actual application scenario, and this application embodiment does not limit it.

[0235] In some implementations, the first protection diode Z1 can eliminate interference signals superimposed on the input signal of the control component 123 by absorption and / or discharge.

[0236] In some implementations, the first protection diode Z1 is connected in parallel with the cell 11 to absorb surge interference signals between the positive and negative terminals of the cell 11 and suppress reverse voltage.

[0237] In some implementations, the first protection diode Z1 may be selected from, but is not limited to, a transient voltage suppressor (TVS) diode. When the TVS diode is subjected to a sudden high-energy surge, it can rapidly reduce its impedance and absorb a large current, clamping the voltage across the TVS diode to a predetermined value, thereby ensuring that downstream circuit components are protected from damage caused by transient high-energy surges.

[0238] In the above embodiments, since multiple chips are connected to portions of the battery cells in the battery device, a control component encapsulated in each chip is used to collect and process the status information of the cells connected to the chip. This reduces the surge protection requirements at both ends of each cell in the sampling circuit compared to a single chip managing all cells, allowing for the selection of a smaller first protection diode. Furthermore, due to the reduced size of the first protection diode, it can be integrated with the control component within the chip. Protected by the chip's encapsulation, the adverse effects of environmental factors such as moisture and conductive foreign matter on the first protection diode are reduced, decreasing its aging rate and device failure rate, thereby further improving the reliability and stability of the battery device.

[0239] In some embodiments, the first protection diode Z1 can be disposed between the die 124 and the package frame 125 in the chip 12. Since, under the same protection requirements, the diode is typically larger than devices such as capacitors and resistors, and the space required for integrating the diode into the die is usually large, disposing the first protection diode between the die and the package frame in the chip allows for easier integration of the first protection diode into the chip while reducing its aging rate and device failure rate, thus saving chip manufacturing costs.

[0240] In some embodiments, the first component 122 further includes a filter component 1222, which is connected between the battery cell 11 and the control component 123, for filtering the state information of the battery cell 11 and transmitting the filtered state information to the control component 123.

[0241] In the above embodiments, multiple chips are used to encapsulate control components, which collect and process the status information of the cells connected to the chips. Each chip connects to a portion of the cells in the battery device. This reduces the parameter requirements of the filtering components in the sampling circuit compared to a single chip managing all cells, allowing for the selection of smaller filtering components. Furthermore, due to the smaller size of the filtering components, they can be integrated with the control and protection components within the chip. Protected by the chip's encapsulation, the adverse effects of environmental factors such as moisture and conductive foreign matter on the filtering components are reduced, decreasing the aging rate and failure rate of the filtering components, thereby improving the reliability and stability of the battery device. In addition, the reduced physical distance between the filtering components and the control and protection components lowers parasitic parameters (RCI), improves the protection capability of the protection components and the filtering capability of the filtering components, thus enhancing the stability of the sampling circuit.

[0242] In some embodiments, such as Figure 11 As shown, the filter component 1222 may include:

[0243] A first filter capacitor C21 is provided corresponding to each battery cell 11. One end of the first filter capacitor C21 is connected between the positive terminal of the corresponding battery cell 11 and the control component 123, and the other end of the first filter capacitor C21 is grounded.

[0244] Here, a corresponding first filter capacitor C21 is provided for each cell 11. By connecting one end of the first filter capacitor C21 between the positive terminal of the corresponding cell 11 and the control component 123, and grounding the other end of the first filter capacitor C21, low-pass filtering to ground can be achieved to filter out noise and AC components in the cell status signal output from the positive terminal of the cell 11 to the control component 123, thereby improving the accuracy of the cell status signal entering the control component 123.

[0245] The first filter capacitor C21 can be directly connected to the positive terminal of the corresponding battery cell 11 and the control component 123, or it can be indirectly connected. The first filter capacitor C21 can be directly grounded, or it can be indirectly grounded through other devices such as resistors and transient voltage suppression diodes.

[0246] It should be noted that the model and specifications of the first filter capacitor C21 can be flexibly selected by those skilled in the art according to the actual application scenario, and the embodiments of this application do not limit this.

[0247] In the above embodiments, one end of the first filter capacitor is connected between the positive terminal of the corresponding battery cell and the control component, and the other end of the first filter capacitor is grounded. This allows for filtering of the positive terminal electrical signal of the battery cell collected by the control component. Furthermore, since multiple chips are connected to portions of the battery cells in the battery device, a control component encapsulated in each chip collects and processes the status information of the battery cells connected to that chip. Compared to a single chip managing all battery cells, this reduces the filtering requirements for the positive terminal electrical signals of the battery cells collected by each chip in the sampling circuit, allowing for the selection of a smaller first filter capacitor. Moreover, due to the small size of the first filter capacitor, it can be integrated with the control component within the chip. Protected by the chip's encapsulation, the adverse effects of environmental factors such as moisture and conductive foreign matter on the first filter capacitor are reduced, decreasing its aging rate and device failure rate, thereby further improving the reliability and stability of the battery device.

[0248] In some embodiments, the first filter capacitor C21 can be integrated on the die 124 in the chip 12. This can further improve the chip's integration density, and by integrating the first filter capacitor and the control components together on the die inside the package, the adverse effects of environmental factors on the first filter capacitor can be reduced, the physical distance between the control components and the first filter capacitor can be shortened, the parasitic parameters of resistance, capacitance, and inductance can be reduced, and the filtering capability of the first filter capacitor can be improved.

[0249] In some implementations, each first filter capacitor C21 can be integrated between the die 124 and the package frame 125 in the chip 12. This facilitates matching the model and specifications of the first filter capacitors according to different application scenarios and adjusting the filter cutoff frequency.

[0250] In some embodiments, such as Figure 12 As shown, the filter component 1222 may include:

[0251] A first filter capacitor C21 is respectively set for each battery cell 11;

[0252] A filter resistor R1 is provided for each battery cell 11. One end of the filter resistor R1 is connected to the positive terminal of the corresponding battery cell 11, and the other end of the filter resistor R1 is connected to the control component 123 and grounded through the first filter capacitor C21.

[0253] Here, by connecting one end of the filter resistor R1 to the positive terminal of the corresponding cell 11 and the other end of the filter resistor R1 to the control component 123 and grounding it through the first filter capacitor C21, the filter resistor R1 and the first filter capacitor C21 can form a resistor-capacitor (RC) filter circuit, so as to better filter out noise and AC components in the cell status signal output from the positive terminal of the cell 11 to the control component 123, thereby improving the accuracy of the cell status signal entering the control component 123.

[0254] The specifications of the first filter capacitor C21 and the filter resistor R1 can be flexibly selected by those skilled in the art according to the actual application scenario, and this application embodiment does not limit them.

[0255] In the above embodiments, a resistor-capacitor filter circuit can be formed by setting a first filter capacitor and a filter resistor corresponding to each battery cell to filter the positive electrode electrical signal of the battery cell collected by the control component. Furthermore, since multiple chips are connected to some of the battery cells in the battery device, and the control component encapsulated in each chip collects and processes the status information of the battery cells connected to the chip, compared to a single chip managing all battery cells, the filtering requirements for the positive electrode electrical signal of the battery cell collected by each chip in the sampling circuit can be reduced, allowing for the selection of smaller first filter capacitors and filter resistors. Further, since the first filter capacitor and filter resistor are small, they can be integrated together with the control component inside the chip. Under the protection of the chip package, the adverse effects of environmental factors such as moisture and conductive foreign matter on the first filter capacitor and filter resistor can be reduced, decreasing the aging rate and device failure rate of the first filter capacitor and filter resistor, thereby improving the reliability and stability of the battery device.

[0256] In some embodiments, the filter resistor R and the first filter capacitor C21 are integrated on the die 124 of the chip 12. By integrating the first filter capacitor, filter resistor, and control components together on the die inside the package, the adverse effects of environmental factors on the first filter capacitor and filter resistor can be reduced, and the physical distance between the control components and the first filter capacitor and filter resistor can be shortened. This reduces parasitic parameters of resistance, capacitance, and inductance, thereby improving the filtering capability of the first filter capacitor and filter resistor. Furthermore, since the filter resistor is integrated on the die of the chip, a larger resistance value can be selected without increasing the resistor's size. Therefore, while achieving the same filtering effect at the cutoff frequency, a smaller capacitance value of the first filter capacitor can be selected, meaning a smaller first filter capacitor can be chosen. Thus, it is convenient to integrate the first filter capacitor onto the die of the chip.

[0257] It should be noted that in related technologies, the filter capacitor in the sampling circuit cannot be integrated into the die on the chip, mainly because: 1) Related technologies use a single chip to manage all battery cells to collect and process the status information of all battery cells in the battery device. Therefore, the required sampling harness is usually long, for example, >2 meters (m), resulting in large parasitic inductance and large voltage oscillation. The required filter capacitor has a high withstand voltage, generally a 50V capacitor is required; 2) In related technologies, the filter resistor connected in series between the battery cell and the control component is not integrated on the die. It needs to be separately packaged outside the die, occupying a large area. Therefore, the selectable resistance value is small, usually only at the kiloohm (KΩ) level. To achieve the required RC filtering effect at the cutoff frequency, a larger filter capacitor is required, generally a 104 capacitor (100nF). In the embodiments of this application, the reasons for integrating the filter capacitor into the die include at least the following: 1) Using multiple chips, each chip manages a portion of the battery cells, thus shortening the sampling harness required to collect the status information of each battery cell. In this way, the sampling harness can be <1m (or even <10cm), the capacitor withstand voltage can be below 10V, and the distance and area of ​​the capacitor plates are greatly reduced; 2) For the RC filter circuit, since the filter resistor R1 can be easily integrated into the die to the megaohm (MΩ) level, compared with the related technology where the filter resistor R1 is not integrated into the die, the resistance R can be increased by 1000 times. According to the RC oscillation frequency calculation formula f = 1 / (2πRC), while maintaining the same cutoff frequency f, the capacitance C can be reduced by 1000 times, and the capacitance size can be reduced to below 1nF (or even 0.1nF). Capacitors below 1nF can be integrated into the die.

[0258] In some implementations, each filter resistor R1 and each first filter capacitor C21 can be integrated between the die 124 and the package frame 125 in the chip 12. This facilitates matching the specifications of the filter resistor R1 and the first filter capacitor C21 according to different application scenarios, and adjusting the filter cutoff frequency.

[0259] In some embodiments, such as Figure 13 As shown, the filter component 1222 may include:

[0260] The filter inductor L is connected between the battery cell 11 and the control component 123 and is used to filter the status information of the battery cell 11.

[0261] The model and specifications of the filter inductor L can be flexibly selected by those skilled in the art according to the actual application scenario, and the embodiments of this application do not limit this.

[0262] In the above embodiments, the filter inductor is connected between the battery cell and the control component, and can be used to filter the state information of the battery cell. Since multiple chips are connected to some of the battery cells in the battery device, the control component encapsulated in each chip collects and processes the state information of the battery cells connected to the chip. In this way, compared with a single chip managing all the battery cells, the filtering requirements for the state information of the battery cells collected by each chip in the sampling circuit can be reduced, so as to support the selection of a smaller filter inductor. Furthermore, since the filter inductor is small in size, the filter inductor and the control component can be integrated together inside the chip. Under the protection of the chip package, the adverse effects of environmental factors such as moisture and conductive foreign objects on the filter inductor can be reduced, the aging rate of the filter inductor and the device failure rate can be reduced, thereby improving the reliability and stability of the battery device.

[0263] In some implementations, the filter inductor L can be positioned between the die 124 and the package frame 125 in the chip 12. Since, under the same filtering requirements, the inductor is typically larger than capacitors, resistors, and other devices, and the space required for integrating the inductor into the die is usually substantial, placing the filter inductor between the die and the package frame in the chip allows for easier integration of the filter inductor into the chip while reducing its aging rate and device failure rate, thus saving chip manufacturing costs.

[0264] In some embodiments, such as Figure 14 As shown, the following are also integrated on the die 124:

[0265] Power management component 126 is used to supply power to control component 123.

[0266] The power management component 126 can supply power to the control component 123 using the voltage of the highest-potential cell (i.e., the highest-position cell) among at least one cell 11 connected to the control component 123 as input. The power management component 126 may include a boost circuit and / or a buck circuit. If the input voltage is lower than the target operating voltage of the control component 123, the boost circuit can increase the input voltage to the target operating voltage. If the input voltage is higher than the target operating voltage of the control component 123, the buck circuit can decrease the input voltage to the target operating voltage.

[0267] In the above embodiments, since multiple chips are connected to portions of the battery cells in the battery device, a control component encapsulated in each chip is used to collect and process the status information of the cells to which the chip is connected. This reduces the power management capability requirements of the power management component in the sampling circuit compared to a single chip managing all cells, allowing for the selection of a smaller power management component. Furthermore, due to the small size of the power management component, it can be integrated with the control component within the chip. Protected by the chip package, the adverse effects of environmental factors on the power management component are reduced, decreasing its aging rate and failure rate, thereby improving the reliability and stability of the battery device and increasing the integration of the sampling circuit.

[0268] In some embodiments, see continue to see Figure 14 Chip 12 may also include:

[0269] The second component 127 is connected between the battery cell 11 and the power management component 126 and is used to eliminate interference signals superimposed on the input signal of the power management component 126.

[0270] Here, the input signals of the power management component 126 may include, but are not limited to, power input signals. When these signals enter the power management component 126, they may be superimposed with interference signals such as electrostatic discharge (ESD) signals and / or surge signals. The second component 127 can be used to absorb and / or discharge the interference signals superimposed on the signals entering the power management component 126, thereby eliminating the interference signals superimposed on the input signals of the power management component 126 and reducing the damage of interference signals to the power management component 126.

[0271] The second component 127 may include any suitable protective device, which is not limited in this embodiment. For example, the second component 127 may include, but is not limited to, at least one of anti-static circuits, surge protection circuits, etc.

[0272] In the above embodiments, since multiple chips are connected to portions of the battery cells in the battery device, a control component encapsulated in each chip is used to collect and process the status information of the connected cells. This reduces the protection requirements for the power management components in the sampling circuit compared to a single chip managing all cells, allowing for the selection of a smaller second component. Furthermore, due to the smaller size of the second component, it can be integrated with the control and first components within the chip. This reduces the adverse effects of environmental factors such as moisture and conductive foreign matter on the second component, slowing its aging rate and device failure rate, thereby improving the reliability and stability of the battery device. In addition, the reduced physical distance between the second component and the control and first components lowers the parasitic parameters of resistance, capacitance, and inductance, improving the protection capability of the second component and thus enhancing the stability of the sampling circuit.

[0273] In some embodiments, the second component 127 may be integrated on the die 124 and / or disposed between the package frame 125 and the die 124.

[0274] In some implementations, each device in the second component 127 may be integrated on the die 124.

[0275] In some embodiments, each device in the second component 127 may be packaged between the die 124 and the package frame 125, and connected to the power management component 126 integrated in the die 124 through the circuit lead 1241 of the die 124.

[0276] In some embodiments, some devices in the second component 127 may be integrated on the die 124, while other devices in the second component 127 may be disposed between the die 124 and the package frame 125. For example, the protection capacitor connected in parallel with the cell 11 in the second component 127 may be integrated on the die 124, and the protection diode connected in parallel with the cell 11 in the second component 127 may be disposed between the die 124 and the package frame 125.

[0277] In the above embodiments, by integrating a portion of the devices in the second component onto the die, the adverse effects of environmental factors on that portion of the devices in the second component can be reduced, thereby improving the reliability and stability of the sampling circuit and increasing the integration of the sampling circuit. By placing another portion of the devices in the second component between the package frame and the die, the die volume can be reduced, the die formation process can be simplified, and compared to integrating all the devices in the second component onto the die, placing some devices between the package frame and the die can improve the chip's heat dissipation performance and facilitate the adjustment of the protection capability of the second component, thereby adapting to different application scenarios.

[0278] In some embodiments, such as Figure 15As shown, the second component 127 may include:

[0279] The third protection capacitor C13 has one end connected between the positive terminal of the target cell and the voltage input terminal of the power management component 126, and the other end grounded, in order to eliminate the surge interference signal superimposed on the input signal of the power management component 126.

[0280] Among them, the target cell is the one with the highest potential among all the cells 11 connected to the chip 12 to which the third protection capacitor C13 belongs.

[0281] Here, by connecting one end of the third protection capacitor C13 between the positive terminal of the target battery cell and the voltage input terminal of the power management component 126, and grounding the other end of the third protection capacitor C13, the third protection capacitor C13 can be used to absorb and / or discharge the ground surge of the target battery cell connected to the power management component 126, thereby reducing the damage of surge interference signals to the power management component 126.

[0282] The selection of the third protective capacitor C13 can be predetermined by those skilled in the art based on the actual application scenario, and this application embodiment does not limit this.

[0283] In the above embodiments, since multiple chips are connected to portions of the battery cells in the battery device, control components encapsulated in each chip are used to collect and process the status information of the cells to which the chip is connected. This reduces the surge protection requirements of the power management components in the sampling circuit compared to a single chip managing all cells, allowing for the selection of a smaller third protection capacitor. Furthermore, due to the small size of the third protection capacitor, the third protection resistor and control components can be integrated together inside the chip. Protected by the chip's encapsulation, the adverse effects of environmental factors such as moisture and conductive foreign matter on the third protection capacitor are reduced, decreasing its aging rate and device failure rate, thereby improving the reliability and stability of the battery device.

[0284] In some embodiments, the third protection capacitor C13 can be integrated on the die 124 in the chip 12. This can further improve the chip integration, and by integrating the third protection capacitor and the control components together on the die inside the package, the adverse effects of environmental factors on the third protection capacitor can be reduced, the physical distance between the control components and the third protection capacitor can be reduced, the parasitic parameters of resistance, capacitance, and inductance can be reduced, and the protection capability of the third protection capacitor can be improved.

[0285] In some implementations, the third protection capacitor C13 can be integrated between the die 124 and the package frame 125 in the chip 12. This facilitates matching the model and specifications of the first protection capacitor according to different application scenarios.

[0286] In some embodiments, such as Figure 16 As shown, the second component 127 may include:

[0287] The second protection diode Z2 is connected between the battery cell 11 and the power management component 126 to eliminate the interference signal superimposed on the input signal of the power management component 126, thereby protecting the power management component 126.

[0288] The selection of the second protection diode Z2 can be predetermined by those skilled in the art based on the actual application scenario, and this application embodiment does not limit this.

[0289] In some implementations, the second protection diode Z2 can eliminate interference signals superimposed on the input signal of the power management component 126 by absorption and / or discharge.

[0290] In some implementations, the second protection diode Z2 may include, but is not limited to, a TVS diode.

[0291] In the above embodiments, since multiple chips are connected to portions of the battery cells in the battery device, a control component encapsulated in each chip is used to collect and process the status information of the cells connected to the chip. This reduces the surge protection requirements of the power management components in the sampling circuit compared to a single chip managing all cells, allowing for the selection of a smaller second protection diode. Furthermore, due to the smaller size of the second protection diode, it can be integrated with the control component and the first component into the chip. Protected by the chip's encapsulation, the adverse effects of environmental factors such as moisture and conductive foreign matter on the second protection diode are reduced, decreasing its aging rate and device failure rate, thereby improving the reliability and stability of the battery device.

[0292] In some embodiments, the second protection diode Z2 can be disposed between the die 124 and the package frame 125 in the chip 12. Thus, since diodes are typically larger than capacitors and resistors under the same protection requirements, and the space required for integrating a diode into the die is usually large, disposing the second protection diode between the die and the package frame in the chip facilitates its integration into the chip while reducing its aging rate and device failure rate, thereby saving chip manufacturing costs.

[0293] In some embodiments, such as Figure 17 As shown, the battery device 100 may further include:

[0294] Each cell 11 is respectively equipped with an equalization switch K1, an equalization resistor R2, and a second filter capacitor C22;

[0295] Each cell 11 is connected in series with the corresponding equalization switch K1 and the corresponding equalization resistor R2;

[0296] The second filter capacitor C22 corresponding to each cell is connected in parallel with the corresponding equalization switch K1 to filter out the noise at both ends of the corresponding equalization switch K1;

[0297] The control component 123 is used to control the closing of the equalization switch K1 corresponding to the battery cell 11, thereby connecting the circuit between the battery cell 11 and the corresponding equalization resistor R2.

[0298] Here, the equalization switch K1, the equalization resistor R2, and the second filter capacitor C22 can all be integrated on the die 124 inside the chip 12, or between the die 124 and the package frame 125, or they can be disposed outside the chip 12. This application embodiment does not limit this.

[0299] When the equalization switch corresponding to the battery cell is closed, the battery cell and the corresponding equalization resistor form a series circuit. The equalization resistor can consume the battery cell's electrical energy, causing the battery cell's voltage to drop.

[0300] It is understandable that when the equalizing switch K1 corresponding to cell 11 is open, no circuit is formed between the equalizing resistor R2 and cell 11. The status information of cell 11, after interference signal elimination by the first component 11, is transmitted to the control component 123 as the input signal. When the voltage difference between the multiple cells 11 connected to the control component 123 is too large, or when the voltage difference between at least one cell 11 connected to the control component 123 and the cells 11 connected to other chips 12 is too large, the control component 123 can control the equalizing switch K1 corresponding to at least one cell 11 with a higher voltage to close, so as to conduct the at least one cell 11. The circuit between each battery cell 11 and its corresponding equalization resistor R2 is established, thereby consuming the electrical energy of the battery cell 11 through the equalization resistor R2, causing the voltage of the battery cell 11 to drop, thus reducing or eliminating the voltage difference between the battery cells 11. At this time, the status information of the battery cell 11 continues to be transmitted to the control component 123 as an input signal after the first component 11 eliminates interference signals. When the voltage difference between at least one battery cell 11 and other battery cells is less than a preset voltage difference threshold, the control component 123 can control the equalization switch K1 corresponding to the at least one battery cell 11 to open, thereby breaking the circuit between the at least one battery cell 11 and its corresponding equalization resistor R2. For example, the battery management unit can receive the voltage of each battery cell 11 transmitted by the control component 123, determine the battery cell 11 to be equalized based on the voltage of each battery cell 11, and control the equalization switch K1 corresponding to the battery cell 11 to be equalized to close through the control component 123.

[0301] It should be noted that the specifications of the equalization switch K1, the equalization resistor R2, and the second filter capacitor C22 can be flexibly selected by those skilled in the art according to the actual situation, and this application embodiment does not limit this.

[0302] In the above embodiments, on the one hand, when the equalization switch corresponding to a battery cell is closed, the battery cell and the corresponding equalization resistor form a circuit, which can dissipate the battery cell's electrical energy, causing the battery cell's voltage to drop; on the other hand, by setting a second filter capacitor corresponding to each battery cell in parallel with the corresponding equalization switch, the second filter capacitor can be used to filter out noise at both ends of the corresponding equalization switch, reducing the probability of false triggering of the equalization switch. In this way, relatively accurate equalization control of each battery cell can be achieved.

[0303] In some embodiments, the equalization switch K1, equalization resistor R2, and second filter capacitor C22 are all disposed inside chip 12. Thus, since multiple chips are connected to portions of the battery cells in the battery device, the control components packaged in each chip collect and process the status information of the cells connected to the chip. Compared to a single chip managing all cells, this reduces the equalization requirements for the cells, allowing for the selection of smaller equalization switches and resistors. Furthermore, reduced noise at the equalization switches reduces the need for noise filtering at those terminals, enabling the selection of a smaller second filter capacitor. Moreover, due to the small size of the equalization switch, equalization resistor, and second filter capacitor, the equalization switch, equalization resistor, second filter capacitor, and control components can be integrated within the chip. Protected by the chip package, the adverse effects of environmental factors such as moisture and conductive foreign matter on the equalization switch, equalization resistor, and second filter capacitor are reduced, decreasing the aging rate and failure rate of the equalization switch, equalization resistor, and second filter capacitor, thereby improving the reliability and stability of the battery device.

[0304] In some embodiments, the equalization switch K1 and the second filter capacitor C22 are integrated on the die 124, and the equalization resistor R2 is disposed between the package frame 125 and the die 124.

[0305] In the above embodiments, by integrating the equalization switch and the second filter capacitor onto the die, the adverse effects of environmental factors on the equalization switch and the second filter capacitor can be reduced, thereby improving the reliability and stability of the sampling circuit and increasing the integration level of the sampling circuit. Furthermore, since the equalization resistor generates heat during the process of consuming the battery cell's electrical energy, placing the equalization resistor between the package frame and the die can reduce heat generation inside the die, thereby slowing down the chip aging process and improving the accuracy of the battery cell's status information acquisition.

[0306] In some embodiments, the second filter capacitor C22 is integrated on the die 124 and / or disposed between the package frame 125 and the die 124.

[0307] In the above embodiments, by integrating the second filter capacitor on the die, the adverse effects of environmental factors on the second filter capacitor can be further reduced, thereby further improving the reliability and stability of the sampling circuit and further improving the integration of the sampling circuit. By placing the second filter capacitor between the package frame and the die, the die forming process can be simplified, the heat dissipation performance of the chip can be improved, and the filtering capability of the second filter capacitor can be easily adjusted to adapt to different application scenarios.

[0308] In some embodiments, such as Figure 18 As shown, the equalizing resistor R2 is set between chip 12 and the corresponding cell 11.

[0309] In the above embodiments, since the equalizing resistor generates heat during the process of consuming the battery cell's electrical energy, by placing the equalizing resistor between the chip and the corresponding battery cell, the internal heat generation of the chip can be reduced, the chip aging speed can be slowed down, and the accuracy of the battery cell's status information acquisition can be improved.

[0310] In some embodiments, such as Figure 19 As shown, the battery device 100 may further include:

[0311] Sampling line 15 is connected between chip 12 and the corresponding battery cell 11;

[0312] Circuit board 16 is used to carry chip 12 and sampling line 15 so that chip 12 is connected to at least one cell 11 through sampling line 15.

[0313] The circuit board 16 may include, but is not limited to, at least one of the following: printed circuit board (PCB), flexible printed circuit (FPC), flexible die-cutting circuit (FDC).

[0314] In some implementations, the sampling line 15 may include metal traces disposed in the circuit board 16.

[0315] In some embodiments, the battery device 100 may include a circuit board 16, on which multiple chips 12 and sampling lines 15 corresponding to the chips 12 may be mounted.

[0316] In some embodiments, the battery device 100 may include a plurality of circuit boards 16, each circuit board 16 being used to carry at least one chip 12 and a sampling line 15 corresponding to the chip 12.

[0317] In some implementations, the chip 12 carried on the circuit board 16 can be electrically connected to the sampling line 15 in the circuit board 16 via pins, so as to connect at least one battery cell 11 via the sampling line 15.

[0318] In some embodiments, the battery device 100 may further include a protective layer 17; the protective layer 17 covers the chip 12, the sampling line 15, and the circuit board 16. The protective layer can be formed of any suitable protective material, and this application embodiment does not limit this.

[0319] In some embodiments, the protective layer may include conformal coating. Conformal coating can prevent moisture, dust, and corrosion. In addition, conformal coating also has insulating properties. By coating the chip 12, sampling line 15, and circuit board 16 with conformal coating, the possibility of short circuits caused by solder slag, solder whiskers, etc., can be reduced, and the heat dissipation of the device can be accelerated.

[0320] In the above embodiments, by mounting the chip and sampling circuit on a circuit board, the connection between the chip and the sampling circuit can be made more stable, thereby improving the stability of cell status information acquisition and thus improving the reliability and stability of the battery device.

[0321] In some embodiments, circuit board 16 may include one of the following: a flexible circuit board, or a flexible die-cut circuit board. This allows the sampling lines in the flexible circuit board to be directly soldered to the positive and negative electrodes of the battery cell without the need for additional connectors. Therefore, the parasitic parameters generated by the sampling lines can be further reduced, thereby further reducing the parameter requirements for protection and / or filtering devices in the sampling circuit. This supports the selection of device parameters for a smaller first component, thus better supporting the integration of the first component and control components within the chip, further reducing the volume occupied by the first component within the chip. Furthermore, using flexible circuit boards and / or flexible die-cut circuit boards facilitates circuit board thinning. The circuit board is flexible and bendable, supports three-dimensional wiring, offers high design freedom, and also avoids the use of connectors. Moreover, flexible circuit boards are more resistant to battery cell expansion stress, have simpler manufacturing processes, and do not require additional connectors in the soldering process, reducing soldering steps.

[0322] In some implementations, the circuit board is a single-layer circuit board. This reduces the hardware cost of the sampling circuit and simplifies the manufacturing process.

[0323] In some embodiments, see continue to see Figure 19 Each chip 12 connects to multiple battery cells 11;

[0324] In the sampling line 15 between chip 12 and the multiple connected battery cells 11, the difference between the trace lengths of any two sampling lines 15 is within the target difference range.

[0325] Here, the target difference range can be determined based on the actual situation, and can characterize the difference range that makes the trace length of the sampling line between chip 12 and any two connected cells tend to be consistent. For example, the target difference range can be 0 or a small range of values ​​including 0.

[0326] In the above embodiments, by setting the difference in the trace length of the sampling line between the chip and any two connected battery cells to be within the target difference range, the trace length of the sampling line between the chip and each connected battery cell can be made consistent. This makes the parasitic parameters (such as parasitic capacitance, parasitic resistance, and / or parasitic inductance, etc.) between the electrical signal acquisition points (positive electrode and / or negative electrode) of the chip and each connected battery cell more consistent, thereby making the acquired battery cell status information more reliable.

[0327] In some embodiments, chip 12 is disposed between battery cell 11 and circuit board 16.

[0328] It is understandable that the chip 12 is disposed on the end face 11a of the battery cell 11 near the circuit board 16, so that the chip 12 is located between the battery cell 11 and the circuit board 16.

[0329] In the above embodiments, by placing the chip between the battery cell and the circuit board, the battery cell and the circuit board can jointly protect the chip to a certain extent, thereby reducing the adverse effects of environmental factors such as moisture and conductive foreign objects on the chip, thus reducing the aging rate and failure rate of the components in the chip, and improving the reliability and stability of the battery device.

[0330] In some embodiments, each chip 12 may be located on the end face of at least one connected cell 11 where a positive electrode and / or a negative electrode is provided.

[0331] For example, for prismatic cells, the positive and negative electrodes are usually disposed on the same end face. Chip 12 can be disposed on the end face of at least one prismatic cell to which the positive and negative electrodes are disposed.

[0332] For example, in cylindrical cells, the positive and negative electrodes are usually located on opposite end faces. Chip 12 can be located on the end face of at least one connected cylindrical cell where the positive or negative electrode is located.

[0333] For example, in blade cells, the positive and negative electrodes are usually located on opposite end faces. Chip 12 can be located on the end face of at least one connected blade cell where the positive or negative electrode is located.

[0334] In the above embodiments, each chip and at least one connected battery cell are provided with end face contact of positive and / or negative electrodes, which can shorten the length of the sampling line between the chip and the positive and / or negative electrodes of the battery cell, thereby reducing the parasitic parameters on the corresponding sampling line. In this way, the device parameter requirements for protection and / or filtering in the sampling circuit can be further reduced to support the selection of device parameters for a smaller first component, thereby better supporting the integration of the first component and the control component inside the chip, and further reducing the volume occupied by the first component inside the chip.

[0335] In some embodiments, such as Figure 20 As shown, the positive electrode 111 and the negative electrode 112 of the battery cell 11 are disposed on the same end face 11a, and the chip 12 is disposed on the end face 11a.

[0336] The chip 12 can be installed at any suitable position on the end face 11a of the battery cell 11 where the positive electrode 111 and the negative electrode 112 are provided, and this application embodiment does not limit this.

[0337] In some embodiments, the cell 11 includes a prismatic cell, with each chip 12 located on the end face 11a of at least one prismatic cell to which a positive electrode 111 and a negative electrode 112 are disposed.

[0338] In the above embodiments, since the positive and negative electrodes of the battery cell are located on the same end face, the length of the sampling lines between the chip and the positive and negative electrodes of the battery cell can be shortened, thereby reducing the parasitic parameters on the corresponding sampling lines. Because the parasitic parameters of the sampling lines are relatively small, the parameter requirements of the protection devices in the sampling circuit can be reduced, allowing for the selection of smaller protection devices and their integration within the chip, thus reducing the volume occupied by the first component within the chip.

[0339] In some embodiments, see continue to see Figure 20 The chip 12 is disposed between the positive electrode 111 and the negative electrode 112 of the corresponding cell 11.

[0340] Here, the chip 12 can be placed at any suitable position between the positive electrode and the negative electrode of the corresponding cell 11, and this embodiment does not limit this.

[0341] In the above embodiments, by placing the chip between the positive and negative electrodes of the corresponding battery cell, the length of the sampling lines between the chip and the positive and negative electrodes of the battery cell can be made more moderate, thereby reducing the parasitic parameters on the corresponding sampling lines of the positive and negative electrodes of the battery cell to a certain extent. In this way, the parameter requirements of the protection device in the sampling circuit of the battery cell can be reduced, so as to support the selection of smaller protection devices and reduce the volume occupied by the first component inside the chip.

[0342] In some embodiments, the chip 12 can be mounted on the end face 11a of the battery cell 11 where the positive and negative electrodes are located, and positioned at the midpoint between the positive and negative electrodes of the corresponding battery cell 11. This makes the sampling line length between the chip and the positive and negative electrodes of the battery cell more consistent, thereby making the parasitic parameters generated on the sampling line between the chip and the positive and negative electrodes of the battery cell more consistent, and thus making the collected battery cell status information more reliable.

[0343] In some embodiments, such as Figure 21As shown, a positive electrode 111 is provided on the first end face 11a1 of the battery cell 11, and a negative electrode 112 is provided on the second end face 11a2 of the battery cell. The first end face 11a1 and the second end face 11a2 are arranged opposite to each other. The third end face 11a3 of the battery cell 11 is adjacent to the first end face 11a1 and the second end face 11a2, and the chip 12 is disposed on the third end face 11a3.

[0344] Here, the chip 12 can be set at any suitable position on the third end face 11a3 of the corresponding cell 11, and this embodiment does not limit this.

[0345] In some embodiments, the cell 11 includes a cylindrical cell, the third end face 11a3 includes the side surface of the cylindrical cell, and each chip 12 is disposed on the side surface of at least one connected cylindrical cell.

[0346] In some embodiments, the battery cell 11 includes a blade battery cell, a first end face 11a1 of which is provided with a positive electrode, a second end face 11a2 of which is provided with a negative electrode, the first end face 11a1 and the second end face 11a2 being disposed opposite to each other, and each chip 12 being disposed on the third end face 11a3 of at least one connected blade battery cell.

[0347] In the above embodiments, since the third end face of the battery cell is adjacent to the first end face where the positive electrode is provided and the second end face where the negative electrode is provided, by placing the chip on the third end face of the battery cell, the length of the sampling line between the chip and the positive and negative electrodes of the battery cell can be made more moderate. This can reduce the parasitic parameters on the corresponding sampling lines of the positive and negative electrodes of the battery cell to a certain extent. In this way, the parameter requirements of the protection device in the sampling circuit of the battery cell can be reduced, so as to support the selection of smaller protection devices and integrate the protection devices inside the chip, thereby reducing the volume occupied by the first component inside the chip.

[0348] In some embodiments, the chip 12 can be disposed on the third end face 11a3 of the battery cell 11 at a position equidistant from or approximately equidistant from the positive and negative electrodes of the battery cell 11. This makes the sampling line length between the chip and the positive and negative electrodes of the battery cell more consistent, thereby making the parasitic parameters generated on the sampling line between the chip and the positive and negative electrodes of the battery cell more consistent, and thus making the collected state information of the battery cell more reliable.

[0349] In some embodiments, such as Figure 22 As shown, a positive electrode 111 is provided on the end face 11a of the battery cell 11. The end face 11a is negatively charged, and the chip 12 is disposed on the end face 11a.

[0350] Here, the chip 12 can be set at any suitable position on the end face 11a of the corresponding cell 11, and this embodiment does not limit this.

[0351] In some embodiments, the battery cell 11 includes a blade battery cell with a negatively charged end face 11a and a positive electrode 111 disposed thereon. The chip 12 may be disposed on the end face 11a of the blade battery cell.

[0352] In the above embodiments, since the positive electrode of the battery cell is located on the negatively charged end face, by placing the chip on this end face, the length of the sampling lines used by the chip to collect the positive and negative electrical signals of the battery cell can be moderate. This reduces the parasitic parameters on the corresponding sampling lines of the positive and negative electrical signals of the battery cell to a certain extent. In this way, the parameter requirements of the protection device in the sampling circuit of the battery cell can be reduced, so as to support the selection of smaller protection devices and integrate the protection devices inside the chip, thereby reducing the volume occupied by the first component inside the chip.

[0353] In some embodiments, the chip 12 can be disposed on the end face 11a of the battery cell 11 near the positive electrode. This allows for shorter sampling lines between the chip and the positive and negative electrodes of the battery cell, thereby reducing parasitic parameters on the corresponding sampling lines of the positive and negative electrodes. This reduces the parameter requirements of the protection devices in the sampling circuit of the battery cell, allowing for the selection of smaller protection devices and reducing the volume occupied by the first component inside the chip.

[0354] In some embodiments, such as Figure 23 As shown, a negative electrode 112 is provided on the end face 11a of the battery cell 11. The end face 11a is positively charged, and the chip 12 is disposed on the end face 11a.

[0355] Here, the chip 12 can be set at any suitable position on the end face 11a of the corresponding cell 11, and this embodiment does not limit this.

[0356] In some embodiments, the battery cell 11 includes a blade battery cell with a positively charged end face 11a and a negative electrode 112 disposed thereon. The chip 12 may be disposed on the end face 11a of the blade battery cell.

[0357] In the above embodiments, since the negative electrode of the battery cell is located on the positively charged end face, by placing the chip on this end face, the length of the sampling lines used by the chip to collect the positive and negative electrical signals of the battery cell can be moderate. This reduces the parasitic parameters on the corresponding sampling lines of the positive and negative electrical signals of the battery cell to a certain extent. In this way, the parameter requirements of the protection device in the sampling circuit of the battery cell can be reduced, so as to support the selection of smaller protection devices and integrate the protection devices inside the chip, thereby reducing the volume occupied by the first component inside the chip.

[0358] In some embodiments, the chip 12 can be disposed on the end face 11a of the battery cell 11 near the negative electrode. This allows for shorter sampling lines between the chip and the positive and negative electrodes of the battery cell, thereby reducing parasitic parameters on the corresponding sampling lines of the positive and negative electrodes. This reduces the parameter requirements of the protection devices in the sampling circuit of the battery cell, allowing for the selection of smaller protection devices and reducing the volume occupied by the first component inside the chip.

[0359] This application provides an embodiment of an electrical device, such as... Figure 24 As shown, the electrical device 200 includes the battery device 100 described in the above embodiments.

[0360] Here, electrical equipment can be any electrical equipment, including but not limited to automobiles, airplanes, electric bicycles, electric motorcycles, electric boats, and / or ships.

[0361] It should be noted that the descriptions of the various embodiments above tend to emphasize the differences between them, while their similarities or commonalities can be referred to interchangeably. The descriptions of the electrical equipment embodiments above are similar to those of the battery device embodiments above, and have similar beneficial effects. For technical details not disclosed in the electrical equipment embodiments of this application, please refer to the descriptions of the battery device embodiments of this application for understanding.

[0362] It should be understood that in the description of this application, the reference to terms such as "in one embodiment," "in some embodiments," "in other embodiments," "yet another embodiment," "in some implementations," "in other implementations," or "exemplary," etc., refers to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the embodiments of this application. In this application, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Furthermore, without contradiction, those skilled in the art can combine the different embodiments or examples described in this application, as well as the features of the different embodiments or examples.

[0363] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0364] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and devices can be implemented in other ways. The apparatus and device embodiments described above are merely illustrative. For example, the division of units is only a logical functional division, and in actual implementation, there may be other division methods, such as: multiple units or components may be combined, or integrated into another system, or some features may be ignored or not executed. In addition, the coupling, direct coupling, or communication connection between the various components shown or discussed may be through some interfaces, and the indirect coupling or communication connection between devices or units may be electrical, mechanical, or other forms.

[0365] The above are merely exemplary embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application are included within the protection scope of this application.

Claims

1. A battery device, characterized in that, include: Multiple battery cells; Multiple chips, each chip being connected to a portion of the multiple battery cells, the chip being disposed on the end face of at least one of the battery cells, each chip including a package housing for accommodating a first component and a control component; The control component is used to collect and process the status information of the battery cell; The first component, connected between the battery cell and the control component, includes a protection component for eliminating interference signals superimposed on the input signal of the control component.

2. The battery device according to claim 1, characterized by The chip also includes: The die is encapsulated inside the package housing and is used to integrate the control components.

3. The battery device of claim 2, wherein Each of the chips also includes: A packaging frame, disposed on the packaging housing, is used to connect the circuit leads of the die and the pins of the chip.

4. The battery device of claim 3, wherein A portion of the devices in the first component are integrated on the die, while another portion of the devices in the first component are disposed between the packaging frame and the die.

5. The battery device according to claim 3 or 4, characterized by The protective components include: A first protective capacitor is provided corresponding to each of the battery cells. The first protective capacitor is connected in parallel with the corresponding battery cell. The connection point between the first protective capacitor and the corresponding battery cell is located at the connection end between the battery cell and the control component, close to the battery cell. The first protective capacitor is used to eliminate surge interference signals generated at both ends of the corresponding battery cell.

6. The battery device of claim 5, wherein The first protective capacitor is integrated on the die.

7. The battery device according to any one of claims 3 to 6, characterized by, The protective components include: A second protective capacitor is provided corresponding to each of the battery cells. The second protective capacitor is connected in parallel with the corresponding battery cell. The connection point between the second protective capacitor and the corresponding battery cell is located at the connection end between the battery cell and the control component, close to the control component. The second protective capacitor is used to clamp the input signal of the control component below the target voltage.

8. The battery device of claim 7, wherein, The second protective capacitor is integrated on the die.

9. The battery device according to any one of claims 3 to 8, characterized by, The protective components include: A first protection diode is connected between the battery cell and the control component to eliminate interference signals superimposed on the input signal of the control component, thereby protecting the control component.

10. The battery device according to claim 9, characterized in that, The first protective diode is disposed between the package frame and the die.

11. The battery device according to any one of claims 3 to 10, characterized by, The first component also includes: A filtering component is connected between the battery cell and the control component to filter the status information of the battery cell and transmit the filtered status information to the control component.

12. The battery device of claim 11, wherein, The filtering component includes: A first filter capacitor is provided corresponding to each of the battery cells. One end of the first filter capacitor is connected between the positive terminal of the corresponding battery cell and the control component, and the other end of the first filter capacitor is grounded.

13. The battery device of claim 12, wherein, The first filter capacitor is integrated on the die.

14. The battery device according to any one of claims 11 to 13, characterized by, The filtering component includes: A first filter capacitor is respectively provided for each of the battery cells; A filter resistor is provided corresponding to each of the battery cells. One end of the filter resistor is connected to the positive terminal of the corresponding battery cell, and the other end of the filter resistor is connected to the control component and grounded through the first filter capacitor.

15. The battery device of claim 14, wherein, The first filter capacitor and the filter resistor are both integrated on the die.

16. The battery device according to any one of claims 11 to 15, characterized by, The filtering component includes: A filter inductor is connected between the battery cell and the control component to filter the status information of the battery cell.

17. The battery device of claim 16, wherein, The filter inductor is disposed between the package frame and the die.

18. The battery device of any one of claims 3-17, wherein, The grain also integrates: A power management component for supplying power to the control component.

19. The battery device of claim 18, wherein, The chip also includes: The second component is connected between the battery cell and the power management component to eliminate interference signals superimposed on the input signal of the power management component.

20. The battery device of claim 19, wherein, A portion of the devices in the second component are integrated on the die, while another portion of the devices in the second component are disposed between the packaging frame and the die.

21. The battery device according to claim 19 or 20, characterized by The second component includes: The third protection capacitor has one end connected between the positive terminal of the target battery cell and the voltage input terminal of the power management component, and the other end grounded, in order to eliminate surge interference signals superimposed on the input signal of the power management component. The target cell is the cell with the highest potential among all the cells connected to the chip to which the third protective capacitor belongs.

22. The battery device of claim 21, wherein, The third protective capacitor is integrated on the die.

23. The battery device of any one of claims 19-22, wherein, The second component includes: The second protection diode is connected between the battery cell and the power management component to eliminate interference signals superimposed on the input signal of the power management component, thereby protecting the power management component.

24. The battery device of claim 23, wherein, The second protection diode is disposed between the package frame and the die.

25. The battery device of any one of claims 3-24, wherein, The battery device also includes: Each of the aforementioned cells is respectively equipped with an equalization switch, an equalization resistor, and a second filter capacitor; Each of the aforementioned cells is connected in series with a corresponding equalization switch and a corresponding equalization resistor; The second filter capacitor corresponding to each of the battery cells is connected in parallel with the corresponding equalization switch to filter out the noise at both ends of the corresponding equalization switch; The control component is used to control the closing of the equalization switch corresponding to the battery cell, thereby connecting the battery cell and the corresponding equalization resistor.

26. The battery device of claim 25, wherein, The equalization switch and the second filter capacitor are integrated on the die, and the equalization resistor is disposed between the package frame and the die.

27. The battery device of any one of claims 1-26, wherein, The battery device also includes: A sampling circuit is connected between the chip and the corresponding battery cell; A circuit board for carrying the chip and the sampling line, so that the chip is connected to at least one of the battery cells through the sampling line.

28. The battery device of claim 27, wherein, Each of the chips is connected to multiple of the battery cells; In the sampling lines between the chip and the multiple connected battery cells, the difference between the trace lengths of any two sampling lines is within the target difference range.

29. The battery device according to claim 27 or 28, characterized in that, The chip is disposed between the battery cell and the circuit board.

30. The battery device of any one of claims 1-29, wherein, The positive and negative electrodes of the battery cell are disposed on the same end face, and the chip is disposed on the end face.

31. The battery device of claim 30, wherein, The chip is disposed between the positive electrode and the negative electrode of the corresponding battery cell.

32. The battery device according to any one of claims 1 to 31, characterized in that, The first end face of the battery cell is provided with a positive electrode, the second end face of the battery cell is provided with a negative electrode, the first end face and the second end face are disposed opposite each other, the third end face of the battery cell is adjacent to the first end face and the second end face, and the chip is disposed on the third end face.

33. The battery device according to any one of claims 1 to 32, characterized in that, The end face of the battery cell is provided with a positive electrode and is negatively charged, and the chip is disposed on the end face.

34. The battery device according to any one of claims 1 to 33, characterized in that, The end face of the battery cell is provided with a negative electrode and is positively charged. The chip is disposed on the end face.

35. An electrical appliance, characterized in that, The electrical equipment includes the battery device according to any one of claims 1 to 34.

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