An ultra-thin connection structure for connecting wires and circuit boards and an electronic product

Abstract

This utility model relates to the field of connecting wires and circuit boards, specifically to an ultra-thin connection structure and electronic product for connecting wires and circuit boards. The ultra-thin connection structure includes a female terminal and a male terminal. The female terminal includes a constraint shell connected to the circuit board and covering the pads on the circuit board. The male terminal includes a metal plate, wires soldered to the metal plate, and an adhesive coating on the metal plate. The metal plate has exposed conductive portions exposed outside the adhesive coating. After the male terminal is inserted into the female terminal, the constraint shell constrains the adhesive coating, and the exposed conductive portions are in electrical contact with the pads. This utility model reduces the height of the female and male terminals, resulting in an ultra-thin connection structure and significantly saving installation space occupied by the circuit board in terms of thickness.

Description

Technical Field

[0001] This utility model relates to the field of connecting wires and circuit boards, specifically to an ultra-thin connection structure and electronic product for connecting wires and circuit boards. Background Technology

[0002] In applications where circuit boards are electrically connected to external cables, board-end connectors (usually referred to as "female connectors") are crucial components. Currently widely used board-end connectors typically consist of metal terminals and a plastic insulating body. The assembly process usually involves first inserting and securing the metal terminals into the plastic insulating body to form the connector body (female connector). Then, this assembled connector body is soldered to the corresponding pads on the PCB board via the solder pads of its metal terminals. This layered stacking structure of "terminal -> plastic body -> PCB" inherently accumulates a certain height in the Z-axis direction.

[0003] Furthermore, the male end of the external cable connection usually adopts a pin structure. In order to achieve reliable insertion and removal and electrical contact, the male pin needs a certain insertion depth and mating length, which also requires the board end connector (female end) to provide sufficient accommodation space in the Z-axis direction.

[0004] The aforementioned traditional board-end connector (female) and male connection method results in a significant increase in the overall Z-axis height (thickness) of the board-end connector (female) and its assembly with the circuit board. This excessively tall connector occupies a large amount of vertical space above the PCB, forcing the device casing or internal structural components to have larger gaps in the thickness direction. This directly makes it difficult to reduce the overall thickness of the product. Furthermore, excessively tall connectors may limit the optimization of circuit board layout or internal device structure. This runs counter to the core demand for the continuous development of thinner and smaller electronic products.

[0005] Therefore, there is an urgent need to design a structure to connect wires and circuit boards in order to solve the above-mentioned technical problems. Summary of the Invention

[0006] The technical problem to be solved by this utility model is to overcome the defects of the prior art and provide an ultra-thin connection structure for connecting wires and circuit boards. It reduces the height of the female and male ends, resulting in an ultra-thin connection structure, which greatly saves the installation space occupied by the circuit board in terms of thickness.

[0007] To solve the above-mentioned technical problems, the technical solution of this utility model is: an ultra-thin connection structure for connecting wires and circuit boards, comprising: The female end includes a constraint shell that is connected to the circuit board and covers the pads of the circuit board; The male terminal includes a metal plate, a wire welded to the metal plate, and an adhesive-coated portion covering the outside of the metal plate, wherein the metal plate has an exposed conductive portion exposed outside the adhesive-coated portion; wherein, After the male end is inserted into the female end, the constraint shell constrains the encapsulated portion, and the exposed conductive portion makes electrical contact with the solder pad.

[0008] Furthermore, the constraint shell is an iron shell, which is welded to the circuit board.

[0009] Furthermore, to prevent external moisture from entering the interior, the rubber-coated part is provided with a sealing lip that protrudes outward and seals against the peripheral wall of the female end at a position closer to the insertion port of the female end than the exposed conductive part.

[0010] Furthermore, to improve the waterproof effect, the sealing lip has at least two lip flaps spaced apart along the insertion direction of the overmolded portion.

[0011] Furthermore, to ensure that the exposed conductive part can contact the solder pad, the exposed conductive part is a protrusion that extends beyond the overmolded part.

[0012] Furthermore, in order to provide reverse pressure and ensure stable contact between the exposed conductive part and the pad, the side of the encapsulated part away from the exposed conductive part has an abutting part that protrudes from it and abuts against the inner wall of the constraint shell.

[0013] To further improve the holding force between the rubber-coated part and the constraint shell, and to facilitate insertion and removal, the rubber-coated part is provided with a snap fastener that cooperates with the constraint shell.

[0014] Furthermore, the solder pads are gold fingers.

[0015] This utility model also includes an electronic product, comprising the aforementioned ultra-thin connection structure for connecting wires and circuit boards.

[0016] By adopting the above technical solution, the constraint shell is directly connected to the circuit board. Compared with the traditional process (terminals are first inserted into plastic for fixation, and then the terminal pins are soldered to the PCB), the height of the female end can be significantly reduced. The metal plate of the male end is soldered to the wire and then encapsulated with adhesive, which also significantly reduces the height compared to the traditional pin structure. In this invention, the height of both the female and male ends is reduced. After insertion, the metal plate of the male end contacts and conducts electricity with the solder pads of the circuit board, resulting in an ultra-thin connection structure. This significantly saves the installation space occupied by the circuit board in terms of thickness, allowing products using this circuit board to be thinner. This invention meets the urgent demand for ultra-thin and lightweight modern electronic devices while ensuring the electrical performance, mechanical strength, and reliability of the connection. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of this utility model before the male end is inserted into the female end; Figure 2 for Figure 1 Exploded view; Figure 3 This is a schematic diagram of the circuit board structure of this utility model; Figure 4 This is a schematic diagram of the structure of the metal plate and wire after welding according to this utility model; Figure 5 This is a schematic diagram of the male end of the present invention; Figure 6 for Figure 5 Side view; Figure 7 This is a schematic diagram of the structure of this utility model after the male end is inserted into the female end; Figure 8 for Figure 7 AA section view; Figure 9 for Figure 8 A magnified view of a portion; Figure 10 for Figure 8 Another enlarged view of a portion; In the diagram, 1 is the female end; 11 is the circuit board; 111 is the solder pad; 112 is the U-shaped soldering area; 12 is the constraint shell; 121 is the card interface; 2 is the male end; 21 is the metal plate; 211 is the exposed conductive part; 22 is the wire; 23 is the encapsulated part; 231 is the sealing lip; 232 is the abutment part; and 233 is the buckle. Detailed Implementation

[0018] To make the contents of this utility model easier to understand, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0019] Example 1

[0020] like Figures 1 to 10 As shown, an ultra-thin connection structure for connecting wires and a circuit board includes: The female end 1 includes a constraint shell 12 connected to the circuit board 11 and covering the pads 111 of the circuit board 11; Male terminal 2 includes a metal plate 21, a wire 22 soldered to the metal plate 21, and an adhesive-coated portion 23 covering the outside of the metal plate 21. The metal plate 21 has an exposed conductive portion 211 exposed outside the adhesive-coated portion 23; wherein, After the male terminal 2 is inserted into the female terminal 1, the constraint shell 12 constrains the rubber-coated part 23, and the exposed conductive part 211 makes electrical contact with the solder pad 111.

[0021] The constraint housing 12 and the circuit board 11 it covers together form the female terminal 1 with an insertion cavity. The solder pad 111 can be a soldering pad or a connector pad, preferably a connector pad, i.e., a gold finger. The male terminal 2 is made by soldering a metal plate 21 and a wire 22, and then the encapsulated part 23 can be obtained by insert injection molding process, preferably using soft rubber. The metal plate 21 can be one, two, three, etc., as needed. The wire 22 may have an insulation layer such as enameled wire, or it may not have an insulation layer, which is not limited here.

[0022] Specifically, the constraint shell 12 is directly connected to the circuit board. Compared to the traditional process (terminals are first inserted into plastic for fixation, and then the terminal pins are soldered to the PCB), the height of the female terminal 1 can be significantly reduced. The metal plate 21 of the male terminal 2 is soldered to the wire 22 and then encapsulated with an adhesive part 23. Compared to the traditional pin structure, this also significantly reduces the height. In this embodiment, the heights of both the female terminal 1 and the male terminal 2 are reduced. After insertion, the metal plate 21 of the male terminal 2 contacts and conducts with the solder pads 111 of the circuit board 11, resulting in an ultra-thin connection structure. This significantly saves the installation space occupied by the circuit board 11 in terms of thickness, allowing products using this circuit board to be thinner. Therefore, this embodiment meets the urgent demand for ultra-thin design in modern electronic devices while ensuring the electrical performance, mechanical strength, and reliability of the connection. Furthermore, the contact and conduction between the metal plate 21 of the male terminal 2 and the solder pads 111 of the circuit board 11 allows for multiple insertions and removals of the male and female terminals.

[0023] In some examples, such as Figure 2 and Figure 3 As shown, the constraint shell 12 is an iron shell, which is welded to the circuit board 11. The circuit board 11 has a U-shaped welding area 112, and the constraint shell 12 is welded to the U-shaped welding area 112, with its three sides welded together. The end corresponding to the notch in the U-shaped welding area 112 is open, serving as the insertion port for the male end 2. In a specific ultra-thin connection structure, the height of the iron shell is 0.55mm, the thickness of the iron shell is greater than 0.05mm, and the maximum height of the female end is 0.55mm.

[0024] In some examples, such as Figure 1 , Figure 2 , Figure 5 , Figure 6 , Figure 8 and Figure 9 As shown, the encapsulated portion 23 has a sealing lip 231 that protrudes outward and seals against the circumferential wall of the female end 1 at a position closer to the insertion port of the female end 1 than the exposed conductive portion 211.

[0025] The sealing lip 231 can interfere with the constraint shell 12 and the circuit board 11 to ensure a seamless perimeter. This forms a waterproof measure, preventing external moisture from entering and corroding the internal contact points, thus meeting high waterproof requirements. Preferably, the sealing lip 231 has at least two lip flaps spaced apart along the insertion direction of the overlay portion 23 to form at least two seals.

[0026] In some examples, such as Figure 6 , Figure 8 , Figure 9 and Figure 10 As shown, the exposed conductive portion 211 is a protrusion that extends beyond the encapsulated portion 23. The protrusion is used to make contact with the pads 111 of the circuit board 11, ensuring that the exposed conductive portion 211 can contact the pads 111.

[0027] In some examples, such as Figure 1 , Figure 2 , Figure 5 , Figure 6 , Figure 8 , Figure 9 and Figure 10 As shown, the side of the encapsulated portion 23 away from the exposed conductive portion 211 has an abutting portion 232 that protrudes from it and abuts against the inner wall of the constraint shell 12.

[0028] The abutment portion 232 can be hemispherical, semi-elliptical, etc. The abutment portion 232 is used to interfere with the constraint shell 12 and provide a reverse pressure to ensure that there is a suitable pressure between the exposed conductive portion 211 of the metal plate 21 and the solder pad 111 of the circuit board 11, so as to avoid poor contact.

[0029] In some examples, such as Figure 1 , Figure 2 , Figure 5 and Figure 6 The rubber-coated portion 23 is provided with a buckle 233 that cooperates with the constraint shell 12. The buckle 233 is provided on both sides of the rubber-coated portion 23, and the constraint shell 12 is provided on both sides with a card interface 121 that cooperates with the buckle 233. The buckle 233 is embedded in the card interface 121, thereby providing a retaining force and facilitating insertion and removal.

[0030] It should be noted that the buckle 233 is positioned closer to the insertion port of the female end 1 than the sealing lip 231, thereby preventing the card interface 121 on the constraint shell 12 from damaging the sealing space formed by the sealing lip 231.

[0031] Example 2

[0032] An electronic product includes an ultra-thin connection structure for connecting wires and a circuit board as described in Embodiment 1.

[0033] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. An ultra-thin connection structure for connecting wires and a circuit board, characterized in that, include: The female end (1) includes a constraint shell (12) connected to the circuit board (11) and covering the pads (111) of the circuit board (11). The male end (2) includes a metal plate (21), a wire (22) welded to the metal plate (21), and an adhesive portion (23) coated on the outside of the metal plate (21), wherein the metal plate (21) has an exposed conductive portion (211) exposed outside the adhesive portion (23); wherein, After the male end (2) is inserted into the female end (1), the constraint shell (12) constrains the encapsulated part (23), and the exposed conductive part (211) is in electrical contact with the solder pad (111).

2. The ultra-thin connection structure for connecting wires and circuit boards according to claim 1, characterized in that, The constraint shell (12) is an iron shell, which is welded to the circuit board (11).

3. The ultra-thin connection structure for connecting wires and circuit boards according to claim 1, characterized in that, The encapsulated portion (23) has a sealing lip (231) that protrudes outward and seals against the peripheral wall of the female end (1) at a position closer to the insertion port of the female end (1) than the exposed conductive portion (211).

4. The ultra-thin connection structure for connecting wires and circuit boards according to claim 3, characterized in that, The sealing lip (231) has at least two lip flaps spaced apart along the insertion direction of the overmolded portion (23).

5. The ultra-thin connection structure for connecting wires and circuit boards according to claim 1, characterized in that, The exposed conductive part (211) is a protrusion that protrudes from the encapsulated part (23).

6. The ultra-thin connection structure for connecting wires and circuit boards according to claim 1, characterized in that, The encapsulated portion (23) has an abutting portion (232) on the side away from the exposed conductive portion (211) that protrudes from it and abuts against the inner wall of the constraint shell (12).

7. The ultra-thin connection structure for connecting wires and circuit boards according to claim 1, characterized in that, The rubber-coated part (23) is provided with a buckle (233) that cooperates with the constraint shell (12).

8. The ultra-thin connection structure for connecting wires and circuit boards according to claim 1, characterized in that, The pad (111) is a gold finger.

9. An electronic product, characterized in that, Including the ultra-thin connection structure for connecting wires and circuit boards as described in any one of claims 1-8.

Images