A laser device

Abstract

This application discloses a laser device, including a housing, a receiving shell, a PCB board, a first fastener, a cover plate, and a cooling fan. The housing has cavities with openings on both sides; the receiving shell has a receiving cavity and mounting holes, the receiving cavity accommodating the light-emitting components of the laser device; the PCB board has fastening holes; the first fastener passes through the mounting holes and fastening holes to fix the PCB board to the receiving shell; the cover plate is fixedly connected to the receiving shell to cover the receiving cavity; the cooling fan is connected to the cover plate, and the cooling fan, cover plate, receiving shell, and PCB board are sequentially fixed, all located within the cavities. By providing a housing with cavities opening on both sides and accommodating the receiving shell, PCB board, cover plate, and cooling fan within the cavities, external bumps and impacts are effectively prevented, dust and moisture intrusion is reduced, and the overall durability and reliability of the laser device are improved.

Description

Technical Field

[0001] This application relates to the field of lasers, and more specifically, to a laser device. Background Technology

[0002] A laser is a device that generates light by amplifying stimulated emission, and it has important applications in many fields. Lasers are typically assembled using a split structure, with a heatsink-equipped top cover housing the laser, a fan fixed to one end, and sometimes even an externally mounted PCB. However, this split structure makes lasers vulnerable to damage and offers relatively weak protection. External impacts and dust ingress can directly affect the laser's performance and lifespan, thus requiring improvement. Utility Model Content

[0003] The purpose of this application is to provide a laser device to solve the problem that existing lasers have weak protection and are easily affected by external impacts and dust, which can affect the performance of the laser.

[0004] To solve the above problems, this application adopts the following technical solution:

[0005] This application provides a laser device, including:

[0006] The outer shell has cavities with openings on both sides;

[0007] The housing has a receiving cavity and a mounting hole, wherein the receiving cavity is used to receive the light-emitting component of the laser device;

[0008] The PCB board has fastening holes;

[0009] A first fastener passes through the mounting hole and the fastening hole to fix the PCB board to the receiving shell;

[0010] A cover plate is fixedly connected to the receiving shell to cover the receiving cavity;

[0011] A cooling fan is connected to the cover plate. The cooling fan, the cover plate, the receiving shell, and the PCB board are fixedly arranged in sequence. The cooling fan, the cover plate, the receiving shell, and the PCB board are all located inside the cavity.

[0012] By setting up an outer shell with cavities on both sides, and housing the housing, PCB board, cover plate and cooling fan inside the cavities, a relatively closed and integrated structure is formed, which effectively prevents external bumps and impacts, and also reduces the risk of external environmental factors such as dust and moisture entering the laser equipment, thereby improving the overall durability and reliability of the laser equipment.

[0013] Furthermore, the laser device includes a connection terminal located between the PCB board and the housing.

[0014] By setting connection terminals, a stable and reliable electrical connection path is provided, thereby improving the electrical performance and operational stability of laser equipment.

[0015] Furthermore, the housing is provided with a clearance step, which is located on the side away from the housing cavity. The clearance step is used to accommodate the connection terminal, thereby improving the utilization rate of the housing sidewall and reducing the risk of interference.

[0016] Furthermore, both the housing and the cover plate are provided with fixing holes, and the laser device includes a second fastener, which passes through the fixing holes to fix the housing and the cover plate together, thereby enhancing the connection effect between the housing and the cover plate and reducing the risk of loosening or falling off.

[0017] Furthermore, the receiving shell is provided with a clearance groove, which is arranged around the periphery of the fixing hole.

[0018] By setting a clearance groove, it is easier to insert the second fastener into the fixing hole, which is beneficial for fastening operations and improves assembly efficiency and convenience.

[0019] Furthermore, the laser device includes a rear plate fixed to one end of the receiving shell to cover the opening of the cavity. The rear plate covering the opening of the cavity further protects the laser device and improves its reliability.

[0020] Furthermore, the cover plate is provided with multiple heat dissipation fins, all of which are parallel to the cooling fan.

[0021] By adding heat dissipation fins, the heat dissipation surface area of ​​the cover plate is increased, thereby improving the heat dissipation effect of the laser equipment.

[0022] Furthermore, the rear plate is provided with through holes, which are arranged opposite to the heat dissipation fins, so that heat can be discharged from the laser equipment more directly and smoothly through the through holes, thereby improving heat dissipation efficiency.

[0023] In summary, this application includes at least one of the following beneficial technical effects:

[0024] 1. By housing the housing, PCB board, cover plate, and cooling fan within the cavity, external impacts are prevented, dust and moisture are reduced from entering the laser equipment, and the reliability of the laser equipment is improved.

[0025] 2. The PCB board is fixed to the housing by the first fastener, the cover plate is fixedly connected to the housing, and the cooling fan is connected to the cover plate, which facilitates assembly, disassembly and replacement during maintenance and improves maintenance efficiency. Attached Figure Description

[0026] Figure 1 An exploded view of a laser device provided in an embodiment of this application;

[0027] Figure 2 An exploded view of a laser device provided in an embodiment of this application, wherein the outer casing, cooling fan, and rear panel are hidden;

[0028] Figure 3 A schematic diagram of the structure of a laser device provided in an embodiment of this application, wherein the outer casing is hidden;

[0029] Figure 4 This application provides a schematic diagram of the structure of a receiving shell.

[0030] Explanation of reference numerals in the attached figures:

[0031] 1. Outer shell; 11. Cavity;

[0032] 2. Housing shell; 21. Housing cavity; 22. Mounting hole; 23. Clearance step; 24. Clearance groove;

[0033] 3. PCB board; 31. Fastening holes;

[0034] 4. First fastener; 5. Cover plate; 51. Heat dissipation fins;

[0035] 6. Cooling fan; 7. Connecting terminal; 8. Second fastener;

[0036] 9. Back panel; 91. Through hole; P. Fixing hole. Detailed Implementation

[0037] The specific embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0038] It should be noted that, unless otherwise specified, the embodiments and technical features in the embodiments of this application can be combined with each other, and the detailed descriptions in the specific implementation should be understood as explanations of the purpose of this application and should not be regarded as undue limitations on this application.

[0039] It should be understood that the orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings. These orientation terms are only for the convenience of describing this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting this application.

[0040] Figure 1 An exploded view of a laser device provided in an embodiment of this application. Figure 2 An exploded view of a laser device provided in an embodiment of this application, wherein the outer casing, cooling fan, and rear panel are hidden; Figure 3 A schematic diagram of the structure of a laser device provided in an embodiment of this application, wherein the outer casing is hidden; Figure 4 This application provides a schematic diagram of the structure of a receiving shell.

[0041] like Figures 1 to 4 As shown in the figure, this application provides a laser device, including: a housing 1, a receiving shell 2, a PCB board 3, a first fastener 4, a cover plate 5, and a cooling fan 6. The housing 1 has a cavity 11 with openings on both sides; the receiving shell 2 has a receiving cavity 21 and a mounting hole 22, the receiving cavity 21 being used to accommodate the light-emitting component of the laser device; the PCB board 3 has a fastening hole 31; the first fastener 4 passes through the mounting hole 22 and the fastening hole 31 to fix the PCB board 3 to the receiving shell 2; the cover plate 5 is fixedly connected to the receiving shell 2 to cover the receiving cavity 21; the cooling fan 6 is connected to the cover plate 5, and the cooling fan 6, cover plate 5, receiving shell 2, and PCB board 3 are sequentially fixedly arranged, all located within the cavity 11.

[0042] Specifically, to address the issues of vulnerability and weak protection in existing split-type laser structures, this application provides a more robust laser device. The laser device includes a housing 1, with an internal cavity 11 having openings on both sides. The cavity 11 provides a relatively independent and protected internal space for the core components of the laser device. One opening can be used to mount the rear plate 9, while the other side is used for laser emission. The housing 2 has an internal cavity 21 for accommodating the laser device's light-emitting components (not shown in the figure). For example, the pump source, working medium, and optical lenses are all installed within the cavity 21. Furthermore, the housing 2 also has mounting holes 22, the positions and dimensions of which are precisely designed for subsequent fixation to the PCB board 3.

[0043] The PCB board 3 is soldered with drive circuits, control chips, power management modules, and other necessary electronic components. The PCB board 3 has pre-set fastening holes 31, whose positions precisely correspond to the mounting holes 22 on the housing 2. To securely mount the PCB board 3 onto the housing 2, a first fastener 4 is used. It should be understood that the first fastener 4 can be a screw, stud, bolt, etc., for example, a screw. In operation, the screw is passed sequentially through the fastening holes 31 on the PCB board 3, and then through the corresponding mounting holes 22 on the housing 2, for locking and securing. In this way, the PCB board 3 is fixed to the housing 2, providing not only a base for electrical connection but also a certain degree of support and fixation. A cover plate 5 is used to cover one side of the opening of the housing 2, thereby sealing one side of the receiving cavity 21. The installation of the cover plate 5 provides further protection for the housing 2 and the PCB board 3.

[0044] A cooling fan 6 is mounted on the cover plate 5. The function of the cooling fan 6 is to force airflow and dissipate the heat generated during the operation of the laser equipment. The cooling fan 6, cover plate 5, housing shell 2, and PCB board are all located within the cavity 11 of the outer shell 1. Compared to a split structure, this significantly improves the laser equipment's protection against external physical impacts, dust, moisture, etc. Specifically, the laser equipment includes a connection terminal 7, located between the PCB board 3 and the housing shell 2. By providing the connection terminal 7, a stable and reliable electrical connection path is provided, improving the electrical performance and operational stability of the laser equipment.

[0045] It should be noted that by housing the housing 2, PCB board 3, cover plate 5, and cooling fan 6 within the cavity 11, external impacts are prevented, dust and moisture are reduced from entering the laser equipment, and the reliability of the laser equipment is improved. The PCB board 3 is fixed to the housing 2 by the first fastener 4, the cover plate 5 is fixedly connected to the housing 2, and the cooling fan 6 is connected to the cover plate 5. This facilitates assembly, disassembly, and replacement during maintenance, improving maintenance efficiency.

[0046] In some embodiments, the housing 2 is provided with a clearance step 23, located on the side away from the housing cavity 21, for accommodating the connecting terminal 7. Specifically, the main body of the housing 2 forms a housing cavity 21 for accommodating the laser light-emitting component. A recessed step structure, namely the clearance step 23, is formed on the side away from the central region of the housing cavity 21. The specific dimensions of the clearance step 23 are determined according to the specifications of the connecting terminal 7 to be accommodated. The connecting terminal 7 is typically used to connect the PCB board 3 inside the laser equipment to external power supplies, control signal cables, or other external devices. By providing the clearance step 23, the utilization rate of the sidewalls of the housing 2 is improved, and the risk of interference is reduced.

[0047] In some embodiments, both the housing 2 and the cover plate 5 are provided with fixing holes P, and the laser device includes a second fastener 8, which passes through the fixing hole P.

[0048] Specifically, to securely connect the housing 2 and the cover plate 5 together to form a closed equipment housing and protect the delicate internal laser components, fixing holes P are provided on both the housing 2 and the cover plate 5, and a second fastener 8 is used for fixation. For example, multiple fixing holes P are pre-machined on the top surface of the housing 2 and on the surface of the cover plate 5 that meets the housing 2. These fixing holes P are typically symmetrically and evenly distributed around the perimeter of the housing 2 to ensure connection stability and uniform force distribution. It should be understood that the second fastener 8 can be a screw, stud, bolt, etc., for example, a screw. The second fastener 8 securely connects the housing 2 and the cover plate 5, enhancing the connection effect and reducing the risk of loosening or detachment.

[0049] For example, the second fastener 8 is a screw with a suitable length and thread specification to ensure it can firmly pass through the fixing hole P of the cover plate 5 and be screwed into the fixing hole P of the receiving shell 2 to form a fixing point. During assembly, the cover plate 5 is first placed on top of the receiving shell 2, ensuring that the fixing holes P between them are precisely aligned. The operator uses a screwdriver or other appropriate tools to pass the second fastener 8 (screw) through the fixing holes P of the cover plate 5 one by one and screw it into the corresponding fixing holes P of the receiving shell 2. As the second fastener 8 (screw) is tightened one by one, the cover plate 5 is gradually pressed downwards and finally firmly fixed to the receiving shell 2. By providing the clearance groove 24, it is easier to insert the second fastener 8 into the fixing hole P, which is beneficial for tightening operations and improves assembly efficiency and convenience. In particular, the receiving shell 2 is provided with a clearance groove 24, which is arranged around the periphery of the fixing hole P.

[0050] In some embodiments, the laser device includes a rear plate 9, which is fixed to one end of the housing 2 to cover the opening of the cavity 11. Specifically, a rear plate 9 is added to the laser device to close the rear opening of the cavity 11 of the housing 1 and further enhance the overall protection and structural integrity of the laser device. The shape and size of the rear plate 9 are designed to precisely cover and fit the edge of the opening formed at the rear end of the housing 2. The rear plate 9 is pre-designed with mounting structures, such as mounting holes for connection with the housing 2. The rear plate 9 is fixed to the edge forming the rear opening of the cavity 11. During installation, holes are pre-machined on the rear plate 9, and corresponding threaded holes are also machined on the corresponding end face of the housing 2. Screws are passed through the holes in the rear plate 9 and screwed into the corresponding threaded holes in the housing 2 to fix the rear plate 9 to the housing 2, thereby closing the rear opening of the cavity 11, further protecting the laser device and improving its reliability.

[0051] In some embodiments, the cover plate 5 is provided with a plurality of heat dissipation fins 51, all of which face the cooling fan 6 in parallel. Specifically, to effectively improve the heat dissipation efficiency of the laser device, a plurality of heat dissipation fins 51 are provided on the cover plate 5. Each heat dissipation fin 51 has approximately the same shape and size and is arranged regularly on the cover plate 5, for example, in parallel arrangement at equal intervals. The heat dissipation fins 51 face the cooling fan 6; for example, the width direction of the heat dissipation fins 51 is parallel or consistent with the air outlet direction of the cooling fan 6. By providing heat dissipation fins 51, the heat dissipation surface area of ​​the cover plate is increased, thereby improving the heat dissipation effect of the laser device.

[0052] In some embodiments, the rear plate 9 is provided with a through hole 91, which is disposed opposite to the heat dissipation fins 51.

[0053] Specifically, to further enhance the heat dissipation effect of the laser equipment, a through hole 91 is provided on the rear plate 9, and the position of the through hole 91 is opposite to the heat dissipation fins 51 on the cover plate 5. The through hole 91 penetrates the entire thickness of the rear plate 9, forming an opening. The through hole 91 is positioned opposite to the heat dissipation fins 51, which means that the through hole 91 is located directly behind the heat dissipation fins 51 (i.e., along the length of the heat dissipation fins 51), allowing the hot airflow from the heat dissipation fins 51 to be discharged more smoothly through the through hole 91, improving the overall heat dissipation performance of the laser equipment, helping to maintain stable internal temperature, and improving the reliability and lifespan of the equipment.

[0054] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions claimed in this application.

Claims

1. A laser device, characterized in that, include: The outer shell has cavities with openings on both sides; The housing has a receiving cavity and a mounting hole, wherein the receiving cavity is used to receive the light-emitting component of the laser device; The PCB board has fastening holes; A first fastener passes through the mounting hole and the fastening hole to fix the PCB board to the receiving shell; A cover plate is fixedly connected to the receiving shell to cover the receiving cavity; A cooling fan is connected to the cover plate. The cooling fan, the cover plate, the receiving shell, and the PCB board are fixedly arranged in sequence. The cooling fan, the cover plate, the receiving shell, and the PCB board are all located inside the cavity.

2. The laser device according to claim 1, characterized in that, The laser device includes a connection terminal located between the PCB board and the housing.

3. A laser device according to claim 2, characterized in that, The housing is provided with a clearance step, which is located on the side away from the housing cavity, and the clearance step is used to accommodate the connection terminal.

4. A laser device according to claim 1, characterized in that, Both the housing and the cover plate are provided with fixing holes. The laser device includes a second fastener, which passes through the fixing holes to fix the housing and the cover plate together.

5. A laser device according to claim 4, characterized in that, The housing is provided with a clearance groove, which is arranged around the periphery of the fixing hole.

6. A laser device according to claim 1, characterized in that, The laser device includes a rear plate, which is fixed to one end of the receiving shell to cover the opening of the cavity.

7. A laser device according to claim 6, characterized in that, The cover plate is provided with multiple heat dissipation fins, all of which are parallel to the cooling fan.

8. A laser device according to claim 7, characterized in that, The rear plate is provided with through holes, which are arranged opposite to the heat dissipation fins.

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