Motherboard power-off protection circuit and electronic equipment

Abstract

This application relates to a motherboard power-off protection circuit and an electronic device. The motherboard power-off protection circuit includes: a hardware presence detection module, the first terminal of which is connected to the device hardware of the electronic device; when the device hardware is not present, the hardware presence detection module outputs a low level; a power-down detection module, the first terminal of which is connected to an input voltage, and the second terminal of which is connected to a reference voltage; the power-down detection module outputs a low level when the input voltage is lower than the reference voltage; and a motherboard power isolation module, the detection terminal of which is connected to the second terminal of the hardware presence detection module and the third terminal of the power-down detection module, and the output terminal of the motherboard power isolation module is connected to the motherboard circuit; used to switch power on and off on the motherboard circuit; when the detection terminal of the motherboard power isolation module receives a low level output from the hardware presence detection module and / or the power-down detection module, it cuts off the power supply path to the motherboard circuit. This improves the reliability of motherboard protection.

Description

Technical Field

[0001] This application relates to the field of power management and protection technology for electronic devices, and in particular to a motherboard power-off protection circuit and electronic device. Background Technology

[0002] Currently, motherboards in electronic devices are generally designed with a standby power function. Even after the operating system is shut down, as long as the host's AC power input is not completely cut off (for example, only the power switch on the chassis is turned off while the power cord is still connected to the socket), some circuits on the motherboard (such as the standby power circuit, the wake-up module, etc.) will still maintain a low-power operating state. At this time, a certain amount of charge will be stored in the critical power filter capacitors and other energy storage components on the motherboard.

[0003] When a user performs a complete power-off operation, such as turning off the power switch at the back of the computer case or unplugging the power cord, the standby power supply and related energy storage components (mainly large-capacity capacitors) on the motherboard need to undergo a discharge process before the stored charge can be fully released.

[0004] However, the existing motherboard discharge circuit design or component characteristics often result in a relatively slow discharge process. The applicant's research found that the reliability of motherboard protection is low after the electronic device is powered off. Utility Model Content

[0005] Based on this, the purpose of this application is to at least solve one of the above-mentioned technical defects, especially the technical defect of low reliability of motherboard protection in the prior art. This application provides a motherboard power failure protection circuit and electronic device.

[0006] In a first aspect, this application provides a motherboard power-off protection circuit, applied to the motherboard circuit of an electronic device, the motherboard power-off protection circuit comprising:

[0007] The hardware presence detection module has a first end for connecting to the device hardware of the electronic device; when the device hardware is not present, the hardware presence detection module outputs a low level.

[0008] The power-down detection module has a first terminal for receiving the input voltage and a second terminal for receiving the reference voltage. When the input voltage is lower than the reference voltage, the power-down detection module outputs a low level.

[0009] The motherboard power isolation module has its detection terminals connected to the second terminal of the hardware presence detection module and the third terminal of the power failure detection module, respectively. The output terminal of the motherboard power isolation module is used to connect to the motherboard circuit and to switch power on and off the motherboard circuit.

[0010] When the detection terminal of the motherboard power isolation module receives a low level output from the hardware presence detection module and / or power failure detection module, it shuts off the power supply path to the motherboard circuit.

[0011] In one embodiment, the hardware presence detection module includes:

[0012] The detection switch circuit has two terminals: the first terminal is used to receive the presence status signal of the device hardware; the second terminal of the detection switch circuit is connected to the detection terminal of the motherboard power isolation module.

[0013] When the presence status signal is a high level indicating that the device hardware is in place, the detection switch circuit is turned on so that the detection terminal of the motherboard power isolation module receives a low level.

[0014] In one embodiment, the detection switch circuit includes:

[0015] The transistor unit's control terminal is used to receive the presence status signal, the transistor unit's output terminal is connected to the detection terminal of the motherboard's power isolation module, and the transistor unit's input terminal is used to receive a low level.

[0016] When the presence status signal is a high level indicating that the device hardware is in place, the transistor unit is turned on so that the detection terminal of the motherboard power isolation module receives a low level.

[0017] In one embodiment, the transistor unit includes:

[0018] The first resistor has one end connected to the in-position status signal;

[0019] The MOSFET has its gate connected to the other end of the first resistor, its source grounded, and its drain connected to the detection terminal of the motherboard's power isolation module.

[0020] In one embodiment, the power failure detection module includes:

[0021] The reference voltage unit has a first terminal for receiving the input voltage and a second terminal for outputting the reference voltage.

[0022] The voltage comparator unit has three terminals: the first terminal is used to connect to the input voltage, the second terminal is connected to the second terminal of the reference voltage unit, and the third terminal is connected to the detection terminal of the motherboard power isolation module.

[0023] In one embodiment, the reference voltage unit includes:

[0024] The shunt regulator has its first terminal connected to the input voltage.

[0025] The second terminal of the shunt regulator is connected to the second terminal of the reference voltage unit;

[0026] The third terminal of the shunt regulator is used for grounding.

[0027] In one embodiment, the voltage comparison unit includes:

[0028] The comparator has three terminals: the first terminal is connected to the input voltage; the second terminal is connected to the second terminal of the reference voltage unit; the third terminal is connected to the detection terminal of the motherboard power isolation module; and the power supply terminal is connected to the operating voltage.

[0029] In one embodiment, the power failure detection module further includes:

[0030] The third resistor has one end connected to the input voltage and the other end connected to the first terminal of the comparator.

[0031] The fourth resistor has one end connected to the other end of the third resistor and the first end of the comparator; the other end of the fourth resistor is used for grounding.

[0032] In one embodiment, the power isolation module includes a power isolation device;

[0033] The enable pin of the power isolation device is the detection pin of the motherboard power isolation module;

[0034] The power input terminal of the power isolation device is used to connect the input voltage;

[0035] The power output terminal of the power isolation device is the output terminal of the motherboard power isolation module;

[0036] When the enable pin of the power isolation device receives a low level, the connection between the power input and the power output pin is broken.

[0037] Secondly, this application provides an electronic device, comprising:

[0038] Motherboard circuitry;

[0039] Such as the motherboard power-off protection circuit mentioned above;

[0040] The motherboard power failure protection circuit is connected to the motherboard circuitry.

[0041] As can be seen from the above technical solutions, the embodiments of this application have the following advantages:

[0042] The motherboard power-off protection circuit and electronic equipment provided in this application monitor the hardware connection status of the device in real time through a hardware in-situ detection module. It can also be combined with the real-time comparison of the input voltage by a power-off detection module. When the in-situ detection module detects hardware disassembly, such as during CPU replacement, it can immediately trigger the motherboard power isolation module to cut off the power supply path. Alternatively, when the input voltage is detected to be dropping, the motherboard power isolation module can cut off the power supply path. This structure can quickly shut down the motherboard power supply through two-stage protection, enabling the motherboard to discharge quickly and thus improving the reliability of motherboard protection. Attached Figure Description

[0043] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0044] Figure 1 This is a schematic diagram of a motherboard power-off protection circuit provided in an embodiment of this application;

[0045] Figure 2 This application provides a schematic diagram of a specific sub-module structure for a motherboard power-off protection circuit.

[0046] Figure 3 This is a schematic diagram of the specific structure of a motherboard power-off protection circuit provided in an embodiment of this application.

[0047] Figure label:

[0048] 110 - Hardware presence detection module; 120 - Power failure detection module; 130 - Motherboard power isolation module; 140 - Device hardware; 111 - Detection switch circuit; 121 - Reference voltage unit; 122 - Voltage comparison unit. Detailed Implementation

[0049] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0050] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0051] It is understood that the terms "first," "second," etc., used herein may be used to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of this application, a first resistor may be referred to as a second resistor, and similarly, a second resistor may be referred to as a first resistor. Both the first resistor and the second resistor are resistors, but they are not the same resistor.

[0052] It is understood that the term "connection" in the following embodiments should be understood as "electrical connection," "communication connection," etc., if the connected circuits, modules, units, etc., have electrical signal or data transmission with each other.

[0053] It is understandable that "at least one" can refer to one or more, while "multiple" can refer to two or more. "At least a part of an element" can refer to part or all of an element.

[0054] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising / including” or “having,” etc., specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. Meanwhile, the term “and / or” as used in this specification includes any and all combinations of the associated listed items.

[0055] Currently, motherboards in electronic devices are generally designed with standby power functions. Even after the operating system is shut down, as long as the host's AC power input is not completely cut off (e.g., only the power switch on the chassis is turned off while the power cord is still connected to the socket), some circuits on the motherboard (such as the standby power circuit and the Wake-up Network module) will still maintain a low-power operating state. At this time, a certain amount of charge will be stored in the critical power filter capacitors and other energy storage components on the motherboard. When the user performs a complete power-off operation, such as turning off the power switch at the back of the chassis or unplugging the power cord, the standby power supply and related energy storage components (mainly large-capacity capacitors) on the motherboard need to undergo a discharge process to fully release the stored charge. However, the discharge circuit design or component characteristics of existing motherboards often result in a relatively slow discharge process. The applicant's research found that the reliability or safety of motherboard protection is poor after electronic devices are powered off. Especially when device hardware is hot-swapped or accidentally detached, or when the input voltage suddenly drops, traditional motherboard circuits lack effective power-off protection, which may lead to damage to circuit components or data loss. In addition, the slow discharge process also affects the efficiency of equipment maintenance and repair, and increases the safety risks to operators.

[0056] To address the aforementioned problems, existing technologies urgently need improvement. Therefore, this application provides a motherboard power-off protection circuit and electronic device. A hardware presence detection module monitors the hardware connection status in real time, and this, combined with a power-off detection module for real-time comparison of input voltage, allows the motherboard power isolation module to immediately cut off the power supply when hardware removal is detected by the presence detection module (e.g., during CPU replacement). Alternatively, the power isolation module can cut off the power supply when a power failure is detected. This structure, with its two-stage protection, quickly shuts off the motherboard power, enabling rapid discharge and improving the reliability of motherboard protection.

[0057] In one exemplary embodiment, Figure 1 This is a schematic diagram of a motherboard power-off protection circuit provided in an embodiment of this application, as shown below. Figure 1 As shown, the motherboard power failure protection circuit is applied to the motherboard circuit of electronic devices. The motherboard power failure protection circuit includes: hardware presence detection module 110, power failure detection module 120, and motherboard power isolation module 130.

[0058] The hardware presence detection module 110 has a first end for connecting to the device hardware 140 of the electronic device; when the device hardware 140 is not in place, the hardware presence detection module 110 outputs a low level.

[0059] The hardware presence detection module 110 refers to a circuit that determines the presence of device hardware 140 based on its physical connection status. For example, it can be implemented using a switching circuit combined with a transistor. For instance, when device hardware 140 is removed, its corresponding presence status signal disappears, triggering the detection module to output a low-level signal.

[0060] The power-down detection module 120 has a first terminal for connecting to the input voltage and a second terminal for connecting to the reference voltage. When the input voltage is lower than the reference voltage, the power-down detection module 120 outputs a low level.

[0061] The power failure detection module 120 refers to a circuit used to monitor whether the input voltage is lower than the safety threshold. Specifically, it can be implemented by using a voltage comparator and a reference voltage source. By comparing the input voltage with the reference value in real time, it outputs a low level when the voltage is abnormal.

[0062] The motherboard power isolation module 130 has its detection terminals connected to the second terminal of the hardware presence detection module 110 and the third terminal of the power failure detection module 120, respectively. The output terminal of the motherboard power isolation module 130 is used to connect to the motherboard circuit and to power on and off the motherboard circuit.

[0063] When the detection terminal of the motherboard power isolation module 130 receives a low level output from the hardware presence detection module 110 and / or the power failure detection module 120, it shuts off the power supply path of the motherboard circuit.

[0064] Among them, the motherboard power isolation module 130 can refer to an electronic switching device that controls the power supply of the motherboard. Specifically, it can be a power isolation chip with an enable terminal. When the enable terminal receives a low-level signal, it automatically disconnects the connection between the power input terminal and the output terminal.

[0065] For example, the first end of the hardware presence detection module 110 is used to connect to the device hardware 140 of the electronic device. It can be a dedicated "presence detection" pin on the interface connector connected to the device hardware 140. For example, the first end of the hardware presence detection module 110 can receive the presence signal SKTOCC_N of the device hardware 140. The SKTOCC_N signal is shorted to GND after the CPU is in normal presence. The SKTOCC_N level is low. If the CPU is unplugged, the SKTOCC_N will be pulled high due to the external pull-up, and the level will be high.

[0066] The first terminal of the power failure detection module 120 can be connected to the input voltage, thus enabling the detection and monitoring of the input voltage. The second terminal of the power failure detection module 120 is connected to a reference voltage, thus allowing the determination of whether a power failure has occurred in the input voltage.

[0067] The detection terminals of the motherboard power isolation module 130 are connected to the second terminal of the hardware presence detection module 110 and the third terminal of the power failure detection module 120, respectively. The output terminal of the motherboard power isolation module 130 is used to connect to the motherboard circuit. Thus, when the hardware presence detection module 110 and / or the power failure detection module 120 output a low level, the power supply path to the motherboard circuit is disconnected. This allows the motherboard circuit to discharge quickly, preventing short circuits while the motherboard is powered on and improving the reliability of motherboard circuit protection.

[0068] Specifically, the motherboard power-off protection circuit monitors the physical connection status of the device hardware 140 in real time through the hardware presence detection module 110. When the device hardware 140 is removed, the hardware presence detection module 110 outputs a low-level signal to the detection terminal of the motherboard power isolation module 130. Simultaneously, the power-off detection module 120 continuously compares the input voltage with the reference voltage. If the input voltage drops below the reference voltage due to power failure, it also outputs a low-level signal. Upon receiving either low-level signal, the motherboard power isolation module 130 immediately cuts off the power supply path to the motherboard circuit, allowing the energy storage components to quickly release charge. This dual detection mechanism ensures that the power supply path can be promptly shut off in the event of abnormal hardware removal or sudden power failure, preventing charge retention.

[0069] In practical applications, by actively cutting off the power supply path, the motherboard circuit can be discharged quickly, significantly shortening the discharge time. This combines hardware in-situ detection with power control, fundamentally eliminating the risk of short circuits caused by operating on the motherboard after hardware disassembly.

[0070] This embodiment effectively solves the problem of low reliability of motherboard protection caused by slow discharge after power failure. The power supply can be immediately cut off after the removal of device hardware 140 or power failure, accelerating the release of charge from the energy storage components. Simultaneously, through the linkage control of hardware status and power on / off, safety hazards caused by live operation are avoided, improving the safety of electronic equipment during maintenance and abnormal power outage scenarios, and enhancing the reliability of motherboard protection.

[0071] In one exemplary embodiment, such as Figure 2 As shown, Figure 2 This application provides a schematic diagram of a specific submodule structure for a motherboard power-off protection circuit, wherein the hardware presence detection module 110 may include:

[0072] The detection switch circuit 111 has a first terminal for receiving the presence status signal of the device hardware 140; the second terminal of the detection switch circuit 111 is connected to the detection terminal of the motherboard power isolation module 130.

[0073] When the presence status signal is a high level indicating that the device hardware 140 is in place, the detection switch circuit 111 is turned on so that the detection terminal of the motherboard power isolation module 130 receives a low level.

[0074] The detection switch circuit 111 can refer to a circuit module that controls the conduction state through a hardware presence status signal. For example, it can be implemented using semiconductor devices such as transistors or MOSFETs, and can directly drive the switch action through a level signal. The presence status signal can refer to a logic level signal that reflects the physical connection status of the device hardware 140. For example, a high level indicates that the hardware is not present, and a low level indicates that the hardware is present. The detection terminal of the motherboard power isolation module 130 can refer to the input terminal that receives external control signals and can be used to control the power supply on and off according to the input level.

[0075] For example, when device hardware 140 is in place, the in-place status signal outputs a high level. At this time, the transistor unit in the detection switch circuit 111 is triggered and turned on, pulling the detection terminal of the motherboard power isolation module 130 low. After detecting the low-level signal, the motherboard power isolation module 130 immediately shuts off the power supply path to the motherboard circuit. This process does not rely on software or complex logic circuits; it achieves a fast response solely through direct control of hardware level signals.

[0076] In practical applications, the detection switch circuit 111 directly links the hardware presence status with the power control signal, which simplifies the circuit structure and avoids the delay caused by software intervention, thus significantly improving the real-time performance of the power failure response.

[0077] In this embodiment, the power supply path of the motherboard can be immediately triggered to shut down when the device hardware 140 is removed or abnormally disconnected, thereby effectively reducing the release time of residual charge in the motherboard's energy storage components. This mechanism is particularly suitable for scenarios requiring rapid power-off protection, avoiding circuit damage or safety hazards caused by slow discharge. Furthermore, the detection switch circuit 111 is implemented using basic semiconductor devices, offering advantages such as low cost and high reliability.

[0078] In one exemplary embodiment, the detection switch circuit includes:

[0079] The transistor unit's control terminal is used to receive the presence status signal, the transistor unit's output terminal is connected to the detection terminal of the motherboard's power isolation module, and the transistor unit's input terminal is used to receive a low level.

[0080] When the presence status signal is a high level indicating that the device hardware is in place, the transistor unit is turned on so that the detection terminal of the motherboard power isolation module receives a low level.

[0081] In this context, a transistor unit refers to an electronic switching device made of semiconductor materials, such as a MOSFET, whose gate voltage changes control the conduction state of the source and drain. A control terminal refers to an access point that receives external signals, such as the gate pin of a MOSFET, where the conduction state is controlled by applying a voltage signal. An "on" status signal refers to a logic signal reflecting whether the device hardware is properly installed, such as a level signal where a high level indicates the hardware is present and a low level indicates its absence. "Conduction" refers to the state in which a transistor unit forms a current path under the influence of a control signal, such as by applying a high level to the gate to reduce the source-drain resistance, at which point a low level applied to the input is transmitted to the output.

[0082] For example, when the device hardware is in place, an in-place status signal outputs a high level, which is applied to the control terminal of the transistor unit to turn it on. In the on-state, the input and output terminals of the transistor unit form a low-impedance path, transmitting the low level input to the input terminal to the detection terminal of the motherboard power isolation module. Upon receiving the low level, the detection terminal triggers the power isolation module to perform a power-off operation, cutting off the power supply path to the motherboard circuitry. This process utilizes the fast switching characteristics of the transistor unit to achieve real-time detection and response to the hardware's in-place status.

[0083] In practical applications, transistor units are used to construct the detection switch circuit. Leveraging the rapid conduction characteristics of semiconductor devices, status detection and signal transmission can be completed within microseconds, while simultaneously reducing static power consumption. This improves the reliability of the detection.

[0084] In this embodiment, real-time and accurate detection of the hardware's presence status is achieved. When the hardware is detected to be detached, power-off protection is immediately triggered, effectively preventing safety hazards caused by continued power-on operation of the motherboard circuit after hardware disassembly. For example, it can avoid short circuits caused by power-on operation, thereby improving the reliability of motherboard protection.

[0085] In one exemplary embodiment, the transistor unit includes:

[0086] The first resistor has one end connected to the in-position status signal;

[0087] The MOSFET has its gate connected to the other end of the first resistor, its source grounded, and its drain connected to the detection terminal of the motherboard's power isolation module.

[0088] The first resistor can be a current-limiting element connected in series in the in-situ state signal transmission path. For example, it can be implemented using a 10kΩ surface-mount resistor to limit the current intensity input to the gate of the MOSFET and prevent overcurrent damage to the device. The MOSFET can be a metal-oxide-semiconductor field-effect transistor. For example, it can be implemented using an N-channel enhancement-mode MOSFET, whose conduction state is controlled by the gate voltage. When the gate voltage is higher than a threshold, it conducts to form a low-impedance path.

[0089] For example, the presence status signal is connected to the gate of the MOSFET through a first resistor. When the device hardware is present, a high-level signal is generated, which is transmitted to the gate of the MOSFET via the first resistor, turning it on. At this time, the drain of the MOSFET and the grounded source form a conduction loop, pulling the detection terminal potential of the motherboard power isolation module down to a low level, triggering the power path to shut down. This structure achieves precise level transition of the hardware presence status through the combination of a resistor and a MOSFET, where the resistance value of the first resistor must be selected to balance signal transmission speed and power consumption control.

[0090] In practical applications, the combination of a single resistor and a MOSFET simplifies the circuit structure while ensuring fast response, and the voltage drive characteristics of the MOSFET can avoid leakage current problems.

[0091] In this embodiment, reliable level conversion of the hardware presence detection signal is achieved, ensuring that the motherboard power isolation module can promptly cut off the power supply path. When the device hardware presence state changes, the MOSFET can complete the conduction state switching within microseconds, effectively shortening the power path shutdown delay, thereby accelerating the discharge process of the motherboard energy storage components and improving the reliability of motherboard protection.

[0092] In one exemplary embodiment, such as Figure 2 As shown, the power failure detection module 120 includes:

[0093] The reference voltage unit 121 has a first terminal for receiving the input voltage and a second terminal for outputting the reference voltage.

[0094] The voltage comparison unit 122 has a first terminal for receiving the input voltage, a second terminal for connecting to the second terminal of the reference voltage unit 121, and a third terminal for connecting to the detection terminal of the motherboard power isolation module 130.

[0095] The reference voltage unit 121 can refer to a circuit module for generating a stable reference voltage. For example, it can be implemented using a shunt regulator and a voltage divider resistor. The reference voltage value can be set by adjusting the voltage division ratio to match the threshold detection requirements of the input voltage. The voltage comparison unit 122 can refer to a circuit module for comparing the input voltage with the reference voltage in real time. For example, it can be implemented using an operational amplifier or a dedicated comparator chip. When the input voltage is lower than the reference voltage, it outputs a low-level signal to trigger a protection action.

[0096] For example, the input voltage can be connected to the non-inverting input of the comparator through a voltage divider resistor network, and the reference voltage output by the reference voltage unit 121 can be connected to the inverting input of the comparator. When the input voltage is normal, the voltage at the non-inverting input of the comparator is higher than that at the inverting input, and the output remains high. When the input voltage starts to drop due to power failure, the voltage at the non-inverting input after voltage division decreases accordingly. When it is lower than the reference voltage, the comparator flips and outputs a low level. This signal is transmitted to the detection terminal of the motherboard power isolation module 130, triggering the power path cutoff action.

[0097] In practical applications, the combination of a voltage divider resistor network and a comparator enables real-time and accurate monitoring of the input voltage, and immediately triggers protection when the voltage drops to a critical value.

[0098] In this embodiment, the power supply to the motherboard can be quickly cut off when the input voltage drops, effectively shortening the discharge time window of the energy storage element, eliminating the risk of circuit malfunction caused by residual charge, and improving the safety protection capability of the device in power outage scenarios.

[0099] In one exemplary embodiment, the reference voltage unit includes:

[0100] The shunt regulator has its first terminal connected to the input voltage.

[0101] The second terminal of the shunt regulator is connected to the second terminal of the reference voltage unit;

[0102] The third terminal of the shunt regulator is used for grounding.

[0103] A shunt regulator refers to a semiconductor device with a voltage reference function, which can maintain a constant output voltage at its second terminal through an internal feedback mechanism. The first terminal, connected to the input voltage, provides the energy required for the device's operation. The second terminal connects to a voltage divider network to output a set reference voltage. The third terminal is grounded, forming a complete current loop. The introduction of a shunt regulator allows the generation of the reference voltage to no longer rely on simple resistor division, but rather on an active voltage regulation mechanism, effectively suppressing the impact of input voltage fluctuations on the reference value.

[0104] For example, when an input voltage is applied to the first terminal of the shunt regulator, its internal circuitry automatically adjusts the conduction state according to a preset threshold, so that the reference voltage output from the second terminal of the shunt regulator remains stable. This reference voltage is transmitted to the voltage comparison unit through a voltage divider resistor network as a reference value for determining whether the input voltage is lower than the threshold.

[0105] In practical applications, an active voltage regulator circuit is constructed by using a shunt regulator. Even if there is ripple or short-term drop in the input voltage, the stability of the reference voltage can still be maintained, ensuring that the power failure detection threshold is accurate and controllable, and avoiding false triggering or missed triggering.

[0106] In this embodiment, an active voltage regulation mechanism provides a stable reference for the voltage comparator, enabling the motherboard to cut off the power supply in time when the input voltage drops accurately to the set threshold, thus preventing the residual charge of the energy storage element from causing overvoltage damage to the circuit components.

[0107] In one exemplary embodiment, the voltage comparison unit includes:

[0108] The comparator has three terminals: the first terminal is connected to the input voltage; the second terminal is connected to the second terminal of the reference voltage unit; the third terminal is connected to the detection terminal of the motherboard power isolation module; and the power supply terminal is connected to the operating voltage.

[0109] The comparator refers to an integrated circuit that can perform differential comparison of two input voltages and output high and low level signals. For example, it can be implemented using an operational amplifier or a dedicated voltage comparator chip to monitor in real time whether the input voltage is lower than the reference voltage.

[0110] The first terminal of the comparator can be used to connect the input voltage. This means that the input voltage signal of the motherboard to be monitored can be introduced into the non-inverting input terminal of the comparator. For example, the voltage can be sampled through a resistor divider network and then connected to establish a comparison benchmark with the reference voltage.

[0111] The second terminal of the comparator being connected to the second terminal of the reference voltage unit can refer to connecting the output terminal of the reference voltage source to the inverting input terminal of the comparator. For example, a shunt regulator or a reference voltage chip can be used to generate a stable reference voltage to set the voltage threshold for triggering power-off protection.

[0112] The third terminal of the comparator being connected to the detection terminal of the motherboard power isolation module can refer to directly connecting the output terminal of the comparator to the enable control terminal of the power isolation device. For example, signal transmission can be achieved through a level conversion circuit or a buffer, which is used to output a low level to trigger a power-off action when the input voltage is lower than the threshold.

[0113] The comparator's power supply terminal, used to connect to the operating voltage, can be an independent power supply for the comparator. For example, it can be powered by the motherboard's standby power supply or an independent voltage regulator circuit to ensure that the comparator can still maintain normal operation when the input voltage drops.

[0114] For example, when the input voltage is connected to the non-inverting input of the comparator through a voltage divider resistor network, the stable voltage generated by the reference voltage unit is applied to the inverting input. When the input voltage is higher than the reference voltage, the comparator outputs a high level, keeping the power isolation module on. When the input voltage drops below the reference voltage due to power failure, the comparator immediately flips to output a low level, triggering the power isolation module to cut off the motherboard power supply. This process achieves millisecond-level response through integrated circuits, eliminating the need for capacitor discharge delay.

[0115] In practical applications, by introducing a high-precision comparator and an independent reference voltage source, the power-off trigger threshold can be accurately set and errors caused by temperature and component aging can be eliminated. At the same time, the fast switching characteristic of the comparator can be used to realize the instant transmission of the power-off signal, avoiding the failure of residual charge in the energy storage element to be released in time due to detection delay.

[0116] In this embodiment, power-off protection can be quickly triggered when the input voltage of the motherboard drops below the safety threshold, eliminating the delay problem caused by the natural discharge of capacitors in traditional solutions, effectively shortening the discharge time of key components on the motherboard, preventing circuit abnormalities or component damage caused by residual charge, and improving the reliability of the device motherboard safety protection under power-off conditions.

[0117] In one exemplary embodiment, the power failure detection module further includes:

[0118] The third resistor has one end connected to the input voltage and the other end connected to the first terminal of the comparator.

[0119] The fourth resistor has one end connected to the other end of the third resistor and the first end of the comparator; the other end of the fourth resistor is used for grounding.

[0120] The third resistor can be a current-limiting voltage divider connected in series between the input voltage and the comparator input. For example, it can be implemented using a fixed resistor with a resistance of 10 kΩ, used to limit the input current and create a voltage divider relationship between the input voltage and the comparator. The fourth resistor can be a pull-down resistor connected between the comparator input and ground. For example, it can be implemented using a fixed resistor with a resistance of 2 kΩ, used to stabilize the level state of the comparator input and suppress signal interference.

[0121] For example, the third and fourth resistors form a voltage divider network. When the input voltage drops or loses power, the voltage divider network proportionally attenuates the input voltage before transmitting it to the non-inverting input of the comparator. When the input voltage is lower than the reference voltage, the comparator output generates a low-level signal, triggering the motherboard power isolation module to cut off the motherboard power supply path. This design, through the precise configuration of the voltage divider resistors, ensures that the comparator can accurately identify the input voltage drop threshold.

[0122] In this embodiment, accurate detection of input voltage drop is achieved, effectively avoiding false power outages caused by transient voltage fluctuations. At the same time, the configuration of voltage divider resistors can flexibly adapt to motherboard circuits with different input voltage ranges, ensuring that the power supply circuit of the energy storage element can be quickly cut off after the device is completely powered off.

[0123] In one exemplary embodiment, the power isolation module includes a power isolation device;

[0124] The enable pin of the power isolation device is the detection pin of the motherboard power isolation module;

[0125] The power input terminal of the power isolation device is used to connect the input voltage;

[0126] The power output terminal of the power isolation device is the output terminal of the motherboard power isolation module;

[0127] When the enable pin of the power isolation device receives a low level, the connection between the power input and the power output pin is broken.

[0128] In this context, a power isolation device refers to a semiconductor device capable of controlling the electrical connection between the main power supply and the motherboard circuitry. For example, it can be implemented using a MOSFET or relay with enable control functionality. When the enable pin receives a specific level signal, the conductive path between the power input and output pins can be actively disconnected. The enable pin, acting as a logic control port, can change the device's operating mode based on the detected signal state. The power input pin is directly connected to the input voltage to receive electrical energy from an external power source. The power output pin is connected to the motherboard circuitry and is responsible for supplying power to the motherboard. When the enable pin receives a low-level signal, the internal conductive path of the power isolation device is forcibly disconnected, thereby eliminating the electrical connection between the motherboard circuitry and the input voltage.

[0129] For example, when the hardware presence detection module detects that the device hardware is not installed or the power failure detection module detects a drop in input voltage, the enable pin of the power isolation device will receive a continuous low-level signal. At this time, the power isolation device can immediately cut off the power supply path between the motherboard circuit and the input voltage, forcing the motherboard energy storage element to quickly release residual charge through a preset discharge circuit. This process does not rely on the time constant of a traditional RC discharge circuit, but directly eliminates the charge maintenance condition of the energy storage element by physically disconnecting the power path, thereby significantly accelerating the discharge speed.

[0130] In some specific implementations, the power isolation device can be an N-channel MOSFET with reverse cutoff function, whose gate serves as the enable terminal connected to the output nodes of the two detection modules. When either detection module outputs a low level, the gate-source voltage of the MOSFET falls below the threshold voltage, causing the drain-source conductive channel to disappear. At this time, the current path between the motherboard circuit and the input voltage is completely blocked, and the energy storage capacitor can only release energy through a preset parallel discharge resistor.

[0131] In practical applications, by actively cutting off the power supply path, the energy storage element is deprived of external power supply, and it is forced to release energy through an independent discharge circuit. This method not only shortens the discharge time but also avoids the problem of residual charge retention caused by leakage current in traditional designs, effectively improving the operational safety of the motherboard in maintenance, transportation, and other scenarios.

[0132] In this embodiment, the electrical connection between the motherboard circuit and the external power supply can be immediately severed after the electronic device is completely powered off, and the energy storage components are forced to quickly release residual charge through an optimized discharge circuit. This effectively solves the maintenance safety hazards caused by the slow discharge speed of traditional motherboards after power failure, while avoiding the increased cost and space occupation caused by adding additional complex discharge circuits.

[0133] In one exemplary embodiment, such as Figure 3 As shown, Figure 3 This is a schematic diagram of a specific structure of a motherboard power-off protection circuit provided in an embodiment of this application, combined with... Figure 1 , Figure 2 As shown, the motherboard power failure protection circuit includes: hardware presence detection module 110, power failure detection module 120, motherboard power isolation module 130, resistor R2, resistor R3, and resistor R4.

[0134] The hardware in-situ detection module 110 includes: MOSFET Q1 and resistor R1; the power-down detection module 120 includes: three-terminal adjustable shunt regulator Q2 and comparator U2; the motherboard power isolation module 130 includes: power isolation device U1.

[0135] For example, power isolation device U1 provides control over the isolated output VOUT. A three-terminal adjustable shunt regulator Q2 provides a reference voltage V2. Comparator U2 compares the reference voltage V2 provided by the three-terminal adjustable shunt regulator with the voltage V2 divided from the power input VIN, outputting a high or low V3. MOSFET Q1 detects the CPU presence signal SKTOCC_N, providing reverse isolation control; removing the CPU allows for rapid shutdown of U1, thus turning off the motherboard's power supply VOUT. Resistors R1 and R4 are used for pull-up current limiting, while resistors R2 and R3 act as voltage dividers.

[0136] In practical applications, the CPU-in-place signal SKTOCC_N is shorted to GND after the CPU is installed, resulting in a low SKTOCC_N level. If the CPU is removed, due to an external pull-up, SKTOCC_N is pulled high to VIN, making the level VIN high. The isolation discharge circuit composed of MOSFET Q1, resistor R1, and power isolation device U1 enables the CPU to be removed. When the CPU is removed, the signal SKTOCC_N goes high, causing MOSFET Q1 to conduct, pulling down the EN terminal voltage of the control power isolation device U1, turning off the power isolation device U1, and quickly shutting off the power supply VOUT at the back of the motherboard. This shuts down all power generated at the back of VOUT. In this way, when the CPU is replaced, the motherboard can be quickly powered off, preventing damage to the motherboard or CPU caused by replacing the CPU while it is powered on.

[0137] The discharge circuit uses a three-terminal adjustable shunt regulator Q2, comparator U2, resistors R2~R4, and power isolation device U1. V2 is a fixed value. When VIN drops to a value that makes the voltage division of V1 less than V2, V3 is pulled low, and the EN terminal of U1 connected to it is pulled low, turning off the power isolation device U1 and quickly turning off the power supply VOUT at the back end of the motherboard. This turns off all the power generated at the back end of VOUT, thus enabling the motherboard to be quickly discharged.

[0138] As an example, this circuit allows for power-off isolation in electronic devices during standby mode. It utilizes the CPU's in-situ pins, a three-terminal adjustable shunt regulator, a comparator, a MOSFET, resistors, and power isolation devices to create an isolated discharge circuit. The main components include a comparator, a three-terminal adjustable shunt regulator, a MOSFET, and power isolation devices. This circuit is simple in structure and low in cost. It can solve problems such as slow discharge after a power outage in standby mode, leading to automatic power-on after a brief power failure, or problems caused by incomplete discharge after a power outage, resulting in the device failing to boot or damaging the motherboard, CPU, or other components when replacing them.

[0139] In one exemplary embodiment, an electronic device is provided, including a motherboard circuit and a motherboard power-off protection circuit connected to the motherboard circuit.

[0140] Among them, the motherboard power failure protection circuit refers to a module that controls the power supply through a dual mechanism of hardware presence detection and power failure detection. For example, it can be implemented by a combination circuit containing a comparator, MOSFET and power isolation device, and realize power supply control by detecting the hardware presence status and input voltage changes.

[0141] The motherboard circuit refers to the printed circuit board assembly in an electronic device that carries the core computing functions. For example, it can be implemented using a multi-layer circuit board structure that includes a central processing unit, memory slots and power interfaces, and the power supply circuit can be quickly cut off through a power isolation module.

[0142] For example, when device hardware 140 is removed or the input voltage falls below a set threshold, the hardware presence detection module 110 outputs a low-level signal to trigger the power isolation module to cut off the power supply circuit of the motherboard. For instance, in the scenario of removing a memory module, the detection switch circuit 111 transmits a low-level signal to the enable terminal of the power isolation device via a MOSFET, immediately disconnecting the electrical connection between the power output terminal and the input terminal. This process does not rely on the natural discharge of the capacitor but accelerates charge release by actively cutting off the power supply path.

[0143] In this embodiment, the problem of slow motherboard discharge after power failure of electronic devices is effectively solved. When the device hardware 140 is removed or the external power supply is abnormal, the motherboard power supply circuit can be cut off immediately, thereby improving the reliability of motherboard protection.

[0144] It should be noted that, Figures 1 to 3 The diagram shows some ports and connections for each module / unit. However, in practical applications, other connections for the ports of each module / unit can be configured according to actual needs. Other pins or ports not shown can be configured according to actual conditions. Figures 1 to 3 The examples shown are not intended to limit this application.

[0145] It is understandable that the above-mentioned hardware in-situ detection module 110, power failure detection module 120, and motherboard power isolation module 130 are included.

[0146] Other forms can also be used, not limited to those mentioned in the above embodiments, as long as they can achieve the functions of hardware presence detection, power failure detection, and motherboard power isolation.

[0147] The circuit described above can be applied to electronic devices or similar devices with motherboards, such as computers, mobile phones, tablets, or video game devices.

[0148] In the description of this specification, the references to terms such as "some embodiments," "other embodiments," "specific implementation," and "another implementation" refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example that are included in at least one embodiment or example of this application. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0149] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, article, or apparatus that includes said element.

[0150] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The various embodiments can be combined as needed, and the same or similar parts can be referred to each other.

[0151] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A main board power-off protection circuit, characterized in that, The motherboard circuit used in electronic devices includes a motherboard power-off protection circuit comprising: The hardware presence detection module has a first end for connecting to the device hardware of the electronic device; the hardware presence detection module outputs a low level when the device hardware is not present. The power-down detection module has a first terminal for receiving an input voltage and a second terminal for receiving a reference voltage. When the input voltage is lower than the reference voltage, the power-down detection module outputs a low level. The motherboard power isolation module has its detection terminals connected to the second terminal of the hardware presence detection module and the third terminal of the power failure detection module, respectively. The output terminal of the motherboard power isolation module is used to connect to the motherboard circuit and to power on / off the motherboard circuit. When the detection terminal of the motherboard power isolation module receives a low level output from the hardware presence detection module and / or power failure detection module, it shuts off the power supply path of the motherboard circuit.

2. The main board power-off protection circuit according to claim 1, characterized in that, The hardware in-situ detection module includes: The detection switch circuit has a first terminal for receiving the presence status signal of the device hardware; the second terminal of the detection switch circuit is connected to the detection terminal of the motherboard power isolation module. When the presence status signal is a high level indicating that the device hardware is in place, the detection switch circuit is turned on so that the detection terminal of the motherboard power isolation module receives a low level.

3. The main board power-off protection circuit according to claim 2, characterized in that, The detection switch circuit includes: A transistor unit, wherein the control terminal of the transistor unit is used to receive the in-situ status signal, the output terminal of the transistor unit is connected to the detection terminal of the motherboard power isolation module, and the input terminal of the transistor unit is used to receive a low level. When the presence status signal is a high level indicating that the device hardware is in place, the transistor unit is turned on so that the detection terminal of the motherboard power isolation module receives a low level.

4. The main board power-off protection circuit according to claim 3, characterized in that, The transistor unit includes: The first resistor has one end connected to the in-situ status signal; The MOSFET has its gate connected to the other end of the first resistor, its source grounded, and its drain connected to the detection terminal of the motherboard power isolation module.

5. The main board power-off protection circuit of claim 1, wherein, The power failure detection module includes: The reference voltage unit has a first terminal for receiving the input voltage and a second terminal for outputting a reference band voltage. The voltage comparison unit has a first terminal for receiving the input voltage, a second terminal for connecting to the second terminal of the reference voltage unit, and a third terminal for connecting to the detection terminal of the motherboard power isolation module.

6. The main board power-off protection circuit according to claim 5, characterized in that, The reference voltage unit includes: The shunt regulator has its first terminal connected to the input voltage. The second terminal of the shunt regulator is connected to the second terminal of the reference voltage unit; The third terminal of the shunt regulator is used for grounding.

7. The main board power-off protection circuit of claim 5, wherein, The voltage comparison unit includes: The comparator has a first terminal for receiving the input voltage; a second terminal for connecting to the second terminal of the reference voltage unit; a third terminal for connecting to the detection terminal of the motherboard power isolation module; and a power supply terminal for receiving the operating voltage.

8. The main board power-off protection circuit of claim 7, wherein, The power failure detection module also includes: The third resistor has one end connected to the input voltage and the other end connected to the first terminal of the comparator. The fourth resistor has one end connected to the other end of the third resistor and the first end of the comparator; the other end of the fourth resistor is used for grounding.

9. The main board power shutdown protection circuit of claim 1, wherein, The power isolation module includes power isolation devices; The enable terminal of the power isolation device is the detection terminal of the motherboard power isolation module; The power input terminal of the power isolation device is used to connect to the input voltage; The power output terminal of the power isolation device is the output terminal of the motherboard power isolation module; When the enable terminal of the power isolation device receives a low level, it enables the disconnection between the power input terminal and the power output terminal.

10. An electronic device, comprising: include: Motherboard circuitry; The motherboard power-off protection circuit as described in any one of claims 1-9; The motherboard power failure protection circuit is connected to the motherboard circuit.

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