An inverter brick with integrated boost function

Abstract

This invention proposes an inverter brick integrating Boost converter functionality, comprising a multi-functional water-cooled plate, integrated thin-film capacitors, a power module, three-phase components, fuses, and a drive control board. The multi-functional water-cooled plate integrates heat dissipation channels and a thin-film capacitor mounting cavity. The integrated thin-film capacitors, encapsulated within the mounting cavity, include a DC-LINK capacitor core and a Boost converter capacitor core, with the DC-LINK and Boost converter capacitor cores sharing a common negative copper busbar. The power module is mounted above the heat dissipation channels of the multi-functional water-cooled plate. The three-phase components, fuses, and drive control board are layered and mounted on the multi-functional water-cooled plate. This invention solves the problems of low integration and poor heat dissipation in existing technologies through the integrated multi-functional water-cooled plate and integrated thin-film capacitors, and a modular layout. It has significant advantages such as small size, high heat dissipation efficiency, and low cost, and is suitable for multi-in-one electric drive systems in new energy vehicles.

Description

Technical Field

[0001] This utility model relates to the field of electric drive system technology for new energy vehicles, and specifically to an inverter brick with integrated boost function. Background Technology

[0002] With the development of technology in the new energy vehicle industry, the electric drive system of new energy vehicles has evolved from three-in-one to multi-in-one, and the operating voltage has also increased from the 400V platform to the 800V platform. This has led to the need for the integration of a boost module inside the motor controller.

[0003] Currently, motor controllers for new energy vehicles generally adopt a discrete architecture. The discrete architecture has the following problems: 1. The structure is loose, each functional component is designed independently, the assembly process is complicated, and the cost is high; 2. Film capacitors dissipate heat through independent plastic shells and thermal pads, resulting in a long thermal resistance chain and significant temperature rise; 3. The heat dissipation system of the power module and the capacitor is separated, resulting in low cooling efficiency; 4. Repair is difficult, requiring the removal of multiple layers of components. Utility Model Content

[0004] In order to solve the technical problems existing in the background technology, this utility model proposes an inverter brick with integrated Boost function.

[0005] This utility model proposes an inverter brick with integrated Boost converter function, comprising:

[0006] The multi-functional water-cooled plate integrates heat dissipation channels and thin-film capacitor mounting cavity, and the coolant flow channels of the heat dissipation channels cover the upper surface of the thin-film capacitor mounting cavity.

[0007] An integrated film capacitor is encapsulated within a film capacitor mounting cavity; the integrated film capacitor includes a DC-LINK capacitor core and a Boost capacitor core, and the DC-LINK capacitor core and the Boost capacitor core share a common negative copper busbar;

[0008] The power module is installed above the heat dissipation channels of the multi-functional water-cooled plate;

[0009] The three-phase components, fuses, and drive control board are installed in layers on a multi-functional water-cooled plate.

[0010] Preferably, the multifunctional water-cooled plate is integrally formed into the heat dissipation channel and the thin-film capacitor mounting cavity by high pressure casting.

[0011] Preferably, the integrated film capacitor is fixed in the film capacitor mounting cavity by epoxy resin potting.

[0012] Preferably, the integrated thin-film capacitor further includes a positive copper busbar and a Boost positive copper busbar, and its DC-LINK capacitor core and Boost capacitor core are connected to the positive copper busbar, negative copper busbar and Boost positive copper busbar by welding.

[0013] Preferably, the interfaces of the positive copper busbar, negative copper busbar, and Boost positive copper busbar of the integrated thin-film capacitor are adjustable.

[0014] Preferably, the bottom of the power module is provided with a PIN-FIN heat dissipation structure, which is in direct contact with the heat dissipation channel.

[0015] Preferably, a sealing ring is provided between the power module and the cooling water channel.

[0016] Preferably, the multi-functional water-cooled plate is provided with a sealing groove; the sealing ring is embedded in the sealing groove of the multi-functional water-cooled plate.

[0017] Preferably, the three-phase component is integrally injection molded and includes a three-phase copper busbar, a current sensor core, and a Boost positive output copper busbar, wherein the three-phase copper busbar is electrically connected to the terminals of the power module.

[0018] Preferably, the interface direction and position of the three-phase copper busbar and the Boost positive output copper busbar of the three-phase component are adjustable.

[0019] Preferably, the fuse is mounted above the multi-functional water-cooled plate via a connector.

[0020] Preferably, the drive control board is mounted above the power module via a connector.

[0021] This invention integrates the cooling water channels and the integrated film capacitor mounting cavity into a multi-functional water-cooled plate. The multi-functional water-cooled plate serves as the integrated carrier, with a power module, three-phase components, fuse, and drive control board at the top, and a DC-LINK capacitor and a boost capacitor integrated into a single film capacitor at the bottom. This integrated cooling water channel and film capacitor mounting cavity eliminate the need for component positioning and assembly structures, as well as the film capacitor assembly process, improving production efficiency and product consistency. It also reduces the number of parts, allowing for a 20% reduction in the overall inverter brick structure space, resulting in a smaller and lighter product structure. Compared to existing structures requiring three sets of molds, the integrated design only requires one mold, reducing processing costs and improving product consistency. Furthermore, the cooling water channels simultaneously cover the power module and the integrated film capacitor, allowing direct cooling of both components, further reducing costs, decreasing thermal resistance, and improving the heat dissipation efficiency of the water-cooled plate. By integrating a multi-functional water-cooled plate, integrated thin-film capacitors, and modular layout, the problems of low integration and poor heat dissipation in existing technologies are solved. It has significant advantages such as small size, high heat dissipation efficiency, and low cost, and is suitable for multi-in-one electric drive systems in new energy vehicles. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of an inverter brick with integrated boost function proposed in this utility model;

[0023] Figure 2 An exploded view of an inverter brick with integrated Boost function proposed in this utility model;

[0024] Figure 3 This is a schematic diagram of the integrated thin-film capacitor and multifunctional water-cooled plate in an inverter brick with integrated boost function proposed in this utility model. Detailed Implementation

[0025] Reference Figure 1-3 This utility model proposes an inverter brick with integrated boost function, comprising: a multi-functional water-cooled plate 1, an integrated thin-film capacitor 2, a power module 3, a three-phase assembly 4, a fuse 5, and a drive control board 6, wherein:

[0026] The multi-functional water-cooled plate 1 is integrally formed by high pressure casting, forming a heat dissipation channel 11 and a thin film capacitor mounting cavity 12, and the coolant flow channel of the heat dissipation channel 11 covers the upper surface of the thin film capacitor mounting cavity 12.

[0027] The integrated film capacitor 2 is fixed inside the film capacitor mounting cavity 12 by epoxy resin potting. The integrated film capacitor 2 includes a DC-LINK capacitor core 21 and a Boost capacitor core 22, and the DC-LINK capacitor core 21 and the Boost capacitor core 22 share a negative copper busbar 24. Specifically, the integrated film capacitor 2 also includes a positive copper busbar 23 and a Boost positive copper busbar 25. During installation, the two ends of the DC-LINK capacitor core 21 are first soldered to the positive copper busbar 23 and the negative copper busbar 24, respectively, and the two ends of the Boost capacitor core 22 are soldered to the Boost positive copper busbar 25 and the negative copper busbar 24, respectively; finally, it is potted into the film capacitor mounting cavity 12 with epoxy resin. In practical operation, the positive copper busbar 23, the negative copper busbar 24 and the power module 3 terminals are electrically connected through connectors; the Boost positive copper busbar 25 and the Boost positive input copper busbar (not shown in the diagram) are electrically connected through connectors, and the Boost positive input copper busbar (not shown in the diagram) needs to be electrically connected to the relay (not shown in the diagram) through connectors.

[0028] Furthermore, the interfaces of the positive copper busbar 23, negative copper busbar 24, and Boost positive copper busbar 25 of the integrated thin-film capacitor 2 are adjustable to adapt to filter components and Boost input copper busbars of different specifications, so as to achieve platform compatibility.

[0029] The power module 3 is used for power conversion. It is installed above the heat dissipation channel 11 of the multi-functional water-cooled plate 1, and the PIN-FIN heat dissipation structure at the bottom of the power module 3 is in direct contact with the heat dissipation channel 11 to achieve efficient heat dissipation.

[0030] Furthermore, a sealing ring 7 for sealing the coolant is provided between the power module 3 and the heat dissipation channel 11. Specifically, the sealing ring 7 is embedded in the sealing groove provided on the multi-functional water-cooled plate 1.

[0031] The three-phase component 4 is integrally injection molded and mounted on top of the multi-functional water-cooled plate 1. The three-phase component 4 includes a three-phase copper busbar, a current sensor core, and a Boost converter positive output copper busbar. The three-phase copper busbar is electrically connected to the terminals of the power module 3, and the Boost converter positive output copper busbar is electrically connected to the relay (not shown in the diagram) via a connector. Furthermore, the interface direction and position of the three-phase copper busbar and the Boost converter positive output copper busbar of the three-phase component 4 are adjustable to adapt to the connection requirements of different motors and Boost converter circuits, achieving platform compatibility.

[0032] Fuse 5 is mounted above the multi-functional water-cooled plate 1 via connectors. The input and output copper busbars of fuse 5 are electrically connected to the three-phase copper busbars via connectors for circuit protection. Specifically, the input and output copper busbars of fuse 5 are bolted to the three-phase copper busbars to form a detachable electrical connection for easy maintenance and replacement.

[0033] The drive control board 6 is mounted on top of the power module 3 via connectors to achieve signal transmission and electrical isolation. Specifically, the drive control board 6 is mounted on top of the power module 3 via plug-in or screw fixing for easy maintenance and replacement.

[0034] As can be seen from the above, this utility model integrates the heat dissipation channel 11 and the integrated film capacitor mounting cavity 12 into a multi-functional water-cooled plate, using the multi-functional water-cooled plate as the integrated carrier. The upper end is equipped with a power module, three-phase components, fuses, and drive control board, while the lower end is equipped with an integrated film capacitor that integrates a DC-LINK capacitor and a Boost capacitor. The multi-functional water-cooled plate integrates the cooling channel and the film capacitor mounting cavity into one unit, eliminating the need for positioning and assembly structures between parts and the film capacitor assembly process, thus improving production efficiency and product consistency. At the same time, it reduces the number of parts, allowing the overall structure space of the inverter brick to be reduced by 20%, resulting in a smaller and lighter product structure. Compared with the existing structure that requires the design of three sets of molds, the integrated design only requires one mold to complete the processing, reducing processing costs and improving product consistency. Furthermore, the heat dissipation channel 11 covers both the power module 3 and the integrated film capacitor 2, so the heat dissipation channel can be directly used for the heat dissipation of the integrated film capacitor and the power module, which not only reduces costs but also reduces thermal resistance and improves the heat dissipation utilization rate of the water-cooled plate. By integrating a multi-functional water-cooled plate, integrated thin-film capacitors, and modular layout, the problems of low integration and poor heat dissipation in existing technologies are solved. It has significant advantages such as small size, high heat dissipation efficiency, and low cost, and is suitable for multi-in-one electric drive systems in new energy vehicles.

[0035] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. An inverter brick integrated with a Boost function, characterized in that, include: The multi-functional water-cooled plate (1) integrates a heat dissipation channel (11) and a thin film capacitor mounting cavity (12), and the coolant flow channel of the heat dissipation channel (11) covers the upper surface of the thin film capacitor mounting cavity (12). An integrated thin-film capacitor (2) is encapsulated in a thin-film capacitor mounting cavity (12); the integrated thin-film capacitor (2) includes a DC-LINK capacitor core (21) and a Boost capacitor core (22), and the DC-LINK capacitor core (21) and the Boost capacitor core (22) share a negative copper busbar (24). The power module (3) is installed above the heat dissipation channel (11) of the multi-functional water-cooled plate (1); The three-phase components (4), fuses (5) and drive control board (6) are installed on the multi-functional water-cooled plate (1) in layers.

2. The integrated Boost function inverter brick of claim 1, wherein, The multi-functional water-cooled plate (1) is integrally formed by high pressure casting to form a heat dissipation channel (11) and a thin film capacitor mounting cavity (12).

3. The integrated Boost function inverter brick of claim 1, wherein, The integrated film capacitor (2) is fixed in the film capacitor mounting cavity (12) by epoxy resin potting.

4. The integrated Boost function inverter brick of claim 1, wherein, The integrated film capacitor (2) also includes a positive copper busbar (23) and a Boost positive copper busbar (25), and its DC-LINK capacitor core (21) and Boost capacitor core (22) are connected to the positive copper busbar (23), the negative copper busbar (24) and the Boost positive copper busbar (25) by welding.

5. The integrated Boost function inverter brick of claim 4, wherein, The interfaces of the positive copper busbar (23), negative copper busbar (24), and Boost positive copper busbar (25) of the integrated thin film capacitor (2) are adjustable.

6. The integrated Boost function inverter brick of claim 1, wherein, The bottom of the power module (3) is provided with a PIN-FIN heat dissipation structure, which is in direct contact with the heat dissipation channel (11).

7. The integrated Boost function inverter brick of claim 1, wherein, A sealing ring (7) is provided between the power module (3) and the heat dissipation channel (11).

8. The integrated Boost function inverter brick of claim 7, wherein, The multi-functional water-cooled plate (1) is provided with a sealing groove; the sealing ring (7) is embedded in the sealing groove of the multi-functional water-cooled plate (1).

9. The integrated Boost function inverter brick of claim 1, wherein, The three-phase component (4) is integrally injection molded and includes a three-phase copper busbar, a current sensor core and a Boost positive output copper busbar, wherein the three-phase copper busbar is electrically connected to the terminals of the power module (3).

10. The integrated Boost function inverter brick of claim 9, wherein, The interface direction and position of the three-phase copper busbar and the Boost positive output copper busbar of the three-phase component (4) are adjustable.

11. The integrated Boost function inverter brick of claim 1, wherein, The fuse (5) is mounted above the multi-functional water-cooled plate (1) via a connector.

12. The integrated Boost function inverter brick of claim 1, wherein, The drive control board (6) is mounted on top of the power module (3) via a connector.

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