Anti-crosstalk structure for optical modules and ultra-low speed optical modules

Abstract

This disclosure provides an anti-crosstalk structure for optical modules. The structure includes a printed circuit board (PCB), a transmitter assembly, and a receiver assembly, with the transmitter and receiver assemblies respectively fixed to the PCB. The transmitter assembly includes a transmitter shield and a first fiber optic array module. The transmitter shield has a first receiving cavity in which a portion of the first fiber optic array module is housed. The shield covers its periphery and is connected to the PCB. The receiver assembly includes a receiver shield and a second fiber optic array module. The receiver shield has a second receiving cavity in which a portion of the second fiber optic array module is housed. The shield covers its periphery and is connected to the PCB. This structure, through the cooperation of the transmitter and receiver shields, effectively prevents ambient light at the transmitter from entering the receiver chip, avoids electrical signal output when there is no light input at the receiver, and prevents mutual interference between the two optical signals at the receiver, thus solving the crosstalk problem of ultra-low-speed optical modules in the DC-50Mbps rate range.

Description

Technical Field

[0001] This disclosure relates to the technical field of ultra-low speed optical modules, and in particular to an anti-crosstalk structure for optical modules and an ultra-low speed optical module. Background Technology

[0002] As an important component of the optical module technology field, the ultra-low speed dual-channel transceiver integrated optical module has a rate range of DC to 50Mbps and is capable of stable and fast transmission of ultra-low speed signals such as clock signals and control signals. It has wide and critical applications in fields such as aviation and ships where the stability of signal transmission is extremely important.

[0003] However, during the operation of the optical module, when the optical chip at the transmitting end emits an optical signal, due to the lack of effective isolation and shielding measures, some of the optical signal is prone to leakage. This leaked optical signal is highly likely to enter the receiving end, interfering with the normal operation of the receiving end's optical chip. Simultaneously, various stray lights from the surrounding environment, such as natural light and light emitted from other light sources, may also enter both the transmitting and receiving ends. Ambient light entering the transmitting end affects the normal transmission of the optical signal, causing changes in parameters such as the intensity and phase of the optical signal; while ambient light entering the receiving end may superimpose with the effective optical signal, causing the receiving end to generate an electrical signal output when there is no light input, or to be unable to accurately identify and receive the effective optical signal when there is light input, thus affecting the accuracy of the information transmitted by the optical module. Utility Model Content

[0004] The purpose of this disclosure is to overcome the shortcomings of the prior art and to provide an anti-crosstalk structure for optical modules and an ultra-low speed optical module that prevents crosstalk between optical signals by the cooperation of a transmitter shield and a receiver shield.

[0005] The purpose of this disclosure is achieved through the following technical solution:

[0006] An anti-crosstalk structure for an optical module includes a printed circuit board, a transmitter assembly, and a receiver assembly. The transmitter assembly and the receiver assembly are respectively fixed to the printed circuit board. The transmitter assembly includes a transmitter shield and a first fiber array module. The transmitter shield has a first receiving cavity, and a portion of the first fiber array module is housed in the first receiving cavity. The transmitter shield covers the periphery of the first fiber array module to block light leakage from the first fiber array module. The transmitter shield is connected to the printed circuit board.

[0007] The receiver assembly includes a receiver shield and a second fiber array module. The receiver shield has a second receiving cavity, and a portion of the second fiber array module is housed in the second receiving cavity. The receiver shield covers the periphery of the second fiber array module to shield the leaked light from the second fiber array module and ambient light. The receiver shield is connected to the printed circuit board.

[0008] In one embodiment, the first fiber array module includes a transmitter optical chip and a transmitter fiber array. The transmitter optical chip is connected to the transmitter fiber array and is housed in the first receiving cavity. The edge of the transmitter shield is aligned with the edge of the transmitter fiber array, and the inner wall of the transmitter shield abuts against the outer surface of the transmitter fiber array.

[0009] In one embodiment, the second fiber array module includes a receiver fiber array and at least one receiver optical chip. The receiver optical chip is connected to the receiver fiber array and housed in the second receiving cavity. The edge of the receiver shield is aligned with the edge of the receiver fiber array, and the inner wall of the receiver shield abuts against the outer surface of the receiver fiber array.

[0010] In one embodiment, the second fiber array module includes two receiving optical chips, and the receiving component further includes an isolator disposed in the second accommodating cavity. The isolator is connected to the receiving shield and is disposed on the center line of the receiving shield, so that the second accommodating cavity is divided into two independent optical channels; each receiving optical chip is correspondingly disposed in one of the independent optical channels.

[0011] In one embodiment, one end of the isolator is connected to the receiving end shield, and the other end of the isolator abuts against the second fiber array module.

[0012] In one embodiment, the transmitter shield has a first U-shaped through slot, which is connected to the first receiving cavity, and the opening of the first U-shaped through slot faces the first fiber array module.

[0013] In one embodiment, the receiving end shield has a second U-shaped through slot, which is connected to the second receiving cavity, and the opening of the second U-shaped through slot faces the second fiber array module.

[0014] In one embodiment, a UV-curable adhesive layer is coated between the contact surfaces of the receiver shield and the transmitter shield and the printed circuit board.

[0015] In one embodiment, a black adhesive sealant layer is coated between the contact surfaces of the receiver shield and the transmitter shield and the printed circuit board.

[0016] This application also provides an ultra-low speed optical module, including the optical module anti-crosstalk structure described in any embodiment.

[0017] Compared with the prior art, this disclosure has at least the following advantages:

[0018] The aforementioned anti-crosstalk structure for optical modules, through the cooperation of the transmitter and receiver shields, effectively prevents ambient light at the transmitter from entering the receiver chip, thus avoiding electrical signal output from the receiver when there is no light input. Simultaneously, it prevents mutual interference between the two optical signals at the receiver, ensuring that the receiver can correctly receive waveform signals. This solves the crosstalk problem generated when ultra-low-speed optical modules transmit optical signals within the DC-50Mbps rate range, enabling effective and stable transmission within this rate range. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this disclosure and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of an anti-crosstalk structure for an optical module according to one embodiment;

[0021] Figure 2 for Figure 1 A partial structural diagram of the optical module anti-crosstalk structure is shown.

[0022] Figure 3 for Figure 1 Another partial structural diagram of the optical module anti-crosstalk structure shown. Detailed Implementation

[0023] To facilitate understanding of this disclosure, a more complete description will be given below with reference to the accompanying drawings, which illustrate preferred embodiments of the present disclosure. However, this disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure.

[0024] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0026] To better understand the technical solutions and beneficial effects of this disclosure, the following detailed description is provided in conjunction with specific embodiments:

[0027] like Figure 1 As shown, an embodiment of the optical module anti-crosstalk structure 10 disclosed herein includes a printed circuit board 100, a transmitter assembly 200, and a receiver assembly 300. The transmitter assembly 200 and the receiver assembly 300 are respectively fixed to the printed circuit board 100. Please refer to the accompanying drawings. Figure 2 and Figure 3 The transmitter assembly 200 includes a transmitter shield 210 and a first fiber array module 220. The transmitter shield 210 has a first receiving cavity 2101. A portion of the first fiber array module 220 is housed in the first receiving cavity 2101. The transmitter shield 210 covers the periphery of the first fiber array module 220 to block light leakage from the first fiber array module 220. The transmitter shield 210 is connected to the printed circuit board 100.

[0028] The receiver assembly 300 includes a receiver shield 310 and a second fiber array module 320. The receiver shield 310 has a second receiving cavity 3101, and a portion of the second fiber array module 320 is housed in the second receiving cavity 3101. The receiver shield 310 covers the periphery of the second fiber array module 320 to shield the leakage light and ambient light from the second fiber array module 320. The receiver shield 310 is connected to the printed circuit board 100.

[0029] In this embodiment, the transmitter shield 210 has a first receiving cavity 2101, in which a portion of the first fiber array module 220 is housed. The transmitter shield 210 covers the periphery of the first fiber array module 220 and is connected to the printed circuit board 100. This allows the transmitter shield 210 to effectively enclose the optical chip and fiber array assembly of the transmitter within a certain area without interfering with other optical components. When the transmitting optical chip emits an optical signal, the transmitter shield 210 prevents light leakage, avoiding light overflow from the transmitter into the receiver, and also blocks ambient light from entering the transmitter and affecting the normal emission of the optical signal. On the other hand, the receiver shield 310 has a second receiving cavity 3101, in which a portion of the second fiber array module 320 is housed. The receiver shield 310 covers the periphery of the second fiber array module 320 and is connected to the printed circuit board 100. This structure effectively encloses the second fiber array module 320 within a certain area, preventing light interference from sources other than fiber optic transmission from affecting the receiving optical chip, thereby blocking light overflowing from the transmitter and the influence of ambient light on the receiving optical chip. Furthermore, the transmitter shield 210 and the receiver shield 310 cooperate with each other. Working in the manner described above, they effectively solve the crosstalk problem generated when the ultra-low-speed optical module transmits optical signals within the DC-50Mbps rate range, thus ensuring stable and complete signal transmission.

[0030] The aforementioned anti-crosstalk structure 10 for the optical module, through the cooperation of the transmitter shield 210 and the receiver shield 310, effectively prevents ambient light at the transmitter from entering the receiver chip, thus avoiding electrical signal output at the receiver when there is no light input. Simultaneously, it prevents mutual interference between the two optical signals at the receiver, ensuring that the receiver can correctly receive waveform signals. This solves the crosstalk problem generated when the ultra-low-speed optical module transmits optical signals within the DC-50Mbps rate range, enabling the ultra-low-speed optical module to achieve effective and stable transmission within this rate range.

[0031] like Figures 1 to 3As shown, in one embodiment, the first fiber array module 220 includes a transmitter optical chip 221 and a transmitter fiber array 222. The transmitter optical chip 221 is connected to the transmitter fiber array 222 and is housed within a first receiving cavity 2101. The edge of the transmitter shield 210 is aligned with the edge of the transmitter fiber array 222, and the inner wall of the transmitter shield 210 abuts against the outer side of the transmitter fiber array 222. In this embodiment, the transmitter optical chip 221 is housed within the first receiving cavity 2101, and the transmitter shield 210 tightly covers it, providing a sealed environment for the transmitter optical chip 221, effectively reducing the influence of external environmental factors, thereby ensuring the stability of the transmitter optical chip 221's operating state and making the emitted optical signal more stable. The edge of the transmitter shield 210 is aligned with the edge of the transmitter fiber array 222, and the inner wall abuts against the side of the transmitter fiber array 222. This precise alignment and tight fit allows the optical signal emitted by the transmitting optical chip 221 to be coupled more accurately to the transmitting fiber array 222, reducing signal loss during coupling and improving transmission efficiency. Simultaneously, the transmitting shield 210 prevents light leakage from the connection point between the transmitting fiber array 222 and the optical chip, further enhancing the confidentiality and security of the optical signal.

[0032] like Figures 1 to 3 As shown, in one embodiment, the second fiber array module 320 includes a receiving fiber array 321 and at least one receiving optical chip 322. The receiving optical chip 322 is connected to the receiving fiber array 321 and is housed within a second receiving cavity 3101. The edge of the receiving shield 310 is aligned with the edge of the receiving optical chip 322, and the inner wall of the receiving shield 310 abuts against the outer side of the receiving fiber array 321. In this embodiment, the edge of the receiving shield 310 is aligned with the edge of the receiving optical chip 322, and the inner wall abuts against the side of the receiving fiber array 321. The close cooperation between the receiving shield 310 and the receiving fiber array 321 reduces the uncertainty of the optical signal in the transmission path, improves the coupling efficiency of the optical signal, and allows more optical signals to be effectively received and converted by the receiving optical chip 322, thereby improving the receiving sensitivity of the optical module. The close cooperation between the receiving shield 310 and the receiving fiber array 321 further enhances the ability to prevent optical crosstalk and external optical interference.

[0033] like Figures 1 to 3As shown, in one embodiment, the second fiber array module 320 includes two receiving optical chips 322, and the receiving assembly 300 further includes an isolator 330 disposed within the second receiving cavity 3101. The isolator 330 is connected to the receiving shield 310 and is disposed on the centerline of the receiving shield 310, thereby dividing the second receiving cavity 3101 into two independent optical channels; each receiving optical chip 322 is correspondingly disposed in one independent optical channel. In this embodiment, the isolator 330 divides the second receiving cavity 3101 into two independent optical channels, so that each receiving optical chip 322 is in a relatively independent space. In this way, optical signals entering from different directions or different sources are strictly confined to their respective channels for transmission, reducing the possibility of optical signals coupling and interfering with each other between the two channels, ensuring that each receiving optical chip 322 can accurately receive the corresponding optical signal, thereby improving the accuracy and reliability of optical signal transmission. After the isolator 330 divides the second receiving cavity 3101 into two independent optical channels, optical signals entering from different directions or from different sources are strictly restricted to their respective channels for transmission, reducing the possibility of optical signals coupling and interfering with each other between the two channels.

[0034] like Figures 1 to 3 As shown, in one embodiment, one end of the isolator 330 is connected to the receiver shield 310, and the other end of the isolator 330 abuts against the second fiber array module 320. In this embodiment, the isolator 330 divides the second receiving cavity 3101 into two independent optical channels, forming a relatively independent and closed optical signal receiving environment. Since each receiver optical chip 322 is correspondingly disposed in an independent optical channel, when the optical signal enters the receiver assembly 300, the precise separation barrier formed by the isolator 330 can ensure that optical signals entering from different directions or from different sources strictly enter the corresponding receiver optical chip 322 through the predetermined channel, further enhancing the directionality of optical signal transmission, greatly reducing the scattering and random reflection of optical signals during transmission, and also reducing the possibility of optical signals coupling and interfering with each other between the two channels, ensuring that each receiver optical chip 322 can accurately receive the corresponding optical signal, thereby improving the accuracy and reliability of optical signal transmission.

[0035] like Figures 1 to 3As shown, in one embodiment, the transmitting shield 210 has a first U-shaped through slot 2102, which connects to the first receiving cavity 2101. The opening of the first U-shaped through slot 2102 faces the first fiber array module 220. In this embodiment, the opening of the first U-shaped through slot 2102 facing the first fiber array module 220 provides more precise guidance for the optical signal coupling between the transmitting optical chip 221 and the transmitting fiber array 222. During optical signal transmission, light needs to be accurately coupled from the transmitting optical chip 221 to the transmitting fiber array 222. The presence of the first U-shaped through slot 2102 can constrain and guide the propagation path of the optical signal, enabling the optical signal to enter the transmitting fiber array 222 more concentratedly and accurately, reducing scattering and loss of the optical signal during coupling, thereby improving the coupling efficiency of the optical signal.

[0036] like Figures 1 to 3 As shown, in one embodiment, the receiving end shield 310 has a second U-shaped through slot 3102, which connects to the second receiving cavity 3101. The opening of the second U-shaped through slot 3102 faces the second fiber array module 320. In this embodiment, the opening of the second U-shaped through slot 3102 facing the second fiber array module 320 plays a role in precise guidance when receiving optical signals. When an external optical signal is transmitted to the receiving end through the optical fiber, the second U-shaped through slot 3102 can constrain the propagation path of the optical signal, making it propagate more concentratedly towards the receiving end optical chip 322. This helps to reduce the scattering and deflection of the optical signal during transmission, ensuring that more optical signals can accurately reach the receiving end optical chip 322, thereby improving the optical signal reception efficiency, enabling the receiving end to capture effective optical signals more clearly, and thus enhancing the optical module's ability to receive weak optical signals.

[0037] like Figures 1 to 3 As shown, in one embodiment, both the receiving shield 310 and the transmitting shield 210 are coated with a UV-curable adhesive layer between their contact surfaces and the printed circuit board 100. In this embodiment, the UV-curable adhesive layer greatly enhances the connection stability between the receiving shield 310, the transmitting shield 210, and the printed circuit board 100. During the operation of the optical module, it is easily affected by various factors such as vibration, impact, and temperature changes, which can lead to loosening or displacement between the shield and the printed circuit board. The UV-curable adhesive layer forms a high-strength adhesive layer after curing, tightly bonding the shield and the printed circuit board together. This effectively resists interference from external factors, ensuring that the shield is always in the correct position, continuously performing its anti-crosstalk function, and guaranteeing stable optical signal transmission.

[0038] like Figures 1 to 3As shown, in one embodiment, a black adhesive sealant layer is coated between the contact surfaces of the receiver shield 310 and the transmitter shield 210 and the printed circuit board 100. In this embodiment, the black adhesive sealant layer forms a closed barrier after curing, which can tightly adhere to the contact surfaces of the receiver shield 310, the transmitter shield 210 and the printed circuit board 100, effectively filling any small gaps that may exist between them. Because the black adhesive sealant layer has good electromagnetic shielding performance, it can absorb and reflect electromagnetic waves, reducing electromagnetic radiation leakage and the intrusion of external electromagnetic waves. Therefore, by coating the contact surfaces of the receiver shield 310, the transmitter shield 210 and the printed circuit board 100 with a black adhesive sealant layer, the electromagnetic shielding capability of the entire anti-crosstalk structure is further enhanced, effectively reducing the impact of electromagnetic interference on optical signal transmission, thereby ensuring the accuracy and stability of the optical signal during transmission.

[0039] This application also provides an ultra-low speed optical module, including an anti-crosstalk structure 10 for optical modules according to any embodiment. In this embodiment, since the transmitter shield 210 has a first receiving cavity 2101, a portion of the first fiber array module 220 is housed in this cavity, and the transmitter shield 210 covers the periphery of the first fiber array module 220 and is connected to the printed circuit board 100, the transmitter shield 210 can effectively enclose the optical chip and fiber array assembly of the transmitter in a certain area without interfering with other optical components. When the transmitting optical chip emits an optical signal, the transmitter shield 210 can prevent light leakage, avoid the light generated by the transmitter from overflowing into the receiver, and also block ambient light from entering the transmitter and affecting the normal emission of the optical signal. On the other hand, the receiver shield 310 has a second receiving cavity 3101, a portion of the second fiber array module 320 is housed in the second receiving cavity 3101, and the receiver shield 310 covers the periphery of the second fiber array module 320 and is connected to the printed circuit board 100. This structure effectively encloses the second fiber array module 320 within a certain area, preventing light interference from sources other than fiber optic transmission from affecting the receiving optical chip, thereby blocking light overflowing from the transmitter and the influence of ambient light on the receiving optical chip. Furthermore, the transmitter shield 210 and the receiver shield 310 cooperate with each other. Working in the manner described above, they effectively solve the crosstalk problem generated when the ultra-low-speed optical module transmits optical signals within the DC-50Mbps rate range, thus ensuring stable and complete signal transmission.

[0040] Compared with the prior art, this disclosure has at least the following advantages:

[0041] The aforementioned anti-crosstalk structure 10 for the optical module, through the cooperation of the transmitter shield 210 and the receiver shield 310, effectively prevents laser light emitted from the transmitter and ambient light from entering the receiver chip, thus avoiding electrical signal output from the receiver when there is no light input. Simultaneously, it prevents mutual interference between the two optical signals at the receiver, ensuring that the receiver can correctly receive waveform signals. This solves the crosstalk problem generated when the ultra-low-speed optical module transmits optical signals within the DC-50Mbps rate range, enabling the ultra-low-speed optical module to achieve effective and stable transmission within this rate range.

[0042] The embodiments described above are merely illustrative of several implementations of this disclosure, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the disclosed patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this disclosure, and these all fall within the protection scope of this disclosure. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. An anti-crosstalk structure for an optical module, comprising a printed circuit board, a transmitter assembly, and a receiver assembly, wherein the transmitter assembly and the receiver assembly are respectively fixed to the printed circuit board, characterized in that, The transmitter assembly includes a transmitter shield and a first fiber optic array module. The transmitter shield has a first receiving cavity, in which a portion of the first fiber optic array module is housed. The transmitter shield covers the periphery of the first fiber optic array module to prevent light leakage. The transmitter shield is connected to the printed circuit board. The receiver assembly includes a receiver shield and a second fiber array module. The receiver shield has a second receiving cavity, and a portion of the second fiber array module is housed in the second receiving cavity. The receiver shield covers the periphery of the second fiber array module to shield the leaked light from the second fiber array module and ambient light. The receiver shield is connected to the printed circuit board.

2. The light module anti-crosstalk structure according to claim 1, characterized in that, The first fiber array module includes a transmitter optical chip and a transmitter fiber array. The transmitter optical chip is connected to the transmitter fiber array and is housed in the first receiving cavity. The edge of the transmitter shield is aligned with the edge of the transmitter fiber array, and the inner wall of the transmitter shield abuts against the outer surface of the transmitter fiber array.

3. The light module anti-cross talk structure according to claim 1, wherein, The second fiber array module includes a receiver fiber array and at least one receiver optical chip. The receiver optical chip is connected to the receiver fiber array and housed in the second receiving cavity. The edge of the receiver shield is aligned with the edge of the receiver fiber array, and the inner wall of the receiver shield abuts against the outer surface of the receiver fiber array.

4. The light module crosstalk prevention structure according to claim 3, characterized in that, The second fiber array module includes two receiving optical chips. The receiving component also includes an isolator disposed in the second accommodating cavity. The isolator is connected to the receiving shield and is disposed on the center line of the receiving shield, so that the second accommodating cavity is divided into two independent optical channels. Each receiving optical chip is correspondingly disposed in one of the independent optical channels.

5. The optical module crosstalk prevention structure according to claim 4, wherein One end of the isolator is connected to the receiving end shield, and the other end of the isolator abuts against the second fiber array module.

6. The light module anti-cross talk structure according to claim 1, wherein, The transmitter shield has a first U-shaped through slot, which is connected to the first receiving cavity, and the opening of the first U-shaped through slot faces the first fiber array module.

7. The light module crosstalk prevention structure according to claim 1, wherein The receiving end shield has a second U-shaped through slot, which is connected to the second receiving cavity, and the opening of the second U-shaped through slot faces the second fiber array module.

8. The light module crosstalk prevention structure according to claim 1, wherein, The contact surfaces between the receiver shield and the transmitter shield and the printed circuit board are coated with a UV-curable adhesive layer.

9. The optical module crosstalk prevention structure according to claim 8, wherein A black sealant layer is coated between the contact surfaces of the receiver shield and the transmitter shield and the printed circuit board.

10. An ultralow-speed optical module characterized by comprising: Includes the optical module anti-crosstalk structure as described in any one of claims 1 to 9.

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