Speaker modules and electronic devices

Abstract

This application provides a loudspeaker module and an electronic device. The loudspeaker module includes a loudspeaker driver and a cabinet. The loudspeaker driver has a diaphragm, a first outer peripheral side, and a second outer peripheral side, which are perpendicularly connected to the diaphragm. The cabinet is located on one side of the loudspeaker driver and faces the diaphragm. An edge region of the loudspeaker driver facing the cabinet is connected to the cabinet to enclose and form a sound outlet channel communicating with the diaphragm. A barrier is formed on one side of the cabinet, and the barrier is provided with a sound outlet hole connected to the sound outlet channel. At least a portion of the barrier is positioned opposite to and connected to the second outer peripheral side. The cabinet also has a third outer peripheral side, which is flush with the first outer peripheral side. At least one outer peripheral side of the cabinet does not protrude outward from the loudspeaker driver, which can reduce the space occupied by the cabinet in the direction parallel to the diaphragm of the loudspeaker driver. Thus, the size of the loudspeaker driver can be increased without changing the size of the loudspeaker module.

Description

Technical Field

[0001] This application relates to the field of loudspeaker technology, and in particular to a loudspeaker module and electronic device. Background Technology

[0002] A speaker module typically consists of a speaker driver and a cabinet connected to the speaker driver, with the inner periphery of the cabinet connected to the outer periphery of the speaker driver. However, the portion of the cabinet protruding from the speaker driver occupies a significant amount of space within the speaker module, limiting the size of the speaker driver and reducing its effective vibrating area. This makes it difficult to improve the sound quality, volume, and other performance characteristics of the speaker module, thus failing to meet users' growing demand for high-quality audio. Utility Model Content

[0003] This application provides a speaker module and an electronic device for increasing the vibration area of ​​a single speaker unit while keeping the size of the speaker module constant.

[0004] In a first aspect, a speaker module is provided, comprising:

[0005] A loudspeaker unit, the loudspeaker unit having a diaphragm, at least one first outer peripheral side and at least one second outer peripheral side, the first outer peripheral side and the second outer peripheral side being perpendicularly connected to the diaphragm respectively;

[0006] The enclosure is located on one side of the speaker unit and opposite the diaphragm. The edge region of the speaker unit facing the enclosure is connected to the enclosure to form a sound outlet channel communicating with the diaphragm. One side of the enclosure extends to form a barrier. The barrier is provided with a sound outlet hole connected to the sound outlet channel. At least a portion of the barrier is opposite to and connected to the second outer peripheral side. The enclosure is also provided with at least one third outer peripheral side, which is flush with the first outer peripheral side.

[0007] In this embodiment, the loudspeaker unit has at least one first outer peripheral side, and the third outer peripheral side of the enclosure is flush with the first outer peripheral side. At least one outer peripheral side of the enclosure does not protrude beyond the loudspeaker unit, reducing the space occupied by the enclosure in the direction parallel to the diaphragm of the loudspeaker unit. Thus, without changing the size of the loudspeaker module, the size of the loudspeaker unit can be increased, thereby increasing the size of the diaphragm and consequently increasing the effective vibrating area of ​​the loudspeaker unit, improving the performance of the loudspeaker module. Furthermore, due to the increased size of the loudspeaker unit, the sizes of structures such as the voice coil and magnet within the loudspeaker unit can also be increased accordingly, further improving the sound quality of the loudspeaker module.

[0008] In some embodiments, the loudspeaker unit has multiple first outer peripheral sides, and the enclosure is provided with multiple third outer peripheral sides, with the multiple third outer peripheral sides being flush with the multiple first outer peripheral sides.

[0009] It should be noted that in the embodiments of this application, the loudspeaker unit has a rectangular cross-section and four outer peripheral sides. In some cases, the loudspeaker unit may have two first outer peripheral sides, which can be connected perpendicularly or arranged in parallel, and the enclosure may have two corresponding third outer peripheral sides; the loudspeaker unit may have two second outer peripheral sides; or the loudspeaker unit may have one second outer peripheral side, in which case the remaining outer peripheral side of the loudspeaker unit may not be flush with the outer peripheral side of the enclosure. In other cases, the loudspeaker unit may have three first outer peripheral sides, which can be connected perpendicularly in sequence, and the enclosure may have three corresponding third outer peripheral sides; the loudspeaker unit may have one second outer peripheral side. In these embodiments, when the loudspeaker unit has three first outer peripheral sides, the space occupied by the enclosure is small in the direction parallel to the diaphragm, thus maximizing the size of the loudspeaker unit; when the loudspeaker unit has two first outer peripheral sides, the space occupied by the enclosure increases, and the size of the loudspeaker unit decreases; when the loudspeaker unit has one first outer peripheral side, the space occupied by the enclosure is even larger, and the size of the loudspeaker unit is further reduced. In other words, the more first outer peripheral sides the loudspeaker unit has, the smaller the space occupied by the enclosure, and the larger the size of the loudspeaker unit can be accordingly increased.

[0010] In some embodiments, the cross-section of the speaker unit may also be pentagonal, hexagonal, etc., but this application does not impose any limitations on these embodiments.

[0011] By having the loudspeaker driver have multiple first outer peripheral sides and making the multiple third outer peripheral sides of the enclosure flush with each of the multiple first outer peripheral sides, the space occupied by the enclosure in the direction parallel to the diaphragm of the loudspeaker driver can be further reduced. In this way, without changing the size of the loudspeaker module, the size of the loudspeaker driver can be maximized, thereby further increasing the effective vibration area of ​​the loudspeaker driver and improving the performance of the loudspeaker module.

[0012] In this embodiment of the application, the loudspeaker unit has a rectangular cross-section and has three first outer peripheral side surfaces and one second outer peripheral side surface. At this time, the enclosure has three third outer peripheral side surfaces, that is, three of the four outer peripheral side surfaces of the enclosure are flush with the three first outer peripheral side surfaces of the loudspeaker unit, and the remaining outer peripheral side surface of the enclosure is provided with a barrier.

[0013] In one possible implementation, the enclosure has a first side facing and close to the speaker unit, the first side being connected to the third outer peripheral side, and the edge of the first side near the third outer peripheral side having a first welding area for connection with the speaker unit.

[0014] Welding the first welding area of ​​the enclosure to the speaker driver improves the connection stability between the enclosure and the speaker driver. Furthermore, welding the enclosure to the speaker driver seals the connection, improving the overall quality of the speaker module.

[0015] In this embodiment, the first welding area is welded to the speaker unit to form a weld pool. The weld pool is a structure formed by melting and cooling a portion of the enclosure and a portion of the speaker unit.

[0016] In one possible implementation, at least the housing is welded to the edge region of the diaphragm.

[0017] Welding the enclosure to the edge of the diaphragm ensures an effective connection between the enclosure and the speaker driver, thus guaranteeing the stability of the connection. Furthermore, welding the enclosure to the edge of the diaphragm avoids the center area of ​​the diaphragm, reducing the impact of welding on diaphragm vibration.

[0018] In this embodiment, the enclosure and the speaker unit are connected by laser welding.

[0019] In one possible implementation, the enclosure includes a plate and a welded portion surrounding the plate, the plate and the diaphragm being spaced apart, and the welded portion being welded to the speaker unit;

[0020] The light transmittance of the welded portion is ≥50%; and / or,

[0021] The welded part is a first polymer material component.

[0022] Setting the light transmittance of the welded part to no less than 50% can reduce the energy loss of the laser irradiating the speaker unit. In this way, an effective weld pool can be formed between the speaker unit and the welded part, ensuring the connection stability between the speaker unit and the enclosure.

[0023] Setting the welding part as the first polymer material component facilitates the welding operation between the welding part and the speaker unit.

[0024] For example, the material of the welded part can be acrylonitrile butadiene styrene (ABS) plastic, polycarbonate (PC) plastic, etc.

[0025] In this embodiment, the plate is a steel plate and the welding part is a first polymer material component. The plate can be formed first, and then the plate is placed in the mold of the welding part to form an integral box shell by injection molding.

[0026] In one possible implementation, the first welding area is provided with a rough pattern; and / or,

[0027] The edge region of the diaphragm facing one side of the housing is smoothly disposed, or the edge region of the diaphragm facing one side of the housing is disposed with a rough pattern.

[0028] Setting a rough pattern in the first welding area of ​​the enclosure can increase the surface roughness of the enclosure, thereby reducing the positional misalignment between the enclosure and the diaphragm during welding and helping to improve welding accuracy.

[0029] In one possible implementation, the loudspeaker unit further includes a frame disposed on the side of the diaphragm away from the enclosure, and the enclosure is welded to the edge region of the diaphragm and the edge region of the frame.

[0030] Setting a rough pattern on the edge of the diaphragm can increase the surface roughness of the diaphragm, which can reduce the positional misalignment between the housing and the diaphragm during the welding process and help improve the welding accuracy.

[0031] Roughening processes such as texturing, etching, and laser engraving can be used to roughen the surface of the diaphragm to create a rough pattern.

[0032] Of course, in some embodiments, the edge area of ​​the diaphragm facing the housing is smoothly provided, that is, the diaphragm is not provided with a rough pattern.

[0033] Smoothing the edge area of ​​the diaphragm facing the enclosure can reduce the possibility of diaphragm damage, thus helping to improve the performance of the speaker module.

[0034] In one possible implementation, the loudspeaker unit further includes a frame disposed on the side of the diaphragm away from the enclosure, and the enclosure is welded to the edge region of the diaphragm and the edge region of the frame.

[0035] Welding the cabinet to the edge areas of the diaphragm and the frame can improve the welding strength between the cabinet and the speaker unit, thus helping to improve the quality of the speaker module.

[0036] In some embodiments, the enclosure includes a plate and a welded portion surrounding the plate, the welded portion being welded to the speaker unit, and the welded portion being welded to the diaphragm and the frame.

[0037] In this embodiment, the welded part is welded to the diaphragm and the frame, and the welded part and the speaker unit form a weld pool that is connected to the weld, the diaphragm and the frame respectively.

[0038] In one possible implementation, the diaphragm has a light transmittance ≥ 50%; and / or,

[0039] The diaphragm is a second polymer material component.

[0040] Setting the diaphragm's transmittance to no less than 50% can reduce the energy loss of the laser irradiating the frame. In this way, an effective weld pool can be formed between the frame and the enclosure, ensuring the connection stability between the speaker unit and the enclosure.

[0041] Setting the diaphragm as a second polymer material component facilitates the welding process between the enclosure and the speaker unit.

[0042] For example, the diaphragm material can be thermoplastic polyurethane (TPU), thermoplastic polyester elastomer (TPEE), rubber, etc. In other embodiments, other materials with high rigidity, low density, high environmental stability, and easy processing can also be used to manufacture the diaphragm.

[0043] In one possible implementation, the diaphragm has a melting point of T1, the housing has a melting point of T2, and |T2-T1|≤100℃; and / or,

[0044] The melting point of the housing is higher than that of the diaphragm.

[0045] Setting the absolute value of the difference between the melting point of the diaphragm and the melting point of the enclosure to less than or equal to 100°C allows the melting points of the diaphragm and the enclosure to be close, thus ensuring the quality of the welding and improving the quality of the speaker module.

[0046] It is understandable that the welding laser passes through the enclosure first, then the diaphragm. This means the enclosure absorbs the laser energy before the diaphragm, resulting in the enclosure heating up faster than the diaphragm. Setting the enclosure's melting point higher than the diaphragm's reduces the time difference between their melting during welding, further improving welding quality and ultimately enhancing the overall quality of the speaker module.

[0047] In one possible implementation, the width of the first welding area is 0.5 mm to 1.0 mm.

[0048] For example, the width of the first welding area can be 0.5mm, 0.55mm, 0.6mm, 0.65mm, 0.7mm, 0.75mm, 0.8mm, 0.85mm, 0.9mm, 0.95mm, or 1.0mm.

[0049] Setting the width of the first welding area to between 0.5mm and 1.0mm ensures sufficient connection area between the enclosure and the speaker unit, thus guaranteeing the connection strength and the quality of the speaker module 100.

[0050] In some embodiments, the width of the first welding area is 0.5 mm to 0.6 mm.

[0051] For example, the width of the first welding area can be 0.5mm, 0.51mm, 0.52mm, 0.53mm, 0.54mm, 0.55mm, 0.56mm, 0.57mm, 0.58mm, 0.59mm, or 0.6mm.

[0052] Setting the width of the first welding area to between 0.5mm and 0.6mm can reduce the space occupied by the connection area between the enclosure and the speaker unit, thus allowing the speaker module to have a sufficient effective vibration area.

[0053] After the enclosure and speaker unit are welded together, a weld pool is formed. In some embodiments, the width of the weld pool can be equal to the width of the first welding area, while in other embodiments, the width of the weld pool can be less than the width of the first welding area.

[0054] In one possible implementation, the diaphragm has a vibrating sound-generating area, and the first welding area avoids the vibrating sound-generating area.

[0055] By avoiding the vibration and sound-generating area in the first welding area, the impact of the welding laser on the quality of the diaphragm's vibration and sound-generating area can be reduced, thereby reducing the impact on the sound quality of the speaker module and helping to ensure the quality of the speaker module.

[0056] In one possible implementation, the distance between the first welding area and the vibration sound-generating area along a direction parallel to the diaphragm is at least 0.1 mm.

[0057] For example, the distance between the first welding area and the vibration sound-generating area along the direction parallel to the diaphragm can be 0.1mm, 0.12mm, 0.14mm, 0.16mm, 0.18mm, 0.2mm, 0.22mm, 0.24mm, 0.26mm, 0.28mm, or 0.3mm.

[0058] Setting the distance between the first welding area and the vibration sound-generating area to at least 0.1mm along a direction parallel to the diaphragm can reduce the impact of the welding laser on the quality of the vibration sound-generating area of ​​the diaphragm, thereby reducing the impact on the sound quality of the speaker module and helping to ensure the quality of the speaker module.

[0059] In some embodiments, a light-absorbing layer can be provided between the welding area of ​​the enclosure and the welding area of ​​the speaker unit before the welding operation. The light-absorbing layer can increase the energy of the welding laser absorbed by the welding areas of the enclosure and the speaker unit, so that the energy can be concentrated between the welding areas of the enclosure and the speaker unit, thereby improving the welding effect.

[0060] In this embodiment, before welding, the enclosure can be positioned on a positioning base made of a high-transparency material (such as glass, acrylic, etc.). A light-absorbing layer can be applied to the welding area of ​​the enclosure (or to the welding area of ​​the diaphragm). Then, the speaker unit is positioned above the enclosure, and a pressure-holding head is used to press the speaker unit and the enclosure together. A semiconductor laser is used to emit a laser, which penetrates the positioning base and the enclosure, focusing on the contact surface between the diaphragm and the enclosure. The energy of the laser causes the diaphragm, enclosure, and frame to melt together, forming a weld pool.

[0061] In one possible implementation, the side of the enclosure is bonded to the second outer peripheral side.

[0062] For example, an adhesive layer can be provided between the side and the second outer perimeter of the fence to achieve bonding between the two.

[0063] Attaching the side of the enclosure to the second outer perimeter reduces the assembly difficulty of the speaker module and helps ensure the molding quality of the speaker module. Furthermore, attaching the side of the enclosure to the second outer perimeter seals the gap between the two sides, thus sealing the gaps in the speaker module.

[0064] In some embodiments, the edge of the diaphragm is flush with the outer peripheral side of the frame, that is, the edge of the frame in the orthographic projection of the diaphragm coincides with the edge of the diaphragm.

[0065] Aligning the edge of the diaphragm with the outer perimeter of the frame reduces the space occupied by the non-vibrating sound-producing area of ​​the diaphragm, thus allowing for an increase in the size of the speaker unit without changing the size of the speaker module.

[0066] In other embodiments, the diaphragm has a flange on the side near the enclosure, which covers a portion of the outer peripheral side of the frame.

[0067] A flange is installed on the side of the diaphragm near the enclosure, and the flange covers part of the outer perimeter of the frame. This increases the connection area between the diaphragm and the frame, thereby ensuring the connection stability between the diaphragm and the frame.

[0068] The speaker module provided in this application embodiment can increase the effective vibration area of ​​the diaphragm without changing the size. Taking a 1116-sized speaker module as an example, the effective vibration area of ​​the diaphragm of the speaker module in the related technology is 132.7 mm². 2 The effective vibrating area of ​​the diaphragm in a speaker module without flanges is 148.6 mm². 2 Compared to speaker modules using related technologies, Figure 5 The speaker module shown has a 12% increase in effective vibrating area and a 0.98 dB gain in sensitivity. The effective vibrating area of ​​the diaphragm in the speaker module with the flanged edge is 169.4 mm². 2 Compared to speaker modules of related technologies, speaker modules with flanges have an effective vibration area that is 14% larger and a sensitivity gain of 1.12dB. In addition, due to the increased size of the speaker unit, the size of the speaker unit's voice coil, magnet, etc. is also increased accordingly, which can further improve the sensitivity gain, making the sensitivity gain greater than 1.12dB.

[0069] In some embodiments, the speaker module also includes a flexible circuit board and wires, which can connect the flexible circuit board to structures such as voice coils to enable the speaker module to be powered on.

[0070] In a second aspect, an electronic device is provided, including a housing and the aforementioned speaker module, wherein the speaker module is disposed within the housing.

[0071] Because the speaker module in any of the above embodiments has good performance, the electronic device containing this speaker module has good sound quality. Attached Figure Description

[0072] Figure 1 This is a schematic diagram of the structure of a speaker module in a related technology.

[0073] Figure 2 This is a schematic diagram of the structure of a speaker module provided in one embodiment of this application.

[0074] Figure 3for Figure 2 The diagram shows a cross-sectional view of the speaker module.

[0075] Figure 4 for Figure 2 The diagram shows a cross-sectional exploded view of the speaker module.

[0076] Figure 5 for Figure 2 Another cross-sectional view of the speaker module shown.

[0077] Figure 6 for Figure 5 An enlarged diagram of point A in the diagram.

[0078] Figure 7 This is a schematic diagram of the welding of a speaker module provided in an embodiment of this application.

[0079] Figure 8 for Figure 5 An enlarged diagram of point B in the diagram.

[0080] Figure 9 This is a schematic diagram of the structure of a speaker module provided in another embodiment of this application.

[0081] Figure 10 for Figure 9 An enlarged diagram of point C in the diagram.

[0082] Figure label:

[0083] Figure 1 :

[0084] 100', Speaker module;

[0085] 1' Cabinet; 11' Barrier; 2' Speaker driver; 3' Sound outlet; 4' Glue;

[0086] Figures 2 to 10 :

[0087] 100. Speaker module; 200. Positioning base; 300. Pressure holding head;

[0088] 1. Shell; 11. Welding section; 111. Third outer peripheral side; 112. First welding area; 12. Panel; 13. Enclosure; 131. Sound outlet;

[0089] 2. Speaker driver; 21. Diaphragm; 221. Flange; 22. Frame; 221. First outer peripheral side; 222. Second outer peripheral side; 23. Voice coil; 24. Magnet;

[0090] 3. Sound channel;

[0091] 4. Welding pool. Detailed Implementation

[0092] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0093] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between the components; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0094] In the description of this application, it should be understood that the terms "upper", "lower", "side", "front", "rear", etc., indicate the orientation or positional relationship based on the installation orientation or positional relationship, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0095] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this application, unless otherwise stated, "a plurality of" means two or more.

[0096] In this article, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0097] With the widespread use of electronic devices, users have increasingly higher demands for their performance in all aspects. Taking laptops as an example, the speaker module, as a key component for sound output, directly determines the user's auditory experience. The speaker module converts electrical signals into mechanical vibrations, which in turn drive air to generate sound waves, thus enabling sound propagation.

[0098] Figure 1This is a structural schematic diagram of a speaker module 100' based on related technologies. (Refer to...) Figure 1 The speaker module 100' typically includes a speaker driver 2' and a housing 1' connected to the speaker driver 2'. The diaphragm of the speaker driver 2' and the inner side of the housing 1' are spaced apart to form a sound outlet channel 3'. The housing 1' is also provided with a baffle 11', which is disposed opposite to the outer peripheral side of the speaker driver 2'. The baffle 11' and the outer peripheral side of the speaker driver 2' are glued and fixed together by adhesive 4'. The housing 1' is also provided with a sound outlet hole 131' that communicates with the sound outlet channel 3' so that the sound emitted by the speaker driver 2' can be transmitted through the sound outlet hole 131'.

[0099] However, in the direction parallel to the diaphragm of the speaker unit 2', the retaining wall 11' of the enclosure 1' occupies a lot of space. Without changing the size of the speaker module 100', this will restrict the size of the speaker unit 2'. The size restriction of the speaker unit 2' will reduce the size of the diaphragm, thereby reducing the effective vibration area of ​​the speaker unit 2' and reducing the sound quality, volume and other performance of the speaker unit 2', which cannot meet the growing demand of users for high-quality audio.

[0100] Based on this, embodiments of this application provide a speaker module and an electronic device that, by reducing the space occupied by the enclosure, increases the vibration area of ​​the speaker unit while keeping the size of the speaker module unchanged.

[0101] This application first provides an electronic device, which may be, for example, a mobile phone, tablet computer, laptop computer, television set, in-vehicle equipment, wearable device, personal digital assistant (PDA), point of sale (POS) terminal, video surveillance equipment, or other electronic products with audio playback functions. The mobile phone may be, for example, a conventional candybar phone or a foldable phone, such as a small vertical folding phone, a left-right inward folding phone, or a left-right outward folding phone. Wearable devices may be, for example, smart bracelets, smartwatches, wireless headphones, augmented reality (AR) glasses, AR headsets, virtual reality (VR) glasses, or VR headsets.

[0102] Electronic devices can have functional modules such as a display screen, a speaker module, a central processing unit (CPU), a memory, and a battery. Among them, the CPU, as the computing and control core of the computer system, is the final execution unit for information processing and program execution. For example, the CPU can be connected to the display screen and the speaker module respectively, so that the display screen and the speaker module can play video and audio respectively.

[0103] Electronic devices may include a housing, and a speaker module may be housed within the housing. The housing can conceal the speaker module, contributing to a better overall appearance of the electronic device.

[0104] In addition, functional modules such as the central processing unit, memory, and battery of electronic devices can also be housed inside the casing.

[0105] Figure 2 This is a schematic diagram of the structure of a speaker module 100 provided in one embodiment of this application; Figure 3 for Figure 2 A cross-sectional view of the speaker module 100 is shown. (Refer to...) Figure 2 and Figure 3 In this embodiment, the loudspeaker module 100 includes a loudspeaker unit 2 and a housing 1. The loudspeaker unit 2 has a diaphragm 21, at least one first outer peripheral side 221, and at least one second outer peripheral side 222. The first outer peripheral side 221 and the second outer peripheral side 222 are respectively perpendicularly connected to the diaphragm 21. The housing 1 is located on one side of the loudspeaker unit 2 and is opposite to the diaphragm 21. The edge region of the loudspeaker unit 2 facing the housing 1 is connected to the housing 1 to enclose and form a sound outlet channel 3 communicating with the diaphragm 21. One side of the housing 1 extends to form a barrier 13. The barrier 13 is provided with a sound outlet hole 131 connected to the sound outlet channel 3. At least a portion of the barrier 13 is opposite to and connected to the second outer peripheral side 222. The housing 1 is also provided with at least one third outer peripheral side 111, which is flush with the corresponding first outer peripheral side 221.

[0106] It should be noted that the speaker unit 2 is an important component of the speaker module 100. Figure 4 for Figure 2 The speaker module 100 shown is a cross-sectional exploded view. (Refer to...) Figure 3 and Figure 4 The loudspeaker unit 2 includes components such as diaphragm 21, voice coil 23, magnet 24, and frame 22. When the loudspeaker module 100 is connected to an electrical signal, the synergistic effect of the voice coil 23 and magnet 24 can cause the diaphragm 21 to vibrate, thereby enabling the loudspeaker unit 2 to emit sound. The sound can be output through the sound outlet channel 3 and the sound outlet hole 131.

[0107] It should be noted that the edge area of ​​the speaker unit 2 facing the enclosure 1 is connected to the enclosure 1. In some embodiments, the speaker unit 2 and the enclosure 1 can be glued and fixed together. In other embodiments, the speaker unit 2 and the enclosure 1 can be welded and fixed together. In still other embodiments, the speaker unit 2 and the enclosure 1 can also be connected by fasteners (such as screws, clips, etc.).

[0108] It should be noted that the third outer peripheral side 111 is flush with the first outer peripheral side 221. This means that after the enclosure 1 is connected to the speaker unit 2, the third outer peripheral side 111 and the first outer peripheral side 221 are on the same plane. There is no difference in height or front and back between the third outer peripheral side 111 and the first outer peripheral side 221, presenting a neat and consistent state.

[0109] It should be noted that the speaker unit 2 having at least one first outer peripheral side 221 means that the speaker unit 2 can have one, two or even more first outer peripheral side 221. When the speaker unit 2 has only one first outer peripheral side 221, the enclosure 1 can have only one third outer peripheral side 111. In this case, the enclosure 1 has only one outer peripheral side that is flush with the speaker unit 2. When the speaker unit 2 has two or more first outer peripheral side 221, the enclosure 1 can be provided with a corresponding number of third outer peripheral side 111, and each third outer peripheral side 111 is flush with the corresponding first outer peripheral side 221.

[0110] It should be noted that the speaker unit 2 having at least one second outer peripheral side 222 means that the speaker unit 2 can have one, two or even more second outer peripheral side 222. When the speaker unit 2 has only one second outer peripheral side 222, the enclosure 1 can only set the enclosure 13 on the corresponding side. When the speaker unit 2 has two or more second outer peripheral side 222, the enclosure 1 can set the enclosure 13 on the corresponding side respectively. At this time, the speaker module 100 can emit sound in different directions.

[0111] In this embodiment, the loudspeaker unit 2 has at least one first outer peripheral side 221, and the third outer peripheral side 111 of the enclosure 1 is flush with the first outer peripheral side 221. Since at least one outer peripheral side of the enclosure 1 does not protrude beyond the loudspeaker unit 2, the space occupied by the enclosure 1 in the direction parallel to the diaphragm 21 of the loudspeaker unit 2 can be reduced. Thus, without changing the size of the loudspeaker module 100, the size of the loudspeaker unit 2 can be increased, thereby increasing the size of the diaphragm 21 and consequently increasing the effective vibration area of ​​the loudspeaker unit 2, thus improving the performance of the loudspeaker module 100. Furthermore, due to the increased size of the loudspeaker unit 2, the sizes of structures such as the voice coil 23 and magnet 24 within the loudspeaker unit 2 can also be increased accordingly, further improving the sound quality of the loudspeaker module 100.

[0112] In some embodiments, the loudspeaker unit 2 has multiple first outer peripheral side surfaces 221, and the housing 1 is provided with multiple third outer peripheral side surfaces 111, with the multiple third outer peripheral side surfaces 111 being flush with the multiple first outer peripheral side surfaces 221.

[0113] It should be noted that in this embodiment, the loudspeaker unit 2 has a rectangular cross-section and four outer peripheral sides. In some cases, the loudspeaker unit 2 may have two first outer peripheral sides 221, which may be vertically connected or arranged in parallel, and the enclosure 1 may have two corresponding third outer peripheral sides 111; the loudspeaker unit 2 may have two second outer peripheral sides 222; or the loudspeaker unit 2 may have one second outer peripheral side 222, in which case the remaining outer peripheral side of the loudspeaker unit 2 may not be flush with the outer peripheral side of the enclosure 1. In other cases, the loudspeaker unit 2 may have three first outer peripheral sides 221, which may be vertically connected in sequence, and the enclosure 1 may have three corresponding third outer peripheral sides 111; the loudspeaker unit 2 may have one second outer peripheral side 222. In these embodiments, when the loudspeaker unit 2 has three first outer peripheral side surfaces 221, the space occupied by the enclosure 1 in the direction parallel to the diaphragm 21 is small, thus maximizing the size of the loudspeaker unit 2; when the loudspeaker unit 2 has two first outer peripheral side surfaces 221, the space occupied by the enclosure 1 increases, and the size of the loudspeaker unit 2 decreases; when the loudspeaker unit 2 has one first outer peripheral side surface 221, the space occupied by the enclosure 1 is even greater, and the size of the loudspeaker unit 2 is further reduced. That is, the more first outer peripheral side surfaces 221 the loudspeaker unit 2 has, the smaller the space occupied by the enclosure 1, and the larger the size of the loudspeaker unit 2 can be accordingly increased.

[0114] In some embodiments, the cross-section of the speaker unit 2 may also be pentagonal, hexagonal, etc., but this application does not impose any limitations on these embodiments.

[0115] By having the loudspeaker unit 2 have multiple first outer peripheral sides 221, and by having the multiple third outer peripheral sides 111 of the enclosure 1 be flush with each of the multiple first outer peripheral sides 221, the space occupied by the enclosure 1 in the direction parallel to the diaphragm 21 of the loudspeaker unit 2 can be further reduced. In this way, without changing the size of the loudspeaker module 100, the size of the loudspeaker unit 2 can be maximized, thereby further increasing the effective vibration area of ​​the loudspeaker unit 2 and improving the performance of the loudspeaker module 100.

[0116] In this embodiment of the application, the cross-section of the loudspeaker unit 2 is rectangular, and the loudspeaker unit 2 has three first outer peripheral side surfaces 221 and one second outer peripheral side surface 222. At this time, the enclosure 1 has three third outer peripheral side surfaces 111, that is, three of the four outer peripheral side surfaces of the enclosure 1 are flush with the three first outer peripheral side surfaces 221 of the loudspeaker unit 2, and the remaining outer peripheral side surface of the enclosure 1 is provided with a barrier 13.

[0117] Figure 5 for Figure 2 Another cross-sectional view of the speaker module 100 shown; Figure 6 for Figure 5 A magnified view of point A in the diagram. (Refer to...) Figures 4 to 6 In some embodiments, the housing 1 has a first side facing and close to the speaker unit 2, the first side being connected to a third outer peripheral side 111, and a first welding area 112 connected to the speaker unit 2 is provided at the edge of the first side near the third outer peripheral side 111.

[0118] It should be noted that the enclosure 1 and the speaker unit 2 can be connected by ultrasonic welding or laser welding. Of course, the enclosure 1 and the speaker unit 2 can also be connected by other welding methods. Regardless of which welding method is used between the enclosure 1 and the speaker unit 2, the enclosure 1 is provided with a first welding area 112.

[0119] It should be noted that the edge area of ​​the enclosure 1 with the baffle 13 on the side can be connected to the speaker unit 2 without welding.

[0120] Welding the first welding area 112 of the enclosure 1 to the speaker unit 2 can improve the connection stability between the enclosure 1 and the speaker unit 2. In addition, welding the enclosure 1 and the speaker unit 2 can also seal the space between the enclosure 1 and the speaker unit 2, improving the quality of the speaker module 100.

[0121] In this embodiment, the first welding area 112 is welded to the speaker unit 2 to form a weld pool 4. The weld pool 4 is a structure formed by melting and cooling a part of the housing 1 and a part of the speaker unit 2.

[0122] In some embodiments, at least the housing 1 is welded to the edge region of the diaphragm 21.

[0123] It should be noted that the enclosure 1 is welded to the edge area of ​​the diaphragm 21. This can be either the enclosure 1 is only welded to the diaphragm 21, or the enclosure 1 is welded to the diaphragm 21 and also welded to other structures of the speaker unit 2 besides the diaphragm 21. When the enclosure 1 is only welded to the diaphragm 21, a weld pool 4 is formed between the enclosure 1 and the speaker unit 2.

[0124] At least the edge area of ​​the enclosure 1 and the diaphragm 21 are welded together, which allows the enclosure 1 and the speaker driver 2 to form an effective connection, thus ensuring the stability of the connection between the enclosure 1 and the speaker driver 2. In addition, the edge area of ​​the enclosure 1 and the diaphragm 21 is welded together so that the welded area avoids the center area of ​​the diaphragm 21, thus reducing the impact of welding on the vibration of the diaphragm 21.

[0125] In this embodiment, the enclosure 1 and the speaker unit 2 are connected by laser welding.

[0126] In some embodiments, the housing 1 includes a plate 12 and a welded portion 11 surrounding the plate 12. The plate 12 and the diaphragm 21 are spaced apart. The welded portion 11 is welded to the speaker unit 2. The light transmittance of the welded portion 11 is ≥50%. The third outer peripheral side 111 is the outer peripheral side of the welded portion 11. The side of the welded portion 11 also extends to form a enclosure 13.

[0127] It should be noted that in some embodiments, the plate 12 may be made of a light-transmitting material, while in other embodiments, the plate 12 may be made of an opaque material. For example, the plate 12 may be a steel plate. The plate 12 and the welded part 11 may be bonded and fixed together, or they may be connected by other means.

[0128] Setting the light transmittance of the welding part 11 to not less than 50% can reduce the energy loss of the laser irradiating the speaker unit 2. In this way, an effective weld pool 4 can be formed between the speaker unit 2 and the welding part 11, ensuring the connection stability between the speaker unit 2 and the housing 1.

[0129] In some embodiments, the welded part 11 is a first polymer material component.

[0130] Setting the welding part 11 as the first polymer material part facilitates the welding operation between the welding part 11 and the speaker unit 2.

[0131] For example, the material of the welded part 11 can be acrylonitrile butadiene styrene (ABS) plastic, polycarbonate (PC) plastic, etc.

[0132] In this embodiment, the plate 12 is a steel plate and the welding part 11 is a first polymer material part. The plate 12 can be formed first, and then the plate 12 can be placed in the mold of the welding part 11 and the integrated box shell 1 can be formed by injection molding.

[0133] In some embodiments, the first welding area 112 is provided with a rough pattern.

[0134] Setting a rough pattern in the first welding area 112 of the housing 1 can increase the surface roughness of the housing 1. This can reduce the positional offset between the housing 1 and the diaphragm 21 during the welding process and help improve the welding accuracy.

[0135] Roughening processes such as texturing, etching, and laser engraving can be used to roughen the surface of the casing 1 to form a rough pattern.

[0136] In some embodiments, the housing 1 includes a plate 12 and a welded portion 11 surrounding the plate 12. The welded portion 11 is welded to the speaker unit 2, and a rough pattern may be provided on the surface of the welded portion 11.

[0137] In some embodiments, the edge region of the diaphragm 21 facing the housing 1 is provided with a rough pattern.

[0138] Setting a rough pattern on the edge of the diaphragm 21 can increase the surface roughness of the diaphragm 21, thereby reducing the positional misalignment between the housing 1 and the diaphragm 21 during the welding process and helping to improve the welding accuracy.

[0139] The surface of the diaphragm 21 can be roughened using processes such as texturing, etching, and laser engraving to form a rough pattern.

[0140] Of course, in some embodiments, the edge area of ​​the diaphragm 21 facing the housing 1 is smoothly provided, that is, the diaphragm 21 is not provided with a rough pattern.

[0141] By smoothly setting the edge area of ​​the diaphragm 21 facing the housing 1, the possibility of damaging the diaphragm 21 can be reduced, thus helping to improve the performance of the speaker module 100.

[0142] In some embodiments, the loudspeaker unit 2 further includes a frame 22, which is disposed on the side of the diaphragm 21 away from the enclosure 1. The enclosure 1 is welded to the edge region of the diaphragm 21 and the edge region of the frame 22. The first outer peripheral side 221 and the second outer peripheral side 222 are both outer peripheral side surfaces of the frame 22.

[0143] Welding the enclosure 1 to the edge area of ​​the diaphragm 21 and the edge area of ​​the frame 22 can improve the welding strength between the enclosure 1 and the speaker unit 2, thus helping to improve the quality of the speaker module 100.

[0144] In some embodiments, the enclosure 1 includes a plate 12 and a welded portion 11 surrounding the plate 12. The welded portion 11 is welded to the speaker unit 2 and to the diaphragm 21 and the frame 22.

[0145] In this embodiment, the welding part 11 is welded to the diaphragm 21 and the frame 22, and the welding part 11 and the speaker unit 2 form a welding pool 4 which is connected to the welding part, the diaphragm 21 and the frame 22 respectively.

[0146] In some embodiments, the transmittance of the diaphragm 21 is ≥50%.

[0147] Setting the light transmittance of the diaphragm 21 to be no less than 50% can reduce the energy loss of the laser irradiating the frame 22. In this way, an effective weld pool 4 can be formed between the frame 22 and the enclosure 1, ensuring the connection stability between the speaker unit 2 and the enclosure 1.

[0148] In some embodiments, the diaphragm 21 is a second polymer material component.

[0149] Setting the diaphragm 21 as a second polymer material component facilitates the welding operation between the housing 1 and the speaker unit 2.

[0150] For example, the material of the diaphragm 21 can be thermoplastic polyurethane (TPU), thermoplastic polyester elastomer (TPEE), rubber, etc. In other embodiments, other materials with high rigidity, low density, high environmental stability, and easy processing can also be used to manufacture the diaphragm 21.

[0151] In some embodiments, the melting point of the diaphragm 21 is T1, the melting point of the housing 1 is T2, and |T2-T1|≤100℃.

[0152] It should be noted that |T2-T1| refers to the absolute value of the difference between the melting point of the diaphragm 21 and the melting point of the housing 1. In some embodiments, the melting point of the diaphragm 21 may be higher than or equal to the melting point of the housing 1, while in other embodiments, the melting point of the diaphragm 21 may be lower than the melting point of the housing 1.

[0153] It should be noted that when the enclosure 1 is made of multiple materials, T2 refers to the melting point of the material of the welding area between the enclosure 1 and the diaphragm 21. In some embodiments, the enclosure 1 includes a plate 12 and a welded portion 11 surrounding the plate 12, which is welded to the speaker unit 2. In this case, T2 refers to the melting point of the welded portion 11.

[0154] Setting the absolute value of the difference between the melting point of the diaphragm 21 and the melting point of the housing 1 to be less than or equal to 100℃ can make the melting point of the diaphragm 21 and the melting point of the housing 1 close. This can ensure the quality of welding and thus improve the quality of the speaker module 100.

[0155] In some embodiments, the melting point of the housing 1 is higher than that of the diaphragm 21.

[0156] It is understandable that the welding laser passes through the housing 1 first, and then through the diaphragm 21. That is, the housing 1 absorbs the energy of the welding laser before the diaphragm 21. As a result, the heating rate of the housing 1 is faster than that of the diaphragm 21. Setting the melting point of the housing 1 to be higher than that of the diaphragm 21 can reduce the time difference between the melting of the housing 1 and the diaphragm 21 during the welding process. This can further improve the welding quality, thereby improving the quality of the speaker module 100.

[0157] In some embodiments, the width of the first welding area 112 is 0.5 mm to 1.0 mm.

[0158] For example, the width of the first welding area 112 can be 0.5mm, 0.55mm, 0.6mm, 0.65mm, 0.7mm, 0.75mm, 0.8mm, 0.85mm, 0.9mm, 0.95mm, or 1.0mm.

[0159] Setting the width of the first welding area 112 to between 0.5mm and 1.0mm allows for sufficient connection area between the enclosure 1 and the speaker unit 2, thus ensuring the connection strength between the two and guaranteeing the quality of the speaker module 100.

[0160] In some embodiments, the width of the first welding area 112 is 0.5 mm to 0.6 mm.

[0161] For example, the width of the first welding area 112 can be 0.5mm, 0.51mm, 0.52mm, 0.53mm, 0.54mm, 0.55mm, 0.56mm, 0.57mm, 0.58mm, 0.59mm, or 0.6mm.

[0162] Setting the width of the first welding area 112 to between 0.5mm and 0.6mm can reduce the space occupied by the connection area between the enclosure 1 and the speaker unit 2, thus allowing the speaker module 100 to have a sufficient effective vibration area.

[0163] Reference Figure 6 After the enclosure 1 and the speaker unit 2 are welded together, a weld pool 4 is formed. In some embodiments, the width L of the weld pool 4 can be equal to the width of the first welding area 112. In other embodiments, the width L of the weld pool 4 can be less than the width of the first welding area 112.

[0164] In some embodiments, the diaphragm 21 has a vibration-generating area, and the first welding area 112 avoids the vibration-generating area.

[0165] By avoiding the vibration and sound-generating area in the first welding area 112, the quality impact of the welding laser on the vibration and sound-generating area of ​​the diaphragm 21 can be reduced, thereby reducing the impact on the sound quality of the speaker module 100 and helping to ensure the quality of the speaker module 100.

[0166] In some embodiments, the distance between the first welding area 112 and the vibration sound-generating area along a direction parallel to the diaphragm 21 is at least 0.1 mm.

[0167] For example, the distance between the first welding area 112 and the vibration sound-generating area along the direction parallel to the diaphragm 21 can be 0.1mm, 0.12mm, 0.14mm, 0.16mm, 0.18mm, 0.2mm, 0.22mm, 0.24mm, 0.26mm, 0.28mm, or 0.3mm.

[0168] By setting the distance between the first welding area 112 and the vibration sound-generating area to at least 0.1 mm along a direction parallel to the diaphragm, the impact of the welding laser on the quality of the vibration sound-generating area of ​​the diaphragm 21 can be reduced, thereby reducing the impact on the sound quality of the speaker module 100 and helping to ensure the quality of the speaker module 100.

[0169] In some embodiments, a light-absorbing layer can be provided between the welding area of ​​the enclosure 1 and the welding area of ​​the speaker unit 2 before the welding operation. The light-absorbing layer can increase the energy of the welding laser absorbed by the welding areas of the enclosure 1 and the speaker unit 2, so that the energy can be concentrated between the welding areas of the enclosure 1 and the speaker unit 2, thereby improving the welding effect.

[0170] Figure 7 This is a schematic diagram of the welding of the speaker module 100 provided in an embodiment of this application. (Refer to...) Figure 7 In this embodiment, before welding, the enclosure 1 can be positioned on a positioning base 200 made of a high-transparency material (such as glass, acrylic, etc.). A light-absorbing layer can be applied to the welding area of ​​the enclosure 1 (or to the welding area of ​​the diaphragm 21). Then, the speaker unit 2 is positioned above the enclosure 1. A pressure-holding head 300 is used to press the speaker unit 2 and the enclosure 1 together. A semiconductor laser is used to emit a laser, which penetrates the positioning base 200 and the enclosure 1 and focuses on the contact surface between the diaphragm 21 and the enclosure 1. The energy of the laser causes the diaphragm 21, the enclosure 1 and the frame 22 to melt together and form a weld pool 4.

[0171] In some embodiments, the side of the enclosure 13 is bonded to the second outer peripheral side 222.

[0172] For example, an adhesive layer (not shown in the figure) can be provided between the side of the enclosure 13 and the second outer peripheral side 222 to achieve bonding between the two.

[0173] Attaching the side of the enclosure 13 to the second outer peripheral side 222 reduces the assembly difficulty of the speaker module 100 and helps ensure the molding quality of the speaker module 100. In addition, attaching the side of the enclosure 13 to the second outer peripheral side 222 seals the gap between the side of the enclosure 13 and the second outer peripheral side 222, thereby sealing the gap of the speaker module 100.

[0174] Figure 8 for Figure 5 A magnified diagram of point B in the image. (Refer to...) Figure 7 and Figure 8 In some embodiments, the edge of the diaphragm 21 is flush with the outer peripheral side of the frame 22, that is, the edge of the orthographic projection of the frame 22 onto the diaphragm 21 coincides with the edge of the diaphragm 21.

[0175] By aligning the edge of the diaphragm 21 with the outer periphery of the frame 22, the space occupied by the non-vibrating sound-producing area of ​​the diaphragm 21 can be reduced, thus increasing the size of the speaker unit 2 without changing the size of the speaker module 100.

[0176] Figure 9 This is a schematic diagram of the structure of a speaker module 100 provided in another embodiment of this application; Figure 10 for Figure 9 A magnified diagram of point C in the image. (Refer to...) Figure 9 and Figure 10 In other embodiments, the diaphragm 21 is provided with a flange 221 on the side near the enclosure 13, and the flange 221 covers a portion of the outer peripheral side of the basin frame 22.

[0177] A flange 221 is provided on the side of the diaphragm 21 near the enclosure 13, and the flange 221 covers part of the outer peripheral side of the basin frame 22, which can increase the connection area between the diaphragm 21 and the basin frame 22, thereby ensuring the connection stability between the diaphragm 21 and the basin frame 22.

[0178] The speaker module 100 provided in this application embodiment can increase the effective vibration area of ​​the diaphragm 21 without changing its size. Taking a speaker module 100 with a size of 1116 as an example... Figure 1 The effective vibrating area of ​​the diaphragm 21 of the speaker module 100 shown is 132.7 mm². 2 , Figure 5 The effective vibrating area of ​​the diaphragm 21 of the speaker module 100 shown is 148.6 mm². 2 Compared to Figure 1 The speaker module 100 shown is... Figure 5The effective vibrating area of ​​the speaker module 100 shown is increased by 12%, and the sensitivity gain is 0.98 dB. Figure 9 The effective vibrating area of ​​the diaphragm 21 of the speaker module 100 shown is 169.4 mm². 2 Compared to Figure 1 The speaker module 100 shown is... Figure 9 The effective vibration area of ​​the speaker module 100 shown is increased by 14%, resulting in a sensitivity gain of 1.12 dB. In addition, due to the increased size of the speaker unit 2, the size of the voice coil 23, magnet 24, etc. of the speaker unit 2 is also increased accordingly, which can further improve the sensitivity gain, making the sensitivity gain greater than 1.12 dB.

[0179] In some embodiments, the speaker module 100 also includes a flexible circuit board and wires, which can connect the flexible circuit board to structures such as the voice coil 23 to enable the speaker module 100 to be powered on.

[0180] The electronic device provided in this application includes a housing and a speaker module 100 as described in any of the above embodiments, wherein the speaker module 100 is disposed within the housing.

[0181] Because the speaker module 100 in any of the above embodiments has good performance, the electronic device containing this speaker module 100 has good sound quality.

[0182] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A speaker module, characterized by include: A loudspeaker unit, the loudspeaker unit having a diaphragm, at least one first outer peripheral side and at least one second outer peripheral side, the first outer peripheral side and the second outer peripheral side being perpendicularly connected to the diaphragm respectively; The enclosure is located on one side of the speaker unit and opposite the diaphragm. The edge region of the speaker unit facing the enclosure is connected to the enclosure to form a sound outlet channel communicating with the diaphragm. One side of the enclosure extends to form a barrier. The barrier is provided with a sound outlet hole connected to the sound outlet channel. At least a portion of the barrier is opposite to and connected to the second outer peripheral side. The enclosure is also provided with at least one third outer peripheral side, which is flush with the corresponding first outer peripheral side.

2. The speaker module of claim 1, wherein, The enclosure has a first side facing and close to the speaker unit, the first side being connected to the third outer peripheral side, and the edge of the first side near the third outer peripheral side having a first welding area for connection with the speaker unit.

3. The speaker module of claim 2, wherein, At least the first welding area is welded to the edge area of ​​the diaphragm.

4. The speaker module of claim 3, wherein, The enclosure includes a plate and a welded portion surrounding the plate. The plate and the diaphragm are spaced apart, and the welded portion is welded to the speaker unit. The light transmittance of the welded portion is ≥50%; and / or, The welded part is a first polymer material component.

5. The loudspeaker module of claim 3 or 4, wherein, The first welding area is provided with a rough pattern; and / or, The edge region of the diaphragm facing one side of the housing is smoothly disposed, or the edge region of the diaphragm facing one side of the housing is disposed with a rough pattern.

6. The speaker module of claim 3 or 4, wherein, The speaker unit also includes a frame, which is disposed on the side of the diaphragm away from the enclosure. The enclosure is welded to the edge region of the diaphragm and the edge region of the frame.

7. The speaker module of claim 6, wherein, The diaphragm has a light transmittance of ≥50%; and / or, The diaphragm is a second polymer material component.

8. The speaker module of claim 6, wherein, The diaphragm has a melting point of T1, and the housing has a melting point of T2, where |T2-T1|≤100℃; and / or, The melting point of the housing is higher than that of the diaphragm.

9. The loudspeaker module of any one of claims 2-4, 7, or 8, wherein, The width of the first welding area is 0.5mm to 1.0mm.

10. The loudspeaker module of any one of claims 2-4, 7, or 8, wherein, The diaphragm has a vibration sound-generating area, and the first welding area avoids the vibration sound-generating area.

11. The speaker module of claim 10, wherein, Along a direction parallel to the diaphragm, the distance between the first welding area and the vibration sound-generating area is at least 0.1 mm.

12. The loudspeaker module of any one of claims 1-4, 7, 8, or 11, wherein, The side of the enclosure is bonded to the second outer peripheral side.

13. An electronic device comprising a housing, characterized in that It also includes a speaker module as described in any one of claims 1-12, wherein the speaker module is disposed within the housing.

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