Acoustic modules and sleep headphones

Abstract

This application discloses an acoustic module and a sleep headset. The acoustic module includes a nozzle, a vibration system, a magnetic circuit system, and a microphone. The nozzle has a sound outlet channel and a sound outlet hole communicating with the sound outlet channel. The vibration system is located within the sound outlet channel and is adjacent to the inner wall of the nozzle. The magnetic circuit system is located within the sound outlet channel and is adjacent to the inner wall of the nozzle. The magnetic circuit system is used to drive the vibration system to vibrate and produce sound. The microphone is located within the sound outlet channel and is spaced along the axial direction of the nozzle on the sound outlet side of the vibration system. This acoustic module integrates the vibration system, magnetic circuit system, and microphone by mounting them within the nozzle, using the nozzle directly as the mounting housing for these components. This eliminates the need for a separate speaker housing, resulting in a compact and smaller acoustic module that improves the comfort of the sleep headset.

Description

Technical Field

[0001] This application relates to the field of electroacoustics, and more specifically, to an acoustic module and sleep headphones. Background Technology

[0002] Headphones, as a portable electroacoustic conversion device that converts electrical signals into sound waves for human hearing, have the basic function of generating sound waves through an internal sound-producing unit and guiding the sound waves to the user's ear canal through a specific acoustic structure.

[0003] Sleep headphones are audio devices specifically designed for sleep, aiming to help users relax better during sleep and avoid external noise interference. Current sleep headphones are relatively large, especially when the user is sleeping on their side, which can put excessive pressure on the ear canal, resulting in a poor wearing experience. Utility Model Content

[0004] This application provides an acoustic module and a sleep headset, aiming to provide a compact and small-sized sleep headset.

[0005] In a first aspect, embodiments of this application provide an acoustic module for use in headphones, including a nozzle, a vibration system, a magnetic circuit system, and a microphone. The nozzle has a sound outlet channel and a sound outlet hole communicating with the sound outlet channel. The vibration system is disposed within the sound outlet channel and is adjacent to the inner wall of the nozzle. The magnetic circuit system is disposed within the sound outlet channel and is adjacent to the inner wall of the nozzle. The magnetic circuit system is used to drive the vibration system to vibrate and emit sound. The microphone is disposed within the sound outlet channel and is spaced along the axial direction of the nozzle on the sound outlet side of the vibration system.

[0006] Based on the above embodiment, the acoustic module differs from the related technology in that the acoustic module is placed inside the sound outlet with a sound hole. In this embodiment, the nozzle itself serves as the sound outlet, and its internal sound outlet channel directly accommodates key sound-generating and sound-picking components such as the magnetic circuit system, vibration system, and microphone. This achieves miniaturization of the acoustic module, simplifies the overall structure of the headphones, and reduces manufacturing costs.

[0007] Furthermore, in related technologies, the sound-generating elements (such as the magnetic circuit system and vibration system) and microphone of headphones are usually housed within the main housing connected to the nozzle. This design requires the main housing to accommodate multiple components, resulting in a larger main housing size and consequently affecting the overall size of the headphones. In this embodiment, the magnetic circuit system, vibration system, and microphone are all integrated within the nozzle. That is, the nozzle simultaneously serves as the housing for the speaker unit and is used to mount the microphone. The main housing no longer needs to accommodate the sound-generating elements and microphone, effectively freeing up its internal space and making the headphones more compact and comfortable to wear.

[0008] Furthermore, the nozzle supports the vibration and magnetic circuit systems, functioning as the speaker housing in related technologies. This design avoids the need for an additional separate housing inside the nozzle to house the vibration and magnetic circuit systems, thus eliminating the need for extra wall thickness. Simultaneously, the microphone is housed within the nozzle, integrating the functions of both a speaker and microphone into the acoustic module. This results in a more compact and smaller overall structure for the in-ear acoustic module, contributing to the miniaturization of sleep headphones.

[0009] Secondly, this application provides an acoustic module for use in headphones, including a nozzle, a vibration system, a magnetic circuit system, and a microphone. The nozzle has a sound outlet channel and a sound outlet hole communicating with the sound outlet channel. The vibration system is located within the sound outlet channel. The magnetic circuit system is located within the sound outlet channel. The magnetic circuit system is used to drive the vibration system to vibrate and emit sound. The microphone is located within the sound outlet channel and is spaced along the axial direction of the nozzle on the sound outlet side of the vibration system. The nozzle serves as the mounting housing for the vibration system, the magnetic circuit system, and the microphone.

[0010] Based on the acoustic module described above, using the nozzle as a mounting housing eliminates the need to design, manufacture, and assemble separate mounting housings for the vibration system, magnetic circuit system, and microphone. The nozzle itself typically has a relatively regular internal structure (such as a sound outlet channel), providing readily available mounting space for these components. By placing the vibration system and magnetic circuit system within the sound outlet channel of the nozzle, sound emission is directly achieved. Simultaneously, the microphone is integrated and mounted within the same nozzle, located on the sound outlet side of the vibration system (i.e., the side closer to the ear canal), enabling it to effectively pick up sound near the ear canal opening. This allows the nozzle to simultaneously perform the dual functions of sound output (sound projection) and sound pickup (microphone pickup), simplifying the internal structure of the acoustic module, reducing the number of required independent components, and shrinking the size of the acoustic module, thus contributing to the realization of smaller and more comfortable headphone products.

[0011] Thirdly, this application provides a sleep headset, including a main shell and the aforementioned acoustic module, with a main control board inside the main shell; the nozzle of the acoustic module is connected to the main shell, and the vibration system and microphone are electrically connected to the main control board.

[0012] Based on the sleep headphones described in the above embodiments, the size of the sleep headphones directly affects the pressure on the ear canal when worn by a user during sleep. During sleep, users may experience discomfort due to the pressure caused by the relatively large size of the sleep headphones. This embodiment integrates the magnetic circuit system, vibration system, and microphone within the nozzle, avoiding the need for an additional separate outer shell to house the vibration and magnetic circuit systems. This eliminates the need for extra wall thickness, achieving miniaturization of the sleep headphones and making the overall structure more compact. Compared to larger sleep headphones, this miniaturized design reduces the pressure on the ear canal, thereby improving wearing comfort. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a schematic diagram of the structure of an earphone in the prior art;

[0015] Figure 2 This is a schematic diagram of the structure of a sleep earphone in one embodiment of this application;

[0016] Figure 3 for Figure 2 An exploded view of the structure shown;

[0017] Figure 4 for Figure 2 A structural diagram of the structure shown from another angle;

[0018] Figure 5 For along Figure 4 A schematic diagram of a cross-sectional structure of line AA in the middle;

[0019] Figure 6 for Figure 5 Enlarged structural diagram at point B;

[0020] Figure 7 This is a schematic diagram of the acoustic module structure in one embodiment of this application;

[0021] Figure 8 This is a partial cross-sectional structural diagram of the sleep headphones in another embodiment of this application;

[0022] Figure 9 for Figure 8 A schematic diagram of the main shell structure shown;

[0023] Figure 10 for Figure 8 A schematic diagram of the acoustic module in the structure shown;

[0024] Figure 11 for Figure 2 An exploded view of the structure shown (ear wings and ear caps omitted);

[0025] Figure 12 for Figure 7 An exploded view of the structure shown;

[0026] Figure 13 for Figure 7 Another exploded view of the structure shown;

[0027] Figure 14 for Figure 2 An exploded view of the structure shown from another angle (ear wings omitted);

[0028] Figure 15 for Figure 7 Another exploded view of the structure shown (protective netting and mesh fabric omitted);

[0029] Figure 16 This is a partial structural diagram of the sleep headphones in another embodiment of this application.

[0030] Explanation of reference numerals in the attached figures:

[0031] 100. Sleep headphones; 10. Acoustic module; 10a. Wiring channel; 10b. Pressure relief channel; 10c. Air duct; 11. Nozzle; 11a. Sound outlet channel; 11b. Sound outlet; 11c. Positioning notch; 11d. Wiring groove; 121. Vibration system; 1211. Diaphragm; 1212. Pad; 1213. Armature; 1213A. First part; 1213B. Second part; 1214. Connecting rod; 122. Magnetic circuit system; 1221. Center magnet; 1221A. Base; 1221A1. Rear cavity tuning hole; 1221B. Magnetic column; 1222. Outer ring magnet ; 1223, Magnet; 1224, Coil; 13, Microphone; 14, Electrical Connector; 141, Power Connector; 142, First Electrical Connector; 15, Bracket; 151, Cylindrical Base; 151a, Limiting Groove; 151b, Clearance Opening; 152, Overlapping Part; 153, Positioning Protrusion; 16, Reinforcing Plate; 161, Connecting Protrusion; 17, Protective Net; 17a, Pressure Relief Hole; 17b, Hole Hole; 171, Cover Plate; 172, Side Plate; 1721, Boss; 18, Ear Cap; 18a, Mounting Slot; 18b, Sound Guide Hole; 181, Mounting Part; 182, Sealing Part; 19, Mesh Fabric;

[0032] 20. Main housing; 20a. Insertion slot; 20b. Mounting cavity; 20c. Wiring hole; 30. Main control board; 40. Battery; 50. Ear flap; 60. Electrical connection mating part; 70. Second electrical connector;

[0033] 91. Earphone shell; 92. Sound module; 921. Speaker shell; 921a. Cavity; 922. Sound assembly; 923. Speaker mounting bracket. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0035] Headphones (Earphones, Headphones, Head-sets, Earpieces) are a pair of transducers that receive electrical signals from a media player or receiver and convert them into audible sound waves using speaker drivers placed close to the ears.

[0036] Wireless headphones are earphones that use Bluetooth technology to achieve a wire-free connection, allowing users to transmit audio wirelessly to their mobile phones or other devices. The main advantages of wireless headphones include the absence of wires, portability, and ease of use, making them particularly suitable for use during exercise.

[0037] Among the various types of wireless headphones, sleep headphones, designed for use during sleep or rest, are gradually becoming an important niche market. These headphones aim to help users isolate themselves from environmental noise while maximizing wearing comfort.

[0038] This embodiment uses an in-ear sleep earphone as an example for explanation. In other embodiments, the sleep earphone may have other structures, such as a semi-in-ear structure. The shape and structure of the sleep earphone are not limited to the above design. In the relevant technical field, the shape and structure design of sleep earphones is already very mature, and sleep earphones can adopt various shape and structure as needed, which will not be specifically described here.

[0039] like Figure 1As shown, in related technologies, the headphones include a headphone shell 91 and a sound-generating module 92. The sound-generating module 92 includes a speaker shell 921 and a sound-generating component 922. The speaker shell 921 is located at the front end of the headphone shell 91 and serves as the sound outlet shell of the headphone shell 91. The speaker shell 921 has a cavity 921a, and a speaker mounting base 923 is also provided inside the cavity 921a. The sound-generating component 922 is disposed in the speaker mounting base 923, that is, the sound-generating component 922 is fixed inside the cavity 921a by the speaker mounting base 923. This results in a relatively large volume of the speaker shell 921, which in turn makes the overall size of the headphones relatively large, which is not conducive to the miniaturization design of headphones.

[0040] like Figure 1 , Figure 2 , Figure 4 and Figure 5 This application proposes a sleep headset 100, which includes an acoustic module 10, a main housing 20, an electrically connected main control board 30 disposed within the main housing 20, and a battery 40. The acoustic module 10 is connected to the main housing 20 and can convert electrical signals into sound that the user can hear. The main housing 20 is the main external structure of the sleep headset 100, and its interior is provided with a mounting cavity 20b. The battery 40 and the main control board 30 are arranged along the thickness direction of the main housing 20 within the mounting cavity 20b. The main control board 30 is responsible for processing various signals and executing control commands. It can receive audio signals from audio sources (such as mobile phones and computers) and then drive the acoustic module 10 to emit sound. The battery 40 can power the main control board 30 and other electronic components, enabling the sleep headset 100 to work independently without an external power source. The acoustic module 10, the main control board 30, and the battery 40 work together. The battery 40 provides energy, the main control board 30 processes signals and issues commands, and the acoustic module 10 generates sound according to the commands. The main housing 20 provides the structural space to accommodate these components and plays a certain acoustic role (such as forming a sound cavity).

[0041] like Figure 5 and Figure 6As shown, the acoustic module 10 includes a nozzle 11, a magnetic circuit system 122, and a vibration system 121. The nozzle 11 is the outer shell structure of the acoustic module 10. The nozzle 11 can be detachably connected to the main shell 20. When the nozzle 11 is installed on the main shell 20, the nozzle 11 at least partially protrudes from the outside of the main shell 20. The nozzle 11 serves as the in-ear part of the sleep earphone 100, and its volume is smaller than that of the main shell 20. The nozzle 11 can be cylindrical in shape, and its interior is hollow and has a sound outlet channel 11a. The magnetic circuit system 122 and the vibration system 121 are also included. Both the magnetic circuit system 121 and the vibration system 121 are housed within the sound outlet channel 11a. The magnetic circuit system 122 and the vibration system 121 are arranged adjacent to each other along the axial direction of the nozzle 11, and both the magnetic circuit system 122 and the vibration system 121 are adjacent to the inner wall of the nozzle 11. The magnetic circuit system 122 is used to drive the vibration system 121 to vibrate and produce sound. The magnetic circuit system 122 can provide a stable and strong magnetic field force for the vibration system 121, ensuring that the vibration system 121 can vibrate accurately according to the instructions of the electrical signal, thereby producing a high-quality sound signal.

[0042] It should be noted that both the magnetic circuit system 122 and the vibration system 121 are adjacent to the inner wall of the nozzle 11, meaning that the vibration system 121 and the magnetic circuit system 122 are in close proximity to the inner wall of the nozzle 11, and there are no additional independent structures or spacers between them and the inner wall of the nozzle 11. This means that the vibration system 121 and the magnetic circuit system 122 are in direct contact with the inner wall of the nozzle 11, and the inner wall of the nozzle 11 acts as the direct support and boundary for the vibration system 121 and the magnetic circuit system 122, functioning as the speaker unit housing in related technologies. This design avoids the need for an additional independent housing inside the nozzle 11 to enclose the vibration system 121 and the magnetic circuit system 122, thus eliminating the need for additional wall thickness and making the overall structure of the in-ear portion more compact. This contributes to the miniaturization design of the sleep headphones 100 and reduces the size of the in-ear portion.

[0043] In different embodiments of this application, the acoustic module 10 may have different types of vibration systems 121, such as moving coil units, dual moving coil units, moving iron units, etc. The main function of the acoustic module 10 is to convert electrical energy into sound. When an electrical signal passes through the vibration system 121, the vibration system 121 will move under the drive of the electrical signal and the magnetic field generated by the magnetic circuit system 122, vibrating to produce sound.

[0044] The nozzle 11 is also provided with a sound outlet 11b communicating with the sound outlet channel 11a. When the sleep earphone 100 is worn by the user, the sound outlet 11b is used to emit sound towards the user's ear canal. Understandably, the vibration system 121 vibrates towards the side where the sound outlet 11b is located, effectively transmitting the sound signal generated by the vibration to the sound outlet 11b, and then propagating into the user's ear canal. The magnetic circuit system 122 and the vibration system 121 are directly integrated into the nozzle 11, allowing the sound signal to propagate to the sound outlet 11b through a more direct and shorter path, reducing distortion or phase shift caused by excessively long paths or complex structures during sound wave propagation.

[0045] The nozzle 11 has a diameter of 3mm-6mm and a length of 3mm-10mm. A diameter smaller than 3mm results in an overly narrow sound propagation channel, causing significant sound wave diffraction and reflection, leading to severe high-frequency attenuation and a muffled sound quality. An excessively small opening can also cause excessive pressure inside the listener's ear, resulting in discomfort. Conversely, a diameter greater than 6mm provides a clearer sound channel and reduces high-frequency loss, but an excessively large opening causes sound to become too diffuse and less directive, resulting in sound energy loss to the external environment of the sleep headphones 100. This reduces the focus and efficiency of the sound, and a larger diameter may also increase discomfort when the sleep headphones 100 are worn, hindering miniaturization. Similarly, a nozzle length less than 3mm results in a short path for sound waves from the speaker to the ear canal, lacking sufficient acoustic impedance matching and acoustic filtering, causing sound to directly impact the ear canal and affecting the overall listening experience. While a length exceeding 10mm might offer some acoustic optimization, an excessively long tube would increase sound transmission loss, especially in the high-frequency range, resulting in a muffled sound. It would also increase the complexity and space required for the internal structure of the sleep headphones 100, making its overall size larger. Therefore, the diameter of the nozzle 11 is limited to 3mm-6mm, and its length to 3mm-10mm.

[0046] Furthermore, the nozzle 11 is made of metal with a wall thickness ranging from 0.1mm to 0.3mm. While ensuring sufficient strength, this significantly reduces the weight of the nozzle 11 and minimizes its space occupation. This is particularly important for portable devices like the Sleep Headphones 100, as it reduces the user's wearing burden and improves wearing comfort.

[0047] Please continue reading. Figure 5 and Figure 6The acoustic module 10 also includes a microphone 13, which is located within the sound output channel 11a and on the sound output side of the vibration system 121. This allows the microphone 13 to pick up the sound signals emitted by the vibration system 121 at close range, enabling real-time monitoring and feedback of the sound signals. The sound signals picked up by the microphone 13 can be compared and analyzed with the original audio signals, thereby dynamically adjusting and optimizing the sound production process of the acoustic module 10. For example, when the microphone 13 detects distortion or noise in the sound signal, it can adjust the vibration parameters of the vibration system 121 using appropriate algorithms, thereby reducing distortion and noise and improving the purity and fidelity of the sound quality. Furthermore, compared to the vibration system 121, the microphone 13 is positioned closer to the sound output port 11b. The microphone 13 can also be used to implement active noise cancellation, picking up ambient noise and generating a corresponding inverse noise signal to cancel out ambient noise, thus providing users with a quieter and more comfortable listening environment.

[0048] Furthermore, the microphone 13 is spaced apart from the vibration system 121, meaning it is located near the path of sound wave propagation generated by the vibration of the vibration system 121, but does not directly contact the vibration system 121, maintaining a certain distance between them. Since the vibration system 121 vibrates during operation, if these vibrations were directly transmitted to the microphone 13, it might cause the microphone 13 to pick up a large amount of mechanical noise, thus affecting its accurate pickup of sound signals. Therefore, the microphone 13 is spaced apart on the sound output side of the vibration system 121.

[0049] In this embodiment, the magnetic circuit system 122, the vibration system 121, and the microphone 13 are all integrated into the nozzle 11. The main housing 20 no longer needs to accommodate the sound-generating element and the microphone 13, and its internal space can be effectively freed up, making the overall size of the sleep headphones 100 more compact and more comfortable to wear.

[0050] In some embodiments, the nozzle 11 serves as the mounting housing for the vibration system 121, the magnetic circuit system 122, and the microphone 13, directly eliminating the need for a speaker housing and saving on the thickness and volume of the speaker housing. Using the nozzle 11 as the mounting housing means that it is no longer necessary to design, manufacture, and assemble separate mounting housings for the vibration system 121, the magnetic circuit system 122, and the microphone 13. The nozzle 11 itself typically has a relatively regular internal structure (such as the sound outlet channel 11a), providing readily available mounting space for these components. By placing the vibration system 121 and the magnetic circuit system 122 within the sound outlet channel 11a of the nozzle 11, sound emission is directly achieved. Simultaneously, the microphone 13 is also mounted within the nozzle 11, located on the sound outlet side of the vibration system 121 (i.e., the side closer to the ear canal), enabling it to effectively pick up sound near the ear canal opening. It can ensure that its relative position with the vibration system 121 is precisely fixed. The nozzle 11, as a mounting housing, provides direct and stable support for the vibration system 121, the magnetic circuit system 122, and the microphone 13. This allows the nozzle 11 to have the dual functions of sound output (sound output) and sound pickup (microphone 13 pickup). It simplifies the internal structure of the acoustic module 10, reduces the number of independent components required, and shrinks the size of the acoustic module 10, which helps to realize a smaller and more comfortable headphone product.

[0051] Furthermore, along the axial direction of the nozzle 11, the distance between the vibration system 121 and the microphone 13 is 0.2mm-0.5mm. The nozzle 11 itself has a relatively small structure; if the distance between them is greater, it will occupy more space along the axial direction of the nozzle 11. This would require either lengthening the nozzle 11 or compressing the space of other components, directly increasing the size of the nozzle 11 and even the entire sleep headphone 100. By controlling the distance between them within this extremely small range of 0.2mm-0.5mm, the axial arrangement efficiency inside the nozzle 11 is optimized. This allows the vibration system 121 and the microphone 13 to be arranged compactly, minimizing their space occupation in the axial direction of the nozzle 11. This compact arrangement allows for a shorter and more compact nozzle 11 structure while maintaining acoustic performance (such as the aforementioned accurate sound pickup).

[0052] Based on the above embodiment, the acoustic module 10 differs from the speaker mounting base 923 in the related art, which places the acoustic components inside the speaker housing 921. In this embodiment, the nozzle 11 itself serves as the speaker housing, and its internal sound outlet channel 11a directly accommodates key sound-generating and sound-picking components such as the magnetic circuit system 122, the vibration system 121, and the microphone 13. That is, the nozzle 11 itself serves as the sound outlet channel of the sleep earphone 100, guiding the internally output sound to the sound outlet 11b. This reduces the need for additional sound outlets to accommodate the acoustic module 10, enabling the miniaturization of the acoustic module 10, simplifying the overall structure of the sleep earphone 100, and reducing manufacturing costs.

[0053] Please continue reading. Figure 5 and Figure 6 In some embodiments, the central axes of both the magnetic circuit system 122 and the vibration system 121 coincide with the central axis of the nozzle 11. Sound waves can radiate from the center of the vibration system 121 in a more direct and symmetrical manner and propagate along the axial direction of the nozzle 11. This reduces unnecessary reflections, diffractions, or mode conversions of sound waves inside the nozzle 11, thereby allowing sound energy to be more concentratedly directed out of the sound hole 11b and improving the directivity of the sound, especially in the mid-to-high frequency range.

[0054] Furthermore, the central axis of microphone 13 coincides with the central axis of nozzle 11, enabling microphone 13 to pick up sound signals more directly. This improves the signal-to-noise ratio (SNR) by shortening the distance between the sound source and the pickup device. If the central axis of microphone 13 deviates from the central axis of nozzle 11, sound waves may need to be reflected or diffracted by the inner wall of the sound outlet channel 11a before reaching microphone 13. This introduces additional delay and phase difference, resulting in distortion of the picked-up signal.

[0055] In the above configuration, the high alignment of the central axis of microphone 13 with the central axis of nozzle 11 does indeed bring significant acoustic advantages. However, in actual product design, due to certain assembly tolerances, some deviation is sometimes permissible. Therefore, in other embodiments, the central axes of both magnetic circuit system 122 and vibration system 121 are aligned with the central axis of nozzle 11, while the distance between the central axis of microphone 13 and the central axis of nozzle 11 ranges from 0 to 0.5 mm. That is, the central axis of microphone 13 has a slight offset relative to the central axis of nozzle 11, which can ensure relatively good acoustic performance to a certain extent. For example, it can still maintain an acceptable signal-to-noise ratio and a relatively accurate pickup signal without causing a sharp decline in performance. Based on this, the requirements for assembly precision are appropriately reduced.

[0056] Since the nozzle 11 can be detached from the main housing 20, the acoustic module 10 also includes an electrical connector 14 to enable signal and power transmission in the installed state. The electrical connector 14 extends into the sound outlet channel 11a and supplies power to the microphone 13 and the vibration system 121.

[0057] Electrical connector 14 can be a flexible circuit board (FPC). The flexible circuit board has the characteristics of being bendable and foldable, which can adapt well to the complex and limited space inside the nozzle 11. The FPC can be easily bent or twisted to connect the microphone 13 and the vibration system 121 through the shortest and most direct path. Wiring along the internal structure of the nozzle 11 makes the overall internal layout more compact, which is conducive to the miniaturization of the sleep headphones 100.

[0058] Furthermore, the microphone 13 can be directly mounted on a flexible circuit board using surface mount technology, making it suitable for mass production and offering high efficiency and high reliability.

[0059] In some embodiments, the electrical connector 14 can be two flexible circuit boards, which are electrically connected to the vibration system 121 and the microphone 13, respectively. One of the two flexible circuit boards can be connected to the other, and the other flexible circuit board has a connection terminal that is electrically connected to the main control board 30, thus simplifying wiring. Alternatively, when using two flexible circuit boards, both flexible circuit boards can have connection terminals and each can be connected to the main control board 30.

[0060] In other embodiments, the electrical connector 14 includes only one flexible circuit board, which is electrically connected to the vibration system 121 and the microphone 13 respectively. This reduces the number of connecting wires required in this design and simplifies the wiring. Furthermore, it should be noted that the electrical connector 14 can be any structure that can be used for electrical signal transmission, besides being a flexible circuit board. This application does not limit the specific form of the electrical connector 14.

[0061] The following content will be presented using electrical connector 14 as a flexible circuit board.

[0062] like Figure 5 , Figure 6 and Figure 7As shown, furthermore, with the nozzle 11 installed in the main housing 20, the electrical connector 14 can be electrically connected to the main control board 30. That is, the main control board 30 can issue commands to drive the vibration system 121 to produce sound via the electrical connector 14. The electrical connector 14 is also used to transmit the audio signal picked up by the microphone 13 to the corresponding signal processing pin on the main control board 30. The electrical connector 14 ensures that even after the nozzle 11 has been disassembled and reinstalled, the signal and power transmission between the vibration system 121, the feedback microphone, and the main control board 30 within the main housing 20 remains stable and reliable.

[0063] The nozzle 11 is detachably connected to the main housing 20 of the sleep earphone 100 and electrically connected to a portion within the main housing 20 via an electrical connector 14. This allows the entire acoustic module 10 to function as a relatively independent module. Because the acoustic module 10 is relatively independent of the main housing 20, it can be treated as a whole during manufacturing, assembly, testing, and subsequent maintenance or replacement, improving product flexibility. For example, when repair or upgrades are needed, the entire acoustic module 10 can be replaced selectively without extensive disassembly of the main housing 20 and other internal components of the sleep earphone 100, simplifying the repair process and potentially reducing related maintenance costs.

[0064] In other words, this embodiment describes a basic acoustic structure configuration within the nozzle 11; however, this is not the only limitation on its internal acoustic structure. In practice, different acoustic elements can be added and the structural layout can be modified within the sound outlet channel 11a, such as sound guides of different lengths or shapes, multi-cavity designs, sound-absorbing cotton, or other sound-absorbing / reflecting materials. Based on the framework and principles provided in this embodiment, adjustments can be made according to target acoustic performance (such as enhancing low frequencies, improving high-frequency details, and improving sound field positioning) to further adjust and optimize the frequency response, sound field, or other acoustic characteristics of the sleep headphones 100.

[0065] However, the core significance of this flexibility in designing acoustic modules 10 with various acoustic characteristics lies in the fact that the acoustic module 10 itself is designed as a module that can operate independently of the main housing 20. It is precisely because the acoustic module 10 can be designed as an independent module and can be detachably connected to the main housing 20 that it possesses this relative independence. This allows the acoustic module 10 to be considered a unit distinct from the main housing 20 in terms of function, structure, and even manufacturing and maintenance processes, thus laying the foundation for subsequent diversified applications (such as replacing nozzles 11 with different acoustic characteristics for personalized customization, or individual repair and replacement).

[0066] The acoustic impedance of the sleep headphones 100 is mainly determined by the acoustic module 10. In the embodiments of this application, different acoustic modules 10 can have different acoustic impedances, so the sleep headphones 100 can be replaced with different specifications of acoustic modules 10 according to different needs to achieve customized sound quality.

[0067] The sleep headphones also include a detection module located within the main housing 20. This detection module detects the acoustic impedance of the acoustic modules. The main control board 30 includes a digital signal processor (DSP), a microprocessor used to process audio signals. In other embodiments, the DSP may also be located on other components within the main housing 20. The main control board 30 can employ various functional DSPs as needed, such as DSPs for implementing active noise cancellation (ANC) or for optimizing sound quality. The DSP of the main control board 30 can have multiple sets of audio parameters built-in, each corresponding to a different acoustic module 10. These audio parameters are related to the DSP's functions and include, but are not limited to, sound quality parameters and ANC noise reduction parameters.

[0068] When the acoustic module 10 is connected to the main control board 30, the main control board 30 is used to match the acoustic parameters according to the acoustic impedance detected by the detection module so that the functions of the sleep headphones 100 can reach the ideal state, such as maximizing sound quality and minimizing noise.

[0069] For example, the DSP of the main control board 30 has two sets of audio parameters built-in, corresponding to the acoustic impedances of two different acoustic modules 10. For ease of explanation, these two sets of audio parameters are named the first audio parameter and the second audio parameter, respectively. The two acoustic modules 10 are named the first acoustic module and the second acoustic module, respectively. The acoustic impedance corresponding to the first acoustic module is called the first acoustic impedance, and the acoustic impedance corresponding to the second acoustic module is called the second acoustic impedance. When the first acoustic module is connected to the main control board 30, the main control board 30 will detect the first acoustic impedance and call the corresponding first audio parameter. When the second acoustic module is connected to the main control board 30, the main control board 30 will detect the second acoustic impedance and call the corresponding second audio parameter. It can be understood that the number of audio parameters built into the DSP of the main control board 30 is not limited to two sets.

[0070] Through the above design, the main control board 30 can identify the acoustic module 10 connected to it and call the corresponding audio parameters, so that the main control board 30 can be used with multiple acoustic modules 10 with different performance to meet various usage requirements.

[0071] In other embodiments, the DSP of the main control board 30 may also have only one set of audio parameters built in. In this case, the main control board 30 can correspond one-to-one with each acoustic module 10. Alternatively, the main control board 30 can use one set of audio parameters to correspond to multiple acoustic modules 10 with the same acoustic impedance. Furthermore, the main control board 30 can use one set of audio parameters to correspond to multiple acoustic modules 10 with different acoustic impedances. In this case, the sleep headphones 100 formed by connecting different acoustic modules 10 with the main control board 30 may have different audio effects.

[0072] The acoustic module 10 can be detachably connected to the main control board 30, allowing the sleep headphones 100 to easily replace different acoustic modules 10 as needed. In the above-described structural design of the acoustic module 10, the electrical connector 14 serves as the component connecting the acoustic module 10 to the main control board 30, ensuring stable power supply and signal transmission for the acoustic module 10. This application provides different electrical connection embodiments, which will be described below.

[0073] like Figure 8 , Figure 9 and Figure 10 As shown, in some embodiments, the main housing 20 is provided with a insertion groove 20a, which can be independent of the mounting cavity 20b. Understandably, when the acoustic module 10 is not installed in the main housing 20, the insertion groove 20a is connected to the outside. When the acoustic module 10 is installed in the main housing 20, the groove wall of the insertion groove 20a can surround a portion of the outer peripheral wall of the nozzle 11, that is, the end of the nozzle 11 facing away from the sound outlet 11b is inserted into the insertion groove 20a. The groove wall of the insertion groove 20a can provide stable support and fixation for the acoustic module 10, reducing loosening of the nozzle 11 during use.

[0074] The acoustic module 10 is equipped with a first electrical connector 142, which is electrically connected to the electrical connector 14. The sleep earphone 100 also has a second electrical connector 70 in the insertion slot 20a. The second electrical connector 70 can be disposed on the bottom wall of the insertion slot 20a and is electrically connected to the main control board 30. Part of the nozzle 11 of the acoustic module 10 is inserted into the insertion slot 20a. The first electrical connector 142 and the second electrical connector 70 are plugged in and engaged to conduct electricity, realizing a quick electrical connection between the acoustic module 10 and the main housing 20. Users only need to insert the acoustic module 10 into the main housing 20 to complete the electrical connection without any additional wiring operations, greatly improving the convenience of use.

[0075] Furthermore, to improve the ease of connection between the nozzle 11 and the main housing 20, in some embodiments, a magnetic attraction design is introduced for the insertion slots 20a provided on the nozzle 11 and the main housing 20. Specifically, mutually engaging magnetic elements are respectively provided on the outer side wall of the nozzle 11 and the inner side wall of the insertion slot 20a of the main housing 20. These magnetic elements can be magnets or magnetic materials, and through the action of magnetic force, the nozzle 11 can be quickly and accurately inserted into the insertion slot 20a and maintain a stable connection after insertion.

[0076] Specifically, in one configuration, the first electrical connector 142 is a power socket located at the end of the electrical connector 14 away from the microphone 13. The power socket contains conductive contacts for electrical connection with the conductive parts of the microphone. Correspondingly, the second electrical connector 70 is a pin that aligns and engages with the conductive contacts of the power socket. The large contact area between the pin and the socket results in low contact resistance, ensuring stable current and signal transmission. This effectively reduces signal attenuation and distortion in the electrical connection, improving the sound quality performance of the acoustic module 10.

[0077] In another configuration, the first electrical connector 142 can be a power socket with a resilient contact piece. The resilient contact piece is in a preset bent state when not under force and possesses a certain elastic potential energy. The second electrical connector 70 can be a pin or metal strip with conductive contacts. When the acoustic module 10 is inserted into the main housing 20, the insertion of the pin or metal strip applies pressure to the resilient contact piece, causing it to elastically deform. During this deformation, the resilient contact piece makes close contact with the pin or metal strip, thereby achieving an electrical connection.

[0078] In another configuration, the first electrical connector 142 can be a small wireless charging coil 1224 integrated inside the nozzle 11 of the acoustic module 10, while the second electrical connector 70 can be a wireless charging transmitter module integrated into the insertion slot 20a of the main housing 20. The wireless charging coil 1224 receives signals from the wireless charging transmitter module to achieve power transmission. Simultaneously, the wireless charging module can also integrate signal transmission functionality to achieve wireless transmission of audio signals. Furthermore, the wireless charging module can ensure the correct positioning of the acoustic module 10 when inserted into the main housing 20 through magnetic induction or electromagnetic field induction.

[0079] In all the aforementioned configurations, the connection between the acoustic module 10 and the main housing 20 is achieved through a plug-in design. This means that users can easily replace the nozzle 11 with different designs (such as length and internal acoustic structure). Users can select nozzles 11 with different acoustic performance to connect to the main housing 20 according to their needs and preferences. By replacing nozzles 11 with different acoustic performance, users can personalize the acoustic performance of the sleep headphones 100 to meet diverse listening needs. Furthermore, if the acoustic module 10 malfunctions, only that module can be replaced, without needing to repair or replace the entire sleep headphones 100, reducing maintenance costs and complexity.

[0080] In other words, users can easily select and replace nozzles 11 with different internal acoustic structures, thereby quickly and economically changing the overall sound of the sleep headphones 100 according to personal preferences or specific needs, making the sleep headphones 100 highly customizable.

[0081] like Figure 7 and Figure 11 As shown, in some embodiments, the wall of the plug-in slot 20a is also provided with a wire-passing hole 20c that connects to the mounting cavity 20b. Specifically, the wire-passing hole 20c can be opened in the bottom wall of the plug-in slot 20a. Part of the nozzle 11 of the acoustic module 10 is inserted into the plug-in slot 20a, and the electrical connector 14 passes through the wire-passing hole 20c. That is to say, the wire-passing hole 20c provides the electrical connector 14 with a path and direction to pass into the mounting cavity 20b, and the hole wall of the wire-passing hole 20c can limit the electrical connector 14 to a certain extent, preventing the electrical connector 14 from bending or tangling at will, and preventing the electrical connector 14 from loosening due to vibration during the use of the sleep headset 100, so that the internal wiring is neat and orderly. The end of the electrical connector 14 away from the microphone 13 is provided with a power receiving part 141, which is connected to the main control board 30. The electrical connector 14 is directly connected to the main control board 30 through the wire-passing hole 20c, avoiding complex wiring paths. This makes the internal wiring simpler, reducing space occupation and signal interference problems caused by excessive wiring.

[0082] Specifically, the sleep headset 100 also includes a power connection part 60, which is a flexible circuit board. The flexible circuit board has bendable characteristics. The flexible circuit board is electrically connected to the main control board 30 and extends along the outer wall of the battery 40 to the end face of the battery 40 away from the main control board 30. The battery 40 is located closer to the acoustic module 10 than the main control board 30. The power connection part 141 is a solder pad located on the end of the electrical connector 14 away from the microphone 13. The solder pad is connected to the part of the flexible circuit board located on the battery 40 away from the main control board 30, providing a stable and reliable connection point that can withstand the vibration during the use of the sleep headset 100 and reduce the risk of poor contact.

[0083] In other words, when the acoustic module 10 is manufactured separately, its design takes into account the subsequent integration requirements with other components inside the main housing 20. Therefore, a connection position with a solder pad is reserved and manufactured externally. This solder pad is a clear interface identifier, serving as the physical and electrical connection point when partially connecting with the main housing 20.

[0084] like Figure 5 , Figure 6 , Figure 11 , Figure 12 As shown, in some embodiments, the sleep headphones 100 also includes a bracket 15, which is disposed in the sound outlet channel 11a of the nozzle 11 and connected to the inner wall of the nozzle 11. It is located on the side of the vibration system 121 facing the sound outlet 11b. The microphone 13 is mounted on the bracket 15. The bracket 15 is designed in a ring shape and can be arranged around the circumference of the microphone 13, so that the bracket 15 and the microphone 13 share part of the radial space of the nozzle 11, which can arrange the internal components of the nozzle 11 more compactly and effectively improve the space utilization.

[0085] The bracket 15 is fitted to the inner wall of the nozzle 11 and is partially spaced from the microphone 13 in the radial direction of the nozzle 11. This means that the bracket 15 itself will not directly block the main propagation path of the sound waves emitted by the vibration system 121. This minimizes the obstruction or reflection of sound propagation by the bracket 15.

[0086] Specifically, the bracket 15 can be welded to the inner wall of the sound outlet channel 11a, so that the bracket 15 and the inner wall of the sound outlet channel 11a of the nozzle 11 form a stable whole. This ensures that the bracket 15 is fixed in position during the use of the sleep headphones 100 (such as wearing, shaking, slight impact), and will not loosen or shift, providing a stable working environment for the microphone 13 mounted on the bracket 15.

[0087] The bracket 15 can be a metal bracket 15, which has high structural strength and stability. Moreover, the wall thickness of the bracket 15 is in the range of 0.1mm-0.3mm. While ensuring sufficient strength, it can significantly reduce the weight of the bracket 15 and reduce the space occupied. This allows more space to be freed up inside the limited space of the nozzle 11, thereby achieving a more compact structural design.

[0088] In some embodiments, the vibration system 121 is mounted on the bracket 15, which provides a stable mounting base for the vibration system 121. Since the bracket 15 is fixed to the inner wall of the nozzle 11, it accordingly ensures the accuracy of the position of the vibration system 121. The magnetic circuit system 122 is connected to the vibration system 121. This design is relatively straightforward, easy to assemble, and also makes the internal structure layered and easy to manufacture.

[0089] In some embodiments, the bracket 15 is located on the side of the vibration system 121 near the sound outlet 11b, that is, the bracket 15 is located in front of the vibration system 121 (near the sound outlet 11b) in the axial direction of the sound outlet channel 11a. In this case, the vibration system 121 is mounted on the bracket 15, but the bracket 15 does not occupy the space between the vibration system 121 and the inner wall of the nozzle 11. That is, there is no bracket 15 structure between the vibration system 121 and the inner wall of the nozzle 11. The radial dimension of the acoustic module 10 is mainly determined by the vibration system 121 itself and the wall thickness of the nozzle 11. The bracket 15 does not add an additional radial layer, so that the radial dimension of the acoustic module 10 does not increase.

[0090] like Figure 5 , Figure 6 As shown, specifically, the support 15 includes a cylindrical base 151 and an overlapping portion 152. The cylindrical base 151 is cylindrical and is the main body of the support 15. The outer wall of the cylindrical base 151 is connected to the inner wall of the nozzle 11, so that the cylindrical base 151 can be stably fixed in the sound outlet channel 11a. The microphone 13 is located inside the cylindrical base 151. The overlapping portion 152 is formed by bending the end of the cylindrical base 151 away from the sound outlet 11b toward the inside of the cylindrical base 151. That is to say, originally one end of the cylindrical base 151 extends along the opening direction of the cylinder, but on the side near the vibration system 121, this edge does not maintain a straight extension, but bends in the direction of the central axis of the cylindrical base 151 and finally falls inside the cylindrical base 151 itself. The structure formed by this bending is the overlapping part 152. It is a part of the cylindrical base 151 that has been "folded" inward, thus forming a structure with a certain shape and position connected to the cylindrical base 151. The outer edge of the vibration system 121 overlaps with the overlapping part 152, specifically on the side of the overlapping part 152 away from the sound outlet 11b. The protruding design of the overlapping part 152 provides a contact surface for connection with the pad 1212, so that the pad 1212 can be firmly connected to the overlapping part 152.

[0091] Specifically, the overlap 152 is a flanged structure that surrounds the cylindrical base 151. This flanged structure provides a large contact area, allowing the padding 1212 to achieve a more secure connection with the overlap 152. This large contact area reduces stress concentration at the contact point, improving connection reliability and evenly distributing the force from the vibration system 121. This design prevents localized stress concentration in the overlap 152 when subjected to vibrations from the vibration system 121, thereby improving the overall structural stability of the support 15.

[0092] To prevent the support 15 from rotating or shifting during use, a positioning protrusion 153 is provided at the end of the cylindrical base 151 away from the vibration system 121. A positioning notch 11c is provided on the nozzle 11, located inside the nozzle 11. The positioning protrusion 153 is confined within the positioning notch 11c, thus fixing the relative position between the support 15 and the nozzle 11. In other words, when the support 15 wants to move circumferentially relative to the nozzle 11, a portion of the wall of the positioning notch 11c can abut against the positioning protrusion 153 from both circumferential sides, thereby restricting the circumferential displacement of the support 15 relative to the nozzle 11.

[0093] Furthermore, the design of the positioning protrusion 153 and the positioning notch 11c provides a convenient assembly method, allowing the bracket 15 to be quickly installed into the nozzle 11. This simplifies the assembly process, reduces assembly errors, and improves production efficiency.

[0094] like Figure 12 and Figure 13 As shown, in some embodiments, the acoustic module 10 further includes a reinforcing plate 16, which is disposed in the sound outlet channel 11a and connected to the cylindrical base 151. The microphone 13 is disposed on the reinforcing plate 16. The reinforcing plate 16 provides additional support for the microphone 13, which can effectively prevent the microphone 13 from shifting or being damaged due to mechanical vibration or external force during the use of the sleep headphones 100.

[0095] In practical applications, electrical connections are typically achieved through soldering. Since the electrical connector 14 is a flexible circuit board, the expansion and contraction rates of the flexible circuit board and the support 15 differ when temperatures change. This difference generates continuous mechanical stress at the solder joint. This can lead to cracks (solder joints) during the soldering process or use, a phenomenon known as "solder cracking." This solder cracking can compromise the stability of the electrical connection, affecting the performance and reliability of the sleep headphones 100.

[0096] Therefore, in this embodiment, the reinforcing plate 16 is electrically connected to the flexible circuit board, and the microphone 13 is electrically connected to the flexible circuit board. The reinforcing plate 16 supports the portion of the flexible circuit board where the microphone 13 is located, meaning that a portion of the flexible circuit board is sandwiched between the reinforcing plate 16 and the microphone 13. The reinforcing plate 16 is located on the side of the flexible circuit board facing away from the sound outlet 11b. The reinforcing plate 16 can be made of a relatively rigid metal to provide strong support. During the soldering process, the stress on the solder joints (solder joints) is dispersed, reducing the risk of cracks caused by stress concentration. This ensures the stability of the entire internal structure of the nozzle 11 during use and reduces damage caused by mechanical vibration or external forces.

[0097] Specifically, the reinforcing plate 16 is made of stainless steel. Stainless steel has excellent corrosion resistance, effectively resisting the erosion of sweat, moisture, and other corrosive substances during daily use, extending the service life of the reinforcing plate 16, and ensuring its long-term stable performance in supporting and conducting electricity. Furthermore, stainless steel has good electrical conductivity, effectively conducting static electricity and quickly dissipating it, thus improving the electrostatic protection capability of the sleep headphones 100.

[0098] Furthermore, the thickness of the stainless steel sheet can be 0.1cm-0.2cm. If the thickness is less than 0.1cm, the strength of the stainless steel sheet will decrease, making it prone to bending, deformation, or even damage during use. If the thickness is greater than 0.2cm, the weight and material cost of the stainless steel sheet will increase, and excessively thick stainless steel sheets are not conducive to the miniaturization and slimming of the Sleep Headphones 100. The thickness of the stainless steel sheet between 0.1cm and 0.2cm is a balance point, ensuring sufficient strength and protective performance without causing processing, assembly, or cost problems due to excessive thickness or thinness.

[0099] To achieve the connection between the cylindrical base 151 and the reinforcing plate 16, a limiting groove 151a is provided on the wall of the cylindrical base 151. The opening of the limiting groove 151a faces the sound outlet 11b. Two limiting grooves 151a are arranged radially opposite each other along the cylindrical base 151. The reinforcing plate 16 is provided with two connecting protrusions 161. The two connecting protrusions 161 are respectively engaged in the two limiting grooves 151a, so that the reinforcing plate 16 can be supported in the cylindrical base 151 through the two connecting protrusions 161, forming a stable support state. The limiting groove 151a provides a clear installation position for the connecting protrusions 161, which can reduce quality problems caused by improper assembly. It effectively prevents the reinforcing plate 16 from shifting or tilting due to vibration or external force during use, and improves the stability of the internal structure of the nozzle 11.

[0100] like Figure 11 , Figure 12 , Figure 13 As shown, a clearance opening 151b is also provided on the wall of the cylindrical substrate 151, so that the electrical connector 14 can extend along the wall of the cylindrical substrate 151. The clearance opening 151b can reduce the extension length of the flexible circuit board, and the path of the electrical connector 14 is shorter, which reduces interference and loss in the signal transmission process. With the guidance of the clearance opening 151b wall, the wiring of the flexible circuit board is more neat and orderly, reducing the possibility of wiring chaos.

[0101] The electrical connector 14 extends through the clearance 151b and toward the vibration system 121, allowing the microphone 13 and the vibration system 121 to be connected simultaneously using a single flexible circuit board, reducing the number of connectors required. This design simplifies the internal structure, reduces wiring complexity, and makes the layout of the entire acoustic module 10 more compact. This compact design improves the space utilization efficiency of the nozzle 11.

[0102] Along the circumferential direction of the nozzle 11, the aforementioned positioning protrusion 153 is located between the two limiting grooves 151a, while the clearance opening 151b is arranged radially opposite to the positioning protrusion 153 along the nozzle 11. When the electrical connector 14 (such as a flexible circuit board) passes through the clearance opening 151b, it can avoid interference from the positioning protrusion 153 and the limiting grooves 151a. Furthermore, the reinforcing plate 16, the electrical connector 14, and the positioning structure do not interfere with each other spatially, further optimizing the utilization of internal space.

[0103] In some embodiments, a wiring channel 10a is formed between the outer wall of the magnetic circuit system 122 and the outer wall of the vibration system 121 and the inner wall of the sound outlet channel 11a (e.g., Figure 6 As shown, the wiring channel 10a extends axially along the nozzle 11. A portion of the electrical connector 14, which exits from the clearance opening 151b, extends along the wiring channel 10a, meaning the wiring channel 10a communicates with the clearance opening 151b. The wiring channel 10a allows the electrical connector 14 to pass through, making it visible in the nozzle 11, specifically on the side of the nozzle 11 opposite to the sound outlet 11b, and electrically connected to the vibration system 121. Due to the narrow area of ​​the nozzle 11, guiding the electrical connector 14 into the specific channel formed by the outer and inner walls of these structures allows for more efficient use of these "gap" spaces, preventing random wiring of the FPC and making the entire acoustic module 10 layout more compact and orderly.

[0104] like Figure 11 , Figure 12 , Figure 13 As shown, the inner wall of the sound outlet channel 11a is further recessed to form a wiring groove 11d. The outer walls of the magnetic circuit system 122, the vibration system 121, and the support 15 cover the opening of the wiring groove 11d to form the wiring channel 10a. The presence of the wiring groove 11d itself can provide a certain degree of protection for the flexible circuit board inside the groove, reducing direct friction or compression between it and the inner wall of the sound outlet channel 11a, and reducing the risk of circuit breakage or poor contact due to damage (such as excessive bending or scratching). Furthermore, covering the opening of the groove with the outer walls of the magnetic circuit system 122, the vibration system 121, and the support 15 further fixes the position of the flexible circuit board, preventing it from shifting in the circumferential direction of the nozzle 11, thereby significantly improving the damage resistance and long-term reliability of the flexible circuit board in complex vibration environments.

[0105] like Figure 11 , Figure 12 , Figure 13 As shown, in some embodiments, the acoustic module 10 also includes a protective net 17, which is generally frustum-shaped and covers the sound outlet 11b of the nozzle 11. The protective net 17 has a perforated hole 17b that communicates with the sound outlet 11b. In other words, the protective net 17 can block external particles and liquids from entering the nozzle 11 through the sound outlet 11b, while allowing sound signals to pass through smoothly.

[0106] Because the microphone 13 is located close to the sound outlet 11b, which is the part of the sleep headset 100 that directly contacts the outside world and exchanges air and sound, it is also the part most susceptible to static electricity. When a user accidentally touches the sound outlet 11b with a static-charged finger or other object, the static electricity will directly affect the microphone 13. The microphone 13 is a miniature microphone, and its internal sensitive components (such as the diaphragm 1211 and amplification circuit) are very sensitive to static electricity. Even a small static shock can cause the microphone 13 to degrade in performance or even fail completely.

[0107] Therefore, in this embodiment, the protective net 17, the bracket 15, and the reinforcing plate 16 are electrically connected, meaning that they can effectively conduct electrostatic charges. Specifically, the protective net 17 and the bracket 15 can achieve electrical connection through laser welding. The protective net 17, as a conductive material, can collect electrostatic charges and transfer them to the bracket 15. The reinforcing plate 16 is installed inside the bracket 15, meaning the charges are then transferred from the bracket 15 to the reinforcing plate 16, and finally electrically connected to the grounding terminal of the main control board 30 through the electrical connector 14 (flexible circuit board). This grounding design guides the static electricity acting on the protective net 17 to a safe grounding terminal, thereby preventing static electricity from directly acting on or breaking down the microphone 13 located near the protective net 17. This embodiment provides a low-impedance path, allowing static electricity to be released quickly, improving the anti-static performance of the sleep headphones 100 and the overall service life of the product.

[0108] Furthermore, the wall thickness of the protective mesh 17 ranges from 0.1mm to 0.3mm. At this thickness, the protective mesh 17 has a certain rigidity, is not easily deformed, and can better maintain its shape and continue to play a protective role. However, if the thickness is too large, the edges may cause unnecessary pressure on the ear canal wall, which may cause pain or discomfort after wearing for a long time, and is also not conducive to the miniaturization of the sleep headphones 100.

[0109] Furthermore, the nozzle 11 can also serve as part of the conduction of electrostatic charge. The protective net 17 conducts the charge to the nozzle 11, and the bracket 15 is arranged around the inner wall of the nozzle 11 to conduct static electricity to the reinforcing plate 16. The subsequent conduction path is the same as described above.

[0110] The electrical conductivity of the protective net 17, nozzle 11, bracket 15 and reinforcing plate 16 can be achieved by using metal materials or spraying conductive coatings. The material or coating method of the components can be flexibly selected according to actual needs during the design process.

[0111] Furthermore, the protective mesh 17 can be a protective steel mesh, which has high strength and toughness, effectively preventing damage caused by vibration, external impact, or accidental collisions during daily use, ensuring the stability and durability of the protective steel mesh in long-term use. In addition, the protective steel mesh has good conductivity, effectively conducting static electricity and reducing the direct impact of static electricity on the microphone 13.

[0112] like Figure 11 , Figure 12 , Figure 13 and Figure 14 As shown, in some embodiments, a boss 1721 is also provided on the outer wall surface of the protective net 17. There may be two bosses 1721, which are arranged radially opposite to each other along the protective net 17. The bosses 1721 protrude in a direction away from the center of the protective net 17. The interior of the bosses 1721 is connected to the interior of the protective net 17. The acoustic module 10 also includes an ear cap 18, which is installed on the outside of the nozzle 11 and connected to the protective net 17. The ear cap 18 has a mounting groove 18a, which engages with the boss 1721. When the ear cap 18 is installed on the acoustic module 10, the boss 1721 can accurately guide the installation position and direction of the ear cap 18, improving the relative position accuracy between the ear cap 18 and the acoustic module 10 (especially the vibration system 121).

[0113] Once the mounting slot 18a engages with the boss 1721, the boss 1721 provides sufficient clamping force to securely fasten the ear cap 18 to the protective mesh 17. This snap-fit ​​connection is more reliable and less prone to loosening than simple press-in or adhesive. If the ear cap 18 needs to be replaced (e.g., due to wear or user preference), or if the ear cap 18 needs to be removed for repair of the underlying acoustic module 10, this snap-fit ​​method simplifies the process and prevents damage.

[0114] The ear tips 18 are typically made of soft materials such as silicone. The soft ear tips 18 provide a more comfortable wearing experience and reduce direct irritation to the ear canal. Different sizes of ear tips 18 can adapt to different users' ear canal sizes, further improving comfort and fit.

[0115] like Figure 11 , Figure 12 , Figure 13 and Figure 14As shown, specifically, the ear cap 18 includes a connected mounting portion 181 and a sealing portion 182. The mounting portion 181 is cylindrical and has the aforementioned mounting groove 18a for mounting with the protective net 17. The sealing portion 182 is arranged in an umbrella shape around the periphery of the mounting portion 181. The sealing portion 182 has a sound guide hole 18b, which communicates with the perforated hole 17b. The sealing portion 182 can be used to seal the user's ear canal opening.

[0116] When the sleep headphones 100 are worn, the ear cap 18 fits tightly against the ear, creating a pressure difference between the inside and outside of the ear. This pressure difference can impact the eardrum, causing discomfort. Furthermore, the pressure can also impact the components inside the nozzle 11, potentially causing damage, such as deformation of the diaphragm 1211, which in turn negatively affects the sound quality of the sleep headphones 100.

[0117] like Figure 6 , Figure 12 and Figure 13 As shown, to solve the above problems, a pressure relief hole 17a is also provided on the protective net 17. Along the axial direction of the nozzle 11, the orthographic projection of the pressure relief hole 17a does not overlap with the orthographic projection of the sound outlet channel 11a, reducing the pressure relief hole 17a from becoming an additional sound leakage point and preventing sound leakage due to pressure relief. The pressure relief hole 17a is located near the boss 1721. Since the boss 1721 protrudes from the protective net 17, the inner wall surface of the boss 1721 and the outer wall surface of the nozzle 11 define an air guide channel 10c, and the pressure relief hole 17a is connected to the air guide channel 10c.

[0118] The inner wall of the ear cap 18 and the outer wall of the nozzle 11 fit together to form a pressure relief channel 10b that communicates with the outside (e.g., Figure 6 As shown, specifically, the pressure relief channel 10b is constructed by the mounting part 181 and the nozzle 11, and extends along the axial direction of the mounting part 181. The inner wall surface of the pressure relief channel 10b is spaced apart from the outer wall surface of the nozzle 11. The pressure relief channel 10b is connected to the pressure relief hole 17a through the air guide channel 10c. The pressure relief design allows the air pressure in the ear to be quickly balanced, reducing the feeling of pressure in the ear caused by the air pressure difference. Especially when wearing the sleep headphones 100 for a long time, this design can significantly improve the user's wearing experience.

[0119] The pressure relief hole 17a is set on the protective net 17, and the existing boss 1721 structure is used to form the air guide channel 10c. Without adding too many new structural components, it is integrated into the existing design, making the overall structure more compact.

[0120] Please continue reading. Figure 6 , Figure 12 and Figure 13Specifically, the protective net 17 includes a cover plate 171 and a side plate 172. The cover plate 171 is disc-shaped and covers the sound outlet 11b. It is provided with the aforementioned perforated hole 17b and pressure relief hole 17a. The side plate 172 is connected to the outer periphery of the cover plate 171 and extends towards the side where the nozzle 11 is located, so as to surround the circumference of the nozzle 11. This allows the protective net 17 to be firmly wrapped around the outer periphery of the nozzle 11, enhancing the structural strength and stability of the protective net 17 and making it less prone to deformation or falling off. A portion of the side plate 172 protrudes radially outward along the cover plate 171 to form a boss 1721, reducing the need for a separate locking structure. The inner wall of the boss 1721 and the outer wall of the nozzle 11 form the aforementioned air guide channel 10c. The two ends of the air guide channel 10c are respectively connected to the pressure relief hole 17a and the pressure relief channel 10b, clearly defining the functional path of the air guide channel 10c. One end connects to the pressure relief hole 17a on the protective net 17 (communicating with the internal space), and the other end connects to the pressure relief channel 10b formed between the ear cap 18 and the nozzle 11 (communicating with the external environment). This ensures that air pressure can flow smoothly along this path, achieving effective pressure relief and quickly balancing the air pressure inside and outside the ear.

[0121] like Figure 12 and Figure 13 As shown, in some embodiments, a mesh fabric 19 is also provided between the protective net 17 and the nozzle 11. The mesh fabric 19 is connected to the inner side of the protective net 17 and covers the perforated holes 17b on the protective net 17. The size and dimensions of the protective net 17 are adapted to the mesh fabric 19, covering the side of the protective net 17 near the sound outlet 11b. Understandably, the main function of the mesh fabric 19 is to further block dust and fine particles from entering the interior of the sleep headphones 100, protect the internal microphone 13 and speaker unit, reduce the risk of failure caused by dust accumulation or foreign object entry, and extend the service life of the sleep headphones 100.

[0122] Understandably, the perforations 17b of the protective mesh 17 are larger than the mesh openings of the mesh fabric 19. The main function of the protective mesh 17 is to prevent larger foreign objects from entering the interior of the sleep headset 100, and it also has a certain mechanical strength to withstand a certain amount of external impact. The mesh fabric 19, on the other hand, has several smaller mesh openings, providing more detailed protection. The combination of the protective mesh 17 and the mesh fabric 19 provides multi-layered protection, ensuring that the internal components of the sleep headset 100 are adequately protected in various usage scenarios. The protective mesh 17 blocks larger foreign objects and liquids, while the mesh fabric 19 further blocks dust and fine particles. This multi-layered protective design can effectively reduce the risk of malfunctions caused by the entry of dust and foreign objects.

[0123] The mesh 19 can be non-woven fabric, nylon mesh or polyester fiber mesh, which has good breathability and dustproof effect, while allowing sound to pass through.

[0124] In some embodiments, the sleep headphones 100 also include ear wings 50 (such as...) Figure 3 As shown, the ear wing 50 wraps around part of the outer surface of the main shell 20. The ear wing 50 is usually made of soft material, such as silicone or rubber, to reduce pressure on the ear and improve wearing comfort.

[0125] The ear wing 50 includes a connecting retaining sleeve and a supporting part. The retaining sleeve covers the portion of the main shell 20 located within the user's concha when the sleep headphones 100 are worn, serving to secure the main shell 20. This design ensures that the sleep headphones 100 will not easily slip or fall off during wear, especially during activities such as exercise or sleeping on one's side. The supporting part is configured to elastically abut against the user's antihelix when the sleep headphones 100 are worn. Through contact with the antihelix, it provides an additional support point for the sleep headphones 100, further enhancing the wearing stability of the sleep headphones 100. The elastic design of the supporting part can adapt to different users' ear shapes, reducing pressure on the antihelix and improving wearing comfort. At the same time, the elasticity of the supporting part can automatically adjust the contact force with the antihelix, ensuring stable wearing in various activity scenarios.

[0126] In this embodiment, the acoustic module 10 is, for example, but not limited to, a moving coil unit, a moving iron unit, a coil-iron unit, an electrostatic unit, a planar diaphragm unit, a magnetostrictive unit, etc. This application provides embodiments of different vibration systems 121 and magnetic circuit systems 122, which will be described below.

[0127] like Figure 15 As shown, in one configuration, the vibration system 121 includes a diaphragm 1211, a pad 1212, and a voice coil 1215. The voice coil 1215 is connected to the side of the diaphragm 1211 facing the magnetic circuit system 122. The diaphragm 1211 is the core component of the vibration system 121, responsible for converting electrical signals into mechanical vibrations to generate sound. The diaphragm 1211 can be made of a material with good elasticity, lightweight, and high strength, such as polyester film or polycarbonate. The pad 1212 is annular and connected to the outer edge of the diaphragm 1211, meaning the diaphragm 1211 is arranged within the pad 1212. The outer edge of the pad 1212 is adjacent to the inner wall of the nozzle 11. Along the radial direction of the nozzle 11, the pad 1212 is directly adjacent to the inner wall of the nozzle 11, without any other structure between them. Furthermore, the pad 1212 is mounted on the bracket 15, which ensures that the position of the pad 1212 is fixed. The pad 1212 serves to fix and support the diaphragm 1211, reducing unnecessary displacement of the diaphragm 1211 during vibration.

[0128] The pad 1212 can be made of a flexible material, such as, but not limited to, rubber, foam plastic, etc. The pad 1212 is connected to the diaphragm 1211 and can also be used to absorb vibration energy during the vibration of the diaphragm 1211, which helps to reduce noise generation, improve sound clarity, protect the diaphragm 1211, reduce wear on the diaphragm 1211 during vibration, and extend the service life of the acoustic module 10.

[0129] The magnetic circuit system 122 includes a central magnet 1221 and an outer ring magnet 1222. The central magnet 1221 can be a T-shaped iron to provide a stable magnetic field. The T-shape design makes the magnetic field more concentrated, improving its strength and uniformity. The central magnet 1221 specifically includes a base 1221A and a magnetic post 1221B protruding from the base 1221A. The base 1221A is arranged around the inner wall of the nozzle 11. The magnetic post 1221B extends into the outer ring magnet 1222 and forms a magnetic gap 122a with the outer ring magnet 1222. The voice coil 1215 is connected to one side of the diaphragm 1211 and inserted into the magnetic gap 122a. Understandably, the outer ring magnet 1222 is arranged in a ring shape and is arranged around the inner wall of the nozzle 11, that is, the outer edge of the outer ring magnet 1222 is adjacent to the inner wall of the nozzle 11, and there are no other structures between them. At least one outer ring magnet 1222 may be provided, and multiple outer ring magnets 1222 may be stacked sequentially. The outer ring magnets 1222 surround the magnetic column 1221B circumferentially and are spaced apart from the magnetic column 1221B to enhance the strength and uniformity of the magnetic field. The outer ring magnets 1222, in conjunction with the central magnet 1221, form a closed magnetic field loop. This structure makes the magnetic field more concentrated and uniform, improving the strength and efficiency of the magnetic field.

[0130] The gasket 1212, the outer ring magnet 1222, and the base 1221A are stacked sequentially along the axial direction of the nozzle 11. The outer ring magnet 1222 is connected to the gasket 1212, and the base 1221A is connected to the outer ring magnet 1222. This arrangement can fix the entire magnetic circuit system 122 in a proper position, ensuring that the magnetic circuit system 122 will not shift or deform during operation.

[0131] Accordingly, the voice coil 1215 is located in the magnetic field generated by the magnetic circuit system 122. The voice coil 1215 is used to vibrate and produce sound under the drive of an electric current. When an audio current passes through the voice coil 1215, a magnetic field is generated around the voice coil 1215. This magnetic field interacts with the magnetic field generated by the magnetic circuit system 122, generating a torque that causes the voice coil 1215 to move. This, in turn, drives the diaphragm 1211 of the vibration system 121 to vibrate. The diaphragm 1211 is driven by the voice coil 1215 to vibrate, thus pushing the surrounding air to emit sound waves.

[0132] It should be noted that the base 1221A of the central magnet 1221 is provided with a rear cavity tuning hole 1221A1 that passes through the base 1221A along the axial direction of the nozzle 11. Along the axial direction of the nozzle 11, the projection of the rear cavity tuning hole 1221A1 does not coincide with the projection of the outer ring magnet 1222. The rear cavity tuning hole 1221A1 can connect the external air and the rear cavity of the vibration system 121, adjust the air pressure on the back of the vibration system 121, control the acoustic coupling degree between the rear cavity and the external air, thereby changing the pressure and acoustic load acting on the back of the diaphragm 1211.

[0133] like Figure 16 As shown, in another configuration, the magnetic circuit system 122 includes a magnet 1223 and a coil 1224, which are spaced apart. The magnet 1223 and coil 1224 can be connected to the bracket 15. The vibration system 121 includes an armature 1213, a connecting rod 1214, and a diaphragm 1211. The armature 1213 includes a first part 1213A and a second part 1213B. The first part 1213A passes through the magnet 1223 and the coil 1224, and is spaced apart from them. The magnet 1223 can generate a constant magnetic field, and the coil 1224 is located in this magnetic field. When an electrical signal passes through the coil 1224, the coil 1224 generates a changing magnetic field, which interacts with the constant magnetic field to generate a force, driving the coil 1224 (or the connected armature 1213) to move. The second part 1213B is located on one side of the magnetic circuit system 122 and is connected to the nozzle 11. It can increase the overall rigidity of the vibration system 121, reduce unnecessary vibration or resonance, and help improve sound quality stability. One end of the connecting rod 1214 is connected to the first part 1213A, and the other end is connected to the diaphragm 1211. The outer edge of the diaphragm 1211 is connected to the bracket 15, which can ensure that the center position of the diaphragm 1211 is accurate and the edge is firmly restrained. That is to say, the diaphragm 1211 does not move freely during operation; its edge needs a supporting structure to define the boundary conditions of its vibration. The bracket 15 provides this support and determines the effective vibration area of ​​the diaphragm 1211 and the constraint method of its edge.

[0134] The microphone 13 is connected to the bracket 15 and is located on the sound output side of the diaphragm 1211. It can more accurately capture the actual effect of the sound emitted by the diaphragm 1211 in the ear canal, providing a more accurate basis for subsequent signal processing.

[0135] In the description of this application, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the accompanying drawings are only for illustrative purposes and should not be construed as limiting this application. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0136] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0137] In the description of this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0138] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0139] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An acoustic module applied to a headset, characterized in that, include: The nozzle is provided with a sound outlet channel and a sound outlet hole communicating with the sound outlet channel; A vibration system is disposed within the sound outlet channel, and the vibration system is adjacent to the inner wall of the nozzle; A magnetic circuit system is disposed within the sound outlet channel and is adjacent to the inner wall of the nozzle; the magnetic circuit system is used to drive the vibration system to vibrate and produce sound. as well as A microphone is located within the sound output channel and spaced along the axial direction of the nozzle on the sound output side of the vibration system.

2. The acoustic module of claim 1, wherein, Along the axial direction of the nozzle, the distance between the vibration system and the microphone is 0.2mm-0.5mm.

3. The acoustic module of claim 1, wherein, The diameter of the nozzle is 3mm-6mm, and the length of the nozzle is 3mm-10mm.

4. The acoustic module of claim 1, wherein, It also includes a support frame; The bracket is located inside the sound outlet channel and connected to the nozzle. The microphone and the vibration system are both mounted on the bracket.

5. The acoustic module of claim 4, wherein, The bracket is located on the side of the vibration system near the sound outlet.

6. The acoustic module of claim 5, wherein, The support includes a cylindrical base and an overlapping portion. The cylindrical base is connected to the inner wall of the nozzle, and the microphone is located inside the cylindrical base. The overlapping portion is formed by bending the end of the cylindrical base away from the sound outlet toward the interior of the cylindrical base, and the vibration system overlaps on the side of the overlapping portion away from the sound outlet.

7. The acoustic module of claim 6, wherein, The cylindrical base is provided with a positioning protrusion at one end away from the vibration system, and a positioning notch is provided on the nozzle, with the positioning protrusion confined within the positioning notch.

8. The acoustic module of claim 4, wherein, The earphone includes a main housing and a main control board disposed within the main housing. The acoustic module is connected to the main housing and further includes: An electrical connector is provided, which is electrically connected to the vibration system and the microphone, and is also used for electrical connection to the main control board.

9. The acoustic module of claim 8, wherein, A wiring channel is formed between the outer wall of the magnetic circuit system and the outer wall of the vibration system and the inner wall of the nozzle, and the wiring channel is used for the electrical connector to pass through.

10. The acoustic module of claim 8, wherein, The electrical connector is a flexible circuit board, and the microphone is electrically connected to the flexible circuit board. The acoustic module also includes a reinforcing plate connected to the bracket, and a portion of the flexible circuit board is sandwiched between the reinforcing plate and the microphone.

11. The acoustic module of claim 10, wherein, It also includes protective netting; The protective netting is installed over the sound outlet of the nozzle.

12. The acoustic module as described in claim 11, characterized in that, The protective net, the bracket, and the reinforcing plate are electrically connected. The reinforcing plate is electrically connected to the main control board through the electrical connector, so that the main control board can be grounded.

13. The acoustic module of any one of claims 1 to 12, wherein, The acoustic module also includes a protective net and ear caps. The protective net covers the sound outlet of the nozzle. The ear caps are installed on the outside of the nozzle and connected to the protective net. The protective net has a pressure relief hole. The inner wall of the ear cap and the outer wall of the nozzle cooperate to form a pressure relief channel. The pressure relief channel connects the pressure relief hole to the outside.

14. The acoustic module of claim 13, wherein, The outer wall of the protective net is provided with a protrusion, and the ear cap has a mounting slot, which is engaged with the protrusion.

15. The acoustic module of claim 14, wherein, The protective net includes: A cover plate covers the sound outlet hole, and the cover plate is provided with a perforated hole and the pressure relief hole; A side plate is connected to the outer periphery of the cover plate and surrounds the nozzle. A portion of the side plate protrudes outward to form a boss. The inner wall of the boss and the outer wall of the nozzle cooperate to form an air guide channel. The two ends of the air guide channel are respectively connected to the pressure relief hole and the pressure relief channel.

16. The acoustic module of claim 1, wherein, The magnetic circuit system includes a central magnet and an outer ring magnet. The outer edge of the outer ring magnet is adjacent to the inner wall of the nozzle. The central magnet includes a base and a magnetic post protruding from the base. The magnetic post extends into the outer ring magnet and forms a magnetic gap with the outer ring magnet. The vibration system includes a diaphragm, a voice coil, and a gasket. The voice coil is connected to one side of the diaphragm and inserted into the magnetic gap. The gasket is annular and connected to the outer edge of the diaphragm. The outer edge of the gasket is adjacent to the inner wall of the nozzle. The microphone is spaced apart on the sound output side of the diaphragm.

17. The acoustic module of claim 16, wherein, The acoustic module also includes a bracket, which is disposed in the sound outlet channel and connected to the nozzle; the pad is installed on the bracket, and the pad, the outer ring magnet and the base are stacked sequentially along the axial direction of the nozzle.

18. The acoustic module of claim 1, wherein, The magnetic circuit system includes a magnet and a coil, with the magnet and the coil spaced apart. The vibration system includes an armature, a connecting rod, and a diaphragm. The armature includes a first part and a second part. The first part passes through the magnet and the coil and is spaced apart from the magnet and the coil. The second part is located on one side of the magnetic circuit system and is connected to the nozzle. One end of the connecting rod is connected to the first part, and the other end is connected to the diaphragm.

19. An acoustic module applied to a headset, characterized in that, include: The nozzle is provided with a sound outlet channel and a sound outlet hole communicating with the sound outlet channel; A vibration system is provided within the sound output channel; A magnetic circuit system is disposed within the sound outlet channel; the magnetic circuit system is used to drive the vibration system to vibrate and produce sound. as well as A microphone is located within the sound output channel and spaced along the axial direction of the nozzle on the sound output side of the vibration system. The nozzle is the mounting housing for the vibration system, the magnetic circuit system, and the microphone.

20. A sleep earphone, characterized in that include: Main housing, wherein a main control board is provided inside the main housing; as well as The acoustic module as described in any one of claims 1 to 19, wherein the nozzle of the acoustic module is connected to the main housing, and the vibration system and the microphone are both electrically connected to the main control board.

21. The sleep earphones of claim 20, wherein, The main housing is provided with a plug groove, and part of the nozzle is inserted into the plug groove and is detachably connected to the main housing.

22. The sleep headphones as described in claim 21, characterized in that, The acoustic module is provided with a first electrical connector, and the main housing is provided with a second electrical connector, wherein the first electrical connector and the second electrical connector are plugged into each other.

23. The sleep earphones of claim 20, wherein, It also includes a detection module located within the main housing, the detection module being used to detect the acoustic impedance of the acoustic module, and the main control board being used to match and adapt acoustic parameters based on the acoustic impedance detected by the detection module.

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