Thermoelectric separation circuit board for easy assembly

Abstract

This utility model discloses a thermoelectric separation circuit board that is easy to assemble, comprising: a substrate, an insulating layer, and a metal circuit layer; the insulating layer is located between the substrate and the metal circuit layer, and the insulating layer is used to isolate the substrate and the metal circuit layer; a through hole is formed on the insulating layer, and a heat-conducting pillar is filled in the through hole, one end of the heat-conducting pillar is connected to the substrate, and the other end of the heat-conducting pillar is in contact with the lower end face of the LDE chip; both the heat-conducting pillar and the substrate are made of metal. This utility model has the advantages of simplifying the production process and reducing the production difficulty.

Description

Technical Field

[0001] This utility model belongs to the field of thermoelectric separation circuit board technology, and specifically relates to a thermoelectric separation circuit board that is easy to assemble. Background Technology

[0002] A thermoelectric separation circuit board typically includes a substrate, an insulating layer, a metal circuit layer, and heat-conducting pillars. The heat-conducting pillars are usually fabricated on the substrate using methods such as etching. Corresponding through-holes are then created in the insulating layer to allow the heat-conducting pillars to be inserted into the through-holes and make contact with the LED for heat conduction. During the etching process, due to the relatively low etching thickness, each heat-conducting pillar requires multiple etching passes to achieve the required size. The fluidity of the etching solution means that each etched area is not perfectly precise, meaning the formed heat-conducting pillars are not perfectly perpendicular. In this situation, increasing the size of the through-holes for easier insertion results in inaccurate relative positioning of the inserted heat-conducting pillar with the substrate and metal circuit layer. Conversely, smaller through-holes make insertion difficult. Therefore, to reduce the assembly difficulty of the thermoelectric separation circuit board, a more easily assembled thermoelectric separation circuit board is proposed. Utility Model Content

[0003] This utility model aims to solve at least one of the technical problems existing in the prior art.

[0004] Therefore, this utility model proposes a thermoelectric separation circuit board that is easy to assemble. This easy-to-assemble thermoelectric separation circuit board has the advantages of simplifying the production process and reducing the difficulty of production.

[0005] According to an embodiment of the present invention, a thermoelectric separation circuit board that is easy to assemble includes: a substrate, an insulating layer, and a metal circuit layer; the insulating layer is located between the substrate and the metal circuit layer, and the insulating layer is used to isolate the substrate and the metal circuit layer; a through hole is formed on the insulating layer, and a heat-conducting pillar is filled in the through hole, one end of the heat-conducting pillar is connected to the substrate, and the other end of the heat-conducting pillar is in contact with the lower end face of the LDE chip.

[0006] According to one embodiment of the present invention, both the heat-conducting pillar and the substrate are made of metal.

[0007] According to one embodiment of the present invention, the heat-conducting column is made of copper.

[0008] According to one embodiment of the present invention, the substrate is made of copper or aluminum.

[0009] According to one embodiment of the present invention, the metal circuit layer is composed of multiple metal wires, and the through holes are staggered with the metal wires.

[0010] According to one embodiment of the present invention, there are multiple through holes, and each of the multiple through holes has a heat-conducting column formed therein.

[0011] According to one embodiment of the present invention, the insulating layer is a semi-cured board.

[0012] According to one embodiment of the present invention, a solder resist layer is formed on the metal circuit layer.

[0013] The beneficial effects of this utility model are that it separates the heat-conducting pillar from the substrate, avoiding the etching process of the substrate, simplifying the production steps, and realizing the preparation of the heat-conducting pillar by filling the through holes of the insulating layer with fluid metals such as copper paste. While playing a role in heat dissipation for the LDE chip, it also avoids the process of assembling with through holes, thus reducing the production difficulty.

[0014] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention.

[0015] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0016] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the following description of the embodiments with accompanying drawings, in which:

[0017] Figure 1 This is a cross-sectional view of the overall structure of this utility model;

[0018] Figure label:

[0019] 1. Substrate; 2. Insulating layer; 3. Metal circuit layer; 4. Solder resist layer; 5. Heat-conducting pillar; 6. LDE chip. Detailed Implementation

[0020] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0021] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, features defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0022] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0023] Thermoelectric separation circuit board of this utility model, which is easy to assemble, is described in detail below with reference to the accompanying drawings.

[0024] like Figure 1 As shown, the easily assembled thermoelectric separation circuit board according to an embodiment of the present invention includes: a substrate 1, an insulating layer 2, and a metal circuit layer 3; the insulating layer 2 is located between the substrate 1 and the metal circuit layer 3, and the insulating layer 2 is used to isolate the substrate 1 and the metal circuit layer 3; a through hole is formed on the insulating layer 2, and a heat-conducting pillar 5 is filled in the through hole, one end of the heat-conducting pillar 5 is connected to the substrate 1, and the other end of the heat-conducting pillar 5 is in contact with the lower end face of the LDE chip 6.

[0025] In this embodiment, substrate 1, insulating layer 2, and metal plate are stacked sequentially to form an interconnected whole. Then, the metal plate is etched into the required metal lines to form metal circuit layer 3. At this time, the etched area exposes insulating layer 2. Then, through holes are formed on insulating layer 2 using laser or other processes. The through holes are then filled with fluid metal such as copper paste, and the fluid metal is sintered to form heat-conducting pillar 5. The lower end of heat-conducting pillar 5 is connected to substrate 1. Then, the pins of LDE chip 6 are connected to the metal lines, and the lower end face of LDE chip 6 is connected to the upper end of heat-conducting pillar 5, so that the heat of LDE chip 6 is guided to substrate 1 through heat-conducting pillar 5, achieving thermoelectric separation. The upper surface of heat-conducting pillar 5 is flat and can be treated by polishing after sintering. By separating the heat-conducting pillar 5 from the substrate 1, the etching process of the substrate 1 is avoided, simplifying the production steps. Furthermore, the heat-conducting pillar 5 is fabricated by filling the through-holes of the insulating layer 2 with fluid metals such as copper paste. While serving to dissipate heat for the LDE chip 6, it also avoids the assembly process with the through-holes, thus reducing the production difficulty. In addition, since the assembly step is avoided, the cross-sectional shape of the heat-conducting pillar 5 does not need to be easy to assemble, so it is not limited to circles or other shapes. Any shape is acceptable. Therefore, the cross-sectional shape and size of the heat-conducting pillar 5 can be consistent with the size of the lower surface of the LDE chip 6 to maximize the contact area with the LDE chip 6 and improve the thermal conductivity.

[0026] Both the heat-conducting pillar 5 and the substrate 1 are made of metal.

[0027] The heat-conducting pillar 5 is made of copper.

[0028] The substrate 1 is made of copper or aluminum.

[0029] In this embodiment, the heat-conducting pillar 5 and the substrate 1 can be made of the same type of metal or different types of metal. For example, the heat-conducting pillar 5 can be made of copper and the substrate 1 can be made of aluminum, or the heat-conducting pillar 5 can be made of copper and the substrate 1 can also be made of copper. Preferably, the heat-conducting pillar 5 is made of copper and the substrate 1 is made of aluminum. Although the thermal conductivity of aluminum is lower than that of copper, its specific heat capacity is much higher than that of copper. Therefore, the heat dissipation speed of the aluminum substrate 1 is not much different from that of the copper substrate 1, while the aluminum substrate 1 has a lower cost, which can more effectively reduce costs.

[0030] The metal circuit layer 3 is composed of multiple metal lines, and the vias and metal lines are staggered; that is, the vias and metal lines do not overlap, so as to ensure the connection between the LDE chip 6 and the metal circuit layer 3.

[0031] There are multiple through-holes, and each through-hole contains a heat-conducting pillar 5. The specific number can be determined based on the number of LDE chips 6.

[0032] Insulation layer 2 is a semi-cured board.

[0033] A solder mask layer 4 is formed on the metal circuit layer 3. In other words, a solder mask layer 4 is formed on the metal lines that will be connected to the LDE chip 6 to protect the metal lines.

[0034] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0035] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A thermoelectric separation circuit board that is easy to assemble, characterized in that, include: The substrate (1), insulating layer (2), and metal circuit layer (3) are provided. The insulating layer (2) is located between the substrate (1) and the metal circuit layer (3) and is used to isolate the substrate (1) and the metal circuit layer (3). A through hole is formed on the insulating layer (2) and a heat-conducting pillar (5) is filled in the through hole. One end of the heat-conducting pillar (5) is connected to the substrate (1) and the other end of the heat-conducting pillar (5) is in contact with the lower end face of the LDE chip (6).

2. The easily assembled thermoelectric separation circuit board according to claim 1, characterized in that, Both the heat-conducting pillar (5) and the substrate (1) are made of metal.

3. The easily assembled thermoelectric separation circuit board according to claim 2, characterized in that, The heat-conducting pillar (5) is made of copper.

4. The easily assembled thermoelectric separation circuit board according to claim 2, characterized in that, The substrate (1) is made of copper or aluminum.

5. The easily assembled thermoelectric separation circuit board according to claim 4, characterized in that, The metal circuit layer (3) is composed of multiple metal lines, and the through holes are staggered with the metal lines.

6. The easily assembled thermoelectric separation circuit board according to claim 5, characterized in that, The number of through holes is multiple, and each of the multiple through holes has a heat-conducting column (5).

7. The easily assembled thermoelectric separation circuit board according to claim 1, characterized in that, The insulating layer (2) is a semi-cured board.

8. The easily assembled thermoelectric separation circuit board according to claim 1, characterized in that, A solder resist layer (4) is formed on the metal circuit layer (3).

Images