Circuit board assemblies, terminal modules and energy storage devices

Abstract

This application provides a circuit board assembly, a terminal module, and an energy storage device. The circuit board assembly includes a substrate and an electrical connector. The substrate has a device placement surface and a soldering surface facing away from each other, and the substrate also has a connection hole that passes through the device placement surface and the soldering surface. The electrical connector includes a connecting portion and a lead portion. The connecting portion is disposed on the device placement surface and located on the side of the connection hole facing the device placement surface. The side of the connecting portion facing the connection hole forms a contact surface, which electrically connects to a conductive bus. The lead portion is connected to the connecting portion and passes through the substrate and is exposed on the soldering surface. During assembly, the device is on the device placement surface, so that the lead portion of the electrical connector and the lead of the device are both on the soldering surface. Therefore, the soldering operation only needs to be performed on the soldering surface, eliminating the need to flip the substrate and perform another soldering operation. In addition, the contact surface is exposed on the soldering surface, so the conductive bus can be installed onto the electrical connector on the soldering surface without having to wrap the conductive bus around the device placement surface, which facilitates the assembly of the conductive bus and improves production efficiency.

Description

Technical Field

[0001] This application relates to the field of circuit board assembly, specifically to a circuit board assembly, terminal module, and energy storage device. Background Technology

[0002] Electronic components are mounted on a circuit board. The pins of these components need to pass through the circuit board and be soldered to it to establish communication between the components and the circuitry within the board. When components are mounted on both the front and back sides of the circuit board, it is necessary to solder not only the pins of the components on the front side but also to flip the circuit board to solder the pins of the components on the back side. This results in two soldering processes required to assemble the components from both sides onto the circuit board, leading to low production efficiency. Utility Model Content

[0003] In view of this, this application provides a circuit board assembly, terminal module and energy storage device that can improve production efficiency.

[0004] One embodiment of this application provides a circuit board assembly, including a substrate and an electrical connector. The substrate has a device placement surface and a soldering surface facing away from each other. The substrate also has a connection hole that passes through the device placement surface and the soldering surface. The electrical connector includes a connection portion and a lead portion. The connection portion is disposed on the device placement surface and located on the side of the connection hole facing the device placement surface. The side of the connection portion facing the connection hole forms a contact surface, which is configured to electrically connect a conductive bus. The lead portion is connected to the connection portion, passes through the substrate, and is exposed on the soldering surface.

[0005] The circuit board assembly provided in this application allows for the placement of components on the component placement surface during assembly. The connecting portion of the electrical connector is also placed on the component placement surface, with the pins of the electrical connector passing through the substrate and exposed on the soldering surface. This ensures that both the pins of the electrical connector and the pins of the component are on the soldering surface, enabling the electrical connector and component to be assembled onto the substrate simply by soldering on the soldering surface. This eliminates the need to flip the substrate and perform another soldering operation, improving production efficiency. Furthermore, the substrate exposes the contact surface through connection holes, allowing the conductive busbar to be installed onto the electrical connector directly on the soldering surface without needing to wind the conductive busbar around the component placement surface, facilitating the assembly of the conductive busbar and further improving production efficiency.

[0006] In some embodiments, the contact surface abuts against the device layout surface and covers the opening of the connection hole facing the device layout surface. The hole wall of the connection hole is configured to limit the displacement of the conductive busbar relative to the contact surface, thereby improving the stability of the conductive busbar relative to the contact surface and improving assembly efficiency.

[0007] In some embodiments, the connecting hole has a limiting area and a clearance area. The contact surface covers the opening of the limiting area facing the device layout surface, and the clearance area is located beside the contact surface and is used to avoid the bend when the conductive bus extends into the connecting hole. Since the bend does not connect to the contact surface, the contact surface does not need to cover the opening of the clearance area facing the device layout surface, thereby saving the area of ​​the contact surface and reducing the material cost of the electrical connector. When the conductive bus is fixed to the contact surface, the bend is prone to protruding from the side where the conductive bus is fixed to the contact surface, resulting in an uneven surface on the side where the conductive bus is fixed to the contact surface. By setting the clearance area to avoid the bend, the side where the conductive bus is fixed to the contact surface can be made flat, increasing the contact area and improving the conductivity efficiency.

[0008] In some embodiments, the circuit board assembly further includes fasteners, and the electrical connector has mounting holes that pass through the contact surface. The fasteners pass through the mounting holes and the through holes of the conductive busbar, and abut against the contact surface to fix the conductive busbar and the connection part. By setting the fasteners, the conductive busbar and the contact surface are fixed tightly, thereby improving the fixing stability and conductivity efficiency.

[0009] In some embodiments, the electrical connector further includes a fixing post, which is located on the side of the connecting portion facing away from the substrate. A mounting hole is located on the fixing post and extends through the end of the fixing post away from the connecting portion. The fastener passes through the mounting hole and is fixed to the fixing post. By providing the fixing post, the fastener is fixed to the fixing post, increasing the fixing area and improving the fixing stability of the fastener.

[0010] In some embodiments, a boss is provided on the side of the connecting portion facing the substrate, and a contact surface is provided on the side of the boss facing away from the connecting portion. The boss is located inside the connecting hole, and the contact surface is flush with the welding surface. Alternatively, a portion of the boss extends out of the connecting hole, and the contact surface protrudes from the welding surface. The boss raises the contact surface, so that the conductive bus can be connected to the contact surface without extending into the connecting hole, so that the conductive bus can be connected to the contact surface.

[0011] In one embodiment of this application, a terminal module is also provided, including terminals and a circuit board assembly as described in any of the above embodiments. The terminals are disposed on the device placement surface of the circuit board assembly, and the solder pins of the terminals penetrate the substrate of the circuit board assembly and are exposed on the soldering surface of the circuit board assembly.

[0012] In some embodiments, a latch is provided on the side of the terminal facing the substrate, and the substrate is provided with a latch groove for the latch to pass through the substrate, thereby fixing the terminal to the substrate.

[0013] In some embodiments, the terminal module further includes a fixing member, the terminal is provided with a first fixing hole, the substrate is provided with a second fixing hole, the first fixing hole and the second fixing hole are aligned, and the fixing member passes through the first fixing hole and the second fixing hole to fix the substrate and the terminal.

[0014] In one embodiment of this application, an energy storage device is also provided, including a housing, a conductive busbar, and a terminal module as described in any of the above embodiments. The terminal module and the conductive busbar are disposed inside the housing, the terminal module is disposed in the housing, the terminals are exposed in the housing, and the conductive busbar is electrically connected to the contact surface of the electrical connector.

[0015] The terminal module and energy storage device provided in this application, through the aforementioned circuit board assembly, also achieve the same result: electrical connectors and devices can be assembled onto the substrate by performing soldering operations only on the soldering surface of the substrate, eliminating the need to flip the substrate and perform another soldering operation. At the same time, the conductive busbar can be installed onto the electrical connector on the soldering surface without having to wrap the conductive busbar around the device placement surface, which facilitates the assembly of the conductive busbar and improves production efficiency. Attached Figure Description

[0016] Figure 1 This is a perspective view of an energy storage device according to one embodiment of this application.

[0017] Figure 2 for Figure 1 An exploded view of the energy storage device.

[0018] Figure 3 This is a perspective view of the assembled terminal module and conductive busbar in one embodiment of this application.

[0019] Figure 4 for Figure 3 An exploded view of the terminal module and conductive busbars.

[0020] Figure 5 for Figure 4 A 3D view of the assembled terminal module and conductive busbar.

[0021] Figure 6 for Figure 4 A 3D view of the terminal module.

[0022] Figure 7 for Figure 2 Enlarged view of point A in the middle.

[0023] Explanation of main component symbols 100. Circuit board assembly; 200. Terminal module; 201. Terminal; 2011. Solder foot; 2012. Snap-fit; 2013. First fixing hole; 202. Fixing component; 300. Energy storage device; 301. Housing; 3011. Exposed hole; 302. Conductor bar; 3021. Electrical connection part; 3022. Bending part; 3023. Through hole; 10. Substrate; 11. Device layout surface; 12. Soldering surface; 13. Connection hole; 131. Limiting area; 132. Clearance area; 14. Slot; 15. Second fixing hole; 20. Electrical connector; 21. Connection part; 211. Contact surface; 22. Pin part; 23. Mounting hole; 24. Fixing post; 30. Fastener. Detailed Implementation

[0024] The technical solution of this application will now be described with reference to the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments.

[0025] It should be noted that when an element is considered to be "connected to" or "located on" another element, it can be directly connected to the other element or may have an element centrally located. In this application, unless otherwise explicitly specified and limited, the terms "installed," "connected," and "fixed," etc., should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two elements. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances. The terms "first," "second," etc., are only used to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly indicating the number, specific order, or primary / secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly specified. The shape descriptions in the embodiments of this application are merely illustrative and should not constitute any absolute limitation on this application. The terms "vertical" and "parallel" are used to describe the ideal state between two components; in actual production or use, a state approximately vertical or parallel may exist.

[0026] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. Where there is no conflict, the various embodiments in this application can be combined with each other.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The terms “comprising,” “having,” and “equipped with,” and any variations thereof, in the description, claims, and foregoing drawings of this application, are intended to cover non-exclusive inclusion.

[0028] Electronic components are mounted on a circuit board. The pins of these components need to pass through the circuit board and be soldered to it to establish communication between the components and the circuitry within the board. When components are mounted on both the front and back sides of the circuit board, it is necessary to solder not only the pins of the components on the front side but also to flip the circuit board to solder the pins of the components on the back side. This results in two soldering processes required to assemble the components from both sides onto the circuit board, leading to low production efficiency.

[0029] In view of this, this application provides a circuit board assembly, terminal module, and energy storage device that can improve production efficiency. The circuit board assembly includes a substrate and electrical connectors. The substrate has a device placement surface and a soldering surface facing away from each other, and the substrate also has a connection hole that passes through the device placement surface and the soldering surface. The electrical connector includes a connection portion and a lead portion. The connection portion is disposed on the device placement surface and is located on the side of the connection hole facing the device placement surface. The side of the connection portion facing the connection hole forms a contact surface, which is configured to electrically connect a conductive bus. The lead portion is connected to the connection portion and passes through the substrate and is exposed on the soldering surface.

[0030] The circuit board assembly provided in this application allows for the placement of components on the component placement surface during assembly. The connecting portion of the electrical connector is also placed on the component placement surface, with the pins of the electrical connector passing through the substrate and exposed on the soldering surface. This ensures that both the pins of the electrical connector and the pins of the component are on the soldering surface, enabling the electrical connector and component to be assembled onto the substrate simply by soldering on the soldering surface. This eliminates the need to flip the substrate and perform another soldering operation, improving production efficiency. Furthermore, the substrate exposes the contact surface through connection holes, allowing the conductive busbar to be installed onto the electrical connector directly on the soldering surface without needing to wind the conductive busbar around the component placement surface, facilitating the assembly of the conductive busbar and further improving production efficiency.

[0031] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0032] like Figure 1 , Figure 2 and Figure 3As shown, this application embodiment provides a circuit board assembly 100, a terminal module 200, and an energy storage device 300. The terminal module 200 includes terminals 201 and the circuit board assembly 100, with the terminals 201 disposed on the circuit board assembly 100. The energy storage device 300 includes a housing 301, a conductive busbar 302, and the terminal module 200. The terminal module 200 and the conductive busbar 302 are located within the housing 301 and protected by it. The terminal module 200 is mounted on the inner surface of the housing 301, and the terminals 201 are exposed through an exposure hole 3011 in the housing 301. The conductive busbar 302 is used to connect the circuit board assembly 100 and other components in the energy storage device 300, such as a battery pack or inverter. The terminals 201 are used to plug in an external device, enabling the energy storage device 300 to supply power to the external device or to charge the energy storage device 300 from the external device. The external device can be an electrical appliance, a solar panel, or a household power supply device, etc. For example, the energy storage device 300 may be a portable power source for outdoor scenarios or a home energy storage system for storing energy in a home.

[0033] In some embodiments, such as Figure 3 , Figure 4 and Figure 5 As shown, the circuit board assembly 100 includes a substrate 10 and an electrical connector 20. The substrate 10 has a device placement surface 11 and a soldering surface 12 facing away from each other. The electrical connector 20 includes a connecting portion 21 and a lead portion 22 for electrical connection. The device placement surface 11 is used to place electronic devices, such as transistors, resistors, and capacitors. Terminals 201 and the connecting portion 21 are both located on the device placement surface 11. The lead portion 22 and the solder feet 2011 of the terminal 201 pass through the substrate 10 and are exposed on the soldering surface 12. The substrate 10 also has a connection hole 13 that passes through the device placement surface 11 and the soldering surface 12. The connecting portion 21 is located on the side of the connection hole 13 facing the device placement surface 11. The side of the connecting portion 21 facing the connection hole 13 forms a contact surface 211. The contact surface 211 is exposed on the soldering surface 12 through the connection hole 13. The contact surface 211 is used to electrically connect to the conductive bus 302, so that the conductive bus 302 is electrically connected to the substrate 10.

[0034] During assembly, the circuit board assembly 100 provided in this application is arranged on the device layout surface 11 via the connecting part 21 and the terminal 201, so that the solder feet 2011 of the pin part 22 and the terminal 201 both pass through the substrate 10 and are exposed on the soldering surface 12. This allows the electrical connector 20 and the terminal 201 to be assembled onto the substrate 10 by performing a soldering operation only on the soldering surface 12, eliminating the need to flip the substrate 10 and perform another soldering operation, thus improving production efficiency. In addition, the substrate 10 exposes the contact surface 211 through the connecting hole 13, so that the contact surface 211 is exposed on the soldering surface 12, so that the conductive bus 302 can be installed onto the electrical connector 20 directly from the soldering surface 12 without having to wrap the conductive bus 302 around the device layout surface 11, which facilitates the assembly of the conductive bus 302 and improves production efficiency.

[0035] Understandably, during the assembly of the energy storage device 300, since the terminal 201 needs to be exposed in the exposure hole 3011 of the housing 301, the device layout surface 11 is the side of the substrate 10 facing the exposure hole 3011, and the welding surface 12 is the side of the substrate 10 facing away from the exposure hole 3011.

[0036] In some embodiments, the contact surface 211 abuts against the device layout surface 11 and covers the opening of the connection hole 13 facing the device layout surface 11. The hole wall of the connection hole 13 is used to limit the conductive bus 302 to restrict the displacement of the end of the conductive bus 302 relative to the contact surface 211, thereby making it easier to install the end of the conductive bus 302 onto the contact surface 211 and improving assembly efficiency.

[0037] For example, the connecting hole 13 has two opposing hole walls, and the distance between the two hole walls is basically the same as the width of the conductive bus 302. When assembling the conductive bus 302 and the electrical connector 20, the end of the conductive bus 302 extends into the connecting hole 13 to be installed on the contact surface 211. At this time, the two hole walls can limit the end of the conductive bus 302 to restrict the movement of the end of the conductive bus 302 in the direction perpendicular to the two hole walls, thereby improving the stability of the end of the conductive bus 302 relative to the contact surface 211 and thus improving the assembly efficiency.

[0038] Optionally, the substrate 10 has a flexible member (not shown) on the wall of the connection hole 13. The flexible member is used to flexibly support the conductive busbar 302. The two opposing hole walls of the connection hole 13 can clamp the conductive busbar 302 through the flexible member, so that the connection hole 13 can accommodate conductive busbars 302 of different sizes. For example, if the conductive busbar 302 has different dimensions due to processing tolerances, the flexible member can compensate for this, so that the connection hole 13 has a higher limiting ability for the conductive busbar 302. At the same time, the flexible member can also buffer the force between the conductive busbar 302 and the substrate 10. For example, the flexible member can be rubber or sponge.

[0039] In some embodiments, such as Figure 5 , Figure 6 and Figure 7 As shown, the connection hole 13 has a limiting area 131 and a clearance area 132 that are connected. The contact surface 211 covers the opening of the limiting area 131 facing the device layout surface 11. The limiting area 131 is used for the electrical connection part 3021 of the conductive bus 302 to extend into, and the electrical connection part 3021 is used for electrical connection to the contact surface 211. The clearance area 132 is located beside the contact surface 211 and is used to avoid the bend 3022 when the conductive bus 302 extends into the connection hole 13. Since the bend 3022 is not connected to the contact surface 211, the contact surface 211 does not need to cover the opening of the clearance area 132 facing the device layout surface 11, thereby saving the area of ​​the contact surface 211 and reducing the material cost of the electrical connector 20. When the conductive bus 302 is fixed to the contact surface 211, the bend 3022 tends to protrude from the side where the conductive bus 302 is fixed to the contact surface 211, resulting in an uneven surface on the side where the conductive bus 302 is fixed to the contact surface 211. By setting the clearance area 132 to avoid the bend 3022, the side where the conductive bus 302 is fixed to the contact surface 211 can be made flat, increasing the contact area and improving the conductivity.

[0040] In some embodiments, there are multiple pin portions 22, which are evenly distributed on opposite edges of the connecting portion 21 and bent relative to the connecting portion 21 toward the substrate 10, and pass through the substrate 10. The avoidance area 132 is located on the side of the connecting portion 21 where no pin portions 22 are provided, to avoid interference between the pin portions 22 and the bent portion 3022 of the conductive bus 302. For example, there are four pin portions 22 in total, with two pin portions 22 provided on each opposite side of the connecting portion 21.

[0041] In some embodiments, the connection hole 13 extends toward the side of the contact surface 211 and penetrates the edge of the substrate 10, so that one side of the connection hole 13 is not closed. In this case, the bent portion 3022 of the conductive bus 302 can be avoided by the unclosed side of the connection hole 13. For example, when the connection hole 13 is close to the edge of the substrate 10, or when the bent portion 3022 of the conductive bus 302 is large, the bent portion 3022 of the conductive bus 302 can be avoided by the connection hole 13 penetrating the edge of the substrate 10.

[0042] In some embodiments, the circuit board assembly 100 further includes a fastener 30, which passes through the connecting portion 21 and the electrical connection portion 3021 of the conductive bus 302 to fix the connecting portion 21 and the conductive bus 302. Specifically, the electrical connector 20 is provided with a mounting hole 23 that passes through the contact surface 211, and the conductive bus 302 is provided with a through hole 3023 in the electrical connection portion 3021. The fastener 30 passes through the mounting hole 23 and the through hole 3023 and abuts against the contact surface 211 to fix the conductive bus 302 and the connecting portion 21. By providing the fastener 30, the conductive bus 302 and the contact surface 211 are fixed tightly, improving the fixing stability and conductivity efficiency. For example, the mounting hole 23 is a threaded hole, the fastener 30 is a screw and the screw head can press the electrical connection part 3021 to the contact surface 211 to realize the electrical connection between the conductive bus 302 and the electrical connector 20. In this way, when installing the conductive bus 302 to the contact surface 211, the operation of placing a nut on the device layout surface 11 is eliminated, which improves the assembly efficiency.

[0043] In some embodiments, the electrical connector 20 further includes a fixing post 24, which is located on the side of the connecting portion 21 facing away from the substrate 10. A mounting hole 23 is located on the fixing post 24 and extends through the end of the fixing post 24 away from the connecting portion 21, allowing the fastener 30 to extend out of the mounting hole 23. This avoids interference between the fixing post 24 and the fastener 30. The fastener 30 passes through the mounting hole 23 and is fixed to the fixing post 24. By providing the fixing post 24, the fastener 202 is fixed to the fixing post 24, increasing the fixing area and improving the fixing stability of the fastener 30. Specifically, the connecting portion 21 can be plate-shaped, and the fixing post 24 can be column-shaped with its axis perpendicular to the connecting portion 21. The cross-sectional area of ​​the fixing post 24 is smaller than the area of ​​the connecting portion 21 to reduce the overall weight of the electrical connector 20.

[0044] In some embodiments, the connecting portion 21 has a boss (not shown) on the side facing the substrate 10. The boss is located inside the connecting hole 21, and the contact surface 211 is located on the side of the boss facing away from the connecting portion 21. The height of the boss can be substantially the same as the thickness of the substrate 10, so that the contact surface 211 is flush with the welding surface 12. Alternatively, a portion of the boss extends out of the connecting hole 13, so that the contact surface 211 protrudes from the welding surface 12. The boss allows the conductive bus 302 to connect to the contact surface 211 without extending into the connecting hole 13. For example, when the area of ​​the electrical connecting portion 3021 is larger than the area of ​​the connecting hole 13, the electrical connecting portion 3021 cannot extend into the connecting hole 13. In this case, the boss can be used to lift the contact surface 211 so that the electrical connecting portion 3021 can connect to the contact surface 211.

[0045] In some embodiments, a latch 2012 is provided on the side of the terminal 201 facing the substrate 10, and the substrate 10 is provided with a slot 14 for the latch 2012 to pass through the substrate 10. The latch 2012 cooperates with the slot 14 to fix the terminal 201 and the substrate 10.

[0046] In some embodiments, the terminal module 200 further includes a fixing member 202. The terminal 201 has a first fixing hole 2013, the substrate 10 has a second fixing hole 15, and the inner surface of the housing 301 has a third fixing hole (not shown). The first fixing hole 2013, the second fixing hole 15, and the third fixing hole are aligned sequentially. The fixing member 202 passes through the first fixing hole 2013, the second fixing hole 15, and the third fixing hole to fix the substrate 10, the terminal 201, and the housing 301. Exemplarily, the fixing member 202 is a screw, and the third fixing hole is a threaded hole.

[0047] Furthermore, those skilled in the art should recognize that the above embodiments are merely illustrative of this application and are not intended to limit this application. Any appropriate changes and variations made to the above embodiments within the essential spirit and scope of this application fall within the scope of this application's disclosure.

Claims

1. A circuit board assembly, characterized in that, include: A substrate has a device placement surface and a soldering surface facing away from each other, and the substrate is also provided with a connection hole that passes through the device placement surface and the soldering surface; An electrical connector includes a connection portion and a pin portion. The connection portion is disposed on the device mounting surface and located on the side of the connection hole facing the device mounting surface. The side of the connection portion facing the connection hole forms a contact surface, which is configured as an electrical connection busbar. The pin portion is connected to the connection portion, passes through the substrate, and is exposed on the soldering surface.

2. The circuit board assembly as described in claim 1, characterized in that: The contact surface abuts against the device layout surface and covers the opening of the connection hole facing the device layout surface, and the hole wall of the connection hole is configured to limit the conductive busbar.

3. The circuit board assembly as described in claim 2, characterized in that: The connection hole has a limiting area and a clearance area. The contact surface covers the opening of the limiting area facing the device layout surface. The clearance area is located on the side of the contact surface and is used to avoid the bend when the conductive busbar extends into the connection hole.

4. The circuit board assembly as described in any one of claims 1 to 3, characterized in that: The circuit board assembly also includes fasteners. The electrical connector has mounting holes that penetrate the contact surface. The fasteners pass through the mounting holes and the through holes of the conductive busbar, and abut against the contact surface to fix the conductive busbar to the connection portion.

5. The circuit board assembly as described in claim 4, characterized in that: The electrical connector further includes a fixing post, which is located on the side of the connection portion facing away from the substrate. The mounting hole is located on the fixing post and extends through the end of the fixing post away from the connection portion. The fastener passes through the mounting hole and is fixed to the fixing post.

6. The circuit board assembly as claimed in claim 1, characterized in that: The connecting part has a boss on the side facing the substrate, and the contact surface is located on the side of the boss facing away from the connecting part. The boss is located inside the connecting hole, and the contact surface is flush with the welding surface. Alternatively, a portion of the boss extends out of the connecting hole, and the contact surface protrudes from the welding surface.

7. A terminal module, characterized in that: The circuit board assembly includes terminals and a circuit board assembly as described in any one of claims 1 to 6, wherein the terminals are disposed on the device placement surface of the circuit board assembly, and the solder pads of the terminals penetrate the substrate of the circuit board assembly and are exposed on the soldering surface of the circuit board assembly.

8. The terminal module as described in claim 7, characterized in that: The terminal is provided with a buckle on the side facing the substrate, and the substrate is provided with a slot for the buckle to pass through the substrate, and the buckle fixes the terminal to the substrate.

9. The terminal module as described in claim 7, characterized in that: The terminal module also includes a fixing member. The terminal has a first fixing hole, and the substrate has a second fixing hole. The first fixing hole and the second fixing hole are aligned. The fixing member passes through the first fixing hole and the second fixing hole to fix the substrate and the terminal.

10. An energy storage device, characterized in that: The energy storage device includes a housing, a busbar, and a terminal module as described in any one of claims 7 to 9. The terminal module and the busbar are disposed within the housing. The terminal module is disposed within the housing, and the terminals are exposed in the housing. The busbar is electrically connected to the contact surface of the electrical connector.

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