Circuit board structure

Abstract

This utility model provides a circuit board structure. The circuit board structure includes a first substrate, a first conductive element, a sintered metal body, a second conductive element, and a second substrate. The first conductive element is disposed on the first substrate. The sintered metal body is disposed on the first conductive element. The second conductive element is disposed on the sintered metal body. The second substrate is disposed on the second conductive element.

Description

Technical Field

[0001] This utility model relates to circuit board structures, and more particularly to a circuit board structure having a metal sintered body. Background Technology

[0002] With the widespread use of electronic products, higher performance is required. For example, to achieve more or more complex functions, the number of interconnect structures in the circuit board structure can be increased. However, due to manufacturing processes, the size or shape of these interconnect structures may deviate (e.g., height differences), leading to unstable connections or even failures. Therefore, while existing circuit board structures have gradually met their intended uses, they are not perfect in every aspect. Thus, there is still a need to improve circuit board structures. Utility Model Content

[0003] According to some embodiments, a circuit board structure is provided. The circuit board structure includes a first substrate, a first conductive element, a sintered metal body, a second conductive element, and a second substrate. The first conductive element is disposed on the first substrate. The sintered metal body is disposed on the first conductive element. The second conductive element is disposed on the sintered metal body. The second substrate is disposed on the second conductive element.

[0004] In some embodiments, the first conductive element has a recess, and a sintered metal body is disposed in the recess.

[0005] In some embodiments, the second conductive element passes through the metal sintered body and directly contacts the first conductive element, and a portion of the side surface of the second conductive element is covered by the metal sintered body.

[0006] In some embodiments, the sintered metal body protrudes from the recess.

[0007] In some embodiments, a portion of the bottom surface and side surface of the second conductive element is covered by a sintered metal body.

[0008] In some embodiments, the number of the first conductive element, the second conductive element, and the sintered metal body are all multiple.

[0009] In some embodiments, each of the plurality of second conductive elements includes a conductive post, and the horizontal height of the conductive posts of the plurality of second conductive elements is different.

[0010] In some embodiments, each of the plurality of first conductive elements includes a pad, and the pads of the plurality of first conductive elements are substantially at the same horizontal height.

[0011] In some embodiments, the volumes of the plurality of sintered metal bodies are substantially the same.

[0012] In some embodiments, the sintered metal body has an arc-shaped top surface.

[0013] The circuit board structure of this invention can be applied to various types of electronic devices. To make the components and advantages of this invention more apparent and understandable, various embodiments are described below in conjunction with the accompanying drawings for detailed explanation. Attached Figure Description

[0014] When with attachment Figure 1 This invention can be more fully understood from the following detailed description. It is worth noting that, in accordance with industry standard practice, the components are not drawn to scale. In fact, for clarity, the dimensions of each component can be arbitrarily enlarged or reduced.

[0015] Figures 1 to 6 These are cross-sectional schematic diagrams showing different stages of the manufacturing process of the circuit board structure according to some embodiments of the present invention. Detailed Implementation

[0016] The following provides a detailed description of the apparatus according to various embodiments of the present invention. It should be understood that the following description provides many different embodiments for implementing various forms of some embodiments of the present invention. The specific elements and arrangements described below are merely for simple and clear description of some embodiments of the present invention. Of course, these are only examples and not limitations on the present invention. Furthermore, similar and / or corresponding element symbols may be used in different embodiments to identify similar and / or corresponding elements for clear description of the present invention. However, the use of these similar and / or corresponding element symbols is only for simple and clear description of some embodiments of the present invention and does not represent any relationship between the different embodiments and / or structures discussed.

[0017] Furthermore, it should be understood that the ordinal numbers used in the specification and claims, such as "first," "second," etc., to modify elements, are not intended to imply any prior ordinal number for that element (or those elements), nor to indicate the order of one element with another, or the order of manufacturing processes. The use of these ordinal numbers is solely to clearly distinguish one named element from another element with the same name. The claims and specification may not use the same terminology; for example, the first element in the specification may be the second element in the claims.

[0018] In some embodiments of this utility model, terms such as "connect," "interconnect," and "bond," unless specifically defined, may refer to two structures being in direct contact, or to two structures not being in direct contact, wherein another structure is disposed between the two structures. Furthermore, these terms regarding connection and bonding may also include cases where both structures are movable or both structures are fixed. In addition, the terms "electrical connection" or "electrical coupling" include any direct and indirect electrical connection means.

[0019] In this text, the terms "approximately," "about," and "substantially" typically indicate a value or range within 10%, 5%, 3%, 2%, 1%, or 0.5%. The given quantities are approximate; that is, even without specific mention of "approximately," "about," or "substantially," their meaning is implied. The phrase "the range is between the first and second values" indicates that the range includes the first value, the second value, and other values ​​in between. Furthermore, any two values ​​or directions used for comparison may have a certain degree of error. If the first value equals the second value, it implies an error within approximately 10%, 5%, 3%, 2%, 1%, or 0.5%. If the first direction is perpendicular to the second direction, the angle between the first and second directions may be between 80 and 100 degrees. If the first direction is parallel to the second direction, then the angle between the first direction and the second direction can be between 0 degrees and 10 degrees.

[0020] It should be understood that, without departing from the spirit of this utility model, the components in the various embodiments can be replaced, reorganized, or combined to complete other embodiments. Components in each embodiment can be arbitrarily combined and used as long as they do not violate the spirit of the invention or conflict with it.

[0021] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art. It is understood that such terms, for example, as defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the relevant art and the background or context of this invention, and should not be interpreted in an idealized or overly formal manner, unless specifically defined in embodiments of this invention.

[0022] To achieve more diverse or complex functions, some existing circuit board structures include multiple interconnected circuit boards. These circuit boards are electrically connected through combinations of conductive pillars and pads, and there can be more than one combination of conductive pillars and pads. Generally, multiple conductive pillars usually have the same horizontal height. However, as designs become more complex or components become smaller, unexpected differences in the horizontal height of multiple conductive pillars may occur. These differences can cause height discrepancies when some conductive pillars and pads are mated, resulting in unstable connections or connection failures.

[0023] As described above, to ensure stable connection between two circuit boards, this invention provides a circuit board structure and its manufacturing method. Specifically, this invention involves placing a metal sintered body (obtained by curing metal paste) between two electrical connecting elements, and filling any gaps that may occur between the two electrical connecting elements. In this way, a stable electrical connection can still be achieved even if the two electrical connecting elements are not in direct contact with each other.

[0024] Reference Figures 1 to 6 These are cross-sectional schematic diagrams showing different stages of the manufacturing process of the circuit board structure according to some embodiments of the present invention. It is worth noting that, for the sake of simplicity and ease of understanding, the dimensions of components and the proportions between them may be exaggerated in the drawings of this invention. Furthermore, some components in the circuit board structure may be omitted in the drawings of this invention, but those skilled in the art will understand that the circuit board structure may also include other common components. For example, the circuit board structure of this invention may also include various active components, passive components, heat dissipation components, connectors, and / or protective layers, etc., not shown in the drawings.

[0025] like Figure 1As shown, a first substrate 10 and a first conductive element 11 are provided. In some embodiments, the first substrate 10 may optionally include a core layer 100, a dielectric layer 101, a circuit layer 102, a core layer via 103, a dielectric layer via 104, and a protective layer 105. The dielectric layer 101 may be disposed on one or both sides of the core layer 100. The circuit layer 102 may be disposed between the core layer 100 and the dielectric layer 101, or disposed on the dielectric layer 101. The core layer via 103 passes through the core layer 100 and electrically connects to the circuit layer 102 or other elements on both sides of the core layer 100. The dielectric layer via 104 passes through the dielectric layer 101 and electrically connects to the circuit layer 102. The protective layer 105 covers the dielectric layer 101. It is worth mentioning that the description of the various components above is for the purpose of helping to understand the possible structure or composition of the first substrate 10 and is not intended to limit the present invention. In some embodiments, the first substrate 10 may omit a portion of its components, such as the core layer 100, the core layer via 103, or both. In some embodiments, the first substrate 10 may also include additional components, such as additional dielectric or circuit layers.

[0026] In some embodiments, the core layer 100 may be made of or may include a prepreg containing polymeric materials, fibrous materials, or other suitable materials, but the present invention is not limited thereto. For example, the polymeric material may be or may include epoxy resin, polyimide (PI), polypropylene (PP), other suitable polymeric materials, or combinations thereof, but the present invention is not limited thereto. For example, the fibrous material may include carbon fiber, glass fiber, other suitable fibrous materials, or combinations thereof, but the present invention is not limited thereto.

[0027] In some embodiments, the dielectric layer 101 may be made of epoxy resin, polyimide, Ajinomoto build-up film (ABF), other suitable polymeric materials, or combinations thereof, but the present invention is not limited thereto. In some embodiments, the circuit layer 102, the core layer via 103, and / or the dielectric layer via 104 may be made of conductive materials, such as aluminum (Al), copper (Cu), their alloys, or compounds thereof, but the present invention is not limited thereto. For example, copper alloys or compounds may be made of brass, phosphor bronze, beryllium bronze, or oxygen-free copper, but the present invention is not limited thereto. In some embodiments, the protective layer 105 may be made of epoxy resin, acrylic resin, polyurethane (PU), silicone resin, polyimide, build-up film, UV-curable resin, other suitable polymeric materials, or combinations thereof, but the present invention is not limited thereto.

[0028] In some embodiments, a dielectric layer 101 may be formed on the core layer 100 by lamination, coating, other suitable processes, or combinations thereof, but the present invention is not limited thereto. In some embodiments, a circuit layer 102 with a specific pattern may be formed on the core layer 100 or the dielectric layer 101 by a combination of deposition, photolithography, and etching processes. In some embodiments, the deposition process may include electroplating, chemical plating, physical vapor deposition (PVD), chemical vapor deposition (CVD), other suitable processes, or combinations thereof, but the present invention is not limited thereto. In some embodiments, the photolithography process may include photoresist application (e.g., spin-on coating, lamination), soft baking, mask alignment, exposure, post-exposure baking, photoresist developing, rinsing, drying (e.g., spin-drying and / or hard baking), other suitable photolithography techniques, and / or combinations thereof, but the present invention is not limited thereto. In some embodiments, the etching process may include dry etching, wet etching, other suitable etching, or combinations thereof, but the present invention is not limited thereto.

[0029] In some embodiments, the circuit layer 102 and the dielectric layer via 104 can be formed sequentially in the same process, but the present invention is not limited thereto. In other embodiments, after forming the dielectric layer 101, a via (not shown) exposing the circuit layer 102 can be formed by a drilling process, and then a conductive material can be filled on the circuit layer 102 by a combination of deposition, photolithography and etching processes to form the dielectric layer via 104. In some embodiments, the drilling process may include mechanical drilling, laser drilling, other suitable processes or combinations thereof, but the present invention is not limited thereto.

[0030] Following the steps described above, a first conductive element 11 is disposed on the first substrate 10. For example, the first conductive element 11 may be disposed on a dielectric layer via 104 of the first substrate 10, so that the circuit layer 102 is electrically connected to the first conductive element 11 through the dielectric layer via 104. In some embodiments, the first conductive element 11 may be a gasket or the like, but the present invention is not limited thereto. In some embodiments, the dielectric layer 101 has an opening, and the side surface 101S of the dielectric layer 101 and the top surface 104T of the dielectric layer via 104 are exposed from the opening. The first conductive element 11 extends from the top surface 101T of the dielectric layer 101 to the side surface 101S of the dielectric layer 101, and extends to cover the top surface 104T of the dielectric layer via 104. In some embodiments, the first conductive element 11 is conformally disposed on the top surface 101T and side surface 101S of the dielectric layer 101, and conformally disposed on the top surface 104T of the dielectric layer via 104. In this case, due to the characteristics of the conformal deposition process, the first conductive element 11 may further form a recess 11R.

[0031] In some embodiments, viewed from a top view, the shape of the recess 11R of the first conductive element 11 may be a triangle, a circle, an ellipse, a quadrilateral, a pentagon, other suitable patterns, or combinations thereof, but the present invention is not limited thereto. In some embodiments, viewed from a cross-sectional view, the shape of the recess 11R of the first conductive element 11 may be a semicircle, a semi-ellipse, an inverted triangle, an inverted trapezoid, other suitable patterns, or combinations thereof, but the present invention is not limited thereto.

[0032] In some embodiments, the recess 11R is for receiving metal paste (e.g., Figure 2 The depth and width (or diameter) of the recess 11R can be determined according to the amount of metal paste to be filled. For example, when a large amount of metal paste is to be filled, the recess 11R can have a deeper depth or a wider width (or diameter) to avoid excessive overflow of the metal paste during subsequent bonding. Conversely, when a small amount of metal paste is to be filled, the recess 11R can have a shallower depth or a narrower width (or diameter) to prevent the metal paste from failing to perform its function (i.e., as an electrical connection element or a fixing element). In some embodiments, the recess 11R can also be a multi-step recess, but the present invention is not limited thereto.

[0033] In some embodiments, the number of first conductive elements 11 can be multiple. For example, the number of first conductive elements 11 can be two, three, four, or more than four, but the present invention is not limited thereto. In some embodiments, viewed from a top view, the multiple first conductive elements 11 can be arranged in any pattern, such as a matrix or a specific pattern as required. In some embodiments, each of the multiple first conductive elements 11 may include a pad, and the top surface 11T of each pad (i.e., the surface away from the dielectric layer via 104) is substantially flush in the horizontal direction. In other words, the top surfaces 11T of the multiple first conductive elements 11 are substantially coplanar. However, the present invention is not limited thereto. In other embodiments, the top surfaces 11T of the multiple first conductive elements 11 may also not be flush in the horizontal direction. For example, due to manufacturing tolerances or design requirements, the first conductive elements 11 may have height differences between each other.

[0034] In embodiments where there are multiple first conductive elements 11, the dimensions (e.g., height or depth) of each recess 11R may be the same, but the present invention is not limited thereto. In other embodiments, the dimensions (e.g., height or depth) of each recess 11R may be adjusted individually as needed. For example, the dimensions of the recesses 11R located at the periphery of the first substrate 10 may be larger, and the dimensions of the recesses 11R located at the center of the first substrate 10 may be smaller.

[0035] In some embodiments, the first conductive element 11 may include a conductive material, the description of which is given above and will not be repeated here. In some embodiments, the dielectric layer via 104 and the first conductive element 11 may be formed continuously in the same process. In this case, the dielectric layer via 104 and the first conductive element 11 may include the same or similar materials. However, the present invention is not limited thereto. In other embodiments, the dielectric layer via 104 and the first conductive element 11 may be formed separately in different processes. In this case, the dielectric layer via 104 and the first conductive element 11 may include different materials.

[0036] In some embodiments, the protective layer 105 may cover a portion of the first conductive element 11. Figure 1 For example, the protective layer 105 may cover a portion of the first conductive element 11 located on the top surface 101T of the dielectric layer 101, and expose another portion of the first conductive element 11 located on the side surface 101S of the dielectric layer 101 and the top surface 104T of the dielectric layer via 104. For example, the protective layer 105 may be formed on the first conductive element 11 after the first conductive element 11 is formed, by a process such as a printing process.

[0037] like Figure 2As shown, following the above steps, a metal paste 12 is provided in the recess 11R of the first conductive element 11. In this invention, the metal paste 12 is used to fill any possible gaps between the first conductive element 11 on the first substrate 10 and the second conductive element (e.g., the second conductive element 15) on the second substrate (e.g., the second substrate 13). That is, when the first conductive element 11 and the second conductive element are not in direct contact, the metal paste 12 is used to electrically connect the two. In some embodiments, the metal paste 12 may fill at least 30% of the recess 11R of the first conductive element 11. For example, the volume of the metal paste 12 may be 30%, 40%, 50%, 60%, 70%, 80%, or any value or range between these values ​​of the recess 11R, but this invention is not limited thereto. In some embodiments, the volume of the metal paste 12 may be less than 80% of the volume of the recess 11R to avoid overflow due to excessive filling of the metal paste 12, but this invention is not limited thereto.

[0038] In embodiments where there are multiple first conductive elements 11, the volume of metal paste 12 in each recess 11R can be the same, but the present invention is not limited thereto. In other embodiments, the volume of metal paste 12 in each recess 11R can be adjusted according to requirements. For example, more metal paste 12 can be filled in larger recesses 11R, or less metal paste 12 can be filled in recesses 11R corresponding to larger second conductive elements.

[0039] In some embodiments, the metal paste 12 may include metal powder, sintering aids, and an organic carrier, but the present invention is not limited thereto. For example, the metal powder may be or may include copper, silver (Ag), nickel (Ni), tin (Sn), other suitable metal powders or alloys thereof, but the present invention is not limited thereto. For example, the metal powder may be a silver-copper alloy or a copper-tin alloy. For example, the sintering aid may include: glass powder, such as silicate glass or borosilicate glass; metal oxides, such as bismuth oxide (Bi2O3), copper oxide (CuO), or zinc oxide (ZnO); organic salts, such as carboxylate salts or acetate salts, but the present invention is not limited thereto. For example, the organic carrier may include: solvents such as α-terpineol, ethylene glycol (EG), and propylene glycol monomethyl ether (PGME); binders such as ethyl cellulose derivatives and polyvinylpyrrolidone (PVP); and dispersants such as stearates, but the present invention is not limited thereto. In some embodiments, the particle size of the metal powder in the metal paste 12 may be between 10 nm and 10 μm, but the present invention is not limited thereto. In some embodiments, the metal paste 12 may also include reducing agents such as formates and hydrides, but the present invention is not limited thereto. In some embodiments, the metal paste 12 may also include antioxidants. In some embodiments, the metal paste 12 is a copper paste.

[0040] In some embodiments, the metal paste 12 may be formed by screen printing, dispensing, inkjet printing, doctor-blade coating, stencil printing, other suitable processes or combinations thereof, but the present invention is not limited thereto.

[0041] like Figure 3 As shown, following the above steps, a second substrate 13 is provided. In some embodiments, the second substrate 13 may optionally include a core layer 130, a dielectric layer 131, a circuit layer 132, a core layer via 133, a dielectric layer via 134, and a protective layer 135. The functions, configurations, and formation steps of these components can be referred to the various similar components of the first substrate 10, and will not be repeated here.

[0042] like Figure 4 As shown, following the above steps, a photoresist material 14 is disposed on one side of the second substrate 13, and the photoresist material 14 has an opening 140, wherein the opening 140 exposes the dielectric layer via 134. In some embodiments, the photoresist material 14 may be or may include epoxy acrylate, polyacrylate, modified polyester resin, other suitable materials or combinations thereof, but the present invention is not limited thereto.

[0043] Following the steps described above, conductive material is filled into the opening 14O to form the second conductive element 15. The description of the conductive material can be found above and will not be repeated here. In some embodiments, the conductive material can be applied by physical vapor deposition, chemical vapor deposition, electroplating, other suitable processes, or combinations thereof, but the present invention is not limited thereto.

[0044] like Figure 5 As shown, following the steps described above, the photoresist material 14 is removed. In some embodiments, the photoresist material 14 can be removed by processes such as photoresist stripping, chemical-mechanical polishing (CMP), etching, other suitable processes, or combinations thereof, but the present invention is not limited thereto. After removing the photoresist material 14, the second conductive element 15 protrudes from the protective layer 135. In some embodiments, the portion of the second conductive element 15 protruding from the protective layer 135 is columnar, but the present invention is not limited thereto. In some embodiments, the second conductive element 15 may include conductive pillars.

[0045] In some embodiments, viewed from a top-down perspective, the shape of the second conductive element 15 may be triangular, circular, elliptical, quadrilateral, pentagonal, or other suitable patterns or combinations thereof, but the present invention is not limited thereto. In some embodiments, the number of second conductive elements 15 may be multiple, corresponding to the number of first conductive elements 11. For example, the number of second conductive elements 15 may be two, three, four, or more than four, but the present invention is not limited thereto. In some embodiments, viewed from a top-down perspective, the multiple second conductive elements 15 may be arranged in any pattern, such as a matrix or a specific pattern as required. In some embodiments, each of the multiple second conductive elements 15 may include a conductive post, and the bottom surface 15B of each conductive post (i.e., the surface away from the dielectric layer via 134) has a different horizontal height. In other words, the bottom surfaces 15B of the multiple second conductive elements 15 are not substantially coplanar. For example, due to process tolerances (e.g., errors in mechanical grinding) or according to design requirements, the second conductive elements 15 may have different heights relative to each other.

[0046] like Figure 6 As shown, following the above steps, the second substrate 13 is attached to the first substrate 10, and the second conductive element 15 is electrically connected to the metal paste 12, or the second conductive element 15 is electrically connected to the first conductive element 11. For example, the second conductive element 15 can be in direct contact with the metal paste 12, or the second conductive element 15 can pass through the metal paste 12 and directly contact the first conductive element 11.

[0047] Following the above steps, the metal paste 12 is cured to form a sintered metal body 16. In some embodiments, the metal paste 12 can be cured by a sintering process, a carrier curing process, other suitable processes, or a combination thereof. For example, the sintering process may include laser sintering, thermo-compression bonding, or microwave sintering, but the present invention is not limited thereto. For example, the carrier curing process may include a photocuring process, but the present invention is not limited thereto. After curing, the paste-form metal paste 12 becomes a solid-form sintered metal body 16, and the sintered metal body 16 can fix the first conductive element 11 and the second conductive element 15.

[0048] When there are multiple first conductive elements 11, second conductive elements 15, and sintered metal bodies 16, the detailed features of these elements can be adjusted according to design requirements or actual conditions. The following are descriptions of some embodiments. In some embodiments, when the bottom surfaces 15B of multiple second conductive elements 15 are at inconsistent horizontal heights, some second conductive elements 15 may not directly contact the first conductive element 11, and a portion of the bottom surfaces 15B and side surfaces 15S of these second conductive elements 15 can be covered by the sintered metal body 16. In this case, the sintered metal body 16 located between them can simultaneously serve as an electrical connection medium and a fixing structure to achieve a stable connection. However, the present invention is not limited to this. In other embodiments, the bottom surfaces 15B of these second conductive elements 15 can contact the sintered metal body 16, but the side surfaces 15S of these second conductive elements 15 may not contact the sintered metal body 16.

[0049] In addition, some of the second conductive elements 15 can directly contact the first conductive element 11, and a portion of the side surfaces 15S of these second conductive elements 15 are covered by the metal sintered body 16. In this case, the metal sintered body 16 mainly serves as a fixing structure to achieve a reliable connection between the two. In some embodiments, the metal sintered body 16 protrudes from the recess 11R. For example, the top surface 16T of the metal sintered body 16 may protrude beyond the top surface 105T of the protective layer 105. However, the present invention is not limited thereto. In other embodiments, the amount of precursor (i.e., metal paste 12) filling the metal sintered body 16 may be reduced, such that the top surface 16T of the metal sintered body 16 may be lower than the top surface 105T of the protective layer 105.

[0050] In some embodiments, the sintered metal body 16 has an arcuate top surface 16T, but the present invention is not limited thereto. In other embodiments, the shape or flatness of the top surface 16T of the sintered metal body 16 may depend on the type of precursor (i.e., metal paste 12). For example, when the metal paste 12 used has low surface tension or high fluidity, the sintered metal body 16 may have a flat top surface.

[0051] In some embodiments, the multiple sintered metal bodies 16 have the same volume. Alternatively, the volumes of the sintered metal bodies 16 may vary depending on design requirements. For example, the sintered metal body 16 corresponding to the larger second conductive element 15 may have a smaller volume to prevent the precursor (i.e., metal paste 12) of the sintered metal body 16 from overflowing excessively into the recess 11R and forming unnecessary electrical connections with other elements. Alternatively, the sintered metal body 16 corresponding to the smaller second conductive element 15 may have a larger volume to prevent the contact area between the second conductive element 15 and the sintered metal body 16 from being too small to achieve a stable connection.

[0052] The circuit board structure obtained through the above steps includes a first substrate 10, a first conductive element 11, a metal sintered body 16, a second conductive element 15, and a second substrate 13. The first conductive element 11 is disposed on the first substrate 10. The metal sintered body 16 is disposed on the first conductive element 11. The second conductive element 15 is disposed on the metal sintered body 16. The second substrate 13 is disposed on the second conductive element 15. Compared to methods that do not use metal paste 12 (or metal sintered body 16), this invention relaxes the process margin for forming the second conductive element 15, allowing for greater height differences between multiple second conductive elements 15, while simultaneously ensuring the reliability of electrical connections and mechanical bonding.

[0053] In summary, this utility model provides a circuit board structure that ensures a stable connection between two circuit boards by providing a metal sintered body between two electrical connection elements and using the metal sintered body as a filler between the electrical connection elements.

[0054] Several embodiments have been summarized above to enable those skilled in the art to better understand the viewpoints of the present invention. Those skilled in the art should understand that other processes and structures can be designed or modified based on the embodiments of the present invention to achieve the same purpose and / or advantages as the embodiments described herein. Those skilled in the art should also understand that such equivalent processes and structures do not depart from the spirit and scope of the present invention, and that various changes, substitutions, and replacements can be made without departing from the spirit and scope of the present invention.

[0055] [Symbol Explanation]

[0056] 10: First substrate

[0057] 100: Core Layer

[0058] 101: Dielectric layer

[0059] 101S: Side surface

[0060] 101T: Top Surface

[0061] 102: Line Layer

[0062] 103: Core layer guide hole

[0063] 104: Dielectric layer via

[0064] 104T: Top surface

[0065] 105: Protective layer

[0066] 105T: Top surface

[0067] 11: First conductive element

[0068] 11R: concave part

[0069] 11T: Top surface

[0070] 12: Metal Paste

[0071] 13: Second substrate

[0072] 130: Core Layer

[0073] 131: Dielectric layer

[0074] 132: Line Layer

[0075] 133: Core layer guide hole

[0076] 134: Dielectric layer via

[0077] 135: Protective layer

[0078] 14: Photoresist materials

[0079] 15: Second conductive element

[0080] 15S: Side surface

[0081] 15B: Bottom surface

[0082] 16: Sintered metal body

[0083] 16T: Top surface.

Claims

1. A circuit board structure, characterized by, Comprising: a first substrate; a first conductive element disposed on the first substrate; a metal sintered body disposed on the first conductive element; a second conductive element disposed on the metal sintered body; and a second substrate disposed on the second conductive element. The first conductive element has a recess, and the metal sintered body is disposed in the recess.

2. The circuit board structure according to claim 1, characterized by The second conductive element passes through the metal sintered body and directly contacts the first conductive element, and a portion of a side surface of the second conductive element is covered by the metal sintered body.

3. The circuit board structure according to claim 2, characterized by The metal sintered body protrudes from the recess.

4. The circuit board structure according to claim 3, characterized by A bottom surface and a portion of a side surface of the second conductive element are covered by the metal sintered body.

5. The circuit board structure of claim 2, wherein The number of the first conductive elements, the number of the second conductive elements, and the number of the metal sintered bodies are all plural.

6. The circuit board structure of claim 1, wherein The plurality of second conductive elements each include a conductive pillar, and the horizontal heights of the conductive pillars of the plurality of second conductive elements are different.

7. The circuit board structure according to claim 6, characterized in that The plurality of first conductive elements each include a spacer, and the horizontal heights of the spacers of the plurality of first conductive elements are substantially the same.

8. The circuit board structure of claim 6, wherein The volumes of the plurality of metal sintered bodies are substantially the same.

9. The circuit board structure of claim 6, wherein, The metal sintered body has an arc-shaped top surface.

10. The circuit board structure of claim 1, wherein ​

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