A welding structure and an inverter

Abstract

This utility model belongs to the field of inverter technology and discloses a welding structure and an inverter. The welding structure includes a PCB board, electronic components, and a heat sink. The PCB board has multiple first through holes, and multiple first extension slots are spaced apart on the PCB board corresponding to each first through hole. The first extension slots penetrate the PCB board along the axial direction of the first through hole. The electronic components are located on a first side of the PCB board, and the heat sink is arranged corresponding to each first through hole and attached to a second side of the PCB board. The leads of the electronic components pass through the first through holes and connect to the heat sink. The leads and the first through holes are fixed by welding, and the outer peripheral wall of the leads and the inner peripheral wall of the first extension slots together form a solder crawling gap. The inverter includes the above-mentioned welding structure. The welding structure provided by this utility model effectively enhances the solder crawling capability of the leads and effectively improves the high current carrying capacity and heat dissipation capacity, ensuring reliable operation of the inverter.

Description

Technical Field

[0001] This utility model relates to the field of inverter technology, and in particular to a welding structure and an inverter. Background Technology

[0002] An inverter is a converter that transforms direct current (DC) power into alternating current (AC) power with fixed frequency and voltage or adjustable frequency and voltage. It consists of an inverter bridge, control logic, and filter circuits, and is widely used in household appliances such as air conditioners, computers, washing machines, and refrigerators.

[0003] Currently, as inverter power increases, the current drawn by the internal electronic components also rises. Existing technology limits the soldering ability of these components' pins on the PCB, restricting their capacity to handle high currents. Furthermore, increased current generates more heat, demanding improved heat dissipation. Therefore, enhancing the soldering ability of the inverter's component pins and improving heat dissipation performance have become key areas of focus for researchers in the field. Utility Model Content

[0004] The purpose of this invention is to provide a welding structure that effectively enhances the soldering capability of the pins and effectively improves the high current carrying capacity and heat dissipation capability.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A welded structure, comprising:

[0007] A PCB board has multiple first through holes. The inner peripheral wall of the PCB board corresponding to each first through hole is provided with multiple first extension grooves at intervals. The first extension grooves penetrate the PCB board along the axial direction of the first through hole.

[0008] Electronic components, wherein the electronic components are located on the first side of the PCB board;

[0009] A heat sink is provided, corresponding to the first through hole. The heat sink is attached to the second side of the PCB board. The pins of the electronic components pass through the first through hole and are connected to the heat sink. The pins are fixed to the first through hole by soldering, and the outer peripheral wall of the pin and the inner peripheral wall of the first extension groove together form a solder crawling gap.

[0010] Preferably, the heat sink has a second through hole, and the pin passes through the first through hole and is inserted into the second through hole.

[0011] Preferably, the cross-sectional shape of the pin of the electronic component is a first shape or a second shape;

[0012] The first through hole includes a first through hole A and a first through hole B. The cross-sectional shape of the first through hole A is a first shape, and the cross-sectional shape of the first through hole B is a second shape.

[0013] The cross-section of the second through hole has a combined shape, which is formed by superimposing the center of the first shape with the second shape.

[0014] Preferably, the cross-sectional shape of the pin of the electronic component is a first shape or a second shape;

[0015] The first through hole includes a first through hole A and a first through hole B. The cross-sections of the first through hole A, the first through hole B and the second through hole are all in a combined shape. The combined shape is formed by superimposing a second shape on the center of a first shape.

[0016] Preferably, the inner peripheral wall of the second through hole is provided with a plurality of second extension grooves spaced apart. The second extension grooves penetrate the heat sink along the axial direction of the second through hole, and the plurality of second extension grooves are connected to the plurality of first extension grooves in a one-to-one correspondence.

[0017] Preferably, there are four first extension grooves, which are arranged in a cross shape around the first through hole; there are also four second extension grooves, which are arranged in a cross shape around the second through hole.

[0018] Preferably, the heat sink is soldered onto the second side of the PCB board.

[0019] Preferably, the end face of the pin is flush with the end face of the heat sink facing away from the PCB board.

[0020] Preferably, the heat sink is made of copper.

[0021] An inverter includes the welding structure described in any of the above claims, and also includes a housing, wherein the PCB board, the electronic components, and the heat sink are all disposed within the housing.

[0022] Beneficial effects:

[0023] The welding structure provided by this utility model includes multiple first through holes on the PCB board for inserting the pins of electronic components. Each first through hole has multiple first extension grooves spaced apart on its inner peripheral wall, extending axially through the PCB board. When the pins of electronic components are inserted into the corresponding first through holes, the outer peripheral wall of the pin and the inner peripheral wall of the first extension groove together form a solder crawling gap. This allows molten solder to flow along the pin to the designated welding area within the solder crawling gap, further improving the welding quality and effectively enhancing the pin's ability to withstand high currents. Furthermore, a heat sink is attached to the second side of the PCB board. The pins pass through the first through holes on the first side of the PCB board and connect to the heat sink. The heat sink effectively improves the heat dissipation performance at the pin location, enhancing the reliability and effectiveness of the electronic components.

[0024] The inverter provided by this utility model includes the above-mentioned welding structure, which improves the ability of electronic components inside the inverter to carry large currents and improves heat dissipation performance, thereby effectively improving the reliability and efficiency of the inverter operation. Attached Figure Description

[0025] Figure 1 This is an exploded view of part of the structure of the inverter provided by this utility model;

[0026] Figure 2 This is a partial structural schematic diagram of the inverter provided by this utility model;

[0027] Figure 3 This is a partial cross-sectional view of the pin end provided by this utility model;

[0028] Figure 4 This is a schematic diagram of the structure of the heat sink provided by this utility model.

[0029] In the picture:

[0030] 1. PCB board; 11. First through hole; 111. First through hole A; 112. First through hole B; 12. First extension groove;

[0031] 2. Electronic components; 21. Electronic component A; 22. Electronic component B;

[0032] 3. Heat sink; 31. Second through hole; 32. Second extension slot;

[0033] 4. Pin; 41. First pin; 42. Second pin. Detailed Implementation

[0034] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0035] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0036] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0037] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0038] This embodiment provides an inverter. The inverter includes a housing and a welded structure. (Refer to...) Figures 1 to 4As shown, the welding structure includes a PCB board 1, electronic components 2, and a heat sink 3. The PCB board 1 has multiple first through holes 11. For each first through hole 11, a plurality of first extension grooves 12 are spaced apart on the inner peripheral wall of the PCB board 1, extending through the PCB board 1 along the axial direction of the first through hole 11. The electronic components 2 are located on the first side of the PCB board 1. The heat sink 3 is arranged in a one-to-one correspondence with the first through holes 11 and is attached to the second side of the PCB board 1. The leads 4 of the electronic components 2 pass through the first through holes 11 and connect to the heat sink 3. The leads 4 are fixed to the first through holes 11 by soldering, and the outer peripheral wall of the leads 4 and the inner peripheral wall of the first extension grooves 12 together form a solder run-through gap. The electronic components 2 are connected to the leads 4.

[0039] In this embodiment, the PCB board 1 has multiple first through holes 11 for the pins 4 of the electronic components 2 to be inserted. For each first through hole 11, a plurality of first extension grooves 12 are spaced apart on the inner peripheral wall, extending axially through the first through hole 11 and penetrating the PCB board 1. When the pin 4 is inserted into the first through hole 11, the outer peripheral wall of the pin 4 and the inner peripheral wall of the first extension groove 12 together form a solder crawling gap. This allows the molten solder to flow along the pin 4 to the designated soldering area within the solder crawling gap, further improving the soldering quality of the pin 4 and effectively enhancing the high current carrying capacity of the pin 4. Furthermore, a heat sink 3 is attached to the second side of the PCB board 1. The pin 4 passes through the first through hole 11 on the first side of the PCB board 1 and connects to the heat sink 3. The heat sink 3 effectively improves the heat dissipation performance at the pin 4 location, enhancing the reliability and effectiveness of the electronic components 2. Furthermore, the application of the aforementioned welding structure to the inverter effectively enhances the ability of the electronic components 2 inside the inverter to carry large currents and improves heat dissipation performance, thereby effectively improving the reliability and effectiveness of the inverter's operation.

[0040] In this embodiment, the heat sink 3 has a second through hole 31, and the pin 4 passes through the first through hole 11 and is inserted into the second through hole 31. The structure is simple, easy to assemble, and also facilitates subsequent soldering work.

[0041] In this embodiment, the cross-sectional shape of the pin 4 of the electronic component 2 is either a first shape or a second shape. The first through hole 11 includes a first through hole A111 and a first through hole B112. The cross-sectional shape of the first through hole A111 is the first shape, and the cross-sectional shape of the first through hole B112 is the second shape. The cross-section of the second through hole 31 is a combined shape, which is formed by superimposing the center of the first shape with the second shape. Specifically, the pin 4 includes a first pin 41 and a second pin 42. The cross-sectional shape of the first pin 41 is the first shape, and the shape of the second pin 42 is the second shape. Specifically, the electronic component 2 of the inverter includes electronic component A21 and electronic component B22. The first pin 41 is disposed on electronic component A21, and the second pin 42 is disposed on electronic component B22.

[0042] The first through-hole A111 corresponds to electronic component A21 and is used for the insertion of the first pin 41 of electronic component A21. Therefore, the cross-sectional shape of both the first pin 41 and the first through-hole A111 is set to the first shape. The first through-hole B112 corresponds to electronic component B22 and is used for the insertion of the second pin 42 of electronic component B22. Therefore, the cross-sectional shape of both the second pin 42 and the first through-hole B112 is set to the second shape. The cross-sectional shape of the second through-hole 31 on the heat sink 3 is a combined shape, which is formed by superimposing the second shape on the center of the first shape. This allows the second through-hole 31 to simultaneously accommodate the insertion of the first pin 41 and the second pin 42, effectively improving the compatibility of the heat sink 3.

[0043] In some alternative embodiments, the cross-sections of the first through hole A111, the first through hole B112, and the second through hole 31 are all of a combined shape, which is formed by superimposing a second shape on the center of a first shape. This arrangement allows the first through hole A111 and the first through hole B112 to simultaneously accommodate the insertion of the first pin 41 and the second pin 42, further improving the usability compatibility of the PCB board 1.

[0044] For example, the first shape may be, but is not limited to, a circle, and the second shape may be, but is not limited to, a square, with the circle and the square having a common center.

[0045] Furthermore, the inner peripheral wall of the second through hole 31 is provided with a plurality of second extension grooves 32 spaced apart. The second extension grooves 32 penetrate the heat sink 3 along the axial direction of the second through hole 31, and the plurality of second extension grooves 32 are correspondingly connected to the plurality of first extension grooves 12. Specifically, the corresponding arrangement of the second extension grooves 32 is used to avoid the first extension grooves 12, so as to prevent the heat sink 3 from blocking the area of ​​the first extension grooves 12 after it is attached.

[0046] For example, the number of first extension slots 12 and the number of second extension slots 32 are both set to four. The four first extension slots 12 are arranged in a cross shape around the first through hole 11, and the four second extension slots 32 are arranged in a cross shape around the second through hole 31. The cross-shaped arrangement of the four first extension slots 12 ensures that the soldering capability of the pin 4 is improved uniformly and reliably, while the corresponding number and position of the second extension slots 32 avoids blocking all the first extension slots 12.

[0047] In this embodiment, the heat sink 3 is soldered to the second side of the PCB board 1. This arrangement ensures a reliable and secure connection. Besides soldering, the heat sink 3 can also be connected by screws for easy disassembly and replacement.

[0048] In this embodiment, the end face of the pin 4 is flush with the end face of the heat sink 3 facing away from the PCB board 1. This arrangement avoids the pin 4 protruding from the heat sink 3, facilitating the overall installation of the PCB board 1, simplifying the layout, and saving space.

[0049] In some other alternative implementations, pin 4 may not be fitted with heat sink 3; instead, pin 4 can be plugged into PCB board 1 and soldered to PCB board 1.

[0050] In this embodiment, the heat sink 3 is made of copper. Copper is inexpensive and has good heat transfer properties, making it suitable for the fabrication of the heat sink 3.

[0051] In summary, the welding structure provided in this embodiment enhances the ability of electronic components inside the inverter to carry large currents and improves heat dissipation performance when used in an inverter, effectively improving the reliability and effectiveness of the inverter's operation.

[0052] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A welded structure, characterized by, include: The PCB board (1) has a plurality of first through holes (11). The inner peripheral wall of the PCB board (1) corresponding to each first through hole (11) is provided with a plurality of first extension grooves (12) at intervals. The first extension grooves (12) penetrate the PCB board (1) along the axial direction of the first through hole (11). Electronic component (2), the electronic component (2) is located on the first side of the PCB board (1); The heat sink (3) is set one-to-one with the first through hole (11). The heat sink (3) is attached to the second side of the PCB board (1). The pin (4) of the electronic component (2) passes through the first through hole (11) and is connected to the heat sink (3). The pin (4) is fixed to the first through hole (11) by welding. The outer peripheral wall of the pin (4) and the inner peripheral wall of the first extension groove (12) together form a solder crawling gap.

2. The welded structure of claim 1, wherein The heat sink (3) has a second through hole (31), and the pin (4) passes through the first through hole (11) and is inserted into the second through hole (31).

3. The welded structure of claim 2, wherein The cross-sectional shape of the pin (4) of the electronic component (2) is either a first shape or a second shape; The first through hole (11) includes a first through hole A (111) and a first through hole B (112). The cross-sectional shape of the first through hole A (111) is a first shape, and the cross-sectional shape of the first through hole B (112) is a second shape. The cross-section of the second through hole (31) is a combined shape, which is formed by superimposing the center of the first shape with the second shape.

4. The welded structure of claim 2, wherein The cross-sectional shape of the pin (4) of the electronic component (2) is either a first shape or a second shape; The first through hole (11) includes a first through hole A (111) and a first through hole B (112). The cross-sections of the first through hole A (111), the first through hole B (112) and the second through hole (31) are all in a combined shape. The combined shape is formed by superimposing a second shape on the center of a first shape.

5. The welded structure of claim 2, wherein The inner peripheral wall of the second through hole (31) is provided with a plurality of second extension grooves (32) spaced apart. The second extension grooves (32) penetrate the heat sink (3) along the axial direction of the second through hole (31). The plurality of second extension grooves (32) are connected to the plurality of first extension grooves (12) in a one-to-one correspondence.

6. The welded structure of claim 5, wherein The number of the first extension groove (12) is four, and the four first extension grooves (12) are arranged in a cross shape around the first through hole (11); the number of the second extension groove (32) is four, and the four second extension grooves (32) are arranged in a cross shape around the second through hole (31).

7. The welded structure of claim 1, wherein The heat sink (3) is soldered to the second side of the PCB board (1).

8. The welded structure of claim 1, wherein The end face of the pin (4) is flush with the end face of the heat sink (3) facing away from the PCB board (1).

9. The welded structure according to claim 1, characterized in that, The heat sink (3) is made of copper.

10. An inverter, characterized by comprising: The system includes the welding structure as described in any one of claims 1-9, and also includes a housing, wherein the PCB board (1), the electronic components (2), and the heat sink (3) are all disposed within the housing.

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