A dustproof fixing device for integrated circuit boards

CN224638269UActive Publication Date: 2026-08-14HANGZHOU JIAYU ELECTRONIC TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-16
Publication Date
2026-08-14

AI Technical Summary

Technical Problem

[0006]本实用新型的目的在于提供一种集成电路板防尘固定装置,以解决上述背景技术中提出电路板防尘固定装置不便于便捷的对电路板进行固定限位,不便于四角挤压对电路板进行固定,影响了电路板进行拆卸更换的便利性,不便于便捷的对防尘罩进行更换,不便于卡扣式连接固定,影响了电路板防尘固定装置对防尘罩进行更换的便利性的问题

Benefits of technology

[0018]与现有技术相比,本实用新型的有益效果是:该电路板防尘固定装置不仅实现了电路板防尘固定装置便捷的对电路板进行固定限位,方便了四角挤压对电路板进行固定,提高了电路板进行拆卸更换的便利性,而且方便了便捷的对防尘罩进行更换,方便了卡扣式连接固定,提高了电路板防尘固定装置对防尘罩进行更换的便利性。

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Abstract

This utility model discloses a dustproof fixing device for integrated circuit boards, belonging to the technical field of circuit board dustproof fixing devices. It includes a support plate and a circuit board body. The circuit board body is disposed on the outside of the support plate. A dust cover body is installed on the top of the circuit board body, and a heat sink is installed on the top of the dust cover body. Four sets of support shafts are installed at the bottom of the support plate, and a rotating shaft is movably installed at the bottom of each support shaft. Threaded sleeves are fitted onto the surface of each rotating shaft. This utility model not only achieves convenient fixing and limiting of the circuit board, facilitating four-corner compression to fix the circuit board and improving the convenience of disassembling and replacing the circuit board, but also facilitates convenient replacement of the dust cover through a snap-fit ​​connection, further enhancing the convenience of dust cover replacement.
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Description

Technical Field

[0001] This utility model relates to the technical field of circuit board dustproof fixing devices, specifically a dustproof fixing device for integrated circuit boards. Background Technology

[0002] Integrated circuit boards are fabricated using semiconductor manufacturing processes. Many transistors, resistors, capacitors and other components are fabricated on a small single-crystal silicon wafer, and the components are combined into a complete electronic circuit by using multilayer wiring or tunnel wiring methods. According to their functions and structures, integrated circuit boards can be divided into two main categories: analog integrated circuit boards and digital integrated circuit boards.

[0003] As disclosed in the patent announcement number CN222582672U, a fixing device for manufacturing and processing integrated circuit boards includes: a support base; a worktable disposed on the support base; a fixing mechanism disposed on the worktable for clamping and fixing the circuit board; a shock-absorbing mechanism disposed on the worktable, which cooperates with the fixing mechanism to provide shock absorption when the fixing mechanism clamps the circuit board; and a heat dissipation mechanism disposed on the worktable for dissipating heat from the circuit board.

[0004] Although it achieves the effect of providing power through a power source and driving the cooling fan to rotate, air is drawn in and passes over the surface of the circuit board to dissipate heat, thereby ensuring the stability and safety of the processing. The first motor drives the ball screw to rotate forward and backward, so that the two clamps on both sides move closer or further apart, thereby fixing or loosening the circuit board. In this way, the circuit board can be fixed to ensure that its position is stable and does not move during processing. When the circuit board is subjected to external vibration, the clamps drive the fixing mechanism to slide in the guide cylinder through the slide bar. The shock-absorbing spring is stretched and then reset. The shock-absorbing spring absorbs some energy, thereby reducing the vibration force transmitted to the circuit board, protecting the circuit board from external interference, and improving processing accuracy and stability.

[0005] However, this does not solve the problem that existing circuit board dustproof fixing devices are generally not convenient for fixing and limiting circuit boards during use, are not easy to fix the circuit board by squeezing the four corners, affect the convenience of disassembling and replacing the circuit board, are not convenient for replacing the dust cover, and are not convenient for snap-on connection fixing, thus affecting the convenience of replacing the dust cover. Utility Model Content

[0006] The purpose of this utility model is to provide an integrated circuit board dustproof fixing device to solve the problems mentioned in the background art, such as the inconvenience of fixing and limiting the circuit board, the inconvenience of squeezing the four corners to fix the circuit board, the inconvenience of disassembling and replacing the circuit board, the inconvenience of replacing the dust cover, and the inconvenience of snap-fit ​​connection fixing, which affect the convenience of replacing the dust cover.

[0007] To solve the above-mentioned technical problems, this utility model provides the following technical solution:

[0008] An integrated circuit board dustproof fixing device includes a support plate and a circuit board body. The circuit board body is disposed on the outside of the support plate. A dust cover body is installed on the top of the circuit board body. A heat sink is installed on the top of the dust cover body. Four sets of support shafts are installed at the bottom of the support plate. A rotating shaft is movably installed at the bottom of each support shaft. A threaded sleeve is fitted on the surface of each rotating shaft. The rotating shaft is movably connected to the threaded sleeve. A threaded rod is fitted inside each threaded sleeve. The threaded rod is threadedly connected to the threaded sleeve. A rotating shaft is movably installed on the side of each threaded rod away from the threaded sleeve. A connecting plate is fitted on the surface of each rotating shaft. A first shaft is movably installed on the side of each connecting plate away from the rotating shaft. The first shaft extends through the support plate to its outside.

[0009] Optionally, the first shaft is movably connected to the support plate, and a connecting plate is installed at the top of the first shaft.

[0010] Optionally, two sets of rotating columns are installed on the side of the connecting plate away from the first axis, and the surface of each rotating column is fitted with a clamp.

[0011] Optionally, a support block is installed at the top of the interior of the dust cover body, a first spring is installed at the bottom of the support block, and a heat-conducting copper plate is installed at the bottom of the first spring, the heat-conducting copper plate being in contact with the circuit board body.

[0012] Optionally, a copper strip is installed on the sidewall of the heat-conducting copper plate, and the side of the copper strip away from the heat-conducting copper plate is connected to the dust cover body. Two sets of fixing blocks are installed on both sides of the circuit board body.

[0013] Optionally, each of the fixing blocks has a telescopic column movably installed inside, and the telescopic column extends through the fixing block into the interior of the circuit board body. Each telescopic column has a pull ring on its side wall.

[0014] Optionally, a top block is installed on the side of the telescopic column away from the pull ring, and the top block is slidably connected to the circuit board body. A second spring is fitted on the surface of the telescopic column inside the circuit board body on one side of the fixing block.

[0015] Optionally, one end of the second spring is connected to the fixed block, and the other end of the second spring is connected to the top block.

[0016] Optionally, support columns are symmetrically installed on both sides of the dust cover body, and the support columns extend into the interior of the circuit board body and are movably connected thereto.

[0017] Optionally, the surface of each support column is provided with a groove, and each top block mates with the groove.

[0018] Compared with the prior art, the beneficial effects of this utility model are: the circuit board dustproof fixing device not only realizes the convenient fixing and limiting of the circuit board, but also facilitates the fixing of the circuit board by squeezing the four corners, improving the convenience of disassembling and replacing the circuit board, but also facilitates the convenient replacement of the dust cover, and facilitates the snap-on connection and fixing, thus improving the convenience of replacing the dust cover.

[0019] By rotating four sets of threaded sleeves in sequence, the threaded rod moves inside the threaded sleeve under the sliding support of the rotating shaft and the threaded sleeve. The threaded rod drives the rotating shaft to move. Under the limiting support of the first shaft, the rotating shaft drives the connecting plate to rotate around the first shaft. The first shaft drives the connecting plate to rotate, and the connecting plate drives the rotating column and the chuck to rotate. This allows multiple sets of chucks to clamp and fix the circuit board body. The chucks act as a buffer to prevent excessive pressure from damaging the circuit board body. The heat sink is turned on to blow air for heat dissipation. The first spring pushes the heat-conducting copper plate to the surface of the circuit board body and into contact with the circuit board body. The heat generated inside the circuit board body is transferred to the heat-conducting copper plate, and the heat-conducting copper plate is transferred to the surface of the dust cover body through the copper strip. The heat sink dissipates heat from the surface of the dust cover body. This realizes the convenient fixation and positioning of the circuit board dustproof fixing device, which facilitates the four-corner compression to fix the circuit board and improves the convenience of disassembling and replacing the circuit board.

[0020] Manually pull the four sets of pull rings. With the support of the fixed block, the pull rings drive the telescopic column to move outward. The telescopic column drives the second spring and the top block to move outward, causing the top block to disengage from the groove. Pull the support column upward, causing the support column to disengage from the circuit board body. Release the pull rings. With the elastic support of the second spring, the second spring drives the top block to return to its original position, facilitating further fitting and limiting the groove. This allows for convenient replacement of the dust cover of the circuit board dustproof fixing device, facilitating the snap-fit ​​connection and improving the convenience of replacing the dust cover. Attached Figure Description

[0021] The accompanying drawings, which are incorporated herein and form part of the specification, illustrate embodiments of the present invention and, together with the specification, further serve to explain the principles of the present invention and enable those skilled in the art to implement and use the present invention.

[0022] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0023] Figure 2 This is a front view structural diagram of the present utility model;

[0024] Figure 3 This is a three-dimensional structural diagram of the threaded sleeve of this utility model;

[0025] Figure 4 This is a front view cross-sectional structural diagram of the threaded sleeve of this utility model;

[0026] Figure 5 This is a three-dimensional structural diagram of the connecting plate of this utility model;

[0027] Figure 6 This is a front view cross-sectional structural diagram of the dust cover body of this utility model;

[0028] Figure 7 This is a three-dimensional structural diagram of the fixing block of this utility model;

[0029] Figure 8 This is a front view cross-sectional structural diagram of the support column of this utility model.

[0030] Figure label:

[0031] 1. Support plate; 2. Circuit board body; 3. Dust cover body; 4. Heat sink; 5. Support shaft; 6. Rotating shaft; 7. Threaded sleeve; 8. Threaded rod; 9. Rotating shaft; 10. Connecting plate; 11. First shaft; 12. Connecting plate; 13. Rotating column; 14. Clamp; 15. Support block; 16. First spring; 17. Heat-conducting copper plate; 18. Copper strip; 19. Fixing block; 20. Telescopic column; 21. Second spring; 22. Support column; 23. Top block; 24. Groove; 25. Pull ring.

[0032] As shown in the figure, specific structures and devices are marked in the figure to clearly illustrate the structure of the embodiment of this utility model. However, this is only for illustrative purposes and is not intended to limit this utility model to this specific structure, device and environment. Those skilled in the art can adjust or modify these devices and environments according to specific needs. Detailed Implementation

[0033] The dustproof fixing device for integrated circuit boards provided by this utility model will be described in detail below with reference to the accompanying drawings and specific embodiments. It should also be noted that, in order to make the embodiments more detailed, the following embodiments are the best and preferred embodiments, and those skilled in the art can also use other alternative methods to implement some known technologies; moreover, the accompanying drawings are only for more specific description of the embodiments and are not intended to specifically limit this utility model.

[0034] It should be noted that the use of terms such as "an embodiment," "an embodiment," "an exemplary embodiment," and "some embodiments" in the specification indicates that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments (whether explicitly described or not) should be within the knowledge of those skilled in the art.

[0035] Generally, terms can be understood at least partly from their use in context. For example, depending at least partly on the context, the term "one or more" as used herein can be used to describe any feature, structure, or characteristic in a singular sense, or a combination of features, structures, or characteristics in a plural sense. Additionally, the term "based on" can be understood not necessarily to convey an exclusive set of factors, but rather, alternatively, depending at least partly on the context, to allow for the presence of other factors that are not necessarily explicitly described.

[0036] It is understood that the meanings of “on”, “above”, and “above” in this utility model should be interpreted in the broadest manner, such that “on” not only means “directly on” something, but also includes the meaning of being “on” something with an intervening feature or layer, and that “above” or “above” not only means “on” something, but also includes the meaning of being “on” something without an intervening feature or layer.

[0037] Furthermore, spatially related terms such as “below,” “under,” “lower,” “above,” and “upper” are used herein for convenience to describe the relationship of one element or feature to one or more other elements or features, as illustrated in the accompanying drawings. Spatially related terms are intended to cover different orientations in the use or operation of the device other than those depicted in the accompanying drawings. The device may be oriented in other ways, and the spatially related descriptive terms used herein can be interpreted similarly.

[0038] like Figures 1 to 8As shown, an embodiment of this utility model provides a dustproof fixing device for an integrated circuit board, including a support plate 1 and a circuit board body 2. The circuit board body 2 is disposed on the outside of the support plate 1. A dustproof cover body 3 is installed on the top of the circuit board body 2. A heat sink 4 is installed on the top of the dustproof cover body 3. Four sets of support shafts 5 are installed on the bottom of the support plate 1. A rotating shaft 6 is movably installed on the bottom of each support shaft 5. A threaded sleeve 7 is fitted on the surface of each rotating shaft 6. The rotating shaft 6 is movably connected to the threaded sleeve 7. A threaded rod 8 is fitted inside each threaded sleeve 7. All threaded rods 8 are threadedly connected to threaded sleeves 7. A rotating shaft 9 is movably installed on the side of the threaded rod 8 away from the threaded sleeve 7. A connecting plate 10 is fitted on the surface of the rotating shaft 9. A first shaft 11 is movably installed on the side of the connecting plate 10 away from the rotating shaft 9. The first shaft 11 extends through the support plate 1 to its outside. The first shaft 11 is movably connected to the support plate 1. A connecting plate 12 is installed at the top of the first shaft 11. Two sets of rotating columns 13 are installed on the side of the connecting plate 12 away from the first shaft 11. A chuck 14 is fitted on the surface of the rotating column 13.

[0039] A support block 15 is installed at the top of the interior of the dust cover body 3. A first spring 16 is installed at the bottom of the support block 15. A heat-conducting copper plate 17 is installed at the bottom of the first spring 16. The heat-conducting copper plate 17 is in contact with the circuit board body 2.

[0040] When using the integrated circuit board dustproof fixing device, the dust cover body 3 is clipped onto the surface of the circuit board body 2 for dust prevention. When it is necessary to fix the circuit board body 2, the circuit board body 2 is moved directly above the support plate 1, and the four sets of threaded sleeves 7 are rotated in sequence. Under the sliding support of the rotating shaft 6 and the threaded support of the threaded sleeves 7, and the threaded connection between the threaded sleeves 7 and the threaded rods 8, the threaded rods 8 move inside the threaded sleeves 7. The threaded rods 8 drive the rotating shaft 9 to move. Under the limiting support of the first shaft 11, the rotating shaft 9 drives the connecting plate 10 to rotate around the first shaft 11. The first shaft 11 drives the connecting plate 12 to rotate, and the connecting plate 12 drives the rotating column 13 and the clamps 14 to rotate, thereby causing the multiple sets of clamps 14 to clamp and fix the circuit board body 2. When it is necessary to disassemble... When removing and replacing the circuit board body 2, rotate the threaded sleeve 7 in the opposite direction to disengage the clamp 14 from the circuit board body 2, making it easier to disassemble and replace the circuit board body 2. Turn on the heat sink 4 to blow air for heat dissipation. Under the support of the support block 15 and the elastic support of the first spring 16, the first spring 16 pushes the heat-conducting copper plate 17 to the surface of the circuit board body 2 where it is prone to heat generation and makes contact with the circuit board body 2. The heat generated inside the circuit board body 2 is transferred to the heat-conducting copper plate 17, and the heat-conducting copper plate 17 is transferred to the surface of the dust cover body 3 through the copper strip 18. The heat sink 4 dissipates heat from the surface of the dust cover body 3, realizing the convenient fixation and positioning of the circuit board by the circuit board dustproof fixing device, which facilitates the four-corner squeezing to fix the circuit board and improves the convenience of disassembling and replacing the circuit board.

[0041] A copper strip 18 is installed on the side wall of the heat-conducting copper plate 17. The side of the copper strip 18 away from the heat-conducting copper plate 17 is connected to the dust cover body 3. Two sets of fixing blocks 19 are installed on both sides of the circuit board body 2.

[0042] Telescopic columns 20 are movably installed inside the fixing block 19. The telescopic columns 20 extend through the fixing block 19 into the interior of the circuit board body 2. Pull rings 25 are provided on the side walls of the telescopic columns 20.

[0043] A top block 23 is installed on the side of the telescopic column 20 away from the pull ring 25. The top block 23 is slidably connected to the circuit board body 2. A second spring 21 is fitted on the surface of the telescopic column 20 inside the circuit board body 2 on the side of the fixing block 19.

[0044] One end of the second spring 21 is connected to the fixed block 19, and the other end of the second spring 21 is connected to the top block 23. Support columns 22 are symmetrically installed on both sides of the dust cover body 3. The support columns 22 extend into the interior of the circuit board body 2 and are movably connected thereto. The surface of the support columns 22 is provided with grooves 24, and the top blocks 23 cooperate with the grooves 24.

[0045] When the dust cover body 3 needs to be replaced, manually pull the four sets of pull rings 25. With the support of the fixing block 19, the pull rings 25 drive the telescopic column 20 to move outward. The telescopic column 20 drives the second spring 21 and the top block 23 to move outward, so that the top block 23 is disengaged from the groove 24. Pull the dust cover body 3 and the support column 22 upward, so that the support column 22 is disengaged from the circuit board body 2. Release the pull rings 25. With the elastic support of the second spring 21, the second spring 21 drives the top block 23 to reset, which facilitates the continued adaptation of the groove 24 and limits and fixes it. This realizes the convenient replacement of the dust cover by the circuit board dust fixing device, which facilitates the snap-on connection and fixation and improves the convenience of replacing the dust cover by the circuit board dust fixing device.

[0046] The working principle of the technical solution provided by this utility model is as follows: Four sets of threaded sleeves 7 are rotated sequentially. Under the sliding support of the rotating shaft 6 and the threaded sleeves 7, the threaded rod 8 moves inside the threaded sleeve 7. The threaded rod 8 drives the rotating shaft 9 to move. Under the limiting support of the first shaft 11, the rotating shaft 9 drives the connecting plate 10 to rotate around the first shaft 11. The first shaft 11 drives the connecting plate 12 to rotate. The connecting plate 12 drives the rotating column 13 and the clamps 14 to rotate, thereby causing multiple sets of clamps 14 to clamp and fix the circuit board body 2. The clamps 14 play a buffering role, preventing excessive pressure from damaging the circuit board body 2. The heat sink 4 is turned on for heat dissipation. The first spring 16 pushes the heat-conducting copper plate 17 to the surface of the circuit board body 2. When the circuit board body 2 comes into contact with the circuit board body 2, the heat generated inside the circuit board body 2 is transferred to the heat-conducting copper plate 17. The heat-conducting copper plate 17 transfers the heat to the surface of the dust cover body 3 through the copper strip 18. The heat sink 4 dissipates heat from the surface of the dust cover body 3. Manually pull the four sets of pull rings 25. With the support of the fixing block 19, the pull rings 25 drive the telescopic column 20 to move outward. The telescopic column 20 drives the second spring 21 and the top block 23 to move outward, so that the top block 23 is disengaged from the groove 24. Pull the support column 22 upward, so that the support column 22 is disengaged from the circuit board body 2. Release the pull rings 25. With the elastic support of the second spring 21, the second spring 21 drives the top block 23 to reset, so that it can continue to adapt to the groove 24 and limit and fix it, thus completing the use of the circuit board dustproof fixing device.

[0047] This utility model encompasses any substitutions, modifications, equivalent methods, and solutions made within the spirit and scope of this utility model. To provide the public with a thorough understanding of this utility model, specific details are described in detail in the following preferred embodiments; however, those skilled in the art will fully understand this utility model even without these detailed descriptions. Furthermore, to avoid unnecessary confusion regarding the essence of this utility model, well-known methods, processes, procedures, components, and circuits are not described in detail.

[0048] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A dustproof fixing device for integrated circuit boards, characterized in that: The system includes a support plate and a circuit board body. The circuit board body is disposed on the outside of the support plate. A dust cover body is installed on the top of the circuit board body. A heat sink is installed on the top of the dust cover body. Four sets of support shafts are installed at the bottom of the support plate. A rotating shaft is movably installed at the bottom of each support shaft. A threaded sleeve is fitted on the surface of each rotating shaft. The rotating shaft is movably connected to the threaded sleeve. A threaded rod is fitted inside each threaded sleeve. The threaded rod is threadedly connected to the threaded sleeve. A rotating shaft is movably installed on the side of each threaded rod away from the threaded sleeve. A connecting plate is fitted on the surface of each rotating shaft. A first shaft is movably installed on the side of each connecting plate away from the rotating shaft. The first shaft extends through the support plate to its outside.

2. The dust-proof fixing device for an integrated circuit board according to claim 1, characterized by: The first shaft is movably connected to the support plate, and a connecting plate is installed at the top of the first shaft.

3. The dust-proof fixing device for an integrated circuit board according to claim 2, characterized by: Two sets of rotating columns are installed on the side of the connecting plate away from the first axis, and each rotating column is fitted with a clamp.

4. The dust-proof fixing device for an integrated circuit board according to claim 3, characterized by: A support block is installed at the top of the interior of the dust cover body, a first spring is installed at the bottom of the support block, and a heat-conducting copper plate is installed at the bottom of the first spring. The heat-conducting copper plate is in contact with the circuit board body.

5. The dust-proof fixing device for an integrated circuit board according to claim 4, characterized by: The sidewall of the heat-conducting copper plate is fitted with a copper strip, and the side of the copper strip away from the heat-conducting copper plate is connected to the dust cover body. Two sets of fixing blocks are installed on both sides of the circuit board body.

6. The dust-proof fixing device for an integrated circuit board according to claim 5, wherein: Each of the fixed blocks has a telescopic column movably installed inside. The telescopic column extends through the fixed block into the interior of the circuit board body, and each telescopic column has a pull ring on its side wall.

7. The dust-proof fixing device for an integrated circuit board according to claim 6, wherein: Each telescopic column has a top block installed on the side away from the pull ring. The top block is slidably connected to the circuit board body. A second spring is fitted on the surface of each telescopic column inside the circuit board body on one side of the fixing block.

8. The dust-proof fixing device for an integrated circuit board according to claim 7, characterized by: One end of the second spring is connected to the fixed block, and the other end of the second spring is connected to the top block.

9. The dust-proof fixing device for an integrated circuit board according to claim 8, characterized by: The dust cover body has symmetrical support columns installed on both sides, and the support columns extend into the interior of the circuit board body and are movably connected thereto.

10. The dust-proof fixing device for an integrated circuit board according to claim 9, wherein: The surfaces of the support columns are all provided with grooves, and the top blocks are all matched with the grooves.

Citation Information

Patent Citations

  • Fixing device for integrated circuit board production and processing

    CN222582672U