A roughening device for electronic components in PCB manufacturing

CN224638273UActive Publication Date: 2026-08-14上海展华电子(南通)有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-09
Publication Date
2026-08-14

AI Technical Summary

Technical Problem

目前制作内埋项目时需将电子元器件埋入PCB板内,由于电子元器件尺寸过小,正常水平粗化线无法进行,而未经过粗化的电子元器件埋入PCB板内会存在电子元器件与PP结合差导致出现裂缝的问题

Benefits of technology

1、该一种PCB制作电子元器件粗化装置,通过设置有用于放置电子元器件的粗化放置区,提升粗化效率,提升电子元器件埋入PCB板的结合力,避免出现裂缝,并且制作成本低,能够重复利用。

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Abstract

This utility model discloses a roughening device for electronic components in PCB manufacturing, comprising several roughening placement areas for placing electronic components in an FR4 board. The roughening placement areas are stepped around their perimeter, and the distance between opposite sides of each placement area is less than the length and width of the electronic component. The electronic component is installed in the roughening placement area and has a hollow bottom. This utility model has a simple structure and reasonable design. By setting up roughening placement areas for placing electronic components, it improves roughening efficiency, enhances the bonding force of electronic components embedded in the PCB board, avoids cracks, and has low manufacturing cost and can be reused.
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Description

Technical Field

[0001] This utility model relates to the field of electronic circuit technology, specifically to a device for roughening electronic components in PCB manufacturing. Background Technology

[0002] Coarsening refers to altering the microscopic geometry and physicochemical properties of a material surface through physical or chemical methods without affecting the bulk properties of the base material. Its purpose is to increase surface area, enhance surface energy, and strengthen mechanical interlocking forces, thereby improving the adhesion of subsequent materials (such as copper layers).

[0003] The shortcomings of existing technology: Currently, when making embedded projects, electronic components need to be embedded in the PCB board. Due to the small size of the electronic components, normal horizontal roughening lines cannot be made. Embedding electronic components without roughening into the PCB board will result in poor bonding between the electronic components and the PP, leading to cracks. Utility Model Content

[0004] The purpose of this invention is to provide a roughening device for electronic components in PCB manufacturing, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a PCB manufacturing electronic component roughening device, comprising several roughening placement areas for placing electronic components in an FR4 board, wherein the roughening placement areas are stepped around the perimeter, and the distance between opposite sides of the roughening placement areas is less than the length and width of the electronic components, wherein the electronic components are installed in the roughening placement areas and the bottom is hollowed out.

[0006] Preferably, a plurality of drainage holes are provided on the side walls around the roughening placement area, and the drainage holes are used for immersion in the roughening solution.

[0007] Preferably, the top and bottom of the FR4 plate are covered with perforated wire mesh for support and protection.

[0008] Preferably, the stepped area of ​​the roughened placement region has gaps.

[0009] Compared with the prior art, the beneficial effects of this utility model are: 1. This PCB manufacturing electronic component roughening device improves roughening efficiency and bonding strength of electronic components embedded in the PCB board by setting up a roughening placement area for placing electronic components, avoiding cracks, and has low manufacturing cost and can be reused.

[0010] 2. The roughening device for PCB manufacturing electronic components has several drainage holes on the side walls around the roughening placement area. The drainage holes are used for roughening solution immersion and side wall drying to improve roughening efficiency. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a partial structural schematic diagram of the present invention; Figure 3 This is a partial structural schematic diagram of the present invention; In the diagram: 1. FR4 board; 2. Electronic components; 3. Roughened placement area; 4. Drainage hole; 5. Perforated wire mesh; 6. Gap. Detailed Implementation

[0012] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0013] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0014] In the description of this patent, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "setting" should be interpreted broadly. For example, they can refer to a fixed connection or setting, a detachable connection or setting, or an integrated connection or setting. Those skilled in the art can understand the specific meaning of the above terms in this patent according to the specific circumstances.

[0015] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "several" means two or more, unless otherwise explicitly specified.

[0016] Example Please see Figure 1-3 As shown, this utility model provides a technical solution for a roughening device for electronic components in PCB manufacturing: It includes several roughening placement areas 3 formed in an FR4 board 1 for placing electronic components 2. The roughening placement areas 3 are stepped around their perimeter, and the distance between opposite sides of the roughening placement areas 3 is less than the length and width of the electronic components 2, ensuring that the bottom of the electronic components 2 is supported when placed in the roughening placement areas 3, preventing scratches during roughening. The electronic components 2 are installed in the roughening placement areas 3 with a hollowed-out bottom, which is beneficial for roughening and drying. Several drainage holes 4 are formed on the side walls of the roughening placement areas 3, which are used for impregnation with roughening chemicals and drying of the side walls. The top and bottom of the FR4 board 1 are covered with perforated mesh 5 for support and protection, preventing the electronic components 2 from jumping out due to spray pressure. Gaps 6 are formed in the stepped areas of the roughening placement areas 3, which is beneficial for roughening and drying of the electronic components 2.

[0017] In use, electronic component 2 is placed in roughening placement area 3 for roughening. Roughening solution is used to roughen electronic component 2. The roughening solution is fully soaked through drainage hole 4 and gap 6 to improve roughening efficiency and enhance the bonding force of electronic component 2 into PCB board.

[0018] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A PCB manufacturing electronic component roughening apparatus, characterized by: The FR4 board (1) includes several roughened placement areas (3) for placing electronic components (2). The roughened placement areas (3) are stepped around the edges. The distance between opposite sides of the roughened placement areas (3) is smaller than the length and width of the electronic components (2). The electronic components (2) are installed in the roughened placement areas (3) and have a hollow bottom.

2. The PCB manufacturing electronic component roughening apparatus of claim 1, wherein: The roughening placement area (3) has several drainage holes (4) on its four sides, which are used for roughening solution immersion.

3. The PCB manufacturing electronic component roughening apparatus of claim 1, wherein: The FR4 plate (1) is covered with perforated wire mesh (5) for support and protection at both the top and bottom.

4. The apparatus according to claim 1, wherein: The roughened placement area (3) has a stepped opening with a gap (6).