Limiting device for multilayer circuit board lamination

Abstract

This utility model discloses a limiting device for laminating multilayer circuit boards, including a support frame, a limiting frame, and a samarium cobalt magnet adsorption strip. Multiple limiting frames are used to limit the circuit board's position. The internal dimensions of each limiting frame are different. The support frame has multiple storage slots for accommodating the limiting frames. Two guide rods penetrating the support frame are fixed to the bottom of each limiting frame, and an adsorption block is fixed to the bottom of each guide rod. The samarium cobalt magnet adsorption strip is fixed to the bottom of the support frame to hold the adsorption block. This utility model is easy to adjust, convenient for limiting circuit boards of different sizes and models, has wider applicability, and allows for smoother placement of the circuit board.

Description

Technical Field

[0001] This utility model relates to the field of multilayer circuit board lamination technology, and in particular to a limiting device for multilayer circuit board lamination. Background Technology

[0002] In the production of multilayer circuit boards, multiple layers of circuit board material need to be stacked together and then placed in a laminator for high-temperature (120-160℃) hot pressing to fix the layers together. During stacking, a limiting device is needed to align the layers and prevent misalignment. Currently, the commonly used method is a frame-type limiting frame. The internal dimensions of the limiting frame are the same as the circuit board dimensions, allowing for quick positioning by simply placing the circuit board inside. However, existing frame-type limiting frames are inconvenient to switch between, and can only limit circuit boards of a specific size, making it difficult to meet diverse usage needs and limiting applicability. Therefore, there is an urgent need to develop a more versatile limiting device for multilayer circuit board lamination that is easy to adjust, allows for positioning of circuit boards of different sizes, and has wider applicability, to overcome the shortcomings of current applications and meet current requirements. Utility Model Content

[0003] The purpose of this utility model is to provide a limiting device for pressing multilayer circuit boards, so as to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] A limiting device for laminating multilayer circuit boards includes a support frame, a limiting frame, and a samarium cobalt magnet adsorption strip. Multiple limiting frames are used to limit the circuit board's position. The internal dimensions of each limiting frame are different. The support frame has multiple storage slots for housing the limiting frames. Two guide rods penetrating the support frame are fixed to the bottom of each limiting frame. An adsorption block is fixed to the bottom of each guide rod. The samarium cobalt magnet adsorption strip is fixed to the bottom of the support frame to hold the adsorption block.

[0006] Preferably, the inner side of the limiting frame is provided with a guide slope.

[0007] Preferably, the guide slope is inclined at 15°.

[0008] Preferably, the inner wall of the limiting frame is provided with a layer of polytetrafluoroethylene coating.

[0009] Preferably, the support frame, limiting frame, guide rod and adsorption block are all made of 430 ferritic stainless steel.

[0010] Preferably, the guide rod is slidably connected to the support frame.

[0011] The beneficial effects of this utility model are as follows: When using this multi-layer circuit board laminating limiting device, first select the required size limiting frame according to the circuit board's dimensions. Lift the required size limiting frame upwards so that its bottom adsorption block is held by the samarium cobalt magnet adsorption strip. The remaining unused limiting frames are stored in the storage slot. Then, place the multi-layer circuit board into the limiting frame. The circuit board is guided by a guide ramp when placed into the limiting frame, making placement smoother. Furthermore, the inner wall of the limiting frame is coated with a layer of polytetrafluoroethylene (PTFE). PTFE has excellent smoothness, reducing friction between the circuit board and the inner wall of the limiting frame when placed, facilitating placement. In summary, this utility model is easy to adjust, convenient for limiting circuit boards of different sizes and models, has wider applicability, and provides smoother placement of circuit boards. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the three-dimensional structure of the present invention. Figure 1 .

[0013] Figure 2 This is a schematic diagram of the three-dimensional structure of the present invention. Figure 2 .

[0014] Figure 3 This is an exploded view of the present invention.

[0015] Figure 4 This is a schematic diagram of the usage state of this utility model. Figure 1 .

[0016] Figure 5 This is a schematic diagram of the usage state of this utility model. Figure 2 .

[0017] Figure 6 This is a partial structural schematic diagram of the present invention.

[0018] Legend:

[0019] 1. Support frame; 101. Storage slot; 2. Limiting frame; 201. Guide rod; 202. Adsorption block; 203. Guide slope; 3. Samarium cobalt magnet adsorption strip. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0021] Specific implementation examples are given below.

[0022] See Figures 1-6 In this embodiment of the present invention, a limiting device for laminating multilayer circuit boards includes a support frame 1, a limiting frame 2, and a samarium cobalt magnet adsorption strip 3. Multiple limiting frames 2 are provided to limit the circuit boards. The internal dimensions of each limiting frame 2 are different to limit circuit boards of different sizes. The internal dimensions of each limiting frame 2 are identical to those of a corresponding circuit board, ensuring that the circuit board fits snugly against the inner wall of the limiting frame 2 after placement. The support frame 1 is provided with multiple storage slots 101 for accommodating the limiting frames 2, eliminating the need for additional storage. The limiting frame 2 is stored in the storage slot 101. The limiting frame 2 that is needed is lifted out of the storage slot 101 and protrudes upward. Two guide rods 201 that penetrate the support frame 1 are fixed at the bottom of each limiting frame 2. The guide rods 201 are slidably connected to the support frame 1. An adsorption block 202 is fixed at the bottom of each guide rod 201. The samarium cobalt magnet adsorption strip 3 is fixed to the bottom of the support frame 1 to attract the adsorption block 202. The samarium cobalt magnet has good high temperature resistance (samarium cobalt magnet can withstand high temperature of 300℃, and the hot pressing temperature of multilayer circuit board is 120-160℃) and can maintain magnetism at high temperature.

[0023] The inner side of the limiting frame 2 is provided with a guide slope 203, which is inclined at 15°. When the circuit board is placed into the limiting frame 2, it is guided by the guide slope 203, making the placement smoother.

[0024] The inner wall of the limiting frame 2 is coated with a layer of polytetrafluoroethylene (PTFE). PTFE has good high temperature resistance (it can be used stably at 260℃) and good smoothness, which makes the friction between the circuit board and the inner wall of the limiting frame 2 less when the circuit board is placed inside the limiting frame 2, making it easier to place.

[0025] The support frame 1, the limiting frame 2, the guide rod 201 and the adsorption block 202 are all made of 430 ferritic stainless steel, which gives them good high temperature resistance and allows them to be adsorbed by the samarium cobalt magnet adsorption strip 3.

[0026] Working principle: This multi-layer circuit board laminating limiting device is used by first selecting the required size of the limiting frame 2 according to the shape of the circuit board. The limiting frame 2 of the required size is lifted upwards so that the adsorption block 202 at its bottom is attracted by the samarium cobalt magnet adsorption strip 3. The remaining unused limiting frames 2 are stored in the storage groove 101. Then, the multi-layer circuit board is placed into the limiting frame 2. When the circuit board is placed into the limiting frame 2, it is guided by the guide slope 203, making the placement smoother. In addition, the inner wall of the limiting frame 2 is provided with a layer of polytetrafluoroethylene coating. Polytetrafluoroethylene has good smoothness, which reduces the friction between the circuit board and the inner wall of the limiting frame 2 when it is placed into the limiting frame 2, making it easier to place.

[0027] Furthermore, it should be noted that, in the description of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0028] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A limiting device for laminating multilayer circuit boards, characterized in that, The circuit board includes a support frame (1), a limiting frame (2), and a samarium cobalt magnet adsorption strip (3). There are multiple limiting frames (2), which are used to limit the circuit board. The internal dimensions of the multiple limiting frames (2) are different. The support frame (1) is provided with multiple storage slots (101) for storing the limiting frames (2). Each limiting frame (2) has two guide rods (201) that pass through the support frame (1) fixed at its bottom. Each guide rod (201) has an adsorption block (202) fixed at its bottom. The samarium cobalt magnet adsorption strip (3) is fixed to the bottom of the support frame (1) to hold the adsorption block (202).

2. The lamination device for a multilayer wiring board according to claim 1, wherein The inner side of the limiting frame (2) is provided with a guide slope (203).

3. The lamination device according to claim 2, wherein The guide slope (203) is inclined at 15°.

4. The lamination device for a multilayer wiring board according to claim 1, wherein The inner wall of the limiting frame (2) is provided with a layer of polytetrafluoroethylene coating.

5. The lamination device for multilayer wiring boards according to claim 1, wherein The support frame (1), the limiting frame (2), the guide rod (201), and the adsorption block (202) are all made of 430 ferritic stainless steel.

6. The lamination device for multilayer wiring boards according to claim 1, wherein The guide rod (201) is slidably connected to the support frame (1).

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