Electronic devices and electronic equipment

Abstract

This application provides an electronic device and an electronic device. The electronic device includes a circuit board, a first heating element, a cover, and a heat-conducting assembly. The first heating element is fixedly connected to the circuit board. At least a portion of the heat-conducting assembly is located on the side of the first heating element away from the circuit board. The bottom of the cover is fixedly connected to the circuit board, and the cover encloses the first heating element and the heat-conducting assembly. The heat-conducting assembly includes an insulating element and a heat-conducting element, with the insulating element surrounding the heat-conducting element. By setting at least a portion of the heat-conducting assembly on the side of the first heating element away from the circuit board, the heat dissipation efficiency of the heat generated in this area of ​​the first heating element can be effectively improved. Furthermore, the outer periphery of the heat-conducting element is completely surrounded by the insulating element, which also provides sealing and insulation protection for the heat-conducting element, effectively improving the reliability and safety of the heat-conducting element in application.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to an electronic device and an electronic equipment. Background Technology

[0002] As electronic devices become increasingly miniaturized and sophisticated, the heat generation problem of internal electronic components is becoming more and more serious. Temperature has a profound impact on the performance of electronic devices, and how to achieve good heat dissipation within the limited space of electronic devices is an urgent problem to be solved. Utility Model Content

[0003] This application provides an electronic device and an electronic equipment, which have good heat dissipation performance and high reliability.

[0004] In a first aspect, embodiments of this application provide an electronic device. The electronic device includes a circuit board, a first heating element, a cover, and a heat-conducting component. The first heating element is fixedly connected to the circuit board, and at least a portion of the heat-conducting component is located on the side of the first heating element away from the circuit board. The bottom of the cover is fixedly connected to the circuit board, and the cover encloses the first heating element and the heat-conducting component. The heat-conducting component includes an insulating element and a heat-conducting element, with the insulating element surrounding the heat-conducting component.

[0005] The heat generated by the first heating element can be conducted to the cover through the heat-conducting components, and then diffused around the cover. It is understood that when the first heating element generates heat, more heat accumulates on the side of the first heating element away from the circuit board. By placing at least a portion of the heat-conducting components on the side of the first heating element away from the circuit board—that is, by placing at least a portion of the heat-conducting components directly opposite the side of the first heating element away from the circuit board—the heat dissipation efficiency of this area of ​​the first heating element can be effectively improved. Furthermore, the outer periphery of the heat-conducting components is surrounded by insulating components. Even if the heat-conducting components become conductive due to static electricity or overvoltage, the insulating components can still provide sealing and insulation protection, effectively solving the problem of short-circuit failure of structural components in electronic devices caused by the spillage of liquid metal, thereby improving the reliability and safety of the heat-conducting components in application. In addition, the cover encloses both the first heating element and the heat-conducting components, indicating that the heat-conducting components provided in this embodiment can also have superior thermal conductivity when applied in a limited space.

[0006] In some possible implementations, the insulating component includes a first insulating portion, a second insulating portion, and a third insulating portion. The first insulating portion and the second insulating portion are spaced apart along a first direction. The second insulating portion is closer to the circuit board than the first insulating portion. The third insulating portion is fixedly connected to the first insulating portion and the second insulating portion. The first direction is parallel to the arrangement direction of the first heating element and the circuit board.

[0007] In some possible implementations, the size of the first insulating part in the first direction is less than 1 mm, and / or the size of the second insulating part in the extension direction perpendicular to the second insulating part is less than 1 mm, so as to reduce the size of the heat-conducting component in the first direction, which is beneficial to realize the application of the heat-conducting component in a limited space and to expand the application scenarios of the heat-conducting component.

[0008] In some possible implementations, the dimension of the second insulating part in the direction perpendicular to its extension is smaller than the dimension of the third insulating part in the second direction, which is perpendicular to the arrangement direction of the first heating element and the circuit board. In other words, the heat-conducting element has a thicker dam in the circumferential direction and a thinner dam in the top-bottom direction, so that the insulating element can achieve the function of insulation and sealing while also enabling the electronic device to be made thinner, making it convenient for the electronic device to be used in thinner devices.

[0009] In some possible implementations, the second insulating portion covers the side of the first heating element. By providing the second insulating portion to cover the side of the first heating element, the contact area between the insulating portion and the first heating element is increased, thereby expanding the area within the electronic device where the insulating portion provides insulation protection to the first heating element, effectively improving the reliability and safety of the electronic device.

[0010] In some possible implementations, the second insulating portion includes a first segment, a second segment, and a third segment connected in sequence in the extending direction of the second insulating portion. The first segment covers the side of the first heating element away from the circuit board, the second segment covers the side of the first heating element, and the third segment is located on the side of the second segment away from the first heating element.

[0011] In some possible implementations, the electronic device includes a component electrically connected to a circuit board, and a housing encloses the component, with the component spaced apart from a first heating element, and a second insulating portion covering at least a portion of the component.

[0012] By providing a second insulating part that covers at least part of the device, the insulation of the device is improved, preventing the thermal conductive parts from overflowing onto the device surface after electrostatic breakdown or compression, thus effectively improving the reliability and safety of the electronic device.

[0013] In some possible implementations, the distance between the surface of the first insulating part facing away from the circuit board and the circuit board is less than or equal to the distance between the surface of the third insulating part facing away from the circuit board and the circuit board. When the heat-conducting component is installed inside the cover, the fluidity of the third insulating part can be used to achieve close contact between the insulating part and the cover, thereby reducing the requirements for the manufacturing precision and flatness of the first insulating part.

[0014] In some possible implementations, the projection of the third insulating portion onto the plane of the second insulating portion lies within the second insulating portion. The enclosure formed by the third insulating portion concentrates the heat-conducting components between the first heating element and the cover, controlling the distribution range of the heat-conducting components within the electronic device. This effectively improves the heat dissipation efficiency of the area of ​​the first heating element directly opposite the cover, and also increases the spacing between the heat-conducting components and other structural components such as devices on the circuit board. This effectively reduces the impact on the circuitry of other structural components such as devices on the circuit board should the heat-conducting components overflow after being broken down, thus improving the reliability and safety of the electronic device.

[0015] In some possible implementations, the electronic device includes a second heating element, which is enclosed by a housing. The second heating element is arranged at intervals from the first heating element, and a heat-conducting component surrounds at least a portion of the second heating element. The heat-conducting component can also be used to conduct the heat generated by the second heating element. The increased space occupied by the heat-conducting component within the housing, i.e., the larger distribution range of the heat-conducting component within the housing, also helps to improve the heat dissipation efficiency of the electronic device.

[0016] In some possible implementations, at least part of the heat-conducting component is located between the first heating element and the second heating element. In this case, the heat-conducting component can fill the gap between the first and second heating elements, which helps to increase the heat-conducting area of ​​the heat-conducting component and thus improve the heat dissipation efficiency of the electronic device.

[0017] In some possible implementations, the cover is a shield; and / or, the heat-conducting component is a paste-like liquid metal; and / or, the material of the third insulating part is insulating silicone grease, insulating gel, or insulating rubber.

[0018] Secondly, this application provides an electronic device. The electronic device includes a housing, functional components, and the electronic device described in any of the above implementations. The electronic device is installed inside the housing, and the functional components are fixedly connected to the circuit board. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0020] Figure 2 yes Figure 1 The diagram shows a cross-sectional view of the electronic device in some embodiments;

[0021] Figure 3 yes Figure 2 The diagram shown is a structural schematic of the heat-conducting component in some embodiments;

[0022] Figure 4 yes Figure 2 Schematic diagrams of the electronic device shown in other embodiments;

[0023] Figure 5 yes Figure 2 Schematic diagrams of the electronic device shown in other embodiments;

[0024] Figure 6 yes Figure 1 The diagram shows a cross-sectional view of the electronic device in some other embodiments. Detailed Implementation

[0025] The following embodiments of this application will be described in conjunction with the accompanying drawings.

[0026] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. "Fixed connection" refers to a connection where the relative positional relationship remains unchanged after connection. "Rotary connection" refers to a connection where the components can rotate relative to each other after connection. The directional terms mentioned in the embodiments of this application, such as "up," "down," "left," "right," "inner," and "outer," are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0027] The terms "first," "second," etc., are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly specifying the number of technical features. Therefore, a feature marked "first" or "second" may explicitly or implicitly include one or more of that feature. In this context, an integrally formed structural component refers to a component in which one part is connected to another part during the formation of that component, without requiring further processing (such as bonding, welding, snap-fit ​​connections, or screw connections) to join the two parts.

[0028] Please see Figure 1 , Figure 1This is a schematic diagram of the structure of an electronic device 1000 provided in an embodiment of this application. The electronic device 1000 can be a mobile phone, camera, tablet personal computer, laptop computer, smart screen, personal digital assistant (PDA), personal computer, laptop computer, in-vehicle equipment, wearable device, augmented reality (AR) glasses, AR headset, virtual reality (VR) glasses, or VR headset, etc. Figure 1 As shown in the embodiments of this application, the electronic device 1000 is a mobile phone as an example for description. Of course, other types of electronic devices 1000 can also adopt a similar structure, which will not be described in detail below.

[0029] In some embodiments, the electronic device 1000 may include a housing 100 and a screen ( Figure 1 (Not shown in the image), the housing 100 may include a frame 11 and a back cover 12. The back cover 12 and the screen are respectively fixed to opposite sides of the frame 11. The screen, frame 11, and back cover 12 can together enclose a receiving space 13 for the electronic device 1000, used to place, for example, a battery or circuit board 21 (e.g., ...) inside the electronic device 1000. Figure 2 (as shown), receivers or microphones and other structural components.

[0030] The screen can be used to display images, videos, etc. For example, the screen can be an organic light-emitting diode (OLED) display, an active-matrix organic light-emitting diode (AMOLED) display, a mini organic light-emitting diode (MLED) display, a microorganic light-emitting diode (MOLED) display, a quantum dot light-emitting diode (QLED) display, a liquid crystal display (LCD), etc. In some other embodiments, the electronic device 1000 may not include a screen; this application does not limit this aspect.

[0031] The back cover 12 can be fixedly connected to the frame 11 by means of adhesive, snap-fit, or other methods. Alternatively, the back cover 12 and the frame 11 can be integrally formed. In addition, the screen can also be fixed to the frame 11 by means of adhesive. This application embodiment does not limit the connection method of the back cover 12, the frame 11, and the screen.

[0032] For ease of description, the electronic device 1000 is defined to have a Z-axis direction, an X-axis direction, and a Y-axis direction, all of which are mutually perpendicular. Specifically, the thickness direction of the electronic device 1000 can be parallel to the Z-axis direction, the length direction can be parallel to the X-axis direction, and the width direction can be parallel to the Y-axis direction.

[0033] In some embodiments, the electronic device 1000 may further include functional components (not shown in the figures), which may be housed within the receiving space 13. The functional components of the electronic device 1000 may include, but are not limited to, a processor, an internal processor, an external storage interface, a universal serial bus (USB) interface, a charging management module, a power management module, an antenna, a communication module, an audio module, a speaker, a receiver, a microphone, a headphone jack, a sensor module, and a subscriber identification module (SIM) card interface, etc. The electronic device 1000 may have more or fewer components than described above, may combine two or more components, or may have different component configurations. This application does not specifically limit the number, type, or location of modules within the electronic device 1000.

[0034] Please refer to the following: Figure 1 and Figure 2 , Figure 2 yes Figure 1 The diagram shows a cross-sectional view of the electronic device 200 in some embodiments. The electronic device 1000 may include the electronic device 200, which may be installed within the housing 100 of the electronic device 1000, i.e., the electronic device 200 is located within the receiving space 13.

[0035] The electronic device 200 may include a circuit board 21, a first heating element 22, and a heat sink 23. The first heating element 22 may be fixedly connected to the circuit board 21. The heat sink 23 may be spaced apart from the first heating element 22 along a first direction and is located on the side of the first heating element 22 opposite to the circuit board 21. Figure 2 As shown in the embodiments of this application, the first direction can be parallel to the Z-axis direction. In some other embodiments, the first direction can also intersect with the Z-axis direction, such as being parallel to the X-axis direction or parallel to the Y-axis direction. This application does not limit this aspect.

[0036] The circuit board 21 can serve as a carrier, where functional components such as antennas, processors, speakers, receivers, or sensor modules can be fixedly connected. The circuit board 21 can also act as a bridge, connecting the various components connected to it for communication. Furthermore, the circuit board 21 can be connected to the housing 100 using screws, clips, or other methods, or it can be fixed to the housing 100 using other structural components to be installed within the receiving space 13. This application embodiment does not limit the position, size, connection method, number, or type of components mounted on the circuit board 21.

[0037] The first heating element 22 can be understood as a component fixedly connected to the circuit board 21 and capable of generating heat. The number of first heating elements 22 can be one, two or more. This application embodiment does not limit the size, shape, number or position of the first heating element 22. In addition, the first heating element 22 can be fixedly connected to the circuit board 21 by contacting and fixing it to the circuit board 21, or the first heating element 22 can be fixedly connected to the circuit board 21 by other structural components such as the cover 24.

[0038] The heat sink 23 can be used to exchange heat with the external space of the electronic device 200. Within the electronic device 200, the heat generated by the first heating element 22 can be conducted to the heat sink 23, and heat dissipation is achieved through the heat exchange process between the heat sink 23 and the external space of the electronic device 200. By providing the heat sink 23 within the electronic device 200, the heat sink 23 can conduct the heat energy of the first heating element 22 out of the electronic device 200, which helps to reduce the temperature around the first heating element 22. This prevents the performance and service life of structural components such as the first heating element 22 within the electronic device 200 from being affected by excessively high temperatures. Providing the heat sink 23 effectively improves the reliability and safety of the electronic device 1000. In some other embodiments, the electronic device 200 may not include the heat sink 23; this application does not limit this.

[0039] For example, the electronic device 200 may include a cover 24, with a circuit board 21 fixedly connected to the bottom of the cover 24. The cover 24 is located between the circuit board 21 and the heat sink 23. The cover 24 may include a placement space 241, within which the first heat-generating element 22 may be located. The cover 24, located between the circuit board 21 and the heat sink 23, can dissipate heat from the first heat-generating element 22. The cover 24 allows the heat generated by the first heat-generating element 22 to be effectively diffused within the placement space 241, and the heat generated by the first heat-generating element 22 can also be conducted to the heat sink 23 through the cover 24. By providing the cover 24, the heat dissipation area is effectively increased, which is beneficial to improving the heat dissipation efficiency of the first heat-generating element 22 and thus improving the operational stability and reliability of the electronic device 200. The number of covers 24 may be one, two, or more; this embodiment does not limit this. The cover 24 can be a shield. By placing the first heating element 22 in the placement space 241 of the cover 24, the cover 24 can be used to prevent external electromagnetic interference to the operation of structural components such as the first heating element 22 on the circuit board 21.

[0040] In some embodiments, the electronic device 200 may further include a component 25, which may be electrically connected to the circuit board 21, and a housing 24 encloses the component 25, with the component 25 and the first heating element 22 spaced apart along a second direction. In other words, the component 25 is also located within the placement space 241. It is understood that the component 25 can be understood as a component disposed within the same housing 24 as the first heating element 22 and that does not generate heat. The number of components 25 can be one, two, or more; this application does not limit this. Figure 2 As shown in the embodiments of this application, the second direction is perpendicular to the first direction, that is, the second direction can be parallel to the X-axis direction. In some other embodiments, the second direction can also be parallel to the Y-axis direction. This application does not limit this aspect.

[0041] Please refer to the following: Figure 2 and Figure 3 , Figure 3 yes Figure 2 The diagram shown is a structural schematic of the heat-conducting element 262 in some embodiments.

[0042] The electronic device 200 may further include a heat-conducting component 26, which may be located between the housing 24 and the first heating element 22. That is, the housing 24 encloses both the first heating element 22 and the heat-conducting component 26. The heat generated by the first heating element 22 can be conducted back to the housing 24 through the heat-conducting component 26. By providing the heat-conducting component 26, the heat dissipation efficiency of the electronic device 200 can be improved.

[0043] For example, the heat-conducting assembly 26 may include an insulating member 261 and a heat-conducting member 262, with the insulating member 261 enclosing the heat-conducting member 262. That is, the insulating member 261 may include a receiving cavity 2614, and the heat-conducting member 262 may be located within the receiving cavity 2614, so that the internal heat-conducting member 262 is not visible from the outside of the heat-conducting assembly 26.

[0044] The insulating component 261 may include a first insulating portion 2611, a second insulating portion 2612, and a third insulating portion 2613. The first insulating portion 2611 and the second insulating portion 2612 may be spaced apart along a first direction (i.e., the Z-axis direction). The second insulating portion 2612 is closer to the circuit board 21 than the first insulating portion 2611. The third insulating portion 2613 is fixedly connected to the first insulating portion 2611 and the second insulating portion 2612. The receiving cavity 2614 is formed by the first insulating portion 2611, the second insulating portion 2612, and the third insulating portion 2613, and is located between the cover 24 and the first heating element 22. That is, at least part of the heat-conducting components are located on the side of the first heating element 22 away from the circuit board 21.

[0045] For example, the heat-conducting component 262 can be a paste-like liquid metal, pure liquid metal, a conductive heat dissipation material, or a heat dissipation material that can conduct electricity under certain conditions (voltage, pressure, etc.), such as... Figure 3 As shown, when the heat-conducting element 262 is a paste-like liquid metal, it may include an organic polymer portion 2621 and a liquid metal portion 2622, with the organic polymer portion 2621 surrounding the outer periphery of the liquid metal portion 2622. The liquid metal portion 2622 has superior thermal conductivity and strong electrical conductivity, but poor electrical insulation. By providing the organic polymer portion 2621 around the outer periphery of the liquid metal portion 2622, the organic polymer portion can provide sealing and insulating protection for the liquid metal portion 2622. This effectively improves the stability and insulation of the heat-conducting element 262 while ensuring its thermal conductivity, thereby effectively improving the reliability and safety of the electronic device 200 when using the heat-conducting element 262. In other embodiments, the heat-conducting element 262 may not include the organic polymer portion 2621; in other words, the heat-conducting element 262 may also be liquid metal, or it may be other conductive heat-conducting materials. This application does not limit this aspect.

[0046] In addition, the paste-like liquid metal is insulating at room temperature, but it will break down and agglomerate to conduct electricity when the withstand voltage exceeds 15V-20V. After breakdown, the paste-like liquid metal can be regarded as pure liquid metal. The liquid metal part 2622 loses the insulating protection of the organic polymer part 2621 and is prone to leakage, which may cause short circuits in other structural components within the electronic device 200.

[0047] In this embodiment, by setting the outer periphery of the heat-conducting component 262 to be surrounded by the insulating component 261, even when the heat-conducting component becomes conductive due to static electricity or overvoltage, the insulating component 261 can still achieve the function of sealing and insulating the heat-conducting component 262. This can effectively solve the problem of short circuit failure of structural components in the electronic device 200 caused by the overflow of the liquid metal part 2622, thereby improving the reliability and safety of the heat-conducting component 262 in application.

[0048] It is understood that when the first heating element 22 generates heat, a greater amount of heat accumulates on the side of the first heating element 22 facing the heat sink 23. By providing at least a portion of the heat-conducting component 26 located on the side of the first heating element 22 away from the circuit board 21, that is, by providing at least a portion of the heat-conducting component 26 directly opposite the side of the first heating element 22 facing the heat sink 23, the heat dissipation efficiency of the heat generated in this area of ​​the first heating element 22 facing the heat sink 23 can be effectively improved. Furthermore, it is understood that the cover 24 encloses both the first heating element 22 and the heat-conducting component 26, indicating that the heat-conducting component 26 provided in this embodiment can also have superior thermal conductivity when applied in a limited space. The first insulating portion 2611 and the second insulating portion 2612 may or may not be thermally conductive; this embodiment does not limit this.

[0049] For example, the third insulating part 2613 can be approximately ring-shaped, such as a square ring or a circular ring. The first insulating part 2611 and the second insulating part 2612 are continuous structures. The first insulating part 2611 and the second insulating part 2612 are used to seal the opposite sides of the heat-conducting element 262 in the first direction. The third insulating part 2613 is used to surround the periphery of the heat-conducting element 262 (the upper surface of the heat-conducting element 262 in a plane perpendicular to the first direction). The sealing of the outer periphery of the first heating element 22 is achieved by the combined action of the first insulating part 2611, the second insulating part 2612 and the third insulating part 2613.

[0050] For example, the second insulating portion 2612 can be made of materials such as modified cyclic olefin adhesive or epoxy resin, and this application embodiment does not limit this. The second insulating portion 2612 can be disposed on the side of the first heating element 22 facing the heat sink 23 by means of spraying or other methods. The size of the second insulating portion 2612 in the first direction (i.e., the Z-axis direction) is very small, which effectively reduces the size of the electronic device 200 in the first direction, so that the electronic device 200 can be installed in a smaller space, which is beneficial to expanding the applicable environment of the electronic device 200 and also to achieving the thinning of the electronic device 1000. In some examples, the size of the second insulating portion 2612 perpendicular to the second insulating portion 2612 can be less than 1 mm to reduce the size of the heat conducting component 26 in the first direction, which is beneficial to the application of the heat conducting component 26 in a limited space.

[0051] Please see Figure 2 As shown, exemplarily, the second insulating portion 2612 may include a first segment 261a, a second segment 261b, and a third segment 261c connected sequentially in its extension direction. The first segment 261a may cover the side of the first heating element 22 away from the circuit board 21, the second segment 261b may cover the side of the first heating element 22, and the third segment 261c may be located on the side of the second segment 261b away from the first heating element 22. In some examples, the extension directions of the first segment 261a and the third segment 261c may both be parallel to the second direction, and the extension direction of the second segment 261b may be parallel to the first direction. That is, the dimensions of the first segment 261a and the third segment 261c in the second direction may be less than 1 mm, and the dimension of the second segment 261b in the second direction may be less than 1 mm. In other embodiments, the extension directions of the first segment 261a and / or the third segment 261c may intersect with the first direction, and the extension direction of the second segment 261b may also intersect with the second direction. This application embodiment does not limit this.

[0052] By setting the second segment 261b to cover the side of the first heating element 22, the contact area between the insulating element 261 and the first heating element 22 is increased, thereby expanding the area within the electronic device 200 where the insulating element 261 provides insulation protection for the first heating element 22, effectively improving the reliability and safety of the electronic device 200.

[0053] It is understandable that, such as Figure 4 As shown, Figure 4 yes Figure 2 The illustrated electronic device 200 is a schematic diagram of its structure in some other embodiments. In other embodiments, the second insulating portion 2612 may also not include the third segment 261c; or, as... Figure 5 As shown, Figure 5 yes Figure 2 The illustrated electronic device 200 is a schematic diagram of its structure in some other embodiments. In other embodiments, the second insulating portion 2612 may not include the second segment 261b and the third segment 261c, and this application does not limit this aspect.

[0054] In some embodiments, the second insulating portion 2612 covers at least a portion of the device 25. By setting the size range of the second insulating portion 2612, it can extend further in the plane perpendicular to the first direction, thereby expanding the insulation protection range within the electronic device 200. This allows the outer surfaces of other structural components on the circuit board 21, such as the device 25, to be provided with the second insulating portion 2612, improving the insulation of other structural components on the circuit, such as the device 25. This prevents the liquid metal portion 2622 from overflowing onto the surface of the device 25 after the heat-conducting component 262 is subjected to electrostatic breakdown or compression, thus effectively improving the reliability and safety of the electronic device 200. Figure 2 As shown in the embodiments of this application, the second insulating part 2612 covers the entire device as an example. In some other embodiments, the second insulating part may also cover part of the device, and this application does not limit this.

[0055] For example, the third insulating portion 2613 can be made of materials such as insulating silicone grease, insulating gel, or insulating rubber. It is understood that, for example, when the third insulating portion 2613 is insulating silicone grease, the insulating silicone grease has good sealing and insulation properties, and has a certain degree of fluidity under normal conditions, and can cure when conditions such as temperature and light change. By setting the third insulating portion 2613 to insulating silicone grease, the fluidity of the grease allows the third insulating portion 2613 to make tight contact with and adapt to different surfaces of other structural components, such as the second insulating portion 2612 or the housing 24, when the third insulating portion 2613 is connected to other structural components, which is beneficial to improving the reliability and tightness of the connection between internal components of the electronic device 200. Furthermore, the third insulating portion 2613 has a ring-shaped structure. By setting the third insulating portion 2613 to silicone grease, there are no connection gaps between the various parts within the third insulating portion 2613 along its extension direction, effectively improving the structural sealing of the third insulating portion 2613 and reducing the molding difficulty of the third insulating portion 2613. In other embodiments, the third insulating portion 2613 may also be made of materials such as foam or silicone, and this application embodiment does not limit this. Furthermore, the third insulating portion 2613 may be thermally conductive; for example, it may be made of insulating thermally conductive silicone grease or insulating thermally conductive gel, and this application embodiment does not limit this.

[0056] For example, the dimension of the second insulating portion 2612 in the direction perpendicular to its extension can be smaller than the dimension of the third insulating portion 2613 in the second direction, and / or, the dimension of the first insulating portion 2611 in the first direction can be smaller than the dimension of the third insulating portion 2613 in the second direction. In other words, as Figure 2From the perspective shown, the insulating component 261 has a thicker dam in the circumferential direction and a thinner dam in the top and bottom direction. While providing insulation and sealing, it also enables the electronic device 200 to be made thinner, making it easier for the electronic device 200 to be used in thinner devices.

[0057] For example, the width L1 of the third insulating portion 2613 (i.e., the dimension of the third insulating portion 2613 in the second direction) can be greater than or equal to 2 mm and less than or equal to 3 mm to ensure that the dam formed by the third insulating portion 2613 is sufficient to limit the heat-conducting element 262. In some other embodiments, the width L1 of the third insulating portion 2613 can be 1.9 mm, 2.2 mm, 2.5 mm, 3 mm, 3.1 mm, etc., and this application embodiment does not limit this. The width L1 of the third insulating portion 2613 can be the distance between the adjacent inner and outer surfaces of the second insulating portion 2612 in the second direction (i.e., the X-axis direction).

[0058] For example, the first insulating portion 2611 can be a polyethylene terephthalate (PET) film. In this case, the first insulating portion 2611 has a small size in the first direction (i.e., the Z-axis direction) and is highly flexible. When the first insulating portion 2611 is connected to other structural components, such as the cover 24, the first insulating portion 2611 can fit well with the surface of the cover 24 facing the first heating element 22, adapting to the shape of the cover 24 surface, effectively improving the reliability and sealing of the first insulating portion 2611 when connected to other structural components, such as the cover 24. In some other embodiments, the first insulating portion 2611 can also be a sheet structure made of other insulating materials, such as silicone, for example, insulating cereal, etc. This application embodiment does not limit this. In some examples, the size of the first insulating portion 2611 perpendicular to the first insulating portion 2611 can be less than 1 mm to reduce the size of the heat-conducting component 26 in the first direction, which is beneficial for the application of the heat-conducting component 26 in a limited space.

[0059] like Figure 2 As shown, the first insulating portion 2611 can be located within the third insulating portion 2613. That is, the distance from the surface of the first insulating portion 2611 away from the circuit board 21 to the circuit board 21 is less than or equal to the distance from the surface of the third insulating portion 2613 away from the circuit board 21 to the circuit board 21. By setting the first insulating portion 2611 within the third insulating portion 2613, when the heat-conducting assembly 26 is installed inside the cover 24, the fluidity of the third insulating portion 2613 can be used to achieve close contact between the insulating component 261 and the cover 24, thereby reducing the requirements for the manufacturing precision and flatness of the first insulating portion 2611.

[0060] Please refer to it again. Figure 2The side of the first heating element 22 facing the heat sink 23 can be formed by the first segment 261a. It is understood that, for example, when the first heating element 22 is a structural component such as a System on Chi (SOC) device, the surface of the first heating element 22 is encapsulated with an insulating material to prevent impurities in the air from corroding the internal circuitry of the first heating element 22 and causing a decrease in electrical performance. Furthermore, the encapsulated first heating element 22 is easier to install and transport. In this application, the second insulating portion 2612 is located on the surface of the first heating element 22. It can also be considered that the second insulating portion 2612 can encapsulate the first heating element 22, replacing the function of the encapsulating insulating material on the surface of the first heating element 22. Alternatively, at least a portion of the second insulating portion 2612 is formed from the encapsulating insulating material on the surface of the first heating element 22. This allows for the insulation and sealing of the heat-conducting element 262 by the receiving cavity 2614 while reducing the manufacturing cost of the insulating element 261, and also helps to reduce the size of the electronic device 200 in the first direction, thus facilitating the thinning of the electronic device 1000.

[0061] In some embodiments, the projection of the third insulating portion 2613 onto the plane of the surface of the first heating element 22 away from the circuit board 21 is located within the first heating element 22. The enclosure formed by the third insulating portion 2613 gathers the heat-conducting element 262 between the first heating element 22 and the heat sink 23, controlling the distribution range of the heat-conducting element 262 within the electronic device 200. This effectively improves the heat dissipation efficiency of the area of ​​the first heating element 22 directly opposite the heat sink 23, and also increases the spacing between the heat-conducting element 262 and other structural components such as devices 25 on the circuit board 21. This effectively reduces the impact on the circuitry of other structural components such as devices 25 on the circuit board 21 if the heat-conducting element 262 may overflow after being broken down, thereby improving the reliability and safety of the electronic device 200. In some other embodiments, the projection of a portion of the third insulating portion 2613 on the plane of the surface of the first heating element 22 away from the circuit board 21 may also be located inside the first heating element 22. That is, the projection of another portion of the third insulating portion 2613 on the plane of the surface of the first heating element 22 away from the circuit board 21 may also be located outside the first heating element 22. In other words, a portion of the third insulating portion 2613 may be arranged with the first heating element 22 along the second direction (i.e., the X-axis direction). This application embodiment does not limit this.

[0062] Combination Figure 2 For the illustrated embodiments, please refer to [link / reference]. Figure 6 , Figure 6 yes Figure 1 A schematic cross-sectional view of the electronic device 200 in some other embodiments.

[0063] In the preceding embodiments, the example described uses one first heating element 22. In other embodiments, the electronic device 200 may also include a second heating element 27, which is enclosed by a cover 24. The second heating element 27 is arranged at intervals from the first heating element 22, and a heat-conducting component 26 may surround at least a portion of the second heating element 27. In this case, the heat-conducting component 26 can also be used to conduct the heat generated by the second heating element 27. The space occupied by the heat-conducting component 26 within the cover 24 increases, meaning the distribution range of the heat-conducting component 262 within the cover 24 increases, which also helps to improve the heat dissipation efficiency of the electronic device 200.

[0064] In some embodiments, at least a portion of the heat-conducting component 26 is connected between the first heating element 22 and the second heating element 27. In this case, the heat-conducting component 262 can fill the gap between the first heating element 22 and the second heating element 27, which helps to increase the heat-conducting area of ​​the heat-conducting component 262, thereby improving the heat dissipation efficiency of the electronic device 200.

[0065] It should be noted that, Figures 1 to 6 The accompanying drawings only schematically show some components included in the electronic device 1000. The actual shape, size, location, and structure of these components are not subject to change. Figures 1 to 6 The attached diagrams are subject to limitations.

[0066] Where there is no conflict, the embodiments and features in the embodiments of this application can be combined with each other, and any combination of features in different embodiments is also within the protection scope of this application. That is to say, the multiple embodiments described above can also be arbitrarily combined according to actual needs.

[0067] The above are only some embodiments and implementation methods of this application. The protection scope of this application is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the protection scope of this application.

Claims

1. An electronic device, characterized by comprising: The device includes a circuit board, a first heating element, a cover, and a heat-conducting assembly. The first heating element is fixedly connected to the circuit board, and at least a portion of the heat-conducting assembly is located on the side of the first heating element away from the circuit board. The bottom of the cover is fixedly connected to the circuit board, and the cover encloses the first heating element and the heat-conducting assembly. The thermally conductive component includes an insulating element and a thermally conductive element, wherein the insulating element surrounds the thermally conductive element. 2.The electronic device of claim 1, wherein, The insulating component includes a first insulating portion, a second insulating portion, and a third insulating portion. The first insulating portion and the second insulating portion are spaced apart along a first direction. The second insulating portion is closer to the circuit board than the first insulating portion. The third insulating portion is fixedly connected to the first insulating portion and the second insulating portion. The first direction is parallel to the arrangement direction of the first heating element and the circuit board. 3.The electronic device of claim 2, wherein, The first insulating portion has a dimension of less than 1 mm in the first direction, and / or the second insulating portion has a dimension of less than 1 mm in the extension direction perpendicular to the second insulating portion. 4.The electronic device of claim 2, wherein, The dimension of the second insulating portion in the extension direction perpendicular to the second insulating portion is smaller than the dimension of the third insulating portion in the second direction, which is perpendicular to the arrangement direction of the first heating element and the circuit board. 5.The electronic device of claim 2, wherein, The second insulating portion covers the side of the first heating element. 6.The electronic device of claim 5, wherein, The second insulating portion includes a first segment, a second segment, and a third segment connected in sequence in the extending direction of the second insulating portion. The first segment covers the side of the first heating element away from the circuit board, the second segment covers the side of the first heating element, and the third segment is located on the side of the second segment away from the first heating element. 7.The electronic device of claim 2, wherein, The electronic device includes a component electrically connected to the circuit board, and the cover encloses the component. The component is spaced apart from the first heating element, and the second insulating portion covers at least a portion of the component. 8.The electronic device of claim 2, wherein, The distance from the surface of the first insulating portion away from the circuit board to the circuit board is less than or equal to the distance from the surface of the third insulating portion away from the circuit board to the circuit board. 9.The electronic device of claim 2, wherein, The projection of the third insulating part onto the plane where the second insulating part is located is within the second insulating part. 10.The electronic device of claim 2, wherein, The electronic device includes a second heating element, the cover encloses the second heating element, the second heating element is arranged at intervals from the first heating element, and the heat-conducting component surrounds at least a portion of the second heating element. 11.The electronic device of claim 10, wherein, At least a portion of the heat-conducting component is located between the first heating element and the second heating element. 12.The electronic device of claim 2, wherein, The cover is a shield; and / or the heat-conducting component is a paste-like liquid metal; and / or the material of the third insulating part is insulating silicone grease, insulating gel, or insulating rubber.

13. An electronic device, comprising: The device includes a housing, functional components, and an electronic device as described in any one of claims 1-12, wherein the electronic device is installed within the housing, and the functional components are fixedly connected to the circuit board.

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