Electronic control unit, motor control system and fan
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-22
- Publication Date
- 2026-08-14
AI Technical Summary
若封装晶体管无法及时散热,则不能保证电子控制单元正常工作
[0014]可以了解,本申请的电子控制单元结构简单、安装方便,不仅可以重复利用工装,降低安装成本,并能够大幅提高电子控制单元的散热效率,还能够克服封装晶体管爬电距离不足等问题。
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Figure CN224638300U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of electronic device technology, and more specifically, this application relates to an electronic control unit, a motor control system provided with the electronic control unit, and a fan configured with the motor control system. Background Technology
[0002] The information provided in this section is for the purpose of generally presenting the background of this disclosure. To the extent described in this section, the work of the currently named inventors and aspects of the description that may not constitute prior art at the time of filing are neither explicitly nor implicitly considered to be prior art of this disclosure.
[0003] Existing electronic control units mostly use packaged transistors to control motor switching. If the packaged transistors cannot dissipate heat in time, the normal operation of the electronic control unit cannot be guaranteed. Therefore, high requirements are placed on the heat dissipation method, installation method, and insulation performance of the packaged transistors. Utility Model Content
[0004] According to this application, an electronic control unit is provided, the electronic control unit comprising: Cover; A positioning plate, which is made of insulating material and is mounted on the cover by a first fastener, wherein a positioning groove is provided on one side of the positioning plate and an opening communicating with the positioning groove is provided on the other side of the positioning plate; A packaged transistor is mounted within the positioning slot and includes a package body and pins, the package body having a first side and a second side facing each other. An insulating and thermally conductive element disposed between a first side surface of the encapsulation body and the cover; and A pressure plate is located on the other side of the positioning plate and is detachably fixed to the cover by a second fastener. The side of the pressure plate facing the positioning plate has a protrusion. When the pressure plate is fixed to the cover, the protrusion passes through the opening and applies pressure to the second side of the encapsulation body, so that the insulating heat-conducting component is in close contact with the encapsulation body and the cover respectively.
[0005] Optionally, in the above-mentioned electronic control unit, the insulating thermally conductive component is a thermally conductive pad or a ceramic sheet.
[0006] Optionally, in the above-described electronic control unit, when the insulating thermally conductive component is a ceramic sheet, the surface of the ceramic sheet is coated with a thermally conductive medium, which includes at least one of thermally conductive adhesive, thermally conductive silicone grease, and thermally conductive gel; and / or When the insulating heat-conducting component is a ceramic sheet, one side of the positioning plate is provided with a snap-fit part and a limiting part for positioning the ceramic sheet.
[0007] Optionally, in the above-mentioned electronic control unit, the number of packaged transistors is six, and the six packaged transistors are arranged in two groups and symmetrically with respect to the center line of the positioning plate.
[0008] Optionally, in the above-described electronic control unit, the number of protrusions is six, and the six protrusions are of the same height.
[0009] Optionally, in the above-mentioned electronic control unit, the pressure plate is provided with a first through hole for the pin to pass through, and the positioning plate is provided with a second through hole for the pin to pass through.
[0010] Optionally, in the above-described electronic control unit, the pressure plate and the cover are made of metal; and / or The positioning plate is made of plastic; and / or The first fastener is a first bolt, and the second fastener is a second bolt, wherein the first bolt and the second bolt are of different sizes and lengths; and / or The cover is made of metal and has a first side and a second side opposite to each other. The insulating heat-conducting element is attached to the first side of the cover, and the second side of the cover is provided with a heat dissipation structure.
[0011] Optionally, in the above-described electronic control unit, the packaged transistor is an insulated gate bipolar transistor (IGBT), which includes a first pin, a second pin, and a third pin extending outward from the same side of the package body.
[0012] Furthermore, according to this application, a motor control system is also provided, the motor control system being provided with the aforementioned electronic control unit, the motor control system further including a housing and a rotor and stator assembly located inside the housing, the housing being detachably fixedly connected to the cover.
[0013] Additionally, according to this application, there is also a fan equipped with the aforementioned motor control system.
[0014] It is understood that the electronic control unit of this application has a simple structure and is easy to install. It can not only reuse tooling to reduce installation costs, but also significantly improve the heat dissipation efficiency of the electronic control unit, and overcome problems such as insufficient creepage distance of packaged transistors. Attached Figure Description
[0015] The disclosure of this application will become more readily understood with reference to the accompanying drawings. It will be readily understood by those skilled in the art that these drawings are for illustrative purposes only and are not intended to limit the scope of protection of this application. Furthermore, similar numbers in the drawings are used to denote similar components, wherein: Figure 1 An exemplary three-dimensional exploded view of the electronic control unit disclosed in this application is shown; Figure 2 A cross-sectional schematic diagram of a motor control system provided with an electronic control unit disclosed in this application is shown as an example; Figure 3 A cross-sectional schematic diagram of the electronic control unit disclosed in this application is shown as an example; Figure 4 An exemplary front view of the positioning plate of the electronic control unit disclosed in this application is shown; Figure 5 An exemplary rear view of the positioning plate of the electronic control unit disclosed in this application is shown; Figure 6 A side view of the positioning plate of the electronic control unit disclosed in this application is shown as an example; Figure 7 An exemplary perspective view of the pressure plate of the electronic control unit disclosed in this application is shown from a first view. Figure 8 An exemplary three-dimensional structural diagram of the pressure plate of the electronic control unit disclosed in this application is shown from a second perspective. Figure 9 An exemplary front view of the pressure plate of the electronic control unit disclosed in this application is shown; Figure 10 An exemplary rear view of the pressure plate of the electronic control unit disclosed in this application is shown; and Figure 11 A side view of the pressure plate of the electronic control unit disclosed in this application is shown as an example. Detailed Implementation
[0016] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings. First, it should be noted that the directional terms such as up, down, left, right, front, back, inner, outer, top, and bottom mentioned or possibly used in this specification are defined relative to the structures shown in the accompanying drawings. They are relative concepts and may therefore vary depending on their location and usage. Therefore, these or other directional terms should not be interpreted as restrictive terms.
[0017] In this application, the terms "installation," "setting," "arrangement," "equipped with," "connection," "linking," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0018] Figure 1 A schematic structure of the electronic control unit disclosed in this application is shown. Figure 2 and Figure 3 As clearly seen, the electronic control unit 10 comprises a cover 100, a positioning plate 200, an encapsulated transistor 400, an insulating heat-conducting component 500, and a pressure plate 600. The cover 100 can be made of metal, such as aluminum, to quickly conduct heat away from the internal electronic components. The positioning plate 200 is made of insulating material, such as plastic, and is mounted on the cover 100 by a first fastener 300. One side of the positioning plate 200 has a positioning groove 210, and the other side has an opening 220 communicating with the positioning groove 210. Figures 4-6 As shown. The positioning groove 210 has a shape that matches the shape of the package body 410, such that the packaged transistor 400 is precisely mounted within the positioning groove 210. The packaged transistor 400 includes a package body 410 and leads 420. The package body 410 has a first side 411 and a second side 412 facing each other. Furthermore, the insulating thermally conductive element 500 is disposed between the first side 411 of the package body 410 and the cover 100. The pressure plate 600 is located on the other side of the positioning plate 200 and is made of metal, such as iron. The pressure plate 600 is detachably fixed to the cover 100 by the second fastener 700. A protrusion 610 is provided on the side of the pressure plate 600 facing the positioning plate 200. When the pressure plate 600 is fixed to the cover 100, the protrusion 610 passes through the opening 220 and applies pressure to the second side 412 of the encapsulation body 410, so that the insulating heat-conducting element 500 is in close contact with the encapsulation body 410 and the cover 100 respectively, thereby conducting the heat emitted by the encapsulated transistor 400 to the cover 100 through the insulating heat-conducting element 500 to achieve the purpose of rapid heat dissipation.
[0019] It should be noted that a certain gap may exist between the pressure plate 600 and the positioning plate 200, so that the pressure plate 600 does not apply pressure to the positioning plate 200, but directly applies pressure to the package body 410, or rather, the second side 412 of the package body 410. Furthermore, the positioning plate 200 can increase the creepage distance between the packaged transistors 400, which solves the problem of insufficient creepage distance for the packaged transistors and enables accurate positioning of the packaged transistors.
[0020] In other optional embodiments, in conjunction with the above embodiments, the insulating thermally conductive element 500 can be a conventional thermally conductive pad used to fill the gap between the first side 411 of the encapsulation body 410 and the cover 100. For example, the cover 100 can be made of metal and has an opposing first side 110 and a second side 120. The insulating thermally conductive element 500 is attached to the first side 110 of the cover 100, while the second side 120 of the cover 100 is provided with a heat dissipation structure 130, such as a finned structure, etc. Figure 2 As shown. In addition, the insulating thermally conductive component 500 can also be a ceramic sheet. Those skilled in the art know that ceramic sheets are a type of thermally conductive material with high thermal conductivity and characteristics such as high insulation, high density, good surface roughness, and high reliability. To remove air between the ceramic sheet and the encapsulation body 410 or between the ceramic sheet and the cover 100, the surface of the ceramic sheet can be coated with a thermally conductive medium, including thermally conductive adhesive, thermally conductive silicone grease, and thermally conductive gel. For insulating thermally conductive components 500 made of different materials, the pressure plate 600 can ensure that a certain pressure is applied to each encapsulated transistor 400, so that the encapsulated transistor 400 is in complete contact with the insulating thermally conductive component 500 without any gaps, thereby improving heat dissipation efficiency. Furthermore, one side of the positioning plate 200 is provided with a latching part 230 and a limiting part 240 for positioning the ceramic sheet, thereby ensuring that the ceramic sheet can be accurately positioned.
[0021] In such Figure 1 In the illustrated embodiment, the number of packaged transistors 400 is six. These six packaged transistors 400 are arranged in two groups and symmetrically about the center line of the positioning plate 200, thereby achieving uniform heat dissipation. Furthermore, the number of protrusions 610 is six, and the six protrusions 610 have the same height (see reference). Figures 8-11 This ensures that each packaged transistor 400 experiences the same force and is in close contact with the insulating thermally conductive element 500. Since each packaged transistor 400 and the insulating thermally conductive element 500 can be pressed together, the heat dissipation efficiency of the packaged transistor 400 is significantly improved. For ease of manufacturing, the six protrusions 610 can be integrally formed with the pressure plate 600.
[0022] Continue to refer to Figure 4 and Figure 7 The pressure plate 600 is provided with a first through hole 611 for the pin 420 to pass through, and the positioning plate 200 is provided with a second through hole 250 for the pin 420 to pass through. Specifically, the first through hole 611 can be in the form of a square through hole, while the second through hole 250 can be in the form of a circular through hole.
[0023] It should be noted that the first fastener 300 is the first bolt, and the second fastener 700 is the second bolt. The first bolt and the second bolt are different in size and length to avoid installation errors. Furthermore, to ensure thread quality, the first bolt and the second bolt do not share bolt holes.
[0024] As an example, the packaged transistor 400 may be an insulated-gate bipolar transistor (IGBT), which includes a first pin, a second pin, and a third pin extending outward from the same side of the package body 410. Since IGBTs are typically assembled in electronic control units and require high operating voltages, their insulation performance is subject to high requirements. In this application, the positioning plate 200 and the insulating thermally conductive element 500, both made of insulating material, meet these insulation requirements.
[0025] The following is combined with Figure 1 A simplified explanation of the installation method of the electronic control unit according to this application is provided. Taking a ceramic sheet as an example of an insulating and heat-conducting component 500, firstly, the operator places six packaged transistors 400 into the corresponding positioning slots 210 on the positioning plate 200, so that the pins 420 of the packaged transistors 400 pass through the corresponding second through holes 250 on the positioning plate 200. Then, the ceramic sheet is placed on the packaged transistors 400, i.e., on the first side 411 of the package body 410. The ceramic sheet is installed and positioned according to the snap-fit portion 230 and the limiting portion 240 on the positioning plate 200, thereby assembling the packaged transistors 400, the positioning plate 200, and the ceramic sheet into a module, and the module is then installed to the cover 100 using the first fastener 300. Subsequently, the operator places the pressure plate 600 on the positioning plate 200 and fixes the pressure plate 600 to the cover 100 using the second fastener 700. At this point, the pins 420 of the packaged transistor 400 pass through the corresponding first through holes 611 on the pressure plate 600, and each packaged transistor 400 and ceramic sheet can be pressed together. After processing, the second fastener 700 is removed, and the pressure plate 600 is removed for continued use. Finally, the operator can tighten the first fastener 300 onto the cover 100, thereby completing the overall assembly of the electronic control unit 10.
[0026] Furthermore, this application also provides a motor control system. The motor control system 1 is equipped with the aforementioned electronic control unit 10. The motor control system 1 also includes a housing 20 and a rotor and stator assembly 30 located inside the housing 20. The housing 20 is fixedly connected to the cover 100 in a detachable manner, such as by bolts. Figure 2 As shown. Therefore, the cover 100 can also serve as a cover for enclosing the housing 20 of the motor control system 1. In this case, the electronic control unit 10 is located on one side of the housing cover of the motor control system 1 and can be spaced apart from the rotor and stator assembly 30 inside the housing 20, thereby improving the reliability and stability of the electronic control unit 10.
[0027] In addition, this application also provides a fan. The fan is equipped with the aforementioned motor control system 1. Since a heat dissipation structure 130 is provided on the second side 120, i.e., the outer side, of the cover 100 of the electronic control unit 10, the airflow generated by the fan when it is working also helps the electronic control unit 10 to dissipate heat quickly when it flows through the heat dissipation structure 130.
[0028] In summary, the electronic control unit of this application not only solves the positioning problem of packaged transistors, but also addresses the issue of insufficient creepage distance when packaged transistors are fixed with fasteners, and further improves the heat dissipation efficiency of packaged transistors. Therefore, its application in motor control systems is highly recommended.
[0029] The above examples illustrate in detail the electronic control unit, the motor control system equipped with the electronic control unit, and the fan equipped with the motor control system of this application. These examples are only for illustrating the principles and implementation methods of this application and are not intended to limit the application. Various modifications and improvements can be made by those skilled in the art without departing from the spirit and scope of this application. Therefore, all equivalent technical solutions should fall within the scope of this application and be defined by the claims of this application.
Claims
1. An electronic control unit, characterized by, The electronic control unit (10) includes: Cover (100); A positioning plate (200) is made of insulating material and is mounted on the cover (100) by a first fastener (300). The positioning plate (200) has a positioning groove (210) on one side and an opening (220) communicating with the positioning groove (210) on the other side. A packaged transistor (400) is mounted in the positioning groove (210) and includes a package body (410) and pins (420), the package body (410) having a first side (411) and a second side (412) opposite to each other. An insulating and thermally conductive element (500) is disposed between a first side (411) of the encapsulation body (410) and the cover (100); and A pressure plate (600) is located on the other side of the positioning plate (200) and is detachably fixed to the cover (100) by a second fastener (700). A protrusion (610) is provided on the side of the pressure plate (600) facing the positioning plate (200). When the pressure plate (600) is fixed to the cover (100), the protrusion (610) passes through the opening (220) and applies pressure to the second side (412) of the encapsulation body (410), so that the insulating heat-conducting element (500) is in close contact with the encapsulation body (410) and the cover (100) respectively.
2. The electronic control unit of claim 1, wherein, The insulating and heat-conducting component (500) is a heat-conducting pad or a ceramic sheet.
3. The electronic control unit of claim 2, wherein, When the insulating thermally conductive component (500) is a ceramic sheet, the surface of the ceramic sheet is coated with a thermally conductive medium, the thermally conductive medium including at least one of thermally conductive adhesive, thermally conductive silicone grease, and thermally conductive gel; and / or When the insulating heat-conducting component (500) is a ceramic sheet, a snap-fit part (230) and a limiting part (240) for positioning the ceramic sheet are provided on one side of the positioning plate (200).
4. The electronic control unit according to any one of claims 1 to 3, characterized by, The number of packaged transistors (400) is six, and the six packaged transistors (400) are arranged in two groups and symmetrically on the left and right sides with respect to the center line of the positioning plate (200).
5. The electronic control unit of claim 4, wherein, The number of protrusions (610) is six, and the six protrusions (610) are of the same height.
6. The electronic control unit according to any one of claims 1 to 3, characterized by The pressure plate (600) is provided with a first through hole (611) for passing through the pin (420), and the positioning plate (200) is provided with a second through hole (250) for passing through the pin (420).
7. The electronic control unit according to any one of claims 1 to 3, characterized by The pressure plate (600) and the cover (100) are made of metal; and / or The positioning plate (200) is made of plastic; and / or The first fastener (300) is a first bolt, and the second fastener (700) is a second bolt, wherein the first bolt and the second bolt are different in size and length; and / or The cover (100) is made of metal and has a first side (110) and a second side (120) opposite to each other. The insulating heat-conducting element (500) is attached to the first side (110) of the cover (100), and the second side (120) of the cover (100) is provided with a heat dissipation structure (130).
8. The electronic control unit according to any one of claims 1 to 3, characterized by The packaged transistor (400) is an insulated gate bipolar transistor, which includes a first pin, a second pin, and a third pin extending outward from the same side of the package body (410).
9. An electric motor control system characterized by, The motor control system (1) is provided with an electronic control unit (10) according to any one of claims 1-8, and the motor control system (1) further includes a housing (20) and a rotor and stator assembly (30) located inside the housing (20), the housing (20) and the cover (100) being fixedly connected in a detachable manner.
10. A fan, characterized by The fan is equipped with a motor control system (1) according to claim 9.