Station-level heat exchange cooling device

Abstract

This utility model discloses a station-level heat exchange cooling device. By setting a partition, the box is divided into an evaporation chamber connected to the machine room and a condensation chamber connected to the external environment. A first microchannel heat exchange plate and a second microchannel heat exchange plate are set in the evaporation chamber and the condensation chamber respectively to form a two-phase working fluid circulation loop. This realizes efficient heat exchange between the high-temperature air in the machine room and the low-temperature air in the external environment in a physically isolated space, effectively utilizing the natural cold source and reducing the cooling energy consumption of the machine room. By designing a staggered stacked S-shaped microchannel tube structure in the microchannel heat exchange plate, the secondary heat exchange between the microchannel tube and the air is increased, and the path of the two-phase working fluid in the microchannel tube is extended. The two-phase working fluid is allowed to flow back twice at the S-shaped bend of the microchannel tube, ensuring that the two-phase working fluid inside the microchannel tube is completely vaporized or liquefied. This avoids the tube blockage effect caused by gas-liquid mixing in the microchannel tube, which would lead to uneven heating and cooling on the surface of the heat exchange plate.

Description

Technical Field

[0001] This utility model belongs to the field of heat exchange technology and relates to refrigeration equipment for computer rooms, specifically a station-level heat exchange cooling device. Background Technology

[0002] In scenarios such as battery energy storage stations and communication base stations, thermal management of the battery compartment is crucial to safety and lifespan. Traditional finned tube heat exchangers exhibit multiple drawbacks when applied to such scenarios: First, their energy efficiency ratio is generally low, and the refrigerant charge is high, leading to increased overall energy consumption and maintenance costs of the battery system; second, fixed-frequency compressors cannot adapt to the dynamic heat load changes during battery charging and discharging, resulting in significant energy waste under partial load conditions; third, fluctuations in ambient temperature and humidity can easily cause unstable cooling capacity, and frequent maintenance further increases the risk of battery system downtime.

[0003] While existing microchannel heat pipe technology offers the advantage of compact structure, in the high heat density environment of the battery compartment, the pure heat pipe mode is prone to gas-liquid mixing and pipe blockage due to insufficient heat exchange, leading to localized overheating or uneven heating and cooling, seriously threatening the uniformity of battery temperature. In addition, the bulky size of traditional equipment is difficult to adapt to the limited space of the battery compartment, requiring the intervention of large equipment during installation; during long-term operation, the problem of dust accumulation on the condenser and evaporator is more prominent in the dusty environment of the battery compartment, resulting in increased wind resistance, a sharp drop in ventilation efficiency, and a continuous decline in cooling capacity. Utility Model Content

[0004] To address the technical problems existing in the background art, this utility model proposes a station-level heat exchange cooling device that uses the natural cold source of the external environment to cool down the computer room station, greatly reducing energy demand.

[0005] The objective of this utility model can be achieved through the following technical solutions:

[0006] A station-grade heat exchange cooling device includes: a housing, a first microchannel heat exchange plate, and a second microchannel heat exchange plate. A partition is provided in the middle of the housing to divide the interior of the housing into an evaporation chamber and a condensation chamber. The first microchannel heat exchange plate is located in the evaporation chamber, and the second microchannel heat exchange plate is located in the condensation chamber. The first microchannel heat exchange plate and the second microchannel heat exchange plate are interconnected by a pipe to form a first circulation loop of two-phase working fluid. The evaporation chamber is connected to the machine room station. The relatively high temperature air in the machine room station enters the evaporation chamber and exchanges heat with the first microchannel heat exchange plate. The liquid two-phase working fluid in the first microchannel heat exchange plate absorbs heat and evaporates into a gaseous state to cool the relatively high temperature air in the machine room station. The condensation chamber is connected to the external environment. The relatively low temperature air in the external environment enters the condensation chamber and exchanges heat with the second microchannel heat exchange plate. The gaseous two-phase working fluid flowing from the first microchannel heat exchange plate into the second microchannel heat exchange plate releases heat and condenses into a liquid state, and then circulates back to the first microchannel heat exchange plate.

[0007] Furthermore, a first air inlet and a first air outlet are provided on the side wall of the evaporation chamber. Both the first air inlet and the first air outlet are connected to the computer room station. A first fan is installed in the first air inlet, and a first microchannel heat exchange plate is installed in the first air outlet. The relatively high temperature air in the computer room station is drawn into the evaporation chamber through the first air inlet by the first fan, and after exchanging heat with the first microchannel heat exchange plate, it returns to the computer room station through the first air outlet. A second air inlet and a second air outlet are provided on the side wall of the condensation chamber. Both the second air inlet and the second air outlet are connected to the external environment. A second fan is installed in the second air inlet, and a second microchannel heat exchange plate is installed in the second air outlet. The relatively low temperature air in the external environment is drawn into the condensation chamber through the second air inlet by the second fan, and after exchanging heat with the second microchannel heat exchange plate, it returns to the external environment through the second air outlet.

[0008] Furthermore, an air inlet pipe is connected to the first air inlet, and an air outlet pipe is connected to the first air outlet. The air inlet pipe and the air outlet pipe are connected to the first air inlet and the first air outlet respectively through a hood, so that the first air inlet and the first air outlet are delivered by separate pipes to avoid turbulence.

[0009] Furthermore, the first microchannel heat exchange plate is provided with a first tube and a second tube, which are connected to each other by a plurality of vertically distributed microchannel tubes. The two-phase working fluid in the first tube flows into the second tube through the plurality of microchannel tubes, and the two-phase working fluid exchanges heat with the air flowing through the first microchannel heat exchange plate in the plurality of microchannel tubes.

[0010] Furthermore, multiple microchannel tubes are arranged in parallel to each other, and each microchannel tube has an S-shaped bend in the middle. The bends of any two adjacent microchannel tubes are staggered.

[0011] Furthermore, three adjacent microchannel tubes form a microchannel tube group, in which the S-shaped bend of the second microchannel tube is located in the middle, and the S-shaped bends of the first and third microchannel tubes are located on both sides of the S-shaped bend of the second microchannel tube.

[0012] Furthermore, the second microchannel heat exchange plate has the same structure as the first microchannel heat exchange plate, with the first tube of the second microchannel heat exchange plate connected to the second tube of the first microchannel heat exchange plate, and the second tube of the second microchannel heat exchange plate connected to the first tube of the first microchannel heat exchange plate.

[0013] Furthermore, the cooling device also includes a compressor, a condenser, and an evaporator. The compressor and condenser are installed in the condensation chamber, and the evaporator is installed in the evaporation chamber. The compressor, condenser, and evaporator are connected by pipes to form a second circulation loop of two-phase working fluid. The liquid two-phase working fluid exchanges heat with the relatively high-temperature air entering the evaporation chamber from the machine room station in the evaporator, becoming a gaseous two-phase working fluid. Then, it first enters the compressor and is compressed into a high-temperature and high-pressure gas, and then enters the condenser to release heat. After condensing into a liquid two-phase working fluid, it returns to the evaporator.

[0014] Furthermore, the cooling device also includes a control board and a temperature sensor. The temperature sensor is installed in the computer room to collect temperature data in real time. The control board is connected to the temperature sensor and the compressor respectively. When the detected temperature data exceeds a preset first threshold, the compressor is started. When the detected temperature data is lower than a preset second threshold, the compressor is shut down.

[0015] The beneficial effects of this utility model are as follows: The station-level heat exchange cooling device provided in this application divides the box into an evaporation chamber connected to the machine room and a condensation chamber connected to the external environment by setting a partition. A first microchannel heat exchange plate and a second microchannel heat exchange plate are set in the evaporation chamber and the condensation chamber respectively to form a two-phase working fluid circulation loop. This realizes efficient heat exchange between the high-temperature air in the machine room and the low-temperature air in the external environment in a physically isolated space, effectively utilizes the natural cold source, and reduces the cooling energy consumption of the machine room. By designing a staggered stacked S-shaped microchannel tube structure in the microchannel heat exchange plate, the secondary heat exchange between the microchannel tube and the air is increased, and the path of the two-phase working fluid in the microchannel tube is extended. This allows the two-phase working fluid to flow back twice at the S-shaped bend of the microchannel tube, ensuring that the two-phase working fluid inside the microchannel tube is completely vaporized or liquefied. This avoids the tube blockage effect caused by gas-liquid mixing in the microchannel tube, which would lead to uneven heating and cooling on the surface of the heat exchange plate. Attached Figure Description

[0016] Figure 1 This is a three-dimensional schematic diagram of the present invention.

[0017] Figure 2 This is a cross-sectional view of the present invention.

[0018] Figure 3 This is an exploded view of the present invention.

[0019] Figure 4 This is a schematic diagram of the layout of the microchannel tubes inside the microchannel heat exchange plate of this utility model. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0021] like Figure 1-3 As shown, this utility model provides a station-level heat exchange cooling device, including: a housing 1, a first microchannel heat exchange plate 2, and a second microchannel heat exchange plate 3. A partition 11 is provided in the middle of the housing 1 to divide the interior of the housing 1 into an evaporation chamber 12 and a condensation chamber 13. The first microchannel heat exchange plate 2 is disposed in the evaporation chamber 12, and the second microchannel heat exchange plate 3 is disposed in the condensation chamber 13. The first microchannel heat exchange plate 2 and the second microchannel heat exchange plate 3 are interconnected by a pipe to form a first circulation loop of two-phase working fluid. Specifically, the two-phase working fluid is a fluorinated liquid (HFE-7100). Evaporation chamber 12 is connected to the computer room station. The relatively high temperature air in the computer room station enters the evaporation chamber 12 and exchanges heat with the first microchannel heat exchange plate 2. The liquid two-phase working fluid in the first microchannel heat exchange plate 2 absorbs heat and evaporates into a gaseous state to cool the relatively high temperature air in the computer room station. Condensation chamber 13 is connected to the external environment. The relatively low temperature air in the external environment enters the condensation chamber 13 and exchanges heat with the second microchannel heat exchange plate 3. The gaseous two-phase working fluid flowing from the first microchannel heat exchange plate 2 into the second microchannel heat exchange plate 3 releases heat and condenses into a liquid state, and then circulates back to the first microchannel heat exchange plate 2. This application utilizes the first circulation loop of a two-phase working fluid to achieve efficient heat exchange between high-temperature air in the computer room and low-temperature air in the external environment within a physically isolated space. It effectively utilizes natural cold sources, reduces the cooling energy consumption of the computer room, and the device has a compact structure and small overall size. During installation, it can be transported to the usage location by forklift, fixed with expansion bolts, and then connected with pipes and wiring harnesses for use. All components inside the housing 1 adopt a modular design so that each component can be disassembled independently for easy maintenance and replacement.

[0022] The evaporation chamber 12 has a first air inlet 14 and a first air outlet 15 on its side wall. Both the first air inlet 14 and the first air outlet 15 are connected to the computer room station. A first fan 4 is installed in the first air inlet 14, and a first microchannel heat exchange plate 2 is installed in the first air outlet 15. The relatively high temperature air in the computer room station is drawn into the evaporation chamber 12 through the first air inlet 14 by the first fan 4, and after exchanging heat with the first microchannel heat exchange plate 2, it returns to the computer room station through the first air outlet 15. The condensation chamber 13 has a second air inlet 16 and a second air outlet 17 on its side wall. Both the second air inlet 16 and the second air outlet 17 are connected to the external environment. A second fan 5 is installed in the second air inlet 16, and a second microchannel heat exchange plate 3 is installed in the second air outlet 17. The relatively low temperature air in the external environment is drawn into the condensation chamber 13 through the second air inlet 16, and after exchanging heat with the second microchannel heat exchange plate 3, it returns to the external environment through the second air outlet 17. This application significantly improves the forced convection efficiency of air in the evaporation chamber 12 and condensation chamber 13 by setting up an air inlet, an air outlet and a fan, which greatly enhances the overall heat exchange effect and cooling capacity. The fan can vertically send air into the rear side of the microchannel heat exchange plate to avoid lateral wind interference and affect the heat exchange efficiency. By installing the first microchannel heat exchange plate 2 in the first air outlet 15, the loss of cold energy can be effectively reduced and the cooling effect can be further enhanced.

[0023] The first air inlet 14 is connected to an air inlet pipe 6, and the first air outlet 15 is connected to an air outlet pipe 7. The air inlet pipe 6 and the air outlet pipe 7 are connected to the first air inlet 14 and the first air outlet 15 respectively through a hood, which greatly facilitates the installation and docking of the device with the computer room station and simplifies on-site construction. At the same time, this connection method helps to ensure the airtightness and integrity of the air duct. The air inlet and the air outlet are both transported by separate pipes, avoiding the occurrence of turbulence effects.

[0024] like Figure 4As shown, the first microchannel heat exchange plate 2 has a first tube 21 and a second tube 22 with opposite sides. The first tube 21 and the second tube 22 are interconnected by multiple vertically distributed microchannel tubes 23. The two-phase working fluid in the first tube 21 flows into the second tube 22 through the multiple microchannel tubes 23. The two-phase working fluid exchanges heat with the air flowing through the first microchannel heat exchange plate 2 in the multiple microchannel tubes 23. By adopting the structure of multiple microchannel tubes connected between parallel double tubes, the effective contact area between the two-phase working fluid and the air is greatly increased, and the heat exchange efficiency of a single heat exchange plate is significantly improved, laying the core foundation for the efficient operation of the entire device. The second microchannel heat exchange plate 3 has the same structure as the first microchannel heat exchange plate 2. The first tube 21 of the second microchannel heat exchange plate 3 is connected to the second tube 22 of the first microchannel heat exchange plate 2, and the second tube 22 of the second microchannel heat exchange plate 3 is connected to the first tube 21 of the first microchannel heat exchange plate 2, so that the two-phase working fluid forms a circulating flow inside the two heat exchange plates, thereby maximizing the effective heat transfer temperature difference between the two heat exchange plates and significantly improving the heat transfer efficiency of the entire two-phase working fluid circulation loop.

[0025] Multiple microchannel tubes 23 are arranged in parallel to each other. Each microchannel tube 23 has an S-shaped bend 24 in the middle. The bends 24 of any two adjacent microchannel tubes 23 are staggered. This staggered stacking design increases the secondary heat exchange between the microchannel tubes 23 and the air, and extends the path of the two-phase working fluid inside the microchannel tubes 23. This allows the two-phase working fluid to reflux twice in the S-shaped bend 24, ensuring that the two-phase working fluid inside the microchannel tubes 23 is completely vaporized / liquefied. This avoids the tube blockage effect caused by gas-liquid mixing inside the microchannel tubes 23, which would lead to uneven heating and cooling on the surface of the heat exchange plate. At the same time, it effectively disrupts the airflow in the limited space and destroys the thermal boundary layer, thereby significantly enhancing the convective heat transfer effect between the air side and the wall of the microchannel tubes 23. Specifically, three adjacent microchannel tubes 23 form a microchannel tube group. In the microchannel tube group, the S-shaped bend 24 of the second microchannel tube 23 is located in the middle, and the S-shaped bends 24 of the first and third microchannel tubes 23 are located on both sides of the S-shaped bend 24 of the second microchannel tube 23, respectively. Through the specific grouped bend staggered design, the airflow distribution through the entire heat exchange plate is more uniform, avoiding local airflow dead zones or short circuits, maximizing the utilization of the heat exchange plate area, and further optimizing the heat exchange uniformity and overall efficiency.

[0026] As another embodiment, the cooling device provided in this application further includes: a compressor 8, a condenser 9, an evaporator 10, a control board, and a temperature sensor. The compressor 8 and condenser 9 are installed in a condensing chamber 13, and the evaporator 10 is installed in an evaporating chamber 12. The compressor 8, condenser 9, and evaporator 10 are connected by pipes to form a second circulation loop for the two-phase working fluid. The liquid two-phase working fluid exchanges heat with the relatively high-temperature air entering the evaporating chamber 12 from the machine room station in the evaporator 10, becoming a gaseous two-phase working fluid. This gas then enters the compressor 8 and is compressed into a high-temperature, high-pressure gas, before entering the condenser 9 to release heat and condense back into a liquid two-phase working fluid before returning to the evaporator 10. The temperature sensor is installed in the machine room station to collect temperature data in real time. The control board is communicatively connected to both the temperature sensor and the compressor 8. When the detected temperature data exceeds a preset first threshold, the compressor 8 is started; when the detected temperature data is below a preset second threshold, the compressor 8 is shut down. In this embodiment, by adding a compression refrigeration cycle subsystem consisting of compressor 8, condenser 9, and evaporator 10 as a second circulation loop, the device is provided with additional, controllable cooling capacity. When the natural cold source (outdoor low-temperature air) is insufficient or the load on the computer room station is too high, the compressor cooling mode can be activated to ensure that the computer room station can obtain sufficient cooling under any operating conditions. Furthermore, the compressor cooling mode achieves intelligent start and stop through closed-loop control of temperature sensors and control boards. When the temperature of the computer room station is too high, supplementary cooling is automatically activated, and when the temperature drops to a safe range, it is automatically shut down. Priority is given to utilizing the natural cold source, which not only ensures the temperature stability of the computer room station but also saves the compressor's energy consumption to the greatest extent, thus optimizing the economy, stability, and reliability of the device operation.

[0027] The above description is merely an example and illustration of the structure of this utility model. Those skilled in the art can make various modifications or additions to the specific embodiments described or use similar methods to replace them, as long as they do not deviate from the structure of the utility model or exceed the scope defined in the claims, they should all fall within the protection scope of this utility model.

Claims

1. A station-grade heat exchange cooling device, characterized in that, include: The enclosure (1), the first microchannel heat exchange plate (2), and the second microchannel heat exchange plate (3) are provided. A partition (11) is provided in the middle of the enclosure (1) to divide the interior of the enclosure (1) into an evaporation chamber (12) and a condensation chamber (13). The first microchannel heat exchange plate (2) is located in the evaporation chamber (12), and the second microchannel heat exchange plate (3) is located in the condensation chamber (13). The first microchannel heat exchange plate (2) and the second microchannel heat exchange plate (3) are connected to each other through pipes to form a first circulation loop of two-phase working fluid. The evaporation chamber (12) is connected to the machine room station so that the relatively high temperature air in the machine room station enters the evaporation chamber (12) to exchange heat with the first microchannel heat exchange plate (2). The condensation chamber (13) is connected to the external environment so that the relatively low temperature air in the external environment enters the condensation chamber (13) to exchange heat with the second microchannel heat exchange plate (3).

2. The cooling device according to claim 1, characterized in that, The evaporation chamber (12) has a first air inlet (14) and a first air outlet (15) on its side wall. Both the first air inlet (14) and the first air outlet (15) are connected to the computer room station. A first fan (4) is installed in the first air inlet (14). A first microchannel heat exchange plate (2) is installed in the first air outlet (15). The condensation chamber (13) has a second air inlet (16) and a second air outlet (17) on its side wall. Both the second air inlet (16) and the second air outlet (17) are connected to the external environment. A second fan (5) is installed in the second air inlet (16). A second microchannel heat exchange plate (3) is installed in the second air outlet (17).

3. The cooling device according to claim 2, characterized in that, An air inlet pipe (6) is connected to the first air inlet (14), and an air outlet pipe (7) is connected to the first air outlet (15). The air inlet pipe (6) and the air outlet pipe (7) are connected to the first air inlet (14) and the first air outlet (15) respectively through a hood.

4. The cooling device according to claim 1, characterized in that, The first microchannel heat exchange plate (2) is provided with a first tube (21) and a second tube (22) that are opposite each other. The first tube (21) and the second tube (22) are interconnected by a plurality of vertically distributed microchannel tubes (23).

5. The cooling device according to claim 4, characterized in that, Multiple microchannel tubes (23) are arranged in parallel to each other. Each microchannel tube (23) has an S-shaped bend (24) in the middle. The bends (24) of any two adjacent microchannel tubes (23) are staggered.

6. The cooling device according to claim 5, characterized in that, Three adjacent microchannel tubes (23) form a microchannel tube group. The S-shaped bend (24) of the second microchannel tube (23) in the microchannel tube group is located in the middle, and the S-shaped bend (24) of the first microchannel tube (23) and the S-shaped bend (24) of the third microchannel tube (23) are located on both sides of the S-shaped bend (24) of the second microchannel tube (23).

7. The cooling device according to claim 4, characterized in that, The second microchannel heat exchange plate (3) has the same structure as the first microchannel heat exchange plate (2). The first tube (21) of the second microchannel heat exchange plate (3) is connected to the second tube (22) of the first microchannel heat exchange plate (2), and the second tube (22) of the second microchannel heat exchange plate (3) is connected to the first tube (21) of the first microchannel heat exchange plate (2).

8. The cooling device according to claim 1, characterized in that, Also includes: The compressor (8), condenser (9) and evaporator (10) are installed in the condensing chamber (13) and the evaporator (10) is installed in the evaporating chamber (12). The compressor (8), condenser (9) and evaporator (10) are connected by pipes to form a second circulation loop of two-phase working fluid.

9. The cooling device according to claim 8, characterized in that, Also includes: The control board and temperature sensor are installed in the computer room to collect temperature data in real time. The control board is connected to the temperature sensor and the compressor (8) respectively. When the temperature data exceeds the preset first threshold, the compressor (8) is started. When the temperature data is lower than the preset second threshold, the compressor (8) is turned off.

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