Heat sink and electronic equipment

Abstract

This application discloses a heat spreader and an electronic device. The heat spreader includes a first housing, a second housing, a support portion, and a first heat dissipation microstructure array. The first housing and the second housing are sealed together to form a cavity. The support portion is located between the first housing and the second housing to support the cavity. The first heat dissipation microstructure array is disposed on the side of the second housing facing the first housing. The first heat dissipation microstructure array includes a plurality of first metal bodies arranged in an array and a first capillary channel. The first capillary channel includes a gap between every two adjacent first metal bodies. In the heat spreader provided by this application, the first heat dissipation microstructure array includes a plurality of first metal bodies arranged in an array. The arrayed first metal bodies form a linear capillary channel, allowing liquid working fluid to pass unimpeded within the channel, improving the permeability and creep performance of the liquid working fluid, thereby improving the heat dissipation effect.

Description

Technical Field

[0001] This application relates to the field of vacuum cavity heat exchanger technology, and more particularly to a heat exchanger and electronic equipment. Background Technology

[0002] In existing technologies, vacuum chambers are highly efficient phase-change heat dissipation devices widely used in the heat dissipation of high-power electronic devices (such as CPUs, GPUs, 5G modules, etc.). Their working principle involves rapid heat diffusion through the evaporation-condensation cycle of the internal working fluid, resulting in excellent thermal conductivity and uniform temperature distribution.

[0003] Existing vapor chamber heat exchangers typically use a copper mesh woven from multiple interlaced copper wires as a capillary structure, with the gaps between the wires serving as capillary channels for the phase change working fluid. The capillary channels within the copper mesh are relatively small and curved, requiring the liquid to bypass the wires to move forward. This hinders the liquid's ascent and penetration, resulting in poor liquid permeability and ascent performance, and consequently, poor heat dissipation from the heat exchanger. Utility Model Content

[0004] In view of this, this application provides a heat spreader and electronic device that can solve the above-mentioned technical problems.

[0005] The first aspect of this application provides a heat spreader, the heat spreader including a first housing, a second housing, a support portion and a first heat dissipation microstructure array, the first housing and the second housing being sealed together to form a cavity, the support portion being located between the first housing and the second housing to support the cavity, the first heat dissipation microstructure array being disposed on the side of the second housing facing the first housing, the first heat dissipation microstructure array including a plurality of first metal bodies arranged in an array and a first capillary channel, the first capillary channel including a gap between every two adjacent first metal bodies.

[0006] In some embodiments, the number of the first metal bodies is at least three, the first metal bodies are columnar bosses, wherein at least two of the first metal bodies are arranged along a first direction, and at least two of the first metal bodies are arranged along a second direction, the first direction and the second direction having an angle.

[0007] In some embodiments, the heat spreader further includes a second heat dissipation microstructure array disposed on the side of the first heat dissipation microstructure array facing the first housing. The second heat dissipation microstructure includes a plurality of second metal bodies arranged in an array and a second capillary channel. The second capillary channel includes a gap between each two adjacent second metal bodies. The second heat dissipation microstructure array is stacked with the first heat dissipation microstructure array, and the first capillary channel and the second capillary channel are interconnected.

[0008] In some embodiments, the first metal body and the second metal body are strip-shaped protrusions, the first metal body is arranged along a first direction, the second metal body is arranged along a second direction, the first direction and the second direction have an angle, and the first capillary channel and the second capillary channel are interconnected.

[0009] In some embodiments, the second housing is provided with a plurality of grooves that penetrate the surface of the second housing toward the first housing.

[0010] In some embodiments, the distance between two adjacent first metal bodies along the first direction is d, the width of the first metal body along the first direction is w, d = 30μm to 300μm, d ≥ w, the height of the first metal body is h1, the number of layers of the first heat dissipation microstructure array is n1, h1 / n1 = 0.054 to 0.066, n1 ≤ 3.

[0011] In some embodiments, the sum of the heights of the first heat dissipation microstructure array and the second heat dissipation microstructure array is h, the number of layers of the first heat dissipation microstructure is n1, the number of layers of the second heat dissipation microstructure array is n2, n1 = n2, n1 ≤ 3, and h / n1 = 0.054 to 0.066.

[0012] In some embodiments, the support extends from the inner surface of the first housing into the cavity. The support includes a first sidewall, a second sidewall, and a bottom wall. The bottom wall is connected between the first sidewall and the second sidewall. The first sidewall and the bottom wall are connected at an angle, and the second sidewall and the bottom wall are connected at an angle. The angle between the first sidewall and the bottom wall and the angle between the second sidewall and the bottom wall are acute angles.

[0013] In some embodiments, the heat spreader further includes a solder paste layer with a clearance groove extending through it. The solder paste layer is located between the first housing and the second housing, and the clearance groove communicates with the cavity. The first housing and the second housing are circumferentially sealed and fixedly connected by the solder paste layer.

[0014] A second aspect of this application provides an electronic device, the electronic device including the heat spreader.

[0015] The heat spreader provided in this application includes a first heat dissipation microstructure array comprising a plurality of first metal bodies arranged in an array. The array of first metal bodies forms a linear capillary channel, in which liquid working fluid can pass unimpeded, thereby improving the permeability and climbing performance of the liquid working fluid and thus improving the heat dissipation effect. Attached Figure Description

[0016] Figure 1 This is a cross-sectional schematic diagram of a heat spreader provided in one embodiment of this application.

[0017] Figure 2A This is a partial three-dimensional structural diagram of a first heat dissipation microstructure array disposed on a second housing according to an embodiment of this application.

[0018] Figure 2B for Figure 2A The diagram shows a partial cross-sectional view of the first heat dissipation microstructure array and the second housing.

[0019] Figure 3A A partial three-dimensional structural diagram of a first heat dissipation microstructure array and a second heat dissipation microstructure array disposed on a second housing, as provided in another embodiment of this application.

[0020] Figure 3B for Figure 3A The diagram shows a partial cross-sectional view of the first heat dissipation microstructure array, the second heat dissipation microstructure array, and the second housing.

[0021] Figure 4A This is a partial three-dimensional structural diagram of a second housing with a groove provided in one embodiment of this application.

[0022] Figure 4B for Figure 4A A partial cross-sectional schematic diagram of the second housing with grooves is shown.

[0023] Explanation of main component symbols

[0024]

[0025]

[0026] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0027] To better understand the above-mentioned objectives, features, and advantages of the embodiments of this utility model, the present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the features in the embodiments of this application can be combined with each other.

[0028] The following description sets forth numerous specific details to provide a thorough understanding of the embodiments of this utility model. The described embodiments are only a portion, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of the embodiments of this utility model.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which embodiments of this invention pertain. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention.

[0030] Please see Figure 1 and Figure 2A This application provides a heat spreader 100, including a first housing 10, a second housing 20, a support 12, and a first heat dissipation microstructure array 41. The first housing 10 and the second housing 20 are sealed together to form a cavity 30. The cavity 30 is a vacuum cavity 30. The heat spreader 100 is filled with a liquid working fluid. In a vacuum environment, the liquid working fluid absorbs heat at the hot end and rapidly evaporates into a gaseous working fluid. The gaseous working fluid dissipates heat at the cold end and condenses back into a liquid working fluid. The liquid working fluid flows back to the hot end, and the cycle repeats to achieve the functions of heat absorption and heat dissipation. The hot end is close to the second housing 20, and the cold end is close to the first housing 10. The support 12 is located between the first housing 10 and the second housing 20 to support the cavity 30. The first heat dissipation microstructure array 41 is disposed on the side of the second housing 20 facing the first housing 10. The first heat dissipation microstructure array 41 includes a plurality of first metal bodies 411 arranged in an array and a first capillary channel 412. The first capillary channel 412 includes a gap between every two adjacent first metal bodies 411. The main function of the first heat dissipation microstructure array 41 is to promote the return of the liquid working fluid formed by heat dissipation condensation to the hot end. Optionally, the first metal body 411 can be arranged in an array pattern such as 1×2 or 1×5.

[0031] In existing technologies, a copper mesh woven from multiple interlaced copper wires is used as the capillary structure layer, with the mesh-like gaps between the copper wires serving as capillary channels for the liquid. The liquid must navigate through one mesh-like gap, bypassing the copper wires, to enter another mesh-like gap in order to move forward; therefore, the liquid's path is curved. However, in the first heat dissipation microstructure array 41 of this application, the first capillary channel 412 is a channel formed between the arrayed first metal bodies 411. This channel is a wide, straight line, allowing the liquid working fluid to move and pass through unimpeded. Therefore, the permeability and climbing performance of the liquid working fluid are enhanced, thereby improving the heat dissipation effect of the heat spreader 100.

[0032] In some implementations, please refer to Figure 2A and Figure 2B The number of first metal bodies 411 is at least three. Each first metal body 411 is a columnar protrusion, with at least two first metal bodies 411 arranged along a first direction X and at least two first metal bodies 411 arranged along a second direction Y, forming an angle between the first direction X and the second direction Y. The first metal bodies 411 are arranged in an array along the two directions, making the first capillary channel 412 a cross-shaped straight channel. The cross-shaped straight channel ensures the space storage capacity of the capillary channel to enhance the liquid permeability, while also taking into account the unobstructed flow of the main channel and the diversion efficiency of the cross channel to enhance the liquid climbing performance, thereby improving the heat dissipation effect of the heat spreader 100.

[0033] Optionally, the shape of the first metal body 411 can be at least one of the following: square prism, strip prism, triangular prism, elliptical prism, circular prism, polygonal prism, etc. The first metal bodies 411 can be arranged in an array of 2×2, 3×4, or 5×5. In this embodiment, the first direction X and the second direction Y are perpendicular to each other.

[0034] In some embodiments, referring to 2B, the spacing between two adjacent first metal bodies 411 along the first direction X is d, the width of the first metal body 411 along the first direction X is w, d = 30μm to 300μm, d ≥ w, the height of the first metal body 411 is h1, the number of layers of the first heat dissipation microstructure array 41 is n1, h1 / n1 = 0.054 to 0.066, n1 ≤ 3. Wherein, d can be 30μm, 50μm, 100μm, 150μm, 200μm, 250μm, 300μm, or any value within the range of any two of the above values. n1 can be 1, 2, or 3. The value of h1 / n1 can be 0.054, 0.056, 0.058, 0.060, 0.062, 0.064, 0.066, or any value within the range of any two of the above values. With a fixed area of ​​the second housing 20, the width w and spacing d of the first metal body 411 along the first direction X are related. The width w of the first metal body 411 determines its own strength. The spacing d of the first metal body 411 determines the total number of capillary channels in the first capillary channel 412, thus affecting the penetration efficiency of the first capillary channel 412. When the range and size relationship between the width w and spacing d of the first metal body 411 along the first direction X satisfies the above relationship, both the strength of the first metal body 411 and the penetration efficiency of the first heat dissipation microstructure array 41 can be taken into account. Under the condition that the manufacturing process allows, the height h1 of the first metal body 411 is a free parameter and is not limited by the width w and spacing d. Compared with copper mesh braided structures, the height of copper mesh is affected by the diameter of copper wires, and the increase or decrease of the diameter of copper wires will directly affect the width and spacing of copper wires. Therefore, the height of the first metal body 411 in this application is more flexible, which is convenient for design and manufacturing. The number of layers n1 in the first heat dissipation microstructure array 41 affects the overall thickness of the heat spreader 100 and the overall penetration efficiency of the capillary channels. When the first heat dissipation microstructure array 41 is multi-layered and considering that the overall thickness of the heat spreader 100 cannot be too thick, otherwise it will affect the thinning of the heat spreader 100, when n1≤3 and h1 / n1=0.054~0.066, the overall thickness of the heat spreader 100 and the penetration efficiency of the capillary channels can be balanced.

[0035] In some implementation methods, please refer to the following: Figure 3AThe heat spreader 100 also includes a second heat dissipation microstructure array 42, which is disposed on the side of the first heat dissipation microstructure array 41 facing the first housing 10. The second heat dissipation microstructure includes a plurality of second metal bodies 421 arranged in an array and second capillary channels 422, each capillary channel 422 including a gap between each adjacent pair of second metal bodies 421. The second heat dissipation microstructure array 42 is stacked with the first heat dissipation microstructure array 41, and the first capillary channels 412 and the second capillary channels 422 are interconnected. The second heat dissipation microstructure array 42 and the first heat dissipation microstructure array 41 are stacked along the thickness direction of the heat spreader 100, which increases the total height of the capillary channels in the thickness direction. This facilitates planning the shortest permeation path of the liquid within the cavity 30, meaning that the liquid working fluid at the cold end can directly flow back to the hot end along the capillary channels formed by the first and second heat dissipation microstructure arrays 41 and 42 in the thickness direction. Compared to the path where the liquid working fluid flows along the inner wall of the first shell 10 to the junction of the second shell 20 and the first shell 10, and then to the hot end of the second shell 20, the flow directly from the first shell 10 to the hot end through the heat dissipation microstructure array along the thickness direction has a shorter permeation path, thus improving permeation efficiency.

[0036] Furthermore, compared to copper mesh structures, due to the woven structure and smaller gaps between copper wires in copper mesh, the capillary channels formed by stacking multiple layers of copper mesh in the thickness direction of the heat spreader 100 are multi-directional and random. This makes it difficult to align and connect the gaps between adjacent layers of copper mesh, i.e., it is difficult to align the grid-like gaps between adjacent layers vertically, making it difficult to form a short penetration path. Moreover, the copper wires in the first layer of copper mesh can easily obstruct the capillary channels in the second layer. Therefore, in the thickness direction, the capillary channel space obtained after stacking multiple layers of copper mesh is small, and the copper wires easily obstruct the capillary channels in the thickness direction. However, according to the first heat dissipation microstructure array 41 and the second heat dissipation microstructure array 42 designed in this application, the direction of the capillary channels formed after stacking is no longer random, making it easier to align and connect the upper and lower capillary channels. Structurally, it is easier to plan the shortest penetration path for the liquid to maximize penetration efficiency.

[0037] In some implementations, please refer to Figure 3A and Figure 3BThe first metal body 411 and the second metal body 421 are strip-shaped protrusions. The first metal body 411 is arranged along the first direction X, and the second metal body 421 is arranged along the second direction Y. The first direction X and the second direction Y form an angle. The first capillary channel 412 and the second capillary channel 422 are interconnected. Compared with copper mesh, the surface of the interwoven copper wires in copper mesh is smooth and flat, and the capillary function on the outer periphery is weak. This embodiment uses arranged strip-shaped metal bodies. On the one hand, the surface roughness of the strip-shaped metal bodies is large, and the capillary function is improved. On the other hand, the capillary channels in the first heat dissipation microstructure array 41 are straight and extend along the first direction X, and there are no obstructions in the capillary channels. The capillary channels in the second heat dissipation microstructure array 42 are also straight and extend along the second direction Y, and there are also no obstructions in the capillary channels. Therefore, the penetration and climbing performance of liquid in the capillary channels are enhanced, thereby further improving the heat dissipation performance of the heat spreader 100. Meanwhile, at the same height, the number of capillary channels formed by the superposition and combination of the first heat dissipation microstructure array 41 and the second heat dissipation microstructure array 42 can be about twice as many.

[0038] In some implementations, please refer to Figure 3A and Figure 3B The width of the first metal body 411 along the first direction X is w, and the distance between two adjacent first metal bodies 411 along the first direction X is d, where d = 30μm to 300μm and d ≥ w. The width of the second metal body 421 along the second direction Y is w1, and the distance between two adjacent second metal bodies 421 along the second direction Y is d1, where d1 = 30μm to 300μm and d1 ≥ w1. Here, d and d1 can be 30μm, 50μm, 100μm, 150μm, 200μm, 250μm, 300μm, or any value within the range of any two of the above values. The sum of the heights of one layer of the first heat dissipation microstructure array 41 and one layer of the second heat dissipation microstructure array 42 is h. The number of layers in the first heat dissipation microstructure array 41 is n1, and the number of layers in the second heat dissipation microstructure array 42 is n2, where n1 = n2, n1 ≤ 3, and h / n1 = 0.054 to 0.066. n1 can be 1, 2, or 3. The value of h / n1 can be 0.054, 0.056, 0.058, 0.060, 0.062, 0.064, 0.066, or any value within the range of any two of the above values. The values ​​of the width w and spacing d of the first metal body 411 along the first direction X, and the width w1 and spacing d1 of the second metal body 421 along the second direction Y, are within the above ranges, which can balance the strength of the metal bodies themselves and the penetration efficiency of the heat dissipation microstructure array. Considering the overall thickness of the heat spreader 100, when the number of layers n1 of the first heat dissipation microstructure array 41 and n2 of the second heat dissipation microstructure array 42, as well as the height and h, are within the above ranges, the overall thickness of the heat spreader 100 and the penetration efficiency of the capillary channels can be balanced.

[0039] In some implementations, please refer to Figure 4A and Figure 4B The second housing 20 is provided with a plurality of grooves 22, which penetrate the surface of the second housing 20 facing the first housing 10. Under the same conditions, the grooves 22 can increase the volume of liquid working fluid that the heat spreader 100 can hold. The more liquid working fluid it can hold, the better the heat dissipation effect.

[0040] In some implementations, please refer to Figure 1 The support portion 12 extends from the inner surface of the first housing 10 into the cavity 30. The support portion 12 includes a first sidewall 121, a second sidewall 122, and a bottom wall 123. The bottom wall 123 connects between the first sidewall 121 and the second sidewall 122. The first sidewall 121 and the bottom wall 123 are connected at an angle, and the second sidewall 122 and the bottom wall 123 are also connected at an angle. The angles between the first sidewall 121 and the bottom wall 123, and between the second sidewall 122 and the bottom wall 123, are acute angles. The support portion 12 is used to enhance the structural strength of the first housing 10 and to ensure that the cavity 30 formed by the first housing 10 and the second housing 20 is not prone to collapse, thereby helping to maintain the heat dissipation performance of the heat spreader 100.

[0041] In some embodiments, the length 'a' of the bottom wall 123 can be 0.4 mm to 0.9 mm, for example, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, or any value within the range of any two of the above values. The larger the length 'a' of the bottom wall 123, the larger its contact area with the second housing 20, the better the bottom wall 123 supports the first housing 10, the better the structural strength of the first housing 10, and the less likely the first housing 10 and the second housing 20 will collapse. However, a larger length 'a' of the bottom wall 123 will also hinder the flow of gaseous working fluid within the cavity 30, affecting the heat dissipation efficiency of the heat spreader 100. Therefore, when the length 'a' of the bottom wall 123 is within the above range, both the heat dissipation efficiency and structural strength of the heat spreader 100 can be balanced.

[0042] In some embodiments, the heat spreader 100 may include a plurality of support portions 12, which are arranged at intervals. The distance b between the bottom walls 123 of two adjacent support portions 12 can be 2.7 mm to 3.2 mm, for example, 2.7 mm, 2.8 mm, 2.9 mm, 3.0 mm, 3.1 mm, 3.2 mm, or any value within the range of any two of the above values. When the distribution spacing b of the bottom walls 123 is within the above range, the flow of the liquid working fluid on one side of the second housing 20 can be more uniform, reducing the difference in the flow rate efficiency of the liquid working fluid, and making the heat dissipation effect of the heat spreader 100 more balanced.

[0043] In some embodiments, the first housing 10 and the second housing 20 are made of copper-steel composite material. The steel layer meets the strength requirements of the structural components, while the copper layer meets functional requirements, such as thermal conductivity and heat dissipation. This is just an example; this application does not impose any special restrictions on the materials of the first housing 10 and the second housing 20.

[0044] In some embodiments, the first housing 10, the support portion 12, and the second housing 20 are manufactured using a stamping process. The first housing 10 and the support portion 12 may be manufactured using an integral molding process.

[0045] In some embodiments, the first housing 10 and the second housing 20 are sealed together by laser welding or brazing.

[0046] In some embodiments, the angle c1 connecting the first sidewall 121 and the bottom wall 123 is 50° to 60°, and the angle c2 connecting the second sidewall 122 and the bottom wall 123 is 50° to 60°. For example, angles c1 and c2 can be 50°, 60°, or any value within the range of the two values ​​mentioned above. The angle c1 between the first sidewall 121 and the bottom wall 123 can be the same as the angle c2 between the second sidewall 122 and the bottom wall 123 to increase the symmetry and stability of the support part 12 structure. If angles c1 and c2 are 90°, although the volume of the cavity 30 can be increased and the flow efficiency of the gaseous working fluid can be higher, from a manufacturing process perspective, a right angle makes the connection between the first shell 10 and the support part 12 prone to structural damage such as fracture due to stress. Therefore, the values ​​of angles c1 and c2 are within the above range, which can balance the integrity of the connection structure between the first shell 10 and the support part 12 and the volume of the cavity 30.

[0047] In some embodiments, the first heat dissipation microstructure array 41 and the second heat dissipation microstructure array 42 can be formed by additive manufacturing, subtractive manufacturing, etching, laser processing, CNC machine tool processing, and other processes. Using additive manufacturing and subtractive manufacturing processes can increase the roughness of the outer surface of the metal body, improve capillary function, and further enhance the heat dissipation performance of the heat spreader 100.

[0048] In some embodiments, the first heat dissipation microstructure array 41 and the second heat dissipation microstructure array 42 can be further processed and manufactured based on the second housing 20, so that the first heat dissipation microstructure array 41 and the second heat dissipation microstructure array 42 and the second housing 20 are integrated into a single structural design, which can increase product precision and improve structural strength. In conventional technology, the copper mesh and the housing are separate designs. On the one hand, the tensile and compressive strength of the copper mesh itself is limited, that is, the structural strength of the copper mesh itself is weak. On the other hand, the joint surface between the copper mesh and the housing is a point-line contact, and the joint strength between the two is limited. Moreover, the copper mesh and the housing are joined by welding process, which limits product precision.

[0049] In some embodiments, the heat spreader 100 further includes a solder paste layer 50, which has a clearance groove extending through it. The solder paste layer 50 is located between the first housing 10 and the second housing 20, and the clearance groove communicates with the cavity 30. The first housing 10 and the second housing 20 are circumferentially sealed and fixedly connected by the solder paste layer 50. The solder paste layer 50 serves to seal and connect the first housing 10 and the second housing 20.

[0050] In some embodiments, the thickness t of the solder paste layer 50 can be 0.01 mm to 0.05 mm, for example, 0.01 mm, 0.02 mm, 0.03 mm, 0.04 mm, 0.05 mm, or any value within the range of any two of the above values. By taking a thickness t within this range, the overall thickness of the heat spreader 100 does not need to be increased. Furthermore, when the total thickness of the heat spreader 100 is constant, a smaller thickness t occupies less space in the cavity 30, maximizing the cavity's capacity and thus improving the heat dissipation performance of the heat spreader 100.

[0051] In some embodiments, the width D of the solder paste layer 50 can be 1.00 mm to 1.50 mm, for example, 1.00 mm, 1.10 mm, 1.20 mm, 1.30 mm, 1.40 mm, 1.50 mm, or any value within the range of any two of the above values. The width D of the solder paste layer 50 determines the size of the effective bonding area between the first housing 10 and the second housing 20. Furthermore, the smaller the width D of the solder paste layer 50, the less volume it occupies in the cavity 30. By keeping the width D of the solder paste layer 50 within the above range, both the effectiveness of the bonding between the first housing 10 and the second housing 20 and the rationalization of the volume of the cavity 30 can be achieved.

[0052] This application also provides an electronic device including a heat spreader 100. Taking a smartphone as an example, smartphones typically contain electronic components such as chips, which often generate heat during operation, leading to excessively high local temperatures in the smartphone. The heat spreader 100 can be mounted on the surface of the electronic components, allowing the heat from the heat source such as the electronic components to be transferred to the liquid working fluid within the heat spreader 100.

[0053] In other embodiments, the electronic device may also be a tablet computer, laptop computer, camera, video recorder, smartwatch, smart bracelet, augmented reality (AR) device, virtual reality (VR) device, in-vehicle computer, or other device requiring heat dissipation. This is just an example, and this application does not impose any special limitations on the specific form of the aforementioned electronic device.

[0054] The above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the spirit and scope of the technical solutions of this application.

Claims

1. A vapor chamber, characterized by, The device includes a first housing, a second housing, a support portion, and a first heat dissipation microstructure array. The first housing and the second housing are sealed together to form a cavity. The support portion is located between the first housing and the second housing to support the cavity. The first heat dissipation microstructure array is disposed on the side of the second housing facing the first housing. The first heat dissipation microstructure array includes a plurality of first metal bodies arranged in an array and a first capillary channel. The first capillary channel includes a gap between each two adjacent first metal bodies.

2. The vapor chamber of claim 1, wherein The number of the first metal bodies is at least three, and the first metal body is a columnar boss, wherein at least two of the first metal bodies are arranged along a first direction, and at least two of the first metal bodies are arranged along a second direction, and the first direction and the second direction have an angle between them.

3. The vapor chamber of claim 1, wherein The heat spreader also includes a second heat dissipation microstructure array, which is disposed on the side of the first heat dissipation microstructure array facing the first housing. The second heat dissipation microstructure includes a plurality of second metal bodies arranged in an array and a second capillary channel. The second capillary channel includes a gap between each two adjacent second metal bodies. The second heat dissipation microstructure array is stacked with the first heat dissipation microstructure array, and the first capillary channel and the second capillary channel are interconnected.

4. The vapor chamber of claim 3, wherein The first metal body and the second metal body are strip-shaped protrusions. The first metal body is arranged along a first direction, and the second metal body is arranged along a second direction. The first direction and the second direction have an angle between them. The first capillary channel and the second capillary channel are interconnected.

5. The vapor chamber of claim 1, wherein The second housing has a plurality of grooves, which penetrate the surface of the second housing toward the first housing.

6. The heat spreader as described in claim 2, characterized in that, The distance between two adjacent first metal bodies along the first direction is d, the width of the first metal body along the first direction is w, d = 30μm ~ 300μm, d ≥ w, the height of the first metal body is h1, the number of layers of the first heat dissipation microstructure array is n1, h1 / n1 = 0.054 ~ 0.066, n1 ≤ 3.

7. The vapor chamber of claim 3, wherein The sum of the heights of the first heat dissipation microstructure array and the second heat dissipation microstructure array is h. The number of layers of the first heat dissipation microstructure is n1, and the number of layers of the second heat dissipation microstructure array is n2. n1 = n2, n1 ≤ 3, and h / n1 = 0.054 ~ 0.

066.

8. The vapor chamber of claim 1, wherein The support extends from the inner surface of the first housing into the cavity. The support includes a first sidewall, a second sidewall, and a bottom wall. The bottom wall is connected between the first sidewall and the second sidewall. The first sidewall and the bottom wall are connected at an angle, and the second sidewall and the bottom wall are connected at an angle. The angle between the first sidewall and the bottom wall and the angle between the second sidewall and the bottom wall are acute angles.

9. The vapor chamber of claim 1, wherein The heat spreader also includes a solder paste layer, which has a clearance groove that penetrates the solder paste layer. The solder paste layer is located between the first housing and the second housing, and the clearance groove communicates with the cavity. The first housing and the second housing are circumferentially sealed and fixedly connected by the solder paste layer.

10. An electronic device, comprising: Includes the heat spreader as described in any one of claims 1-9.

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