A VC heat spreader

Abstract

This utility model relates to the field of heat spreader design technology, specifically to a VC heat spreader, comprising: a first heat-conducting plate and a second heat-conducting plate, adapted to be connected as a sealing element, both provided with capillary structures and channels, wherein the channels of the first heat-conducting plate have a supporting structure; in the sealing element, the capillary structures of the first heat-conducting plate and the second heat-conducting plate are arranged opposite to each other, the channels of the first heat-conducting plate and the second heat-conducting plate are arranged opposite to each other, and the supporting structure of the first heat-conducting plate is fixedly connected to the channel of the second heat-conducting plate; wherein, a coolant is disposed within the sealing element. In this application, when the VC heat spreader is heated, the coolant at the hot end vaporizes and reaches the cold end through the channels, and the coolant at the cold end condenses and returns to the hot end through the capillary structure, thereby achieving cyclic heat release.

Description

Technical Field

[0001] This utility model relates to the field of heat exchanger design technology, specifically to a VC heat exchanger. Background Technology

[0002] Smartphones are increasingly pursuing slim and lightweight designs to improve user portability and grip comfort. To ensure good drop and shock resistance and a long lifespan, the VC (Vapor Vapor Deposition) heat sink needs to have increased mechanical strength. This is usually achieved by thickening the VC heat sink; however, this method takes up limited internal space in the phone, hindering the slim and lightweight design. Utility Model Content

[0003] In view of this, the present invention provides a VC heat dissipation plate to solve the problem that increasing the mechanical strength of the VC heat dissipation plate by thickening it is detrimental to the design of thinner and lighter mobile phones.

[0004] This utility model provides a VC heat spreader, comprising:

[0005] The first heat-conducting plate and the second heat-conducting plate are suitable for being connected as a sealing element, and both are provided with capillary structures and channels, wherein the channels of the first heat-conducting plate have a supporting structure;

[0006] In the seal, the capillary structure of the first heat-conducting plate and the capillary structure of the second heat-conducting plate are arranged opposite to each other, the channel of the first heat-conducting plate and the channel of the second heat-conducting plate are arranged opposite to each other, and the support structure of the first heat-conducting plate is fixedly connected to the channel of the second heat-conducting plate.

[0007] The seal contains coolant.

[0008] In this application, when the VC heat spreader is heated, the coolant at the hot end vaporizes and reaches the cold end through channels. The coolant at the cold end condenses and returns to the hot end through capillary structures, thus achieving cyclic heat release. The support structure of the first heat-conducting plate is fixedly connected to the channels of the second heat-conducting plate, forming an integrated force-bearing system with the first and second heat-conducting plates respectively. This improves the overall mechanical strength and deformation resistance of the VC heat spreader, thereby meeting the mechanical strength requirements of the VC heat spreader without thickening it. The capillary structures of the first and second heat-conducting plates are arranged opposite each other, as are the channels of the first and second heat-conducting plates, allowing the vaporized coolant to quickly diffuse to the cold end to complete heat release.

[0009] In one optional embodiment, the edges of the first heat-conducting plate and the second heat-conducting plate are sealed together.

[0010] In this application, the sealed connection between the edges of the first and second heat-conducting plates ensures a vacuum environment suitable for coolant phase change between them. The plates provide physical protection for the capillary structure, support structure, and channels, reducing damage from external impacts and friction, and extending the service life of the VC heat spreader.

[0011] In one alternative embodiment, the areas containing the capillary structure and the areas containing the channels on the first heat-conducting plate are spaced apart.

[0012] In this application, after the VC heat exchanger is heated, the coolant can quickly diffuse to the cold end through the channels, and the vapor rapidly releases heat and condenses into liquid at the cold end, thus improving heat exchange efficiency. The spacing also allows the channel area where the support structure is located to form a complementary stress distribution with the capillary structure area, avoiding local deformation caused by concentrated stress in a single area. When the VC heat exchanger is subjected to external pressure, the spacing layout can disperse stress, thereby enhancing the overall resistance to deformation.

[0013] In one alternative implementation, the capillary structure on the first heat-conducting plate is located in two regions on both sides of the channel region.

[0014] In this application, after the VC heat exchanger is heated, the coolant can reach the cold end through the channel located in the middle, and the capillary structure on both sides can make the condensed coolant quickly return to the hot end.

[0015] In one alternative implementation, the channels on the first heat-conducting plate are located in two regions and are situated on both sides of the region containing the capillary structure.

[0016] In this application, after the VC heat exchanger is heated, the coolant can reach the cold end through channels located on both sides, while the capillary structure in the middle allows the condensed coolant to quickly return to the hot end. This avoids the problem of insufficient condensation efficiency caused by vapor accumulation.

[0017] In one alternative implementation, there are multiple support structures within the area where the channel is located, and there is a gap between two adjacent support structures.

[0018] In this application, multiple support structures can distribute external pressure and impact forces to multiple stress points, avoiding the problem of a single support structure breaking or deforming due to concentrated stress. This significantly improves the overall compression and bending resistance of the heat spreader, making it particularly suitable for devices such as smartphones that need to withstand complex conditions such as drops and vibrations. The vaporized coolant steam can flow within the gaps between adjacent support structures, avoiding the problem of overly dense support structures obstructing steam flow.

[0019] In addition, the number and distribution density of the support structure can be adjusted according to the area of ​​the channel, so as to minimize the occupation of heat dissipation space while ensuring structural strength, thus taking into account both structural stability and heat dissipation functionality, and adapting to the development trend of thinner and larger heat dissipation plates.

[0020] In one alternative implementation, the support structure is cylindrical in shape.

[0021] In this application, the column structure has good compression and bending resistance, and can evenly distribute pressure from above and below. It can provide higher support strength per unit volume, effectively enhance the overall rigidity of the heat spreader, and reduce deformation or warping caused by external forces. It is especially suitable for thin and light equipment with strict requirements for structural stability.

[0022] In one alternative embodiment, the shape of the support structure is one or more of a cylinder, an elliptical cylinder, a corrugated cylinder, and an arc-shaped cylinder.

[0023] In this application, support structures of different shapes can be specifically adapted to different stress requirements: cylindrical structures distribute stress evenly and are suitable for bearing vertical pressure; elliptical cylinders have stronger bending resistance in specific directions and can cope with impact forces in inclined directions; corrugated columns and arc-shaped columns have a certain deformation buffering capacity, which can absorb the energy brought by vibration and reduce structural damage. By using a single shape or a combination of multiple shapes, the support structure can remain stable under complex stress environments, solving the problem of insufficient adaptability of single-shape support structures.

[0024] In addition, diverse shapes can optimize the flow field distribution within the channel: for example, the curved surface of the circular arc column can guide the direction of steam flow and reduce flow resistance; the gaps between the corrugated columns can make the flow orderly, accelerate steam diffusion, avoid local steam stagnation caused by a single shape, improve condensation efficiency, and ensure smooth heat dissipation circulation.

[0025] In one optional embodiment, the first heat-conducting plate and the second heat-conducting plate are made of one or more of the following materials: copper alloy, stainless steel, titanium alloy, and steel-copper composite material.

[0026] In this application, copper alloys have excellent thermal conductivity, which can quickly transfer the heat generated by the heat source, making them suitable for scenarios with extremely high heat dissipation efficiency requirements; stainless steel has high strength and strong corrosion resistance, which can improve the structural stability and service life of the heat spreader and adapt to humid or complex external environments; titanium alloys are lightweight and have excellent strength, which can meet the requirements of lightweight equipment design; and steel-copper composite materials combine the strength of steel and the thermal conductivity of copper, which can simultaneously solve the shortcomings of single materials in terms of thermal conductivity and strength.

[0027] By selecting a single material or a combination of materials, the shortcomings of existing technologies can be addressed in a targeted manner: for example, when using copper alloys, the lack of strength can be compensated for by combining them with a support structure; when using stainless steel, the poor thermal conductivity can be improved by optimizing the capillary structure and channel design. The flexible material selection allows the heat spreader to adapt to a variety of application scenarios, from low power consumption to high power consumption, and from thin and light to high strength.

[0028] In one optional embodiment, the thickness of the first heat-conducting plate and / or the second heat-conducting plate is 0.1 to 0.5 mm. This reduces the limited internal space occupied by the VC heat spreader, facilitating a thinner and lighter design for the phone. Attached Figure Description

[0029] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of the first structure of this utility model embodiment;

[0031] Figure 2 This is a schematic diagram of the first structure of the first heat-conducting plate in an embodiment of this utility model;

[0032] Figure 3 This is a schematic diagram of the second structure of an embodiment of the present utility model;

[0033] Figure 4 This is a schematic diagram of the second structure of the first heat-conducting plate in an embodiment of this utility model.

[0034] Explanation of reference numerals in the attached figures:

[0035] 1. First heat-conducting plate; 2. Second heat-conducting plate; 3. Capillary structure; 4. Channel; 5. Support structure. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0037] With the widespread adoption of 5G technology and the deep integration of AI into smartphones, processor performance continues to improve, leading to a corresponding increase in power consumption. This necessitates that vapor chambers (VCs) improve their heat dissipation efficiency to meet the cooling requirements of high-power chips and fast charging.

[0038] Smartphones are increasingly pursuing thinner and lighter designs to improve user portability and grip comfort. Therefore, VC (Vapor Plate) heat sinks need to be continuously thinned to fit within the limited space inside the phone. To ensure good drop and vibration resistance and a long service life, VC heat sinks need to improve their rigidity and reliability.

[0039] Currently, most solutions use high-strength materials such as stainless steel to manufacture VC heat spreaders. These heat spreaders are stronger in high-heat environments and less prone to deformation or warping. Compared to traditional copper VC heat spreaders, they better fit the internal space of mobile phones and meet high heat dissipation requirements. In addition, some solutions use titanium alloys combined with etching processes to create capillary structures, thereby creating thinner and lighter VC heat spreaders.

[0040] Among existing technical solutions, copper alloy VC heat spreaders have the advantages of good thermal conductivity, light weight, and mature manufacturing process. However, their strength is relatively low, and they may need to be thickened or reinforced in high-strength applications. The high price of copper and the high processing requirements lead to high costs. Stainless steel VC heat spreaders have advantages such as high strength, which can ensure structural strength and can cover a large area; strong corrosion resistance and long service life; low price and simple processing to reduce costs; and the ability to be made thinner, adapting to the trend of lightweight and thinner products. However, their thermal conductivity is generally poor, which affects heat dissipation efficiency. Titanium alloy VC heat spreaders have high strength, corrosion resistance, and light weight, but their raw material costs are high, processing is difficult, and production costs are high. Their thermal conductivity is worse than that of copper alloys, and high heat dissipation requirements require optimized design or combination with other materials.

[0041] Therefore, while meeting heat dissipation requirements and achieving a thinner and lighter design, it is necessary to improve the rigidity of the VC heat dissipation plate to meet the needs of large size and high reliability, and even achieve the goal of integrated mid-frame.

[0042] Example 1

[0043] The following is combined with Figures 1 to 4 The following describes embodiments of the present invention.

[0044] According to an embodiment of the present invention, a VC heat spreader is provided, comprising:

[0045] The first heat-conducting plate 1 and the second heat-conducting plate 2 are adapted to be connected as a sealing element, and both are provided with capillary structures 3 and channels 4. The channel 4 of the first heat-conducting plate 1 has a support structure 5. The overall thickness of the sealing element can be 0.2 to 1.0 mm, and the thickness of a single first heat-conducting plate 1 or second heat-conducting plate 2 can be 0.1 to 0.5 mm. The capillary structure 3 can be prepared by etching process.

[0046] In the sealing component, when the first heat-conducting plate 1 and the second heat-conducting plate 2 are connected, the capillary structure 3 of the first heat-conducting plate 1 and the capillary structure 3 of the second heat-conducting plate 2 are arranged opposite to each other, and the two capillary structures can abut to form an integral capillary structure. The channel 4 of the first heat-conducting plate 1 and the channel 4 of the second heat-conducting plate 2 are arranged opposite to each other to form an integral channel, and the support structure 5 of the first heat-conducting plate 1 is fixedly connected to the bottom end of the channel 4 of the second heat-conducting plate 2; a weld seam may be left between the support structure 5 of the first heat-conducting plate 1 and the bottom end of the channel 4 of the second heat-conducting plate 2, and the support structure 5 of the first heat-conducting plate 1 and the channel 4 of the second heat-conducting plate 2 can be combined by diffusion welding, specifically, solid-phase diffusion welding and / or instantaneous liquid-phase diffusion welding can be used.

[0047] Diffusion welding can achieve high-strength, defect-free joints without melting the base material. No casting defects such as porosity, cracks, or segregation will appear in the weld, and the residual stress is much lower than in fusion welding. Near-net-shape forming can be achieved with almost no post-weld machining, making it particularly suitable for the precision components or deformation-sensitive thin-walled structures of this application. In this application, the support structure 5 of the first heat-conducting plate 1 and the channel 4 of the second heat-conducting plate 2 can be combined by diffusion welding. The welding temperature is lower than the melting point of the base material, and no coarse cast structure or brittle intermetallic compound will be formed at the contact interface between the support structure 5 and the channel 4. This maintains the original high strength and toughness of the base material and avoids thermal deformation, so that the VC heat spreader can still obtain reliable mechanical properties. The diffusion weld joint achieves metallurgical bonding through atomic-level interdiffusion. Its bonding strength is usually comparable to that of the base material. It can fuse the support structure 5 and the second heat-conducting plate 2 into an integrated force-bearing system. It is not easy to have interface cracking or fatigue failure during drop, extrusion or long-term thermal cycling, thereby significantly improving the bending resistance, compressive resistance and impact resistance of the heat spreader without increasing the overall thickness. The diffusion welding process can be carried out in a vacuum or protective atmosphere, without spatter or brazing filler residue, which can ensure the cleanliness and vacuum of the inner wall of the channel 4.

[0048] The sealing element contains a coolant, which can be water.

[0049] When the VC heat exchanger is heated, the channel 4 is adapted to allow the coolant to move from the hot end to the cold end, and the capillary structure 3 is adapted to pull the coolant located at the cold end back to the hot end through capillary force.

[0050] In this application, when the VC heat exchanger is heated, the coolant at the hot end (close to the heat source) vaporizes and reaches the cold end (generally located at the edge of the VC heat exchanger, or where a heat dissipation device is installed) through channel 4. The coolant at the cold end condenses and returns to the hot end through capillary structure 3, thereby achieving cyclic heat release. The support structure 5 of the first heat-conducting plate 1 is fixedly connected to the channel 4 of the second heat-conducting plate 2, so that the support structure 5 forms an integrated force-bearing system with the first heat-conducting plate 1 and the second heat-conducting plate 2, improving the overall mechanical strength and deformation resistance of the VC heat exchanger, thus meeting the mechanical strength requirements of the VC heat exchanger itself without thickening the VC heat exchanger. The capillary structure 3 of the first heat-conducting plate 1 and the capillary structure 3 of the second heat-conducting plate 2 are arranged opposite to each other, and the channel 4 of the first heat-conducting plate 1 and the channel 4 of the second heat-conducting plate 2 are arranged opposite to each other, so that the vaporized coolant can quickly diffuse to the cold end to complete heat release.

[0051] In one optional embodiment, the edges of the first heat-conducting plate 1 and the second heat-conducting plate 2 are sealed together. A weld may be provided between the edges of the first heat-conducting plate 1 and the second heat-conducting plate 2. The edges of the first heat-conducting plate 1 and the second heat-conducting plate 2 can be joined by diffusion welding, specifically, solid-phase diffusion welding and / or transient liquid-phase diffusion welding. The first heat-conducting plate 1 and the second heat-conducting plate 2 can be considered as having capillary structures 3 and / or support structures 5 processed on their opposing surfaces, forming channels 4. Alternatively, the capillary structures 3 and / or support structures 5, as well as the channels 4, can be considered as being embedded in the plates of the first heat-conducting plate 1 or the second heat-conducting plate 2.

[0052] In this application, the sealed connection between the edges of the first heat-conducting plate 1 and the second heat-conducting plate 2 ensures a vacuum environment suitable for coolant phase change between the first heat-conducting plate 1 and the second heat-conducting plate 2. The plates provide physical protection for the capillary structure 3, the support structure 5, and the channel 4, reducing damage from external impacts and friction, and extending the service life of the VC heat spreader.

[0053] In one optional embodiment, the areas containing the capillary structure 3 and the areas containing the channels 4 on the first heat-conducting plate 1 are spaced apart. Both the areas containing the capillary structure 3 and the areas containing the channels 4 on the first heat-conducting plate 1 can be strip-shaped. The second heat-conducting plate has a structure opposite to the first heat-conducting plate; therefore, defining the structure of the first heat-conducting plate also simultaneously defines the structure of the second heat-conducting plate.

[0054] In this application, after the VC heat exchanger is heated, the coolant can quickly diffuse to the cold end through channel 4. The vapor at the cold end rapidly releases heat and condenses into liquid, improving heat exchange efficiency. The spacing also allows the channel 4 region containing the support structure to form a complementary stress distribution with the capillary structure 3 region, avoiding localized deformation caused by concentrated stress in a single area. When the VC heat exchanger is subjected to external pressure, the spacing layout can disperse stress, enhancing the overall resistance to deformation.

[0055] In one alternative implementation, such as Figure 1 and Figure 2 As shown, the capillary structure 3 on the first heat-conducting plate 1 is located in two areas and is situated on both sides of the area where the channel 4 is located.

[0056] In this application, after the VC heat exchanger is heated, the coolant can reach the cold end through the channel 4 located in the middle, and the capillary structures 3 on both sides can make the condensed coolant quickly return to the hot end.

[0057] In one alternative implementation, such as Figure 3 and Figure 4 As shown, there are two channels 4 on the first heat-conducting plate 1, located on both sides of the area where the capillary structure 3 is located.

[0058] In this application, after the VC heat exchanger is heated, the coolant can reach the cold end through the channels 4 located on both sides, and the capillary structure 3 in the middle allows the condensed coolant to quickly return to the hot end. This avoids the problem of insufficient condensation efficiency caused by vapor accumulation.

[0059] In one optional embodiment, multiple support structures 5 are present in the area where channel 4 is located, and there is a gap between adjacent support structures 5. The support structures 5 can be distributed in an array within the area where channel 4 is located.

[0060] In this application, multiple support structures 5 can distribute external pressure and impact forces to multiple stress points, avoiding the problem of a single support structure 5 breaking or deforming due to concentrated stress. This significantly improves the overall compression and bending resistance of the heat spreader, making it particularly suitable for devices such as smartphones that need to withstand complex conditions such as drops and vibrations. The vaporized coolant steam can flow in the gaps between adjacent support structures 5, avoiding the problem of overly dense support structures 5 obstructing steam flow.

[0061] In addition, the number and distribution density of the support structure 5 can be adjusted according to the area of ​​the channel 4, so as to minimize the occupation of the circulation space while ensuring the structural strength, taking into account both structural stability and heat dissipation function, and adapting to the development trend of thinner and larger heat dissipation plates.

[0062] In one alternative embodiment, the support structure 5 is cylindrical in shape.

[0063] In this application, the column structure has good compression and bending resistance, and can evenly distribute pressure from above and below. It can provide higher support strength per unit volume, effectively enhance the overall rigidity of the heat spreader, and reduce deformation or warping caused by external forces. It is especially suitable for thin and light equipment with strict requirements for structural stability.

[0064] In one optional embodiment, the shape of the support structure 5 is one or more of a cylinder, an elliptical cylinder, a corrugated cylinder, and an arc cylinder.

[0065] In this application, the support structures 5 of different shapes can be specifically adapted to different stress requirements: cylindrical structures have uniform stress and are suitable for bearing vertical pressure; elliptical cylinders have stronger bending resistance in specific directions and can cope with impact forces in inclined directions; corrugated columns and arc-shaped columns have a certain deformation buffering capacity, which can absorb the energy brought by vibration and reduce structural damage. By using a single shape or a combination of multiple shapes, the support structure 5 can remain stable under complex stress environments, solving the problem of insufficient adaptability of a single-shape support structure 5.

[0066] In addition, the diverse shapes can optimize the flow field distribution within channel 4: for example, the curved surface of the arc column can guide the direction of steam flow and reduce flow resistance; the gaps between the corrugated columns can make the flow orderly, accelerate steam diffusion, avoid local steam stagnation caused by a single shape, improve condensation efficiency, and ensure smooth heat dissipation circulation.

[0067] In one optional embodiment, the first heat-conducting plate 1 and the second heat-conducting plate 2 are made of one or more of the following materials: copper alloy, stainless steel, titanium alloy, and steel-copper composite material. Specifically, for example... Figure 1 As shown, both the first heat-conducting plate 1 and the second heat-conducting plate 2 can be considered as a two-layer structure. The first heat-conducting plate 1 can be divided into an inner layer including capillary structures 3, channels 4, and support structures 5, and an outer layer surrounding the inner layer. The inner layer of the first heat-conducting plate 1 can be made of copper, and the outer layer of the first heat-conducting plate 1 can be made of stainless steel. The second heat-conducting plate 2 can be divided into an inner layer including capillary structures 3 and channels 4, and an outer layer surrounding the inner layer. The inner layer of the second heat-conducting plate 2 can be made of copper, and the outer layer of the first heat-conducting plate 1 can be made of stainless steel.

[0068] In this application, copper alloys have excellent thermal conductivity, which can quickly transfer the heat generated by the heat source, making them suitable for scenarios with extremely high heat dissipation efficiency requirements; stainless steel has high strength and strong corrosion resistance, which can improve the structural stability and service life of the heat spreader and adapt to humid or complex external environments; titanium alloys are lightweight and have excellent strength, which can meet the requirements of lightweight equipment design; and steel-copper composite materials combine the strength of steel and the thermal conductivity of copper, which can simultaneously solve the shortcomings of single materials in terms of thermal conductivity and strength.

[0069] By selecting a single material or a combination of multiple materials, the shortcomings of existing technologies can be addressed in a targeted manner: for example, when using copper alloy, the support structure 5 can compensate for its insufficient strength; when using stainless steel, the poor thermal conductivity can be improved by optimizing the design of the capillary structure 3 and the channel 4. The flexible material selection allows the heat spreader to adapt to a variety of application scenarios, from low power consumption to high power consumption, and from thin and light to high strength.

[0070] In one optional embodiment, the thickness of the first heat-conducting plate 1 and / or the second heat-conducting plate 2 is 0.1 to 0.5 mm. This reduces the limited internal space occupied by the VC heat spreader, facilitating a thinner and lighter design for the phone.

[0071] In one optional embodiment, the support structure 5 is prepared by one or more of etching, laser engraving, machining, and stamping.

[0072] In this application, etching can precisely process fine support structures 5 on the surface of the heat-conducting plate, which is especially suitable for preparing structures with complex height and shape, ensuring that the dimensions of the support structure 5 match those of the capillary structure 3 and the channel 4, and meeting the requirements of precision processing for the thinning of the heat spreader; laser engraving has high flexibility and can quickly adjust the shape and distribution of the support structure 5, which is suitable for small-batch, personalized production needs; machining can ensure the mechanical property stability of the support structure 5, which is suitable for scenarios with extremely high strength requirements; stamping is suitable for large-scale mass production, which can significantly improve production efficiency and reduce unit cost.

[0073] Diverse manufacturing methods can adapt to different production scales and technical requirements, overcoming the limitations of traditional single processing methods in terms of precision, efficiency, or cost. For example, for high-end models requiring complex support structures 5, a combination of etching and laser engraving can be used to ensure precision; for mass-production models, stamping processes can be used to increase production capacity. This not only ensures the performance reliability of the support structure 5 but also adapts to the production needs at different stages.

[0074] The processing method of the VC heat spreader may include the following steps:

[0075] 1. The first heat-conducting plate 1 and the second heat-conducting plate 2 are manufactured by stamping.

[0076] 2. The capillary structure 3 and the support structure 5 are processed on the surface of the first heat-conducting plate 1 by etching process, and the capillary structure 3 is processed on the surface of the second heat-conducting plate 2.

[0077] 3. The first heat-conducting plate 1 and the second heat-conducting plate 2, the supporting structure 5 and the second heat-conducting plate 2 are combined together by diffusion welding.

[0078] This application achieves complete integration of the first heat-conducting plate 1 and the second heat-conducting plate 2 by adopting a support structure 5, which effectively improves the overall mechanical strength and deformation resistance of the VC heat spreader.

[0079] The support structure 5 can be arranged at both ends or in the middle, separate from the capillary structure 3. This can improve the overall mechanical strength and resistance to deformation, while ensuring the heat dissipation capacity of the VC heat exchange plate through gas-liquid separation.

[0080] In traditional VC vapor chambers, thicker plates, such as copper VC vapor chambers, are often used to improve their thickness and lightness. Alternatively, high-strength materials, such as stainless steel VC vapor chambers, can be used as the substrate. However, stainless steel has a low thermal conductivity, which affects the heat dissipation effect of the VC vapor chamber.

[0081] Specifically, the first heat-conducting plate 1 and the second heat-conducting plate 2 of this application can be made of composite materials. Capillary structures 3 are uniformly etched on both sides using an etching process to improve heat dissipation. A support structure 5 is etched in the middle. The four perimeters of the first heat-conducting plate 1 and the second heat-conducting plate 2 are joined by diffusion welding. Simultaneously, the support structure 5 and the channel 4 of the second heat-conducting plate 2 are joined by diffusion welding, thereby increasing the overall mechanical strength of the VC heat spreader. This effectively solves the problems of relatively low strength in traditional copper alloy VC heat spreaders, which can only be addressed by increasing thickness in high-strength applications, resulting in a loss of lightweight design.

[0082] Example 2

[0083] like Figure 1 and Figure 2 As shown, the first heat-conducting plate 1 and the second heat-conducting plate 2 of this application use a steel-copper composite material as the substrate, with a thickness of 0.1 mm. Capillary structures 3 with a height of 0.04 mm are uniformly etched on both sides using an etching process. A cylindrical support structure 5 with a height of 0.08 mm is etched in the middle. The first heat-conducting plate 1 and the second heat-conducting plate 2 are bonded together around their perimeter by diffusion welding. Simultaneously, the support structure 5 is bonded to the second heat-conducting plate 2 by diffusion welding. A high-strength heat-dissipating plate is prepared by vacuuming and liquid injection sealing. Tests show that the compressive strength of the VC heat-dissipating plate can be increased by 20%.

[0084] Example 3

[0085] like Figure 1and Figure 2 As shown, the first heat-conducting plate 1 and the second heat-conducting plate 2 of this application use copper as the base material with a thickness of 0.15 mm. Capillary structures 3 with a height of 0.08 mm are uniformly etched on both sides using an etching process. A cylindrical support structure 5 with a height of 0.16 mm is etched in the middle. The first heat-conducting plate 1 and the second heat-conducting plate 2 are bonded together around their perimeter by diffusion welding. Simultaneously, the support structure 5 is bonded to the second heat-conducting plate 2 by diffusion welding. A high-strength heat-dissipating plate is prepared by vacuuming and liquid injection sealing. Tests show that the compressive strength of the VC heat-dissipating plate is increased by 10%.

[0086] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A VC vapor chamber, characterized by, include: The first heat-conducting plate (1) and the second heat-conducting plate (2) are adapted to be connected as a sealing element and are provided with capillary structure (3) and channel (4), wherein the channel (4) of the first heat-conducting plate (1) has a support structure (5). In the seal, the capillary structure (3) of the first heat-conducting plate (1) and the capillary structure (3) of the second heat-conducting plate (2) are arranged opposite to each other, the channel (4) of the first heat-conducting plate (1) and the channel (4) of the second heat-conducting plate (2) are arranged opposite to each other, and the support structure (5) of the first heat-conducting plate (1) is fixedly connected to the channel (4) of the second heat-conducting plate (2). The seal contains coolant.

2. The VC vapor chamber of claim 1, wherein, The edges of the first heat-conducting plate (1) and the second heat-conducting plate (2) are sealed together.

3. The VC vapor chamber of claim 1, wherein, The capillary structure (3) and the channel (4) on the first heat-conducting plate (1) are spaced apart.

4. The VC vapor chamber of claim 3, wherein, The capillary structure (3) on the first heat-conducting plate (1) is located in two areas and is located on both sides of the area where the channel (4) is located.

5. The VC vapor chamber of claim 3, wherein, The channels (4) on the first heat-conducting plate (1) are located in two areas and are situated on both sides of the area where the capillary structure (3) is located.

6. The VC vapor chamber of claim 1, wherein, Within the area where the channel (4) is located, there are multiple support structures (5), and there is a gap between two adjacent support structures (5).

7. The VC vapor chamber of claim 1, wherein, The supporting structure (5) is in the shape of a column.

8. The VC vapor chamber of claim 7, wherein, The shape of the support structure (5) is one or more of the following: cylindrical, elliptical, corrugated, and arc-shaped.

9. The VC vapor chamber of claim 1, wherein, The thickness of the first heat-conducting plate (1) and / or the second heat-conducting plate (2) is 0.1 to 0.5 mm.

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