A memory module chip mounting device

Abstract

This utility model relates to the field of surface mount technology, specifically a memory module chip mounting device, including a base. Two symmetrically arranged fixing blocks are fixedly connected to the upper surface of the base. This utility model enables the mounting device to achieve extremely high positional accuracy when the movable plate moves the chip mounter through the threaded transmission between the threaded rod and the movable plate, and the guiding action of the limiting blocks, preventing chip misalignment. Simultaneously, a hollow box limits the sliding movement of the chip mounter, further ensuring its stability during the mounting process and reducing mounting deviations caused by equipment shaking or displacement, ensuring precise bonding between the chips and the substrate. Furthermore, a connecting plate on the base fixes a testing machine, which can promptly inspect the memory module chip mounting effect after mounting, quickly identifying quality problems such as chip misalignment and poor soldering. This facilitates timely handling of defective products by staff, preventing defective products from flowing into subsequent processes and effectively improving the product qualification rate of memory module chip mounting.

Description

Technical Field

[0001] This utility model relates to the field of surface mount technology, specifically a surface mount device for memory modules. Background Technology

[0002] Traditional manual chip mounting relies on operators to manually perform a series of operations, including feeding the memory module substrate, picking up and positioning the memory chips. This method not only requires a high level of technical skill from the operators, but also suffers from fatigue and lack of concentration during long hours of operation, resulting in slow mounting speeds that cannot meet the needs of large-scale mass production. At the same time, manual operation is highly random, and it is difficult to guarantee the precision of the chip-to-substrate bonding position. Problems such as chip misalignment and poor contact between the chip and the substrate often occur, leading to quality defects such as poor soldering and contact in memory modules. This significantly increases the product defect rate and raises the company's production and rework costs.

[0003] With the iteration of production technology, semi-automated chip mounting equipment has been gradually applied to the production processes of some enterprises. Although such equipment can replace manual labor to a certain extent in completing some repetitive operations, such as simple substrate conveying or initial particle positioning, there are still obvious technical limitations. In the substrate conveying stage, semi-automated equipment mostly adopts intermittent conveying methods, which cannot achieve continuous and uniform substrate transmission, resulting in interruptions between processes and limited improvement in production efficiency. In terms of particle raw material supply, the equipment lacks a precise material height adjustment and quantitative supply mechanism, often resulting in untimely or excessive material replenishment, affecting the continuity of the chip mounting process. In the core chip mounting stage, the chip mounting mechanism of semi-automated equipment mostly adopts a fixed trajectory motion design, lacking flexible position adjustment and stable limiting structure. The chip mounting accuracy is easily affected by factors such as equipment operation vibration and component wear, making it difficult to achieve the production standards of high-precision chip mounting. In addition, whether it is traditional manual chip mounting or semi-automated equipment chip mounting, most current production modes have not established a complete real-time detection mechanism for chip mounting quality. After chip mounting is completed, quality problems need to be identified by manual sampling inspection or offline inspection in subsequent processes. This lagging inspection method not only fails to detect problems such as chip misalignment and poor soldering in a timely manner, but may also lead to defective products flowing into subsequent assembly and testing processes, further increasing the company's quality control costs and product recall risks. To address these issues, we propose a memory chip mounting device. Utility Model Content

[0004] The purpose of this invention is to provide a memory module chip mounting device to solve the problems mentioned in the background art.

[0005] The technical solution of this utility model is: a memory module chip mounting device, including a base, two symmetrically arranged fixing blocks are fixedly connected to the upper surface of the base, two symmetrically arranged partitions are fixedly connected to the upper surface of the two fixing blocks, two symmetrically arranged base plates are fixedly connected to the lower surface of the two partitions, two sets of symmetrically arranged baffles are fixedly connected to the upper surface of each of the two base plates, a conveying device is provided on the inner wall of the partition, a material storage device is provided on the upper surface of the baffle, and a chip mounting device is provided on the upper surface of the baffle.

[0006] Preferably, the conveying device includes two sets of first pulleys, which are rotatably connected to the inner walls of two sets of baffles. The surfaces of the two first pulleys are fitted with the same first belt. The inner walls of one set of first pulleys are fixedly connected to the same transmission rod. The front side wall of the transmission rod passes through the inner wall of the left baffle and extends to the outside. A protrusion is fixedly connected to the front side wall of the left baffle. The front side wall of the transmission rod passes through the inner wall of the protrusion and extends to the outside. The front end of the transmission rod is fixedly connected to a second pulley. A square plate is fixedly connected to the front side wall of the left base plate. A first motor is fixedly connected to the lower surface of the left base plate. The output end of the first motor is fixedly connected to a third pulley. The surfaces of the second pulley and the third pulley are fitted with the same second belt.

[0007] Preferably, the inner walls of the two partitions are provided with grooves, and the two grooves are matched with the two first belts.

[0008] Preferably, the storage device includes two sets of concave columns, which are fixedly connected to the outer walls of two partitions. Two sets of symmetrically arranged servo telescopic machines are fixedly connected to the upper surfaces of the two partitions. A lifting machine is fixedly connected to the left side wall of the left fixed block, and a support plate is fixedly connected to the output end of the lifting machine.

[0009] Preferably, the patching device includes two concave frames, which are fixedly connected to the upper surface of the base. A groove is formed on the upper surface of the rear concave frame. A second motor is fixedly connected to the left side wall of the rear concave frame. A threaded rod is fixedly connected to the output end of the second motor. The left end of the threaded rod penetrates the outer side wall of the concave frame and extends into the interior. A limiting block is fixedly connected to the upper surface of the front concave frame. The threaded rod and the limiting block are slidably connected to the same movable plate. A hollow box is fixedly connected to the left side wall of the movable plate. A patcher is slidably connected to the inner wall of the hollow box. A connecting plate is fixedly connected to the upper surface of the base. A testing machine is fixedly connected to the front side wall of the connecting plate.

[0010] This utility model provides an improved memory module chip mounting device, which has the following improvements and advantages compared with the prior art:

[0011] Firstly, this invention utilizes a conveying device where a first motor drives a third pulley to rotate, which in turn drives a second pulley and transmission rod via a second belt. This, in turn, causes the first pulley to drive the first belt, stably conveying the memory module substrate without manual operation, achieving continuous and uniform substrate transport. In the material storage device, a servo telescopic mechanism precisely controls the supply of granular raw materials to the concave column. A lifting mechanism, in conjunction with a support plate, flexibly adjusts the material height, ensuring timely and accurate particle supply and preventing material replenishment delays. In the chip mounting device, a second motor drives a threaded rod to rotate, causing a movable plate to move smoothly along a groove and a limiting block. The chip mounter inside the hollow box precisely completes the chip mounting operation. All these devices work in tandem to form a complete automated process. Compared to traditional manual chip mounting methods, this significantly shortens the single-cycle mounting time, meets the needs of mass production, and significantly improves the overall production efficiency of memory module chip mounting.

[0012] Secondly, this utility model utilizes the threaded transmission between the threaded rod and the movable plate, along with the guiding action of the limiting block, to achieve extremely high positional accuracy when the movable plate moves the chip mounter, preventing chip misalignment. Simultaneously, the hollow box provides sliding limit for the chip mounter, further ensuring its stability during the mounting process and reducing mounting deviations caused by equipment shaking or displacement, thus guaranteeing precise bonding between the chips and the substrate. Furthermore, the connecting plate on the platform fixes the inspection machine, which can promptly inspect the memory chip mounting effect after mounting, quickly identifying quality issues such as chip misalignment and poor soldering. This facilitates timely handling of defective products by staff, preventing them from flowing into subsequent processes, effectively improving the product qualification rate of memory chip mounting, and ensuring product quality stability. Attached Figure Description

[0013] The present invention will be further explained below with reference to the accompanying drawings and embodiments:

[0014] Figure 1 This is a front view structural diagram of the present invention;

[0015] Figure 2 This is a side view structural diagram of the present invention;

[0016] Figure 3 This is a schematic diagram of the connecting plate structure of this utility model;

[0017] Figure 4 This is a schematic diagram of the fixing block structure of this utility model;

[0018] Explanation of reference numerals in the attached figures:

[0019] 1. Base; 2. Fixing block; 3. Partition; 4. Base plate; 5. Baffle; 6. First pulley; 7. First belt; 8. Transmission rod; 9. Protrusion; 10. Second pulley; 11. Square plate; 12. First motor; 13. Third pulley; 14. Second belt; 15. Concave column; 16. Servo telescopic mechanism; 17. Lifting mechanism; 18. Support plate; 19. Concave frame; 20. Slide groove; 21. Second motor; 22. Threaded rod; 23. Limiting block; 24. Movable plate; 25. Hollow box; 26. Patch mounter; 27. Connecting plate; 28. Testing machine. Detailed Implementation

[0020] The present invention will now be described in detail, and the technical solutions in the embodiments of the present invention will be clearly and completely described. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present invention.

[0021] This utility model provides an improved memory module chip mounting device. The technical solution of this utility model is as follows:

[0022] like Figure 1 - Figure 4 As shown, a memory module chip mounting device includes a base 1. Two symmetrically arranged fixing blocks 2 are fixedly connected to the upper surface of the base 1. Two symmetrically arranged partitions 3 are fixedly connected to the upper surface of the two fixing blocks 2. Two symmetrically arranged base plates 4 are fixedly connected to the lower surface of the two partitions 3. Two sets of symmetrically arranged baffles 5 are fixedly connected to the upper surface of each of the two base plates 4. A conveying device is provided on the inner wall of the partition 3. A material storage device is provided on the upper surface of the baffle 5. A chip mounting device is provided on the upper surface of the baffle 5.

[0023] Furthermore, the conveying device includes two sets of first pulleys 6, which are rotatably connected to the inner walls of two sets of baffles 5. The surfaces of the two first pulleys 6 are fitted with the same first belt 7. A common transmission rod 8 is fixedly connected to the inner wall of one set of first pulleys 6. The front side wall of the transmission rod 8 penetrates the inner wall of the left baffle 5 and extends to the outside. A protrusion 9 is fixedly connected to the front side wall of the left baffle 5. The front side wall of the transmission rod 8 penetrates the inner wall of the protrusion 9 and extends to the outside. A second pulley 10 is fixedly connected to the front end of the transmission rod 8. A square pulley 10 is fixedly connected to the front side wall of the left bottom plate 4. The square plate 11 is fixedly connected to the first motor 12 on the lower surface of the left base plate 4. The output end of the first motor 12 is fixedly connected to the third pulley 13. The second pulley 10 and the third pulley 13 are fitted with the same second belt 14. The square plate 11 plays an auxiliary role in fixing the first motor 12, enhancing the installation stability of the first motor 12 on the lower surface of the base plate 4, and preventing the motor from shifting due to vibration when running. In addition, the components of the belt drive structure are easy to disassemble and replace. If the first motor 12 or the pulley needs to be maintained in the future, the staff can operate quickly, reducing the downtime of equipment maintenance.

[0024] Furthermore, the inner walls of the two partitions 3 are provided with grooves, which match the two first belts 7. The grooves on the inner walls of the partitions 3 match the first belts 7, which can strictly guide the running trajectory of the first belts 7, prevent the first belts 7 from shifting laterally during the transmission of the substrate, ensure that the substrate always moves along the preset path, lay the foundation for accurate docking in subsequent chip mounting operations, and reduce chip mounting position deviation caused by belt offset.

[0025] Furthermore, the material storage device includes two sets of concave columns 15, which are fixedly connected to the outer walls of two partitions 3. Two sets of symmetrically arranged servo telescopic machines 16 are fixedly connected to the upper surface of the two partitions 3. A lifting machine 17 is fixedly connected to the left side wall of the left fixed block 2. A support plate 18 is fixedly connected to the output end of the lifting machine 17. The two sets of symmetrically arranged servo telescopic machines 16 can precisely adjust the supply of granular raw materials on the concave columns 15 according to the chip placement rhythm, which avoids both excessive supply of raw materials leading to accumulation and waste, and insufficient supply leading to interruption of the chip placement process, ensuring a continuous and stable supply of granular raw materials and ensuring the continuity of the production process.

[0026] Furthermore, the patch assembly includes two concave frames 19, which are fixedly connected to the upper surface of the base 1. A groove 20 is formed on the upper surface of the rear concave frame 19. A second motor 21 is fixedly connected to the left side wall of the rear concave frame 19. A threaded rod 22 is fixedly connected to the output end of the second motor 21. The left end of the threaded rod 22 penetrates the outer side wall of the concave frame 19 and extends into it. A limiting block 23 is fixedly connected to the upper surface of the front concave frame 19. The threaded rod 22 and the limiting block 23 are slidably connected to the same movable plate 24. A hollow box 25 is fixedly connected to the left side wall of the movable plate 24. The inner wall of the 25 is slidably connected to the pick-and-place device 26, and the upper surface of the base 1 is fixedly connected to the connecting plate 27. The front side wall of the connecting plate 27 is fixedly connected to the inspection machine 28. The sliding groove 20 of the rear concave frame 19, the limiting block 23 of the front concave frame 19 and the threaded rod 22 cooperate to form a bidirectional guide and limit for the movable plate 24, so as to prevent the movable plate 24 from shaking up and down or shifting left and right during the movement. At the same time, the threaded drive of the threaded rod 22 has extremely high positional accuracy, which can accurately control the moving distance of the movable plate 24, ensuring that the pick-and-place device 26 can accurately position itself to the placement area of ​​the substrate, greatly reducing the placement offset rate and improving the product qualification rate.

[0027] Working principle: After the equipment is started, the first motor 12 located on the lower surface of the left base plate 4 starts to run. Its output end drives the third pulley 13 to rotate. Through the second belt 14, the second pulley 10 and the transmission rod 8 fixed thereto rotate synchronously. The transmission rod 8 drives the two sets of first pulleys 6 to rotate, which in turn causes the first belt 7, which is fitted on the surface of the first pulleys 6, to rotate. The operator places the memory module substrate on the first belt 7. The substrate is continuously and uniformly transported along the groove on the inner wall of the partition 3 by the first belt 7, without the need for manual conveying. At the same time as the substrate is being transported, the material storage device starts to work. The servo telescopic mechanism 16 on the upper surface of the partition 3 precisely controls the supply of granular raw materials on the concave column 15 to avoid over- or under-supply of raw materials. The elevator 17 located to the left of the left fixed block 2 drives the support plate 18 to move up and down, flexibly adjusting the height of the granular raw materials to ensure that the granular raw materials are in a precise position that is convenient for subsequent chip mounting operations, thus preparing the raw materials for the chip mounting process. When the substrate is transported to the chip mounting area, the chip mounting device starts, and the second motor 21 located to the left of the rear concave frame 19 starts to operate. Its output end drives the threaded rod 22 to rotate. Due to the movable plate 24 The movable plate 24, threadedly connected to the threaded rod 22 and guided by the limiting block 23, moves smoothly along the slide groove 20 and the limiting block 23, driving the left hollow box 25 and the chip mounter 26 with sliding limit inside the box to the designated position. The chip mounter 26 accurately picks up the particles supplied by the storage device and attaches the particles to the memory module substrate that has been transported here, completing the automated chip mounting. The structural limiting ensures the accuracy of the chip mounting position and avoids offset. After the chip mounting is completed, the memory module substrate with particles continues to be transported by the first belt 7. When it passes in front of the connecting plate 27 on the platform 1, the inspection machine 28 on the front side wall of the connecting plate 27 immediately inspects the chip mounting effect, quickly identifying quality problems such as chip offset and cold solder joint. The staff can promptly handle the unqualified products detected, preventing defective products from flowing into subsequent processes, and finally completing a complete memory module chip mounting operation. All devices work together to achieve fully automated operation.

[0028] The foregoing description enables those skilled in the art to implement or use this invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this invention. Therefore, this invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A memory module chip mounting device, comprising a platform (1), characterized in that: The upper surface of the platform (1) is fixedly connected to two symmetrically arranged fixing blocks (2), the upper surfaces of the two fixing blocks (2) are fixedly connected to two symmetrically arranged partitions (3), the lower surfaces of the two partitions (3) are fixedly connected to two symmetrically arranged base plates (4), the upper surfaces of the two base plates (4) are fixedly connected to two sets of symmetrically arranged baffles (5), the inner wall of the partition (3) is provided with a conveying device, the upper surface of the baffle (5) is provided with a material storage device, and the upper surface of the baffle (5) is provided with a patch device.

2. The memory module chip mounting equipment according to claim 1, characterized in that: The conveying device includes two sets of first pulleys (6), which are rotatably connected to the inner walls of two sets of baffles (5). The surfaces of the two first pulleys (6) are fitted with the same first belt (7). The inner walls of one set of first pulleys (6) are fixedly connected with the same transmission rod (8). The front side wall of the transmission rod (8) passes through the inner wall of the left baffle (5) and extends to the outside. The front side wall of the left baffle (5) is fixedly connected with a protrusion (9). The front side wall of the transmission rod (8) passes through the inner wall of the protrusion (9) and extends to the outside. The front end of the transmission rod (8) is fixedly connected with a second pulley (10). The front side wall of the left base plate (4) is fixedly connected with a square plate (11). The lower surface of the left base plate (4) is fixedly connected with a first motor (12). The output end of the first motor (12) is fixedly connected with a third pulley (13). The surfaces of the second pulley (10) and the third pulley (13) are fitted with the same second belt (14).

3. The memory module chip mounting equipment according to claim 2, characterized in that: The inner walls of the two partitions (3) are provided with grooves, and the two grooves are matched with the two first belts (7).

4. The memory module chip mounting equipment according to claim 1, characterized in that: The storage device includes two sets of concave columns (15), which are fixedly connected to the outer walls of two partitions (3). Two sets of symmetrically arranged servo telescopic machines (16) are fixedly connected to the upper surfaces of the two partitions (3). A lifting machine (17) is fixedly connected to the left side wall of the left fixed block (2). A support plate (18) is fixedly connected to the output end of the lifting machine (17).

5. The memory module chip mounting equipment according to claim 1, characterized in that: The patch assembly includes two concave frames (19), which are fixedly connected to the upper surface of the base (1). A groove (20) is provided on the upper surface of the rear concave frame (19). A second motor (21) is fixedly connected to the left side wall of the rear concave frame (19). A threaded rod (22) is fixedly connected to the output end of the second motor (21). The left end of the threaded rod (22) penetrates the outer side wall of the concave frame (19) and extends into the interior. A limiting block (23) is fixedly connected to the upper surface of the concave frame (19). The threaded rod (22) and the surface of the limiting block (23) are slidably connected to the same movable plate (24). A hollow box (25) is fixedly connected to the left side wall of the movable plate (24). A patcher (26) is slidably connected to the inner wall of the hollow box (25). A connecting plate (27) is fixedly connected to the upper surface of the base (1). A testing machine (28) is fixedly connected to the front side wall of the connecting plate (27).

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