An image sensor packaging structure

Abstract

This utility model provides an image sensor packaging structure, relating to the field of semiconductor packaging, including a substrate, an image sensor, and sidewalls. The image sensor is located on the upper surface of the substrate. The image sensor is electrically connected to the substrate via leads. The sidewalls are arranged around the edges of the substrate. An extension is provided at the top of the sidewalls. The image sensor is located on the inner side of the sidewalls, and the extension extends inward. A first protrusion is provided at the bottom of the extension. A second protrusion is provided on the upper surface of the substrate. The first protrusion is located inside the second protrusion. The first and second protrusions are arranged around the image sensor. One end of the lead is located outside the second protrusion, and the other end is located inside the first protrusion. The lead is in contact with the first and second protrusions. This utility model can solve the problem in the prior art where the adhesive cannot be evenly distributed on the substrate in time, resulting in a large amount of filler adhesive flowing, which squeezes the lead and makes the connection between the lead and the substrate unstable.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging, and in particular to an image sensor packaging structure. Background Technology

[0002] An image sensor is a core component of an image device that converts optical sensing signals into electronic signals. When packaging an image sensor, it is usually electrically connected to the substrate, typically by wire bonding. Pads or other electrical connection points are provided on the substrate to connect the image sensor to external electronic circuits, enabling signal sensing, processing, and interaction.

[0003] For example, the image sensor packaging structure and packaging method disclosed in Chinese patent application No. 202410857805.1 includes a substrate and a sensing chip fixed on the substrate. The sensing chip includes a sensing area and is electrically connected to the substrate. It also includes a transparent cover plate, which is narrower on the outer side and wider at the bottom. The filler adhesive can flow from one side of the transparent cover plate into the first bottom surface of the substrate outside the sensing chip. The liquid level of the filler adhesive rises from bottom to top, which can fully cover the leads.

[0004] When using the image sensor packaging structure provided by the above-mentioned patent, its transparent cover, side plate and first bottom surface form a filling groove, and the lead wire is located in the filling groove. If a large amount of filler glue is applied to one place of the transparent cover, the glue cannot be evenly distributed to the first bottom surface in time, resulting in a large amount of filler glue flowing on the first bottom surface. This causes the flowing filler glue to squeeze the lead wire used to connect the substrate and the sensing chip, which in turn causes the lead wire to bend or makes the connection between the lead wire and the substrate unstable, affecting the normal use of the sensing chip. Utility Model Content

[0005] To address the aforementioned problems, this utility model provides an image sensor packaging structure that solves the problem in the prior art where, during dispensing, the adhesive cannot be evenly distributed to the first bottom surface in a timely manner, resulting in a large amount of filler adhesive flowing on the first bottom surface. This flowing filler adhesive then squeezes the leads used to connect the substrate and the sensing chip, causing the leads to bend or making the connection between the leads and the substrate unstable, thus affecting the normal use of the sensing chip. The present invention improves the resistance of the leads to the squeezing force of the flowing filler adhesive and enhances the connection stability between the leads and the substrate.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0007] This utility model provides an image sensor packaging structure, including a substrate, an image sensor, and sidewalls; if the substrate is placed horizontally, the image sensor is located on the upper surface of the substrate; the image sensor is electrically connected to the substrate via leads; the sidewalls are arranged around the edge of the substrate;

[0008] The top of the sidewall is also provided with an extension; the image sensor is located inside the sidewall, and the extension extends inward; the bottom of the extension is provided with a downward first protrusion; the upper surface of the substrate is provided with an upward second protrusion; the first protrusion is located inside the second protrusion; the first protrusion and the second protrusion are arranged around the image sensor;

[0009] One end of the lead wire connected to the substrate is designated as the first end, and the other end of the lead wire connected to the image sensor is designated as the second end. The first end of the lead wire is located outside the second protrusion, and the second end of the lead wire is located inside the first protrusion. The lead wire is in contact with the first protrusion and the lead wire is in contact with the second protrusion.

[0010] The image sensor packaging structure provided by this utility model preferably has the first protrusion and the second protrusion being elastic.

[0011] The image sensor packaging structure provided by this utility model preferably further includes a glass cover plate; the glass cover plate includes a cover plate body and a housing; the bottom of the cover plate body is fixed to the top of the housing;

[0012] The cover has an inner cavity; the bottom of the cover has an opening; the opening communicates with the inner cavity; the cover is located inside the side wall; the cover plate body is located above the extension;

[0013] The bottom of the cover is in contact with the image sensor; the sensing area of ​​the image sensor passes through the opening and is located in the inner cavity; the bottom of the cover body and the top of the extension form a first dispensing channel; the side wall of the extension and the outer side wall of the cover form a second dispensing channel; the first dispensing channel and the second dispensing channel are connected.

[0014] The image sensor packaging structure provided by this utility model preferably has the following features: the bottom of the cover plate body forms a downward protrusion from the edge to the center; the top of the extension forms a downward sloping surface from the outside to the inside; and the first dispensing channel is inclined downward.

[0015] The image sensor packaging structure provided by this utility model preferably includes a glass cover plate that further includes a guide fluid; the guide fluid is frustum-shaped; the guide fluid has a through-hole extending from top to bottom; the cover is fitted into the through-hole; and the bottom plane of the guide fluid is in contact with the image sensor.

[0016] The outlet of the second dispensing channel is located above the fluid guide.

[0017] The image sensor packaging structure provided by this utility model preferably includes a sealing strip between the fluid guide and the cover.

[0018] The image sensor packaging structure provided by this utility model preferably includes a filler adhesive between the cover, the substrate and the sidewall; and the first dispensing channel and the second dispensing channel are filled with filler adhesive.

[0019] The above technical solution has the following advantages or beneficial effects:

[0020] The image sensor packaging structure provided by this utility model includes a substrate, an image sensor, and sidewalls. The image sensor is the same as the sensing chip in the prior art. The image sensor is connected to the substrate via leads. The sidewalls are arranged around the edge of the substrate, and the image sensor is located inside the sidewalls. In the prior art, because the adhesive cannot be evenly distributed to the first bottom surface, a large amount of filler adhesive flows on the first bottom surface. This large amount of filler adhesive may squeeze the leads during dispensing, thus affecting the normal use of the image sensor. Therefore, the top of the sidewalls is also provided with an extension that extends inward to provide a flat surface for guiding and fixing the leads. To secure the lead wire, the bottom of the extension has a downward-facing first protrusion, and the upper surface of the substrate has an upward-facing second protrusion. The first protrusion is located inside the second protrusion. The first and second protrusions surround the image sensor. When the lead wire connects the substrate and the image sensor, the lead wire passes through the first and second protrusions, and the lead wire is in contact with both the first and second protrusions. Because the first and second protrusions provide radial support for the lead wire, the lead wire can effectively resist the radial extrusion pressure of the filler adhesive, thereby improving the lead wire's stability. The filling adhesive resists the pressure of the flowing adhesive. Furthermore, the first and second protrusions restrict the direction of the lead wire, causing it to form an S-shape. Because there is a gap between the first protrusion and the substrate, the filling adhesive needs to first fill the first groove. The first groove acts as a buffer for the filling adhesive, reducing its flow velocity and the pressure generated by its flow. This allows the liquid level of the filling adhesive to slowly rise to the bottom of the first protrusion and contact the lead wire, effectively reducing the pressure from the circumferential direction. Similarly, as the liquid level of the filling adhesive rises, the filling adhesive slowly... The filler adhesive slowly contacts the lead wire that is in contact with the second protrusion. It overflows the top of the second protrusion and flows into the second groove, where it contacts the connection between the lead wire and the substrate. Finally, the filler adhesive contacts the connection between the lead wire and the image sensor. Furthermore, because the filler adhesive is viscous, and it contacts the lead wire that is in contact with the first protrusion and the second protrusion in turn, the filler adhesive first bonds and fixes the middle section of the lead wire before flowing to both ends of the lead wire. This prevents the lead wire from shaking due to the flow of the filler adhesive and improves the connection stability between the lead wire and the substrate and the image sensor.

[0021] In existing technologies, during dispensing, the adhesive cannot be evenly distributed to the first bottom surface in a timely manner, resulting in a large amount of filler adhesive flowing on the first bottom surface. This flowing filler adhesive squeezes the leads used to connect the substrate and the sensing chip, causing the leads to bend or making the connection between the leads and the substrate unstable, affecting the normal use of the sensing chip. The image sensor packaging structure provided by this utility model restricts the direction of the leads by setting a first protrusion and a second protrusion, making the leads form an S-shape. This provides radial support for the leads and buffers the extrusion pressure generated by the filler adhesive, effectively reducing the extrusion pressure from the circumferential filler adhesive. This improves the resistance of the leads to the extrusion pressure of the flowing filler adhesive, as well as the connection stability between the leads and the substrate or image sensor, and prevents the leads from bending under stress. Attached Figure Description

[0022] The present invention, its features, shape, and advantages will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings. Like reference numerals denote like parts throughout the drawings. The drawings are not intentionally drawn to scale; the focus is on illustrating the gist of the invention.

[0023] Figure 1 This is a cross-sectional schematic diagram of the image sensor packaging structure provided in Embodiment 1 of this utility model. Detailed Implementation

[0024] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention.

[0025] Example 1:

[0026] like Figure 1 As shown, the image sensor packaging structure provided in Embodiment 1 of this utility model includes a substrate 1, an image sensor 2, and a sidewall 3; if the substrate 1 is placed horizontally, the image sensor 2 is located on the upper surface of the substrate 1; the image sensor 2 and the substrate 1 are electrically connected through a lead wire 4; the sidewall 3 is arranged around the edge of the substrate 1.

[0027] The top of the side wall 3 is also provided with an extension 31; the image sensor 2 is located inside the side wall 3, and the extension 31 extends inward; the bottom of the extension 31 is provided with a downward first protrusion 311; the upper surface of the substrate 1 is provided with an upward second protrusion 11; the first protrusion 311 is located inside the second protrusion 11; the first protrusion 311 and the second protrusion 11 are arranged around the image sensor 2.

[0028] One end of the lead wire 4 connected to the substrate 1 is designated as the first end, and the other end of the lead wire 4 connected to the image sensor 2 is designated as the second end. The first end of the lead wire 4 is located outside the second protrusion 11, and the second end of the lead wire 4 is located inside the first protrusion 311. The lead wire 4 is in contact with the first protrusion 311 and the lead wire 4 is in contact with the second protrusion 11.

[0029] When using the image sensor packaging structure provided in Embodiment 1 of this utility model, one end of the lead wire 4 is connected to the substrate 1, and the other end of the lead wire 4 bends upward around the second protrusion 11 and adheres to the second protrusion 11, then bends downward around the first protrusion 311 and adheres to the first protrusion 311. The other end of the lead wire 4 is connected to the image sensor 2, and the lead wire 4 forms an S-shape. If a transparent cover plate as in the prior art is used, the transparent cover plate is placed on the image sensor 2, so that the sensing area 21 of the image sensor 2 is located within the cavity of the transparent cover plate. Adhesive is applied to the inclined slope surface of the transparent cover plate. The filler adhesive flows naturally along the inclined slope into the first groove formed by the second protrusion 11, the image sensor 2, and the substrate 1. As the liquid level of the filler adhesive rises, it comes into contact with the lead wire 4 attached to the first protrusion 311 and the lead wire 4 attached to the second protrusion 11. The filler adhesive overflows the top of the second protrusion 11 and flows into the second groove formed by the second protrusion 11, the side wall 3, and the substrate 1, where it comes into contact with the connection between the lead wire 4 and the substrate 1. Finally, the filler adhesive comes into contact with the connection between the lead wire 4 and the image sensor 2. The dispensing is completed when the filler adhesive is submerged between the extension 31 and the transparent cover plate.

[0030] The image sensor packaging structure provided in Embodiment 1 of this utility model includes a substrate 1, an image sensor 2, and a sidewall 3. The image sensor 2 is the same as the sensing chip in the prior art. The image sensor 2 is connected to the substrate 1 via a lead wire 4. The sidewall 3 is arranged around the edge of the substrate 1, and the image sensor 2 is located inside the sidewall 3. In the prior art, because the adhesive cannot be evenly distributed to the first bottom surface, a large amount of filler adhesive flows on the first bottom surface. This large amount of filler adhesive may squeeze the lead wire 4 during dispensing, thus affecting the normal use of the image sensor 2. Therefore, the top of the sidewall 3 is also provided with an extension 31, which extends inward to provide a platform for guiding and fixing the lead wire 4. To fix the lead 4, the bottom of the extension 31 is provided with a downward-facing first protrusion 311, and the upper surface of the substrate 1 is provided with an upward-facing second protrusion 11. The first protrusion 311 is located inside the second protrusion 11. The first protrusion 311 and the second protrusion 11 are arranged around the image sensor 2. When the lead 4 connects the substrate 1 and the image sensor 2, the lead 4 passes through the first protrusion 311 and the second protrusion 11, and the lead 4 is in contact with the first protrusion 311 and the second protrusion 11. Since the first protrusion 311 and the second protrusion 11 provide radial support for the lead 4, the lead 4 can effectively resist radial forces. The extrusion pressure of the filler adhesive is reduced, thereby improving the resistance of the lead 4 to the extrusion pressure of the flowing filler adhesive. Furthermore, the first protrusion 311 and the second protrusion 11 restrict the direction of the lead 4, causing it to form an S-shape. Since there is a gap between the first protrusion 311 and the substrate 1, the filler adhesive needs to first fill the first groove. The first groove acts as a buffer for the filler adhesive, reducing its flow rate and the extrusion pressure generated by its flow. This allows the liquid level of the filler adhesive to slowly rise to the bottom of the first protrusion 311 and contact the lead 4, effectively reducing the extrusion pressure from the circumferential direction. Similarly, as the liquid level of the filler adhesive rises... The filler adhesive slowly comes into contact with the lead wire 4 that is attached to the second protrusion 11. The filler adhesive overflows the top of the second protrusion 11 and flows into the second groove, where it comes into contact with the connection between the lead wire 4 and the substrate 1. Finally, the filler adhesive comes into contact with the connection between the lead wire 4 and the image sensor 2. Furthermore, since the filler adhesive is viscous and comes into contact with the lead wire 4 that is attached to the first protrusion 311 and the second protrusion 11 in turn, the filler adhesive first bonds and fixes the middle section of the lead wire 4 before flowing to both ends of the lead wire 4. This prevents the lead wire 4 from shaking due to the flow of the filler adhesive and improves the connection stability between the lead wire 4 and the substrate 1 and the image sensor 2.

[0031] In existing technologies, during dispensing, the adhesive cannot be evenly distributed to the first bottom surface in a timely manner, resulting in a large amount of filler adhesive flowing on the first bottom surface. This flowing filler adhesive squeezes the leads used to connect the substrate and the sensing chip, causing the leads to bend or making the connection between the leads and the substrate unstable, affecting the normal use of the sensing chip. The image sensor packaging structure provided in Embodiment 1 of this utility model restricts the direction of the leads 4 by setting the first protrusion 311 and the second protrusion 11, making the leads 4 form an S-shape. This provides radial support for the leads 4 and buffers the extrusion pressure generated by the filler adhesive, effectively reducing the extrusion pressure from the circumferential filler adhesive. This improves the resistance of the leads 4 to the extrusion pressure of the flowing filler adhesive and the connection stability of the leads 4 with the substrate 1 or the image sensor 2, preventing the leads 4 from bending under stress.

[0032] The image sensor packaging structure provided in Embodiment 1 of this utility model preferably addresses the issue that, since the image sensor 2 generates heat during operation, the filler adhesive will expand and contract due to thermal expansion and contraction when the image sensor 2 operates intermittently, thereby pulling on the lead wire 4 and easily causing the lead wire 4 to break. Therefore, the first protrusion 311 and the second protrusion 11 are made elastic. If the filler adhesive expands due to heat, the filler adhesive will squeeze the first protrusion 311 and the second protrusion 11, and the first protrusion 311 and the second protrusion 11 will provide support for the lead wire 4, preventing the lead wire 4 from being squeezed and broken by the filler adhesive.

[0033] The image sensor packaging structure provided in Embodiment 1 of this utility model preferably includes a glass cover plate 5 in order to encapsulate the image sensor 2. Here, the glass cover plate 5 replaces the transparent cover plate in the prior art. The glass cover plate 5 includes a cover plate body 51 and a cover body 52. ​​The bottom of the cover plate body 51 and the top of the cover body 52 are fixed together and the two are integrally formed.

[0034] During dispensing, in order to prevent the filler glue from flowing onto the sensing area 21 of the image sensor 2, the sensing area 21 needs to be separated. Specifically, the cover 52 is provided with an inner cavity 521, and the bottom of the cover 52 is provided with an opening 522. The opening 522 is connected to the inner cavity 521, so that the photosensitive area 21 can be covered in the inner cavity 521 through the opening 522.

[0035] More specifically, the cover 52 is located inside the side wall 3, the cover plate body 51 is located above the extension 31, and the bottom of the cover 52 is in contact with the image sensor 2. At this time, the sensing area 21 of the image sensor 2 passes through the opening 522 and is located in the inner cavity 521, so that the sensing area 21 is separated from the external dispensing area. Further, the bottom of the cover plate body 51 and the top of the extension 31 form a first dispensing channel 5131, and the side wall of the extension 31 and the outer side wall of the cover 52 form a second dispensing channel 3152. The first dispensing channel 5131 and the second dispensing channel 3152 are connected. Filler glue is injected from the first dispensing channel 5131, so that the filler glue can enter the dispensing area along the first dispensing channel 5131 and the second dispensing channel 3152, which facilitates the assembly and dispensing of the image sensor packaging structure.

[0036] The image sensor packaging structure provided in Embodiment 1 of this utility model preferably has a bottom of the cover plate body 51 that protrudes downward from the edge to the center, and the top of the extension 31 that slopes downward from the outside to the inside, so that the first dispensing channel 5131 slopes downward. The downwardly sloped first dispensing channel 5131 can increase the dispensing speed, thereby improving the packaging efficiency of the image sensor. Furthermore, the downwardly sloped first dispensing channel 5131 allows for clear observation of the liquid level of the filler adhesive, preventing the filler adhesive from overflowing.

[0037] Meanwhile, the bottom of the cover plate body 51 protrudes downward from the edge to the center, which can improve the light-gathering ability, concentrate the light to the sensing area 21, and improve the photoelectric conversion efficiency of the image sensor 2.

[0038] The image sensor packaging structure provided in Embodiment 1 of this utility model preferably includes a guide fluid 53 in order to allow the filler adhesive to flow slowly through the lead wire 4 and prevent the lead wire 4 from bending due to the pressure of the filler adhesive. The guide fluid 53 is frustum-shaped and has a mounting hole 531 extending from the top to the bottom. The cover 52 is fitted inside the mounting hole 531, and the bottom plane of the guide fluid 53 is in contact with the image sensor 2.

[0039] The outlet of the second dispensing channel 3152 is located above the guide fluid 53. When the filler flows out from the outlet of the second dispensing channel 3152, the filler first falls to the top plane of the guide fluid 53, reducing the flow speed of the filler. Then, the filler slides down the inclined surface of the guide fluid 53, causing the liquid level of the filler to rise from bottom to top.

[0040] The image sensor packaging structure provided in Embodiment 1 of this utility model preferably has a sealing strip between the fluid guide 53 and the cover 52, which improves the connection stability between the fluid guide 53 and the cover 52, and at the same time avoids excessive filler glue flowing into the gap between the fluid guide 53 and the cover 52.

[0041] The image sensor packaging structure provided in Embodiment 1 of this utility model preferably includes a filler adhesive between the cover 52, the substrate 1, and the sidewall 3; the first dispensing channel 5131 and the second dispensing channel 3152 are filled with filler adhesive; the filler adhesive covers the lead wire 4 and connects the substrate 1, the image sensor 2, the sidewall 3, and the glass cover plate 5.

[0042] The image sensor packaging structure provided in Embodiment 1 of this utility model preferably has a plurality of solder balls 6 at the bottom of the substrate 1 for electrical connection with electronic circuits to achieve circuit interconnection.

[0043] In summary, the image sensor packaging structure provided by this utility model can solve the problem in the prior art where, during dispensing, the adhesive cannot be evenly distributed to the first bottom surface in a timely manner, resulting in a large amount of filler adhesive flowing on the first bottom surface. This flowing filler adhesive squeezes the leads used to connect the substrate and the sensing chip, causing the leads to bend or making the connection between the leads and the substrate unstable, thus affecting the normal use of the sensing chip. The present invention improves the resistance of the leads to the extrusion pressure of the flowing filler adhesive and enhances the connection stability between the leads and the substrate.

[0044] Those skilled in the art should understand that variations can be implemented by combining existing technology and the above embodiments, and will not be elaborated here. Such variations do not affect the substantive content of this utility model, and will not be elaborated here.

[0045] The preferred embodiments of this utility model have been described above. It should be understood that this utility model is not limited to the specific embodiments described above, and the devices and structures not described in detail should be understood as being implemented in a conventional manner in the art; any possible variations and modifications made by those skilled in the art without departing from the technical solution of this utility model, or equivalent embodiments with equivalent changes, do not affect the essential content of this utility model. Therefore, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of this utility model without departing from the content of the technical solution of this utility model, shall still fall within the protection scope of the technical solution of this utility model.

Claims

1. An image sensor package structure, characterized by, It includes a substrate, an image sensor, and sidewalls; if the substrate is placed horizontally, the image sensor is located on the upper surface of the substrate; the image sensor is electrically connected to the substrate via leads; the sidewalls are arranged around the edge of the substrate; The top of the sidewall is also provided with an extension; the image sensor is located inside the sidewall, and the extension extends inward; the bottom of the extension is provided with a downward first protrusion; the upper surface of the substrate is provided with an upward second protrusion; the first protrusion is located inside the second protrusion; the first protrusion and the second protrusion are arranged around the image sensor; One end of the lead wire connected to the substrate is designated as the first end, and the other end of the lead wire connected to the image sensor is designated as the second end. The first end of the lead wire is located outside the second protrusion, and the second end of the lead wire is located inside the first protrusion. The lead wire is in contact with the first protrusion and the lead wire is in contact with the second protrusion.

2. The image sensor package structure of claim 1, wherein, The first protrusion and the second protrusion are elastic.

3. The image sensor package structure of claim 1, wherein, It also includes a glass cover plate; the glass cover plate includes a cover plate body and a housing; the bottom of the cover plate body is fixed to the top of the housing; The cover has an inner cavity; the bottom of the cover has an opening; the opening communicates with the inner cavity; the cover is located inside the side wall; the cover plate body is located above the extension; The bottom of the cover is in contact with the image sensor; the sensing area of ​​the image sensor passes through the opening and is located in the inner cavity; the bottom of the cover body and the top of the extension form a first dispensing channel; the side wall of the extension and the outer side wall of the cover form a second dispensing channel; the first dispensing channel and the second dispensing channel are connected.

4. The image sensor package structure of claim 3, wherein, The bottom of the cover plate body protrudes downward from the edge towards the center; the top of the extension forms a downward sloping surface from the outside to the inside; the first adhesive channel slopes downward.

5. The image sensor package structure of claim 3, wherein, The glass cover also includes a fluid guide; the fluid guide is frustum-shaped; the fluid guide has a through-hole extending from top to bottom; the cover is fitted into the through-hole; the bottom plane of the fluid guide is in contact with the image sensor. The outlet of the second dispensing channel is located above the fluid guide.

6. The image sensor package structure of claim 5, wherein, A sealing strip is provided between the fluid guide and the cover.

7. The image sensor package structure of claim 3, wherein, The space between the cover, the substrate, and the sidewall is filled with filler adhesive; the first dispensing channel and the second dispensing channel are filled with filler adhesive.

Images