A structure to improve poor contact caused by loose silver paste on LED chips

CN224638404UActive Publication Date: 2026-08-14GUANGDONG ALISON DIGITAL ELECTRIC APPLIANCE CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-05-26
Publication Date
2026-08-14

AI Technical Summary

Technical Problem

[0004]本实用新型的目的是为了解决现有技术中存在LED芯片与LED支架松脱造成接触不良的缺点，而提出的一种改善LED芯片银胶易松脱导致接触不良的结构

Benefits of technology

通过在碗杯内壁所开设的开槽，且开槽位于LED芯片的底部，使得LED芯片的底部与碗杯之间填充有银胶，且在加注银胶时，银胶能够残留于开槽的内部，在封装成成品后，因LED芯片底部有导电银胶，通过银胶连接LED芯片底部与LED支架，因而不会造成LED芯片位移后有空隙而接触不良。

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Abstract

This utility model relates to the field of LED chip technology, and in particular to a structure for improving the poor contact caused by the easy loosening of silver paste on LED chips. It includes a first metal bracket and a second metal bracket, both of which are wrapped with epoxy resin. The first metal bracket has a cup-shaped opening, and an LED chip is fixedly mounted inside the cup-shaped opening using silver paste. A connecting wire electrically connects the LED chip to the second metal bracket. The structure also includes a groove formed on the inner wall of the cup-shaped opening, into which the silver paste can fill the groove. This structure for improving the poor contact caused by the easy loosening of silver paste on LED chips solves the problem of poor contact caused by the loosening of LED chips and LED brackets in existing technologies.
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Claims

1. A structure for improving poor contact caused by easy loosening of silver paste on LED chips, comprising a first metal bracket (1) and a second metal bracket (2), wherein the first metal bracket (1) and the second metal bracket (2) are wrapped with epoxy resin (7), the first metal bracket (1) has a cup (3), and an LED chip (4) is fixedly installed in the cup (3) by silver paste (5), and the LED chip (4) is electrically connected to the second metal bracket (2) by a connecting wire (6), characterized in that: Also included are: A groove (8) is opened in the inner wall of the bowl cup (3), and the silver glue (5) can be filled in the inside of the groove (8).

2. The structure for improving the easy release of LED chip silver glue leading to poor contact according to claim 1, characterized in that: The groove (8) is a "cross" structure.

3. The structure for improving the easy release of LED chip silver glue leading to poor contact according to claim 1, characterized in that: The groove (8) is a "rice" structure.

4. The structure for improving the easy release of LED chip silver glue leading to poor contact according to any one of claims 2 or 3, characterized in that: The depth of the middle part of the groove (8) is greater than the depth of the edge.

5. The structure for improving the easy release of LED chip silver glue leading to poor contact according to any one of claims 2 or 3, characterized in that: The depth of the edge of the groove (8) is greater than the depth of the middle part.

6. A structure for improving poor contact caused by easy loosening of silver paste on LED chips according to any one of claims 2 or 3, characterized in that: The depth of the groove (8) should be not less than 500 μm.