LED bracket array and LED bracket

Abstract

This utility model discloses a light-emitting diode (LED) bracket array and an LED bracket. The LED bracket array includes a conductive substrate, a first insulating frame, and a second insulating frame. The conductive substrate includes multiple lead frames and one or more connecting ribs connecting the lead frames. The first insulating frame partially covers the conductive substrate and includes multiple first through slots. The lead frames are located in the first through slots. A region is formed on the first insulating frame after the connecting ribs are removed. The second insulating frame is formed on the surface of the first insulating frame and fills the region. The second insulating frame includes multiple second through slots, and each lead frame portion is exposed in the second through slot. The LED bracket array is divided into multiple independent LED brackets along a cutting line passing through the region.

Description

Technical Field

[0001] This utility model relates to a light-emitting diode (LED) support array and LED support, and more particularly to an LED support array and LED support that avoids cutting the conductive substrate. Background Technology

[0002] The LED holder is a crucial component of an LED device, its primary function being to support the LED chip and provide electrical connections. The basic structure of an LED holder includes a conductive substrate and a first insulating frame covering the conductive substrate. The conductive substrate provides the electrical connection for the LED, while the first insulating frame isolates the positive and negative electrodes of the conductive substrate and supports the LED. The LED holder not only provides fixation and conductivity for the LED but also helps improve luminous efficiency and heat dissipation, thus it is widely used in various LED devices.

[0003] Most common LED brackets are manufactured through the following process: providing a metal substrate to form electrode sheets; then forming an insulating frame covering the metal substrate; finally, cutting the insulating frame along a predetermined cutting line to form multiple independent bracket units. The electrode sheets on the metal substrate are typically connected by connecting ribs to improve the convenience of subsequent electroplating, handling, and mass production, which is beneficial for mass production of LED brackets.

[0004] However, the connecting ribs on the metal substrate necessitate cutting these ribs along with the final bracket unit during the cutting process. This causes the cutting tool to directly contact and abrade the bottom surface of the metal substrate, increasing the risk of bracket damage. Furthermore, because all electrode sheets are connected to each other via the ribs, it is impossible to perform electrical testing on each conductive sheet of the bracket individually before cutting. This means quality inspection can only be performed after the entire bracket is completed, making it impossible to detect defective products in real time. Therefore, while existing LED brackets can be mass-produced, their yield and quality still have room for further improvement. Utility Model Content

[0005] To address the aforementioned problems, this utility model provides a light-emitting diode (LED) support array, comprising a conductive substrate, a first insulating frame, and a second insulating frame. The conductive substrate includes multiple lead frames and one or more connecting ribs connecting the lead frames. The connecting ribs are formed together with the lead frames and have a sacrificial portion. The first insulating frame partially covers the conductive substrate and includes multiple first through-grooves extending through the first insulating frame along a thickness direction, and one or more grooves laterally connecting the first through-grooves. The lead frames are respectively disposed in the first through-grooves, and the connecting ribs are disposed in the grooves. A region without the connecting ribs is formed on the first insulating frame after the sacrificial portion is removed. The second insulating frame is formed on the surface of the first insulating frame and fills the region. The second insulating frame includes multiple second through-grooves extending through the second insulating frame along a thickness direction, with the lead frame portion of each unit exposed in the second through-grooves. The light-emitting diode support array defines a plurality of adjacent units, each of which includes one of the first through slots, one of the second through slots, and one of the lead frame.

[0006] This invention further provides a light-emitting diode (LED) support, comprising a conductive substrate, a first insulating frame, and a second insulating frame. The conductive substrate includes a lead frame and one or more connecting ribs connecting the lead frames. The connecting ribs are formed together with the lead frames and have a sacrificial portion. The first insulating frame partially covers the lead frame and includes a first through-groove extending through the first insulating frame along a thickness direction, and one or more grooves laterally connecting the first through-groove. The lead frame is disposed in the first through-groove, the connecting ribs are disposed in the grooves, and a region without the connecting ribs is formed on the first insulating frame after the sacrificial portion is removed. The second insulating frame is formed on the surface of the first insulating frame and fills the region. The second insulating frame includes a second through-groove extending through the second insulating frame along a thickness direction, and the lead frame is partially exposed in the second through-groove. Attached Figure Description

[0007] 『 Figure 1 』, which is a three-dimensional structural diagram of a conductor frame;

[0008] 『 Figure 2 』, which is a three-dimensional structural diagram of an insulating frame;

[0009] 『 Figure 3 』, is a three-dimensional structural diagram of a semi-finished product of a light-emitting diode bracket array;

[0010] 『 Figure 4 The image shows a three-dimensional structural diagram of the LED support after a sacrificial portion has been removed.

[0011] 『 Figure 5 The image shows a three-dimensional structural diagram of the LED support array.

[0012] 『 Figure 6 』, which is a schematic diagram of the first three-dimensional structure of the light-emitting diode bracket;

[0013] 『 Figure 7 』, which is a schematic diagram of the second three-dimensional structure of the light-emitting diode bracket; and

[0014] 『 Figure 8 ",for" Figure 6 』Cross view along section line AA.

[0015] In the attached figures, the following labels are used:

[0016] 1: LED bracket

[0017] 10: Conductive substrate

[0018] 11: Conductor frame

[0019] 111: First electrode plate

[0020] 112: Second electrode plate

[0021] 12: Conductor frame

[0022] 121: Third electrode plate

[0023] 122: Fourth electrode plate

[0024] 13: Connecting ribs

[0025] 131: Sacrifice

[0026] 132: Fixed part

[0027] 20: First Insulation Frame

[0028] 21: First Surface

[0029] 22: First slot

[0030] 23: Second Surface

[0031] 24: Trench

[0032] 25: Spacing section

[0033] 30: End face

[0034] 40: Region

[0035] 50: Second insulation frame

[0036] 51: Second slot

[0037] 90: Cutting line

[0038] 100: Light Emitting Diode (LED) Bracket Array Detailed Implementation

[0039] It should be understood that the terminology used in the description of various embodiments herein is for the purpose of describing particular examples only and is not intended to be limiting. Unless the context explicitly indicates or intentionally limits the number of elements, the singular forms "a" and "the" as used herein also include the plural forms. It will be further understood that the term "comprising," as used herein, indicates the presence of the described features, elements, and / or components, but does not preclude the addition or presence of one or more other features, elements, components, and / or groups thereof. Indefinite and definite articles should include both plural and singular forms unless the opposite is clearly apparent from the context.

[0040] This utility model provides a light-emitting diode (LED) bracket array, and an independent LED bracket formed by cutting the LED bracket array.

[0041] See 『 Figure 1 "to" Figure 6 The light-emitting diode (LED) support array 100 includes a conductive substrate 10 and a first insulating frame 20. The conductive substrate 10 supports and electrically connects an LED chip (not shown), and the first insulating frame 20 partially covers the conductive substrate 10. The LED support array 100 defines a plurality of adjacent units, each of which corresponds to forming the LED support 1.

[0042] See 『 Figure 1 The conductive substrate 10 includes a plurality of lead frames 11 and 12 and one or more connecting ribs 13. The connecting ribs 13 are formed together with and connected to the lead frames 11 and 12. The connecting rib 13 includes a sacrificial portion 131 and two fixing portions 132 located at both ends of the sacrificial portion 131, and the two fixing portions 132 are respectively connected to the lead frames 11 and 12. The sacrificial portion 131 is defined as the portion that is removed before the light-emitting diode support array 100 is cut, and after being removed, the lead frames 11 and 12 are separated from each other.

[0043] In one example, the conductive substrate 10 is a plate-shaped structure made of metals such as copper, stainless steel or aluminum, and the lead frames 11, 12 and the connecting ribs 13 can be formed by metal processing methods such as etching, stamping, laser cutting or electroforming.

[0044] In one example, each of the lead frames 11, 12 includes at least two electrode plates spaced apart from each other, which can be respectively connected to two pins of the light-emitting diode. In one example, as shown in the example below... Figure 1 As shown, the lead frame 11 (first lead frame) includes a first electrode plate 111 and a second electrode plate 112, which are arranged opposite to each other at a distance. Similarly, the lead frame 12 (second lead frame) includes a third electrode plate 121 and a fourth electrode plate 122, which are arranged opposite to each other at a distance. In this example, the two fixing portions 132 of the connecting rib 13 are respectively connected to the second electrode plate 112 of the first lead frame 11 and the third electrode plate 121 of the second lead frame 12, so that the first lead frame 11 and the second lead frame 12 are interconnected.

[0045] See 『 Figure 2 The image shows a three-dimensional structural diagram of the first insulating frame 20. The first insulating frame 20 includes a first surface 21 and a second surface 23 opposite to the first surface 21, and the first insulating frame 20 forms a plurality of first through-slots 22 and one or more grooves 24. Each first through-slot 22 penetrates the first surface 21 and the second surface 23 along a thickness direction, and forms one or more interconnected openings on the first surface 21 and the second surface 23, respectively. Each groove 24 is formed on the first surface 21 and is laterally connected to the first through-slots 22, so that adjacent first through-slots 22 are interconnected through the grooves 24.

[0046] In one example, the material of the first insulating frame 20 may be made of an insulating thermosetting or thermoplastic plastic, such as epoxy molding compound (EMC) or silicone molding compound (SMC), but is not limited thereto.

[0047] See 『 Figure 3 The image shows a three-dimensional structural diagram of the LED support array 100. The first insulating frame 20 covers the periphery of the conductive substrate 10, positioning the conductive substrate 10 between the first surface 21 and the second surface 23. The lead frames 11 and 12 are located within the first through slots 22, blocking the openings on the first surface 21 and the second surface 23 from communicating. The connecting rib 13 is located in the groove 24 and protrudes from the first surface 21. In one example, the thickness of the first insulating frame 20 is substantially the same as the thickness of the conductive substrate 10, meaning that the first surface 21 and the second surface 23 of the first insulating frame 20 are coplanar with the upper and lower surfaces of the conductive substrate 10, respectively.

[0048] Participate together Figure 4The LED support array 100 defines a plurality of adjacent units along one or more cutting lines 90, each unit corresponding to an LED support 1. Each unit includes a first through groove 22 and a lead frame 11 (or 12) located in the first through groove 22. The connecting rib 13 and the groove 24 connect two adjacent units. Before the LED support array 100 is cut into independent LED supports 1, the sacrificial portion 131 of the connecting rib 13 is removed, leaving a region 40 without the connecting rib 13 at the original location of the connecting rib 13. The region 40 is a space without any metal material, that is, a gap is formed between the lead frames 11 and 12 to separate the lead frames 11 and 12 from each other, and one end face of each of the two fixing portions 132 is exposed in the region 40. In one example, the length of the region 40 along the long side of the connecting rib 13 is not less than the length of the connecting rib 13. In this example, the connecting rib 13 has only the sacrificial portion 131 and does not have the two fixed portions 132.

[0049] In one example, the groove 24 corresponding to the sacrificial portion 131 is removed along with the sacrificial portion 131, making the region 40 a perforation through the first surface 21 and the second surface 23 of the first insulating frame 20.

[0050] See 『 Figure 5 The LED support array 100 further includes a second insulating frame 50 disposed on the first surface 21 of the first insulating frame 20 and filling the region 40. The second insulating frame 50 has a plurality of second through slots 51, each corresponding to a unit. In one example, the second through slots 51 are arranged in an array. Each second through slot 51 penetrates the upper and lower surfaces of the second insulating frame along a thickness direction and is not interconnected, so that each second through slot 51 independently corresponds to a unit, and the lead frame 11 (or 12) of each unit is partially exposed in the second through slot 51. Accordingly, the second insulating frame 50 forms a package structure protecting an LED chip and its wiring.

[0051] The LED support array 100 is cut along the cutting line 90, which passes through the region 40 and does not intersect with any part of the conductive substrate 10. That is, a cutting path of the cutting tool (not shown) will only pass through the part of the first insulating frame 20 that does not have the conductive substrate 10, without contacting the conductive substrate 10.

[0052] See 『 Figure 6 "and" Figure 7The image shows a three-dimensional structural diagram of the LED support 1 formed by cutting the LED support array 100, viewed from the first surface 21 and the second surface 23 of the LED support 1, and is also shown in the accompanying diagram. Figure 8 』, for the light-emitting diode bracket 1 along 『 Figure 6 The diagram shows a cross-sectional view along section AA of the LED bracket 1. The LED bracket 1 includes a lead frame 11, a first insulating frame 20 partially covering the lead frame 11, and a second insulating frame 50 disposed on the first insulating frame 20. Two surfaces of the lead frame 11 are exposed above the first insulating frame 20 and the second insulating frame 50, respectively. The second insulating frame 50 fills the area 40 left after the removal of the sacrificial portion 131, ensuring that the end face of the fixing portion 132 of the connecting rib 13 is covered by the second insulating frame 50 after the removal of the sacrificial portion 131 and is not exposed on the sidewall of the LED bracket 1.

[0053] Participate together Figure 6 "and" Figure 8 In one example, the first insulating frame 20 further includes a spacer 25 located between the first surface 21 and the second surface 23 and extending along the thickness direction. The spacer 25 divides the lead frame 11 into the first electrode sheet 111 and the second electrode sheet 112, which are electrically isolated from each other. In one embodiment, the spacer 25 extends from the first surface 21 toward the second surface 23, and the spacer 25 and the lead frames 11, 12 have the same thickness.

[0054] Compared to conventional methods for manufacturing LED brackets, this invention removes the connecting ribs connecting multiple adjacent electrode sheets on the conductive substrate before cutting the LED bracket array to form multiple independent LED brackets. This separates the lead frames and forms a space without the conductive substrate, allowing subsequent cutting operations to pass through this non-metallic space without cutting the conductive substrate. This avoids potential problems with poor sealing between the insulating frame and the electrode sheets caused by cutting the conductive substrate. Furthermore, this invention includes a first insulating frame and a second insulating frame, with the second insulating frame filling the area formed after the connecting ribs are removed. This allows the cut end faces of the lead frames to be covered within the second insulating frame, protecting them. Additionally, all four sidewalls of the LED bracket are covered by the insulating frame, ensuring that the conductive substrate is not exposed on the sidewalls of the LED bracket and is isolated from the outside environment, thus improving the airtightness of the LED bracket.

[0055] Furthermore, since removing the connecting rib eliminates the electrical connection between adjacent electrode groups, the circuitry of each electrode group can be made completely independent before cutting the LED support array, facilitating pre-testing of electrical properties. In addition, removing the connecting rib removes the conductive substrate within the LED support array, which is no longer integrally connected, effectively improving the flatness of the LED support array and reducing the risk of deformation, further enhancing the accuracy of subsequent packaging processes.

[0056] Of course, there may be other embodiments of this utility model. Without departing from the spirit and essence of this utility model, those skilled in the art can make various corresponding changes and modifications based on this utility model, but these corresponding changes and modifications should all fall within the protection scope of the appended claims of this utility model.

Claims

1. A light-emitting diode (LED) support array, characterized in that, Include: A conductive substrate includes a plurality of lead frames and one or more connecting ribs connecting the lead frames, the connecting ribs being formed together with the lead frames and having a sacrificial portion; A first insulating frame partially covers the conductive substrate, including a plurality of first through slots penetrating the first insulating frame along a thickness direction, and one or more grooves laterally connecting the first through slots. Lead frames are respectively disposed in the first through slots, and connecting ribs are disposed in the grooves. A region without the connecting ribs is formed on the first insulating frame after the sacrificial portion is removed; and A second insulating frame is formed on a surface of the first insulating frame and fills the region, the second insulating frame including a plurality of second through slots extending through the second insulating frame along a thickness direction; The light-emitting diode support array defines a plurality of adjacent units, each unit including one of the first through slots, one of the second through slots and one of the lead frame, with the lead frame portion of each unit exposed in the second through slot.

2. The light-emitting diode support array as described in claim 1, characterized in that, This area is a perforation that runs through the first insulating frame.

3. The light-emitting diode support array as described in claim 1, characterized in that, The thickness of the first insulating frame is substantially the same as the thickness of the conductive substrate.

4. The light-emitting diode support array as described in claim 1, characterized in that, The length of this region along the long side of the connecting bar is not less than the length of the connecting bar.

5. A light-emitting diode bracket, characterized in that, Include: A conductive substrate includes a lead frame and one or more connecting ribs connected to the lead frame, the connecting ribs being formed together with the lead frame and having a sacrificial portion; A first insulating frame partially covers the conductor frame, including a first through-slot extending through the first insulating frame along a thickness direction, and one or more grooves laterally connecting the first through-slot, wherein the conductor frame is disposed in the first through-slot, the connecting rib is disposed in the groove, and a region without the connecting rib is formed on the first insulating frame after the sacrificial portion is removed; and A second insulating frame is formed on a surface of the first insulating frame and fills the region, the second insulating frame including a second through-slot extending through the second insulating frame along a thickness direction, the conductor frame portion being exposed in the second through-slot.

6. The light-emitting diode bracket as described in claim 5, characterized in that, This area is a perforation that runs through the first insulating frame.

7. The light-emitting diode bracket as described in claim 5, characterized in that, The thickness of the first insulating frame is substantially the same as the thickness of the conductive substrate.

8. The light-emitting diode bracket as described in claim 5, characterized in that, The length of this region along the long side of the connecting bar is not less than the length of the connecting bar.

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