An RGBW multi-color surface mount LED light source

Abstract

This utility model relates to the field of LED light source technology, and in particular to an RGBW multi-color surface-mount LED light source, comprising: a bracket with receiving slots, an isolation wall formed on the bracket between two adjacent receiving slots, and reflective slopes formed on the inner wall of the receiving slots and the side of the isolation wall; wherein the receiving slots are used to install chipsets, and chip electrodes are disposed in the receiving slots. In this utility model, through the optimized design of the positions of red light chip, green light chip, blue light chip and white light chip, the reflective slopes can reflect side light upwards to improve light output. At the same time, by setting a transparent adhesive layer on the light-emitting surface of the light source, the mixing effect of the four-color light output is improved, resulting in better lighting effect.

Description

Technical Field

[0001] This utility model relates to the field of LED light source technology, and in particular to an RGBW multicolor chip LED light source. Background Technology

[0002] With the continuous development of light source technology and the increasing demand for high-quality lighting and diversified lighting environments, multi-color LED light sources, with their ability to provide rich colors and high-quality white light, are gradually being widely used in many fields, and market demand is showing an upward trend.

[0003] Traditional dimming typically uses two color temperature light sources, cool white and warm white, for simple dimming, which is insufficient to meet high-end multi-color requirements. While RGB three-color LED dimming can adjust a wide color gamut, its color quality and color rendering index are poor due to spectral discontinuity. Currently, RGBW four-color dimming light sources have been developed. Adding white LEDs can not only supplement the spectrum between single-color LEDs to improve the color rendering of the light source, but also effectively improve the electro-optical conversion efficiency when white light is used for lighting applications, thus balancing light quality and luminous efficiency.

[0004] Currently, four-color LED light sources have different packaging forms such as surface mount packaging and COB packaging. Surface mount packaging is widely used in lighting sources because of its advantages such as arbitrary combination and convenient maintenance. However, current monochrome LED light sources have problems such as low extraction efficiency and narrow spectral range, resulting in low color rendering. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing monochrome LED light sources, such as low extraction efficiency and narrow spectral range leading to poor color rendering, and to propose an RGBW multicolor chip LED light source.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: Design an RGBW multicolor surface-mount LED light source, including: A bracket is provided with receiving slots, and a partition wall is formed on the bracket between two adjacent receiving slots. Reflective slopes are formed on the inner wall of the receiving slots and the side of the partition wall. The receiving slot is used to install a chipset, and chip electrodes are disposed in the receiving slot. The back end of the bracket has a bracket electrode that is electrically connected to the chip electrodes. A transparent adhesive layer is also provided above the bracket, and the chipset includes a red light chip, a green light chip, a blue light chip, and a white light chip.

[0007] Furthermore, the transparent adhesive layer has a planar or raised structure, and the transparent adhesive layer covers at least one receiving groove.

[0008] Furthermore, two receiving slots are provided, each having a fan-shaped structure, and the two receiving slots together form a circular light source area; The red light chip, green light chip, and blue light chip are installed in one of the receiving slots, and the white light chip is installed in another receiving slot. The white light chip is composed of a blue light chip W and a phosphor adhesive layer.

[0009] Furthermore, a transparent adhesive layer is attached above each of the two receiving slots; Alternatively, a transparent adhesive layer may be connected between the tops of the two receiving slots, wherein the height of the partition wall between the two receiving slots is not higher than the upper surface of the bracket.

[0010] Furthermore, four receiving slots are provided, and the red light chip, green light chip, blue light chip and white light chip are respectively installed in one receiving slot.

[0011] Furthermore, a transparent adhesive layer is attached above at least one of the receiving slots; Alternatively, a transparent adhesive layer may be connected between the tops of the four receiving slots, wherein the height of the partition wall between two adjacent receiving slots is not higher than the upper surface of the bracket.

[0012] Furthermore, all four receiving slots are configured as circular, fan-shaped, or rectangular structures; The four receiving slots are arranged in a ring along a vertical line of the support.

[0013] Furthermore, the receiving slot for mounting the white light chip is configured as a circular structure, and the other three receiving slots are configured as fan-shaped annular structures and are enclosed on the outside of the receiving slot for the white light chip.

[0014] Furthermore, both the red and green light chips are composed of a blue light chip W and a phosphor adhesive layer.

[0015] Furthermore, the chipset also includes an infrared chip, a yellow-green chip, a near-ultraviolet chip, and a long-wavelength blue light chip; The infrared chip and the red light chip are disposed in one receiving slot, the yellow-green chip and the green light chip are disposed in one receiving slot, the near-ultraviolet chip and the blue light chip are disposed in one receiving slot, and the long-wavelength blue light chip and the white light chip are disposed in one receiving slot.

[0016] The RGBW multi-color chip LED light source proposed in this utility model has the following advantages: In this utility model, the positions of the red light chip, green light chip, blue light chip and white light chip are optimized. At the same time, the reflective slope can reflect the side light upward to improve the light output. By setting a transparent adhesive layer on the light output surface of the light source, the mixing effect of the four-color light output is improved, and the lighting effect is better. Attached Figure Description

[0017] Figure 1 This is a top view of Embodiment 1 of the present utility model; Figure 2 This is a bottom view of Embodiment 1 of the present utility model; Figure 3 This is a cross-sectional view of Embodiment 1 of the present utility model; Figure 4 This is a schematic diagram of the receiving groove structure in Embodiment 2 of this utility model. Figure 1 ; Figure 5 for Figure 4 A schematic diagram of the cross-sectional structure; Figure 6 This is a schematic diagram of the receiving groove structure in Embodiment 2 of this utility model. Figure 2 ; Figure 7 for Figure 6 A schematic diagram of the cross-sectional structure; Figure 8 This is a schematic diagram of the receiving groove structure in Embodiment 2 of this utility model. Figure 3 ; Figure 9 for Figure 8 A schematic diagram of the cross-sectional structure; Figure 10 This is a schematic diagram of the receiving groove structure in Embodiment 2 of this utility model. Figure 4 ; Figure 11 for Figure 10 A schematic diagram of the cross-sectional structure; Figure 12 This is a schematic diagram of the receiving groove structure in Embodiment 2 of this utility model. Figure 5 ; Figure 13 for Figure 12 A cross-sectional structural diagram.

[0018] In the diagram: 1. Support; 10. Receiving groove; 11. Isolation wall; 12. Reflective slope; 13. Chip electrode; 14. Support electrode; 2. Chipset; 21. Red light chip; 22. Green light chip; 23. Blue light chip; 24. White light chip; 241. Blue light chip W; 242. Phosphor adhesive layer; 25. Infrared chip; 26. Yellow-green chip; 27. Near-ultraviolet chip; 28. Long-wavelength blue light chip; 3. Transparent adhesive layer. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0020] Example 1 Reference Figures 1-3 As one embodiment of this utility model, an RGBW multicolor chip LED light source is disclosed, specifically the LED light source comprising: A bracket 1 is provided with a receiving groove 10, and an isolation wall 11 is formed on the bracket 1 between two adjacent receiving grooves 10. Reflective slopes 12 are formed on the inner wall of the receiving groove 10 and the side of the isolation wall 11. The receiving slot 10 is used to mount the chipset 2. A chip electrode 13 is disposed in the receiving slot 10. The back end of the support 1 has a support electrode 14 electrically connected to the chip electrode 13. Both the support electrode 14 and the chip electrode 13 include positive and negative electrodes that are sequentially opposite each other. The specific structure of the support electrode 14 can be found in [reference needed]. Figure 2 As shown, the specific power supply principle for chipset 2 is existing technology and will not be elaborated here. Specifically, in this embodiment, the material of the bracket 1 is generally composed of high-temperature nylon (PPA), poly(1,4-cyclohexanedimethyl terephthalate) (PCT), epoxy molding compound (EMC), and ceramics. Since the bracket material has a high reflectivity, the reflective slope 12 can reflect the side light upwards, thereby improving the light output. A transparent adhesive layer 3 is also provided above the support 1. The transparent adhesive layer 3 has a planar or raised structure and covers at least one receiving groove 10. Specifically, in this embodiment, the surface of the transparent adhesive layer 3 can be a planar sealant. In other embodiments, the surface of the transparent adhesive layer 3 can also be a convex sealant with a hemispherical, semi-ellipsoidal, or arc-shaped structure. By setting a convex sealant on the light-emitting surface of the light source, the light mixing effect of four-color light emission is improved. Compared with the total internal reflection caused by the refractive index difference between the adhesive and air interface in planar encapsulation adhesive, the convex design makes the incident angle of the light emitted by the chip at the adhesive and air interface smaller, greatly reducing total internal reflection. Furthermore, due to the setting of the convex adhesive, the light emission angle of the light source is smaller, resulting in better illumination.

[0021] In some embodiments, the chipset 2 of this invention includes a red light chip 21, a green light chip 22, a blue light chip 23, and a white light chip 24.

[0022] Furthermore, in this embodiment, two receiving slots 10 are provided. The receiving slots 10 have a fan-shaped structure, and the two receiving slots 10 together form a circular light source area. The red light chip 21, green light chip 22, and blue light chip 23 are mounted in one of the receiving slots 10, and the white light chip 24 is mounted in another receiving slot 10. The white light chip 24 is composed of a blue light chip W241 and a phosphor adhesive layer 242. That is, in this embodiment, the white light chip 24 is set as a separate area. The blue light chip W241 adopts a wavelength range of 440-460nm, which has a relatively high excitation efficiency for phosphors. The blue light chip W241 can adopt a right-side-mounted or flip-chip structure. The phosphor adhesive is a mixture of phosphor and organic encapsulating adhesive. The phosphor can be one or more of green, yellow-green, yellow, orange, and red phosphors. The red chip 21, green chip 22, and blue chip 23 are monochromatic LEDs, with the blue LED wavelength range of 440-470nm, the green LED wavelength range of 500-550nm, and the red LED wavelength range of 600-660nm. The red, green, and blue chips can be upright, flip-chip, or vertically mounted.

[0023] In order to improve the uniformity of light output from the light source and ensure that there are no obvious color spots in the light spot after mixing, our preferred light source area is as shown in Figure 1, where two receiving slots 10 form a concentric circle of the same size.

[0024] Furthermore, in this embodiment, a transparent adhesive layer 3 is connected above each of the two receiving slots 10; Alternatively, a transparent adhesive layer 3 may be connected between the tops of the two receiving slots 10, wherein the height of the partition wall 11 between the two receiving slots 10 is not higher than the upper surface of the bracket 1.

[0025] Preferably, when a transparent adhesive layer 3 is connected between the tops of the two receiving slots 10, the height of the isolation wall 11 is not higher than the upper surface of the bracket 1. The design that the height of the isolation wall 11 is not higher than the outer plane of the bracket 1 facilitates the setting of the encapsulating adhesive and is conducive to improving the light mixing effect.

[0026] That is, the transparent adhesive layer 3 described in this embodiment can be designed separately on each receiving groove 10, or it can be molded together between the tops of two receiving grooves 10.

[0027] Example 2 Reference Figures 4-13 In this embodiment, the similarities with Embodiment 1 will not be repeated. The difference is that in this embodiment, four receiving slots 10 are provided, and the red light chip 21, green light chip 22, blue light chip 23 and white light chip 24 are respectively installed in one receiving slot 10.

[0028] Of course, in this embodiment, at least one of the receiving slots 10 is connected to a transparent adhesive layer 3. In an optional embodiment, a transparent adhesive layer 3 can be provided in the receiving slots 10 corresponding to the red light chip 21, green light chip 22, and blue light chip 23, while the white light chip 24 can be composed of a blue light chip W241 and a phosphor adhesive layer 242. Alternatively, a transparent adhesive layer 3 may be connected between the tops of the four receiving slots 10, wherein the height of the partition wall 11 between two adjacent receiving slots 10 is not higher than the upper surface of the bracket 1.

[0029] It should be noted that in this embodiment, all four receiving slots 10 are configured as circular, fan-shaped, or rectangular structures; The four receiving slots 10 are arranged in a ring along a vertical line of the support 1.

[0030] In this embodiment, the chip mounting position has been optimized. Its main purpose is to distribute the light source at the four corners of the ring center, which will result in better uniformity. It can be applied in high-density application scenarios where multiple surface-mount light sources are evenly distributed.

[0031] Specifically, such as Figure 4 As shown, in this embodiment, the receiving slot 10 is arranged into small squares of equal size at the four corners. In order to facilitate the manufacture of the bracket and the use of the light source, the outer corner of each small square can be a right angle or an angle with a certain curvature. This is not limited. The four separately configured light source areas can be equipped with red light chip 21, green light chip 22, blue light chip 23, and white light chip 24 as needed. Since they are set up as independent areas, the four light sources can be set arbitrarily as needed, which is particularly suitable for the application requirements of position modulation of different colors of light in large-area, high-density applications. The white light source area is composed of blue light chip W241 and phosphor adhesive layer 242, while the other monochromatic light source areas are sealed with transparent encapsulating adhesive. The red light chip 21, green light chip 22, blue light chip 23, and white light chip 24 are designed in concentric circles around the center of the light source, which can improve the uniformity of light output.

[0032] Furthermore, to improve the health lighting applications of light sources, we have optimized the light source design, such as... Figure 6 As shown, the chipset 2 also includes an infrared chip 25, a yellow-green chip 26, a near-ultraviolet chip 27, and a long-wavelength blue light chip 28; The infrared chip 25 and the red light chip 21 are disposed in a receiving slot 10, the yellow-green chip 26 and the green light chip 22 are disposed in a receiving slot 10, the near-ultraviolet chip 27 and the blue light chip 23 are disposed in a receiving slot 10, and the long-wavelength blue light chip 28 and the white light chip 24 are disposed in a receiving slot 10.

[0033] Of course, in this embodiment, the infrared chip 25 and the red light chip 21 can be arbitrarily distributed in a receiving slot 10. Similarly, when the yellow-green chip 26 and the green light chip 22, the ultraviolet chip 27 and the blue light chip 23, and the long-wavelength blue light chip 28 and the white light chip 24 are configured in each independent receiving slot 10, their positions can be arbitrarily adjusted. Therefore, their specific layout is not limited here.

[0034] By adding long-wavelength blue light chips to the white light source region—chips with wavelengths greater than blue light chips and ranging from 460-490nm—the low-spectral components around 470nm in the traditional white light spectrum can be supplemented, improving spectral continuity. This spectrum also has the function of regulating the human biological clock and optimizing circadian rhythms. Adding long-wavelength red light and even near-infrared chips to the red light source region, such as red light wavelengths of 660nm, 680nm, 740nm, and 850nm, provides better skin penetration, aiding metabolism and blood circulation, and is increasingly used in bio-health lighting applications. Adding near-ultraviolet wavelengths (400nm-420nm) to the blue light source region primarily supplements the missing violet portion of our light source, which plays a role in truly simulating the full solar spectrum and regulating human circadian rhythms. Finally, adding yellow-green light wavelengths to the green light source region is mainly used to achieve full-spectrum adjustment and obtain the maximum color gamut in applications such as backlighting.

[0035] In addition, to improve the color rendering of the light source, our white light source area uses at least two types of phosphors, such as combinations of yellow-green phosphor + short-wavelength red phosphor and long-wavelength red phosphor, or combinations of green phosphor + orange phosphor + red phosphor, etc.

[0036] Transparent adhesive can be produced using either a molding process or a high-viscosity encapsulating adhesive dispensing process. However, the molding process has a better yield in terms of consistency of molding processes. Molding can be hemispherical or other ellipsoidal shapes. The shape is generally optimized according to the chip position to improve the light output power of the light source, especially for monochromatic LEDs. Compared with planar shapes, convex shapes have a superior light extraction effect.

[0037] like Figure 8 As shown, each receiving slot 10 can also be set as a circle, and each light source area can be molded into a convex shape.

[0038] Optionally, in this embodiment, both the red light chip 21 and the green light chip 22 are composed of a blue light chip W241 and a phosphor adhesive layer 242.

[0039] Specifically, the blue LED chip W241 combined with phosphor layers 242 of different colors can emit monochromatic phosphor light. Alternatively, a CSP chip structure can be used. Of course, the white LED chip 24 described in this invention can also be a CSP chip, because the light source area is independently set. A CSP chip is essentially a blue LED chip coated with phosphor of the corresponding color, emitting monochromatic phosphor light. The advantage of this design is that all chips are blue LED chips, the external voltage of the light source is the same, and the circuit fabrication is simple. It should be noted that the use of CSP chips generally requires an independent light source area. Figure 1 With the design of two receiving slots 10, multiple monochromatic light chips are located in the same light source area. This means that the phosphors outside the red and green CSP chips will be excited when the blue chip is lit alone, resulting in the presence of green and red light in the blue light spectrum. like Figure 10 As shown, the four receiving slots 10 can also be designed in a fan-shaped structure, which together form a circle. Each light source area is a right-angled fan, and the chips are arranged in concentric circles. The colored light chip can be an LED chip or a CSP chip, and there is no risk of color mixing. The design of a single molding is conducive to the final light extraction and also conducive to the light mixing when multiple chips are lit. Of course, the independent light source area design can connect chips of multiple wavelengths in parallel, which is an optimized light source design.

[0040] like Figure 12 As shown, in some embodiments, the receiving slot 10 for mounting the white light chip 24 is configured as a circular structure, and the other three receiving slots 10 are configured as a fan-shaped annular structure and are enclosed on the outside of the receiving slot 10 for the white light chip 24.

[0041] The concentric circle design in this embodiment can also be used for larger light source brackets such as 5050 and 7070, where white light is placed in the middle and red, green, and blue light are arranged in a ring around the outside. In this design, white light can be made with a large chip, while red, green, and blue monochromatic light generally uses a small chip. This design is suitable for applications that primarily use white light and require an improved color gamut. This design is not limited to whether the chip is mounted upright, upside down, or vertically, and it can be a CSP chip. In addition, because it is a concentric circle design, it can also be made into a molding process.

[0042] In summary, this invention optimizes the positions of the red light chip 21, green light chip 22, blue light chip 23, and white light chip 24, and improves the light mixing effect of the four-color light emission by setting a transparent adhesive layer 3 on the light-emitting surface of the light source. Compared with planar encapsulation adhesive, the convex structure of the transparent adhesive layer 3 has more total internal reflection caused by the refractive index difference between the adhesive and air interface. In addition, the incident angle of the light emitted by the convex design chip at the adhesive and air interface is smaller, which greatly reduces total internal reflection. Furthermore, due to the setting of the convex adhesive, the light emission angle of the light source is smaller, resulting in better illumination.

[0043] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. An RGBW multi-color surface mount LED light source, characterized in that, include: A bracket (1) is provided with a receiving groove (10), and an isolation wall (11) is formed on the bracket (1) between two adjacent receiving grooves (10). Reflective slopes (12) are formed on the inner wall of the receiving groove (10) and the side of the isolation wall (11). The receiving slot (10) is used to install the chipset (2), and a chip electrode (13) is provided in the receiving slot (10). The back end of the support (1) has a support electrode (14) that is electrically connected to the chip electrode (13). A transparent adhesive layer (3) is also provided above the bracket (1). The chip group (2) includes a red light chip (21), a green light chip (22), a blue light chip (23) and a white light chip (24). The receiving slot (10) is provided with four slots, and the red light chip (21), green light chip (22), blue light chip (23) and white light chip (24) are respectively installed in one receiving slot (10).

2. The RGBW multi-color surface mount LED light source of claim 1, wherein: The transparent adhesive layer (3) has a planar or raised structure and covers at least one receiving groove (10).

3. The RGBW multi-color surface mount LED light source of claim 1, wherein: A transparent adhesive layer (3) is connected above at least one of the receiving slots (10); or a transparent adhesive layer (3) is connected between the tops of the four receiving slots (10), wherein the height of the partition wall (11) between two adjacent receiving slots (10) is not higher than the upper surface of the bracket (1).

4. The RGBW multi-color surface mount LED light source of claim 1, wherein: The four receiving slots (10) are configured as circular, fan-shaped or rectangular structures; the four receiving slots (10) are distributed in a ring along a vertical line of the support (1).

5. The RGBW multi-color SMD LED light source according to claim 1, characterized in that: The receiving slot (10) for mounting the white light chip (24) is configured as a circular structure, and the other three receiving slots (10) are configured as fan-shaped ring structures and are enclosed on the outside of the receiving slot (10) of the white light chip (24).

6. The RGBW multi-color surface mount LED light source of claim 1, wherein: The red light chip (21) and the green light chip (22) are both composed of a blue light chip W (241) and a phosphor adhesive layer (242).

7. The RGBW multi-color surface mount LED light source of claim 1, wherein: The chipset (2) further includes an infrared chip (25), a yellow-green chip (26), a near-ultraviolet chip (27), and a long-wavelength blue light chip (28); the infrared chip (25) and the red light chip (21) are disposed in a receiving slot (10), the yellow-green chip (26) and the green light chip (22) are disposed in a receiving slot (10), the near-ultraviolet chip (27) and the blue light chip (23) are disposed in a receiving slot (10), and the long-wavelength blue light chip (28) and the white light chip (24) are disposed in a receiving slot (10).

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