A light-emitting device

Abstract

This utility model relates to the field of semiconductor light-emitting technology and discloses a light-emitting device. The light-emitting device includes a substrate, at least two light-emitting chips spaced apart on the substrate, at least two bonding wires connecting the light-emitting chips and the substrate, a lens sealed on the substrate, and at least one layer of light-transmitting adhesive on all the light-emitting chips. The lens and the substrate enclose at least two spaced cavities. The lens includes at least two optical parts, each corresponding to one of the at least two light-emitting chips, with each light-emitting chip located in one cavity. By placing the bonding wires directly in the cavities, without affecting the original performance of the light-emitting device, there is no need for encapsulating adhesive filling, and no encapsulating adhesive pulling on the bonding wires. Even if the bonding wires become longer, they will not break, and the light-emitting device is less prone to open circuits, thus improving the reliability of the light-emitting device.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor light-emitting technology, and in particular to a light-emitting device. Background Technology

[0002] Traditional light-emitting devices (LEDs) use a translucent encapsulating adhesive to fill a support frame, covering the LED chip and bonding wires within. The encapsulating adhesive not only seals the electronic components but also shapes the light field. When applied to security lighting, to meet near-field illumination requirements, the dimensions of a traditional LED are increased in one direction, resulting in a corresponding increase in the length of the bonding wires. However, traditional LEDs generate heat during operation, causing the encapsulating adhesive to expand as the temperature rises; conversely, when the device stops operating, the encapsulating adhesive contracts as the temperature drops. This expansion and contraction of the encapsulating adhesive exerts a pulling force on the bonding wires. Because the bonding wires are longer, they are more prone to breaking at the connection between the bonding wires and the support frame, potentially causing an open circuit in the LED. Summary of the Invention

[0003] Based on this, the present invention provides a light-emitting device to solve the problem that traditional light-emitting devices are prone to breakage due to the lengthening of bonding wires.

[0004] This utility model provides a light-emitting device, the light-emitting device comprising:

[0005] Base;

[0006] At least two light-emitting chips are disposed at intervals on the substrate;

[0007] At least two bonding wires, each of the bonding wires connecting one of the light-emitting chips and the substrate;

[0008] A lens, sealed on the substrate and enclosing at least two spaced cavities with the substrate, the lens including at least two optical elements, each optical element corresponding to one of the at least two light-emitting chips, each light-emitting chip located in one of the cavities; and

[0009] At least one light-transmitting adhesive layer is disposed on all of the light-emitting chips.

[0010] Preferably, the substrate is a support, the support having at least two spaced grooves, each groove forming at least a portion of each inner cavity; or the substrate is a base plate, the lens having at least two spaced cavities, each cavity forming at least a portion of each inner cavity.

[0011] Preferably, the light-transmitting adhesive layer on each of the light-emitting chips is spaced apart from the corresponding optical element.

[0012] Preferably, each of the optical components has an inner optical interface and an outer optical interface, wherein the inner optical interface is a concave curved surface and the outer optical interface is a free-form surface.

[0013] Preferably, the at least two light-emitting chips include a first light-emitting chip and a second light-emitting chip, which are arranged side by side in a vertical direction; the at least two optical parts include a first optical part and a second optical part connected to each other, with the first optical part corresponding to the first light-emitting chip and the second optical part corresponding to the second light-emitting chip.

[0014] Preferably, each of the optical components has an inner optical interface and an outer optical interface, wherein the orthographic projection of the outer optical interface onto the substrate covers the orthographic projection of the inner optical interface onto the substrate.

[0015] Preferably, each optical element has an inner optical interface and an outer optical interface, the inner optical interface being a concave curved surface and the outer optical interface being a convex curved surface; the curvature of the inner and outer optical interfaces of each optical element in the vertical direction is less than the curvature in the horizontal direction.

[0016] Preferably, the maximum length of the orthographic projection of the external optical interface onto the substrate in the horizontal direction is greater than its maximum length in the vertical direction.

[0017] Preferably, the first light-emitting chip has two light-transmitting adhesive layers, namely a fluorescent adhesive layer and a light-diffusing adhesive layer; the second light-emitting chip has one light-transmitting adhesive layer, and the light-emitting surface of the light-transmitting adhesive layer is a convex curved surface.

[0018] Preferably, the light-emitting device further includes an encapsulating adhesive layer disposed in each of the inner cavities and covering the corresponding surface of the substrate.

[0019] The beneficial effects of this utility model are as follows: by directly sealing the lens on the substrate, the sealing effect of the traditional encapsulating glue is replaced; at the same time, the light-transmitting adhesive layer on the light-emitting chip plays a certain optical role; by placing the bonding wire directly in the inner cavity, without affecting the original performance of the light-emitting device, and because there is no encapsulating glue filling, there is no encapsulating glue pulling on the bonding wire, so even if the bonding wire becomes longer, it will not break, and the light-emitting device is not prone to open circuit. Attached Figure Description

[0020] Figure 1 This is a three-dimensional structural diagram of the light-emitting device according to an embodiment of the present utility model;

[0021] Figure 2 This is a top view of the light-emitting device according to an embodiment of the present utility model;

[0022] Figure 3 for Figure 2 Cross-sectional view along direction AA;

[0023] Figure 4 This is a cross-sectional view of the light-emitting device containing the encapsulating adhesive layer according to an embodiment of the present invention;

[0024] Figure 5 for Figure 2 Cross-sectional view along the BB direction;

[0025] Figure 6 for Figure 2 Cross-sectional view along the CC direction;

[0026] Figure 7 This is a schematic diagram of the inner and outer optical interfaces of the first light-emitting chip in the horizontal direction according to an embodiment of the present invention.

[0027] Figure 8 This is a schematic diagram of the inner and outer optical interfaces of the second light-emitting chip in the horizontal direction according to an embodiment of the present invention.

[0028] Figure 9 This is a schematic diagram of the inner and outer optical interfaces in the vertical direction of the first light-emitting chip (left) and the second light-emitting chip (right) in an embodiment of this utility model.

[0029] The meanings of the labels in the attached diagram are as follows:

[0030] 100-Light-emitting device; 1-Substrate; 2-Light-emitting chip; 3-Bonding wire; 4-Lens; 5-Inner cavity; 6-Transmitting adhesive layer; 7-Encapsulating adhesive layer; 21-First light-emitting chip; 22-Second light-emitting chip; 41-Optical component; 61-Fluorescent adhesive layer; 62-Light-diffusing adhesive layer; 411-Inner optical interface; 412-Outer optical interface; 413-First optical component; 414-Second optical component. Detailed Implementation

[0031] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this utility model.

[0032] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0034] like Figure 1 , Figure 2 , Figure 3 , Figure 5 and Figure 6 As shown, this is a light-emitting device 100 according to an embodiment of the present invention. The light-emitting device 100 of the present invention reduces the stress between materials and the breakage of the bonding wire 3 by directly placing the bonding wire 3 in the inner cavity 5, thereby improving the reliability of the light-emitting device 100 and extending its service life.

[0035] Further, please see Figure 1 , Figure 2 , Figure 3 , Figure 5 and Figure 6 The light-emitting device 100 includes a substrate 1, at least two light-emitting chips 2 spaced apart on the substrate 1, at least two bonding wires 3 connecting the light-emitting chips 2 and the substrate 1, a lens 4 sealed on the substrate 1, and at least one layer of light-transmitting adhesive 6 disposed on all the light-emitting chips 2. Each bonding wire 3 connects one light-emitting chip 2 and the substrate 1. The lens 4 and the substrate 1 enclose at least two spaced cavities 5, which are also cavities. The lens 4 includes at least two optical parts 41, each corresponding to one of the at least two light-emitting chips 2, with each light-emitting chip 2 located in one cavity 5. Integrating at least two optical parts 41 into one lens 4 reduces the volume of the light-emitting device 100. In this embodiment, only a small amount of light-transmitting adhesive is adhered to the bonding wires 3, resulting in negligible stress between the materials, thus greatly improving the strength of the bonding wires 3.

[0036] In one feasible embodiment, please refer to Figure 1 , Figure 2 and Figure 3 The base 1 is a support, and the support has at least two spaced grooves, each groove forming at least a portion of each inner cavity 5. Optionally, the two grooves are independent of each other, and are the same size and shape. Preferably, the two grooves are located on both sides of the support and are mirror-symmetrical about the center plane of their connecting surface. Preferably, the support is sealed to the lens 4.

[0037] In another possible embodiment, see [link to relevant documentation]. Figure 1 , Figure 2 and Figure 4The substrate 1 is a base plate, and the lens 4 has at least two spaced cavities, each cavity forming at least a portion of each inner cavity 5. Preferably, each cavity is the same as each inner cavity 5. Preferably, each cavity is independent of each other, and they are the same size and shape. Preferably, the lens 4 contains two independent cavities, and the two cavities are symmetrically arranged on the base plate. Preferably, the base plate and the lens 4 are sealed together.

[0038] In one feasible embodiment, please refer to Figure 3 The light-transmitting adhesive layer 6 on each light-emitting chip 2 is spaced apart from the corresponding optical part 41. This arrangement creates gaps between the light-transmitting adhesive layer 6 on each light-emitting chip 2 and the corresponding optical part 41, further reducing stress between materials and improving product reliability.

[0039] In one feasible embodiment, please refer to Figure 3 Each optical component 41 has an inner optical interface 411 and an outer optical interface 412. The inner optical interface 411 is a concave curved surface, and the outer optical interface 412 is a free-form surface. The inner optical interface 411 is the light-incident surface, and the outer optical interface 412 is the light-exit surface. By setting the inner optical interface 411 to a concave curved surface, the offset of light rays from the optical axis is reduced, retaining some large-angle light rays. When applied to security lighting, this meets the requirements of near-field security lighting scenarios. Optionally, each inner optical interface 411 can be the same size and shape.

[0040] In one feasible embodiment, please refer to Figure 3 , Figure 5 and Figure 6 At least two light-emitting chips 2 include a first light-emitting chip 21 and a second light-emitting chip 22, which are arranged side by side in a vertical direction; at least two optical parts 41 include a first optical part 413 and a second optical part 414 connected to each other, with the first optical part 413 corresponding to the first light-emitting chip 21 and the second optical part 414 corresponding to the second light-emitting chip 22. By integrating the two optical parts 41 onto a lens 4, the package size of the light-emitting device 100 is smaller and the production cost is lower. Optionally, the first light-emitting chip 21 and the second light-emitting chip 22 are respectively located at the center of the substrate 1 portion in their respective inner cavities 5.

[0041] Optionally, the first light-emitting chip 21 and the second light-emitting chip 22 are different types of chips. Preferably, the first light-emitting chip 21 is a blue light chip, and the second light-emitting chip 22 is a red light chip with a wavelength of 620nm or higher. Because a red light chip with a wavelength of 620nm or higher can emit visible red light and invisible infrared light, when applied to security lighting, the visible and invisible light are combined and work together to improve the reliability of security lighting and achieve all-round, blind-spot-free security coverage. In other alternative embodiments, at least two light-emitting chips 2 also include a third light-emitting chip, and at least two optical parts 41 also include a third optical part. The first light-emitting chip 21, the second light-emitting chip 22, and the third light-emitting chip are arranged side by side in a vertical direction, and the first optical part 413, the second optical part 414, and the third optical part are connected in sequence, with the third optical part corresponding to the third light-emitting chip. The type of the third light-emitting chip may be the same as or different from that of the first and second light-emitting chips. The bonding wire 3 connecting the third light-emitting chip and the substrate 1 is not pulled by encapsulant and is not easy to break, thus improving the reliability of the light-emitting device 100.

[0042] In one feasible embodiment, please refer to Figure 3 Each optical element 41 has an inner optical interface 411 and an outer optical interface 412, the orthographic projection of the outer optical interface 412 onto the substrate 1 covering the orthographic projection of the inner optical interface 411 onto the substrate 1. This arrangement reduces the package size of the light-emitting device 100. Optionally, the linear dimensions of the inner optical interface 411 in both the vertical and horizontal directions are smaller than the linear dimensions of the outer optical interface 412 in both the vertical and horizontal directions.

[0043] In one feasible embodiment, please refer to Figure 3 , Figure 7 , Figure 8 and Figure 9 Each optical unit 41 has an inner optical interface 411 and an outer optical interface 412. The inner optical interface 411 is a concave curved surface, and the outer optical interface 412 is a convex curved surface. This arrangement results in the inner optical interface 411 and the outer optical interface 412 having a larger center and smaller edges in the horizontal direction, thus retaining some large-angle light rays. When applied to security lighting, this can also provide near-field illumination. The curvature of the inner optical interface 411 and the outer optical interface 412 of each optical unit 41 in the vertical direction is smaller than its curvature in the horizontal direction. By slightly increasing the curvature of the inner optical interface 411 and the outer optical interface 412 of each optical unit 41 in the vertical direction, light focusing is facilitated, which is beneficial for long-distance illumination. Therefore, this arrangement, when applied to security lighting, can meet the lighting requirements of both near and far-field security supplementary lighting scenarios.

[0044] Optional, please see Figure 3 , Figure 5, Figure 6 , Figure 7 , Figure 8 and Figure 9 The curvature of the outer optical interface 412 corresponding to the first light-emitting chip 21 in the horizontal direction is greater than the curvature of the inner optical interface 411 corresponding to the first light-emitting chip 21 in the horizontal direction. Optionally, the curvature of the outer optical interface 412 corresponding to the second light-emitting chip 22 in the horizontal direction is approximately equal to the curvature of the inner optical interface 411 corresponding to the second light-emitting chip 22 in the horizontal direction. Optionally, the curvature of the outer optical interface 412 corresponding to the first light-emitting chip 21 in the horizontal direction is greater than the curvature of the outer optical interface 412 corresponding to the second light-emitting chip 22 in the horizontal direction. Optionally, the curvature of the inner optical interface 411 corresponding to the first light-emitting chip 21 in the horizontal direction is less than the curvature of the inner optical interface 411 corresponding to the second light-emitting chip 22 in the horizontal direction. Optionally, the curvatures of the inner optical interface 411 and the outer optical interface 412 of each optical part 41 in the vertical direction are almost equal.

[0045] In one feasible embodiment, please refer to Figure 3 The maximum length of the orthographic projection of the external optical interface 412 onto the substrate 1 in the horizontal direction is greater than its maximum length in the vertical direction. Preferably, twice the maximum length of the orthographic projection of the external optical interface 412 onto the substrate 1 in the horizontal direction is equal to its maximum length in the vertical direction.

[0046] In one feasible embodiment, please refer to Figure 5 and Figure 6 The first light-emitting chip 21 has two light-transmitting adhesive layers 6, namely a fluorescent adhesive layer 61 and a light-diffusing adhesive layer 62; the second light-emitting chip 22 has one light-transmitting adhesive layer 6, the light-emitting surface of which is a convex curved surface. The fluorescent adhesive layer 61 converts the wavelength of the light emitted by the first light-emitting chip 21 to obtain the desired light, and the light-diffusing layer homogenizes the wavelength-converted light, improving the light quality. Preferably, the light-transmitting adhesive layer 6 on the second light-emitting chip 22 is a light-extracting lens 4, which improves the luminous efficiency of the light-emitting device 100.

[0047] In one feasible embodiment, please refer to Figure 4The light-emitting device 100 further includes an encapsulating adhesive layer 7 disposed in each inner cavity 5, the encapsulating adhesive layer 7 in each inner cavity 5 covering the corresponding surface of the substrate 1. By filling the inner cavity 5 with the encapsulating adhesive layer 7, the hermeticity of the substrate 1 is increased, while the heat dissipation channel of the light-emitting chip 2 is increased, and the brightness of the light-emitting device 100 is improved. Meanwhile, the light-transmitting adhesive layer 6 and the encapsulating adhesive layer 7 are separated, reducing inter-material stress and improving product reliability. Optionally, the thickness of the encapsulating adhesive layer 7 is less than the thickness of the light-emitting chip 2. Optionally, the thickness of the encapsulating adhesive layer 7 is 1 / 4 to 1 / 2 of the thickness of the light-emitting chip 2. Optionally, the thickness of the encapsulating adhesive layer 7 in each inner cavity 5 is equal. Optionally, the upper surface of the encapsulating adhesive layer 7 is flush with the upper surface of the light-transmitting adhesive layer 6.

[0048] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0049] The above embodiments only illustrate preferred implementations of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A light emitting device, characterized by, The light-emitting device includes: Base (1); At least two light-emitting chips (2) are disposed at intervals on the substrate (1); At least two bonding wires (3), each of the bonding wires (3) being connected between one of the light-emitting chips (2) and the substrate (1); A lens (4) is sealed on the substrate (1) and surrounds the substrate (1) to form at least two spaced cavities (5). The lens (4) includes at least two optical parts (41), which are correspondingly arranged with the at least two light-emitting chips (2). Each light-emitting chip (2) is located in one of the cavities (5). At least one light-transmitting adhesive layer (6) is disposed on all of the light-emitting chips (2).

2. The light-emitting device according to claim 1, characterized in that, The base (1) is a support, the support having at least two spaced grooves, each groove forming at least a portion of each of the inner cavities (5); or The substrate (1) is a substrate, and the lens (4) is provided with at least two spaced cavities, each cavity forming at least a portion of each inner cavity (5).

3. The light emitting device of claim 1, wherein, The light-transmitting adhesive layer (6) on each of the light-emitting chips (2) is spaced apart from the corresponding optical part (41).

4. The light emitting device of claim 1, wherein Each of the optical components (41) has an inner optical interface (411) and an outer optical interface (412), wherein the inner optical interface (411) is a concave curved surface and the outer optical interface (412) is a free-form surface.

5. The light-emitting device according to any one of claims 1 to 3, characterized in that, The at least two light-emitting chips (2) include a first light-emitting chip (21) and a second light-emitting chip (22), wherein the first light-emitting chip (21) and the second light-emitting chip (22) are arranged side by side in a vertical direction; The at least two optical units (41) include a first optical unit (413) and a second optical unit (414) connected to each other. The first optical unit (413) is disposed corresponding to the first light-emitting chip (21), and the second optical unit (414) is disposed corresponding to the second light-emitting chip (22).

6. The light emitting device of claim 5, wherein, Each of the optical components (41) has an inner optical interface (411) and an outer optical interface (412), the orthographic projection of the outer optical interface (412) onto the substrate (1) covering the orthographic projection of the inner optical interface (411) onto the substrate (1).

7. The light-emitting device according to claim 5, characterized in that, Each of the optical components (41) has an inner optical interface (411) and an outer optical interface (412), wherein the inner optical interface (411) is provided with a concave curved surface and the outer optical interface (412) is provided with a convex curved surface. The curvature of the inner optical interface (411) and outer optical interface (412) of each optical part (41) is less in the vertical direction than in the horizontal direction.

8. The light emitting device of claim 7, wherein, The maximum length of the orthographic projection of the external optical interface (412) onto the substrate (1) in the horizontal direction is greater than its maximum length in the vertical direction.

9. The light-emitting device according to claim 5, characterized in that, The first light-emitting chip (21) is provided with two light-transmitting adhesive layers (6), namely a fluorescent adhesive layer (61) and a light-diffusing adhesive layer (62); The second light-emitting chip (22) is provided with a light-transmitting adhesive layer (6), and the light-emitting surface of the light-transmitting adhesive layer (6) is a convex curved surface.

10. The light-emitting device according to any one of claims 1 to 4, wherein The light-emitting device further includes: An encapsulating adhesive layer (7) is disposed in each of the inner cavities (5) and covers the corresponding surface of the substrate (1).

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