A pressure-adjustable piezoelectric ceramic bonding device

Abstract

This utility model relates to a pressure-adjustable piezoelectric ceramic bonding device, comprising: a mounting base with a piezoelectric ceramic mounting groove; an elastic fixing mechanism fixed to one side of the mounting base for pressing the piezoelectric ceramic; and a pressure adjusting mechanism mounted on the other side of the mounting base for applying pressure to the side of the piezoelectric ceramic. The pressure adjusting mechanism includes a pressure shaft, a pressure shaft base, a spring, a spring guide pin, and a pressure adjusting component. The pressure shaft base is slidably mounted on the mounting base, and has a groove inside. One end of the pressure shaft is confined within the groove, and the spring guide pin is fixed to the other end within the groove. A spring is provided between the pressure shaft and the spring guide pin. The pressure adjusting component is mounted on the mounting base and abuts against the pressure shaft base. This utility model can bond piezoelectric ceramics while ensuring that the bonding surfaces are aligned, and can provide a suitable lateral force value to the piezoelectric ceramic, ensuring a firmly bonded and stable performance.

Description

Technical Field

[0001] This utility model relates to the field of precision measurement technology, and in particular to a pressure-adjustable piezoelectric ceramic bonding device. Background Technology

[0002] Piezoelectric ceramics have a simple structure, making them easy to manufacture miniaturized, high-speed, low-power, and highly reliable components, which plays a vital role in modern opto-mechatronic products. Sensors, actuators, transducers, and piezoelectric ultrasonic motors made of piezoelectric ceramics have been widely used in precision measurement, precision positioning, aerospace, marine exploration, ultrasonic cleaning, solid-state flaw detection, as well as medical imaging, ultrasonic diagnosis, and ultrasonic disease treatment.

[0003] However, the aforementioned small piezoelectric ceramics have the following problems during use:

[0004] (1) The ceramic must be strictly flush with the reference surface. Traditional manual bonding relies on visual alignment, which leads to tilting or offset of the bonding surface, directly affecting the linearity of the piezoelectric response.

[0005] (2) The thickness of the adhesive layer needs to be strictly controlled. Manual application of adhesive is prone to over- or under-application, and overflow adhesive will contaminate the electrode or bonding surface. After curing, manual cleaning is required, resulting in a high damage rate.

[0006] (3) The piezoelectric effect is extremely sensitive to the preload. Too little pressure will cause uneven adhesive layer, while too much pressure will cause microcracks in the ceramic. Existing tooling lacks real-time adjustment capability.

[0007] (4) The curing time is long, and traditional tooling sticks to ceramics, requiring violent disassembly, resulting in a high breakage rate and high maintenance costs. Utility Model Content

[0008] Therefore, the technical problem to be solved by this utility model is to overcome the shortcomings of the prior art and provide a pressure-adjustable piezoelectric ceramic bonding device. The elastic fixing mechanism presses the piezoelectric ceramic so that the piezoelectric ceramic can be bonded while ensuring that the bonding surfaces of the piezoelectric ceramic are aligned. By adjusting the pressure adjustment mechanism, a suitable lateral force value is provided to the piezoelectric ceramic to ensure that the piezoelectric ceramic is firmly bonded and has stable performance.

[0009] To solve the above-mentioned technical problems, this utility model provides a pressure-adjustable piezoelectric ceramic bonding device, comprising:

[0010] The mounting base is provided with a piezoelectric ceramic mounting groove for mounting piezoelectric ceramics;

[0011] An elastic fixing mechanism is fixed on one side of the mounting base to press the piezoelectric ceramic, so that the piezoelectric ceramic is tightly attached to the piezoelectric ceramic mounting groove;

[0012] A pressure regulating mechanism is installed on the other side of the mounting base to apply pressure to the side of the piezoelectric ceramic. The pressure regulating mechanism includes a pressure shaft, a pressure shaft base, a spring, a spring guide pin, and a pressure regulating component. The pressure shaft base has a groove, one end of the pressure shaft is restricted to one end of the groove, the spring guide pin is fixedly installed at the other end of the groove, a spring is provided between the pressure shaft and the spring guide pin, and the pressure regulating component is installed on the mounting base and abuts against the pressure shaft base.

[0013] In one embodiment of this utility model, the elastic fixing mechanism includes a spring plate mounting base and a plurality of spring plates. The spring plate mounting base is fixed to the mounting base by mounting base fixing screws, and the spring plates are fixed to the spring plate mounting base by the spring plate fixing screws.

[0014] In one embodiment of the present invention, the bottom of the spring plate mounting base is provided with a first groove, the first groove being adapted to the width of the mounting base.

[0015] In one embodiment of the present invention, the mounting base is provided with a mounting seat for mounting the spring mounting seat on one side of the piezoelectric ceramic mounting groove.

[0016] In one embodiment of this utility model, one end of the pressure shaft is restricted within the groove by the pressure shaft baffle and the baffle fixing screw.

[0017] In one embodiment of this utility model, the mounting base has two opposing support blocks on both sides of the piezoelectric ceramic mounting groove in the width direction, which are used to limit the position of the pressure adjustment mechanism, and a gap is provided between the two support blocks for the pressure shaft to pass through.

[0018] In one embodiment of the present invention, the bottom of the pressure shaft base is provided with a second groove, the second groove being adapted to the width of the mounting base.

[0019] In one embodiment of this utility model, an overflow groove is provided in the piezoelectric ceramic mounting groove corresponding to the adhesive area of ​​the piezoelectric ceramic.

[0020] In one embodiment of this utility model, a piezoelectric ceramic receiving groove is provided below the mounting base for removing the piezoelectric ceramic after it has been bonded and cured.

[0021] In one embodiment of this utility model, the pressure regulating component is a pressure adjusting screw, and the force on the piezoelectric ceramic is adjusted by rotating the pressure adjusting screw.

[0022] Compared with the prior art, the above-mentioned technical solution of this utility model has the following beneficial effects:

[0023] The present invention discloses a pressure-adjustable piezoelectric ceramic bonding device. The elastic fixing mechanism presses down on the piezoelectric ceramic, allowing the piezoelectric ceramic to be bonded while ensuring that the bonding surfaces are aligned. Furthermore, by adjusting the pressure adjustment mechanism, a suitable lateral force value is provided to the piezoelectric ceramic, ensuring a firm bond and stable performance.

[0024] The present invention discloses a pressure-adjustable piezoelectric ceramic bonding device. During bonding, excess adhesive can overflow into the adhesive groove of the mounting base, which can effectively prevent the piezoelectric ceramic from being stuck to the mounting base due to excess adhesive. After the piezoelectric ceramic is bonded, it can be directly left to cure and can be easily removed through the piezoelectric ceramic removal groove after curing. Attached Figure Description

[0025] To make the content of this utility model easier to understand, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0026] Figure 1 This is a schematic diagram of the structure of the pressure-adjustable piezoelectric ceramic bonding device in a preferred embodiment of the present invention;

[0027] Figure 2 This is a structural schematic diagram of the mounting base of this utility model;

[0028] Figure 3 This is a schematic diagram of the elastic fixing mechanism of this utility model;

[0029] Figure 4 This is a schematic diagram of the pressure regulating mechanism of this utility model;

[0030] Figure 5 This is an exploded schematic diagram of the pressure regulating mechanism of this utility model;

[0031] Figure 6 This is a cross-sectional view of the installation of the pressure-adjustable piezoelectric ceramic bonding device of this utility model;

[0032] Figure 7 This is a schematic diagram of the mounting base and piezoelectric ceramic of this utility model;

[0033] Figure 8 This is a schematic diagram of a structure in which multiple pressure-adjustable piezoelectric ceramic bonding devices are installed side by side on a fixed rod and a fixed base;

[0034] Explanation of reference numerals in the accompanying drawings: 1. Mounting base; 11. Piezoelectric ceramic mounting groove; 12. Positioning seat; 13. Alignment block; 14. Glue overflow groove; 15. Piezoelectric ceramic dispensing groove; 2. Elastic fixing mechanism; 21. Spring mounting seat; 211. First groove; 22. Spring; 23. Spring fixing screw; 24. Mounting seat fixing screw; 3. Pressure adjustment mechanism; 31. Pressure shaft; 32. Pressure shaft baffle; 33. Pressure shaft base; 331. Second groove; 34. Baffle fixing screw; 35. Spring; 36. Spring guide pin; 37. Pressure adjusting component; 100. Piezoelectric ceramic; 200. Fixing rod; 300. Fixing base. Detailed Implementation

[0035] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments are not intended to limit the present invention.

[0036] Reference Figure 1-7 As shown, this utility model discloses a pressure-adjustable piezoelectric ceramic bonding device, comprising:

[0037] Mounting base 1, wherein the mounting base 1 is provided with a piezoelectric ceramic mounting groove 11 for mounting piezoelectric ceramic;

[0038] The elastic fixing mechanism 2 is fixed on one side of the mounting base 1 to press the piezoelectric ceramic 100 so that the piezoelectric ceramic 100 is tightly attached to the piezoelectric ceramic mounting groove 11.

[0039] A pressure regulating mechanism 3, installed on the other side of the mounting base 1, applies pressure to the side of the piezoelectric ceramic 100. The pressure regulating mechanism 3 includes a pressure shaft 31, a pressure shaft baffle 32, a pressure shaft base 33, a baffle fixing screw 34, a spring 35, a spring guide pin 36, and a pressure regulating component 37. The pressure shaft base 33 has a groove. The pressure shaft baffle 32, through the baffle fixing screw 34, restricts one end of the pressure shaft 31 within the groove. The spring guide pin 36 is fixedly disposed at the other end of the groove. A spring 35 is provided between the pressure shaft 31 and the spring guide pin 36. The pressure regulating component 37 is disposed on the mounting base 1 and contacts the pressure shaft base 33. The pressure regulating component 37 is a pressure regulating screw; by rotating and adjusting the pressure regulating screw, the force on the piezoelectric ceramic 100 can be adjusted.

[0040] Furthermore, the elastic fixing mechanism 2 includes a spring plate mounting base 21 and a plurality of spring plates 22. The spring plate mounting base 21 is fixed to the mounting base 1 by mounting base fixing screws 24, and the spring plates 22 are fixed to the spring plate mounting base 21 by spring plate fixing screws 23. The spring plates 22 can be replaced with different stiffnesses to achieve the goal of appropriate force on the piezoelectric ceramic 100.

[0041] Furthermore, the bottom of the spring mounting base 21 is provided with a first groove 211, which is adapted to the width of the mounting base 1. The first groove 211 and the width of the mounting base 1 are adapted to form a positioning reference surface, eliminating the need for additional calibration during assembly and improving installation efficiency.

[0042] In this embodiment, the mounting base 1 is provided with a positioning seat 12 for mounting the spring plate mounting seat 21 on one side of the piezoelectric ceramic mounting groove 11.

[0043] Furthermore, two opposing abutment blocks 13 are provided on both sides of the piezoelectric ceramic mounting groove 11 on the mounting base 1, which are used to limit the position of the pressure regulating mechanism 3. A gap is provided between the two abutment blocks 13 for the pressure shaft 31 to pass through. When the pressure shaft baffle 32 in the pressure regulating mechanism 3 contacts the abutment block 13, the maximum output force of the spring 35 is achieved. The operator can accurately control the maximum pressure without experience, avoiding the risk of human overpressure. At the same time, the spacing of the abutment blocks 13 is adjustable to adapt to ceramics of different thicknesses.

[0044] In this embodiment, the bottom of the pressure shaft base 33 is provided with a second groove 331, which is adapted to the width of the mounting base 1. The second groove 331 at the bottom of the pressure shaft base 33 is adapted to the width of the mounting base 1, forming a sliding guide structure to ensure the straightness of the movement of the pressure shaft 31.

[0045] Furthermore, an overflow groove 14 is provided in the piezoelectric ceramic mounting groove 11 corresponding to the adhesive application point of the piezoelectric ceramic 100. This design effectively prevents excess adhesive from sticking the piezoelectric ceramic 100 to the mounting base 1 so that it cannot be removed.

[0046] In this embodiment, a piezoelectric ceramic receiving slot 15 is provided below the mounting base 1 for removing the piezoelectric ceramic 100 after it has been bonded and cured.

[0047] The pressure-adjustable piezoelectric ceramic bonding device based on the above structure is used as follows:

[0048] (1) A layer of adhesive with controllable thickness is uniformly coated on the bonding surface of the piezoelectric ceramic 100; wherein the bonding surface of the piezoelectric ceramic 100 is the piezoelectric ceramic load surface;

[0049] (2) Place the piezoelectric ceramic 100 after applying adhesive into the piezoelectric ceramic mounting groove 11 of the mounting base 1, and use the elastic fixing mechanism 2 to keep the bonding surface of the piezoelectric ceramic 100 flush with the reference surface of the piezoelectric ceramic mounting groove 11.

[0050] (3) Apply adjustable pressure to the side of the piezoelectric ceramic 100 using the pressure adjustment mechanism 3, rotate the pressure adjustment component 37, push the pressure shaft base 33 to slide along the mounting base 1, and drive the pressure shaft 31 to move towards the side of the ceramic; after the pressure shaft 31 contacts the side of the ceramic, continue to use the pressure adjustment component 37, the spring 35 is compressed, and elastic pressure is generated. The pressure is proportional to the compression of the spring 35. The number of rotations of the pressure adjustment component 37 directly corresponds to the pressure value, realizing stepless adjustment; when the pressure shaft baffle 32 contacts the positioning block 13, the spring 35 reaches the maximum compression and the pressure reaches the upper limit.

[0051] (4) After the set pressure is reached, stop rotating the pressure regulating component 37. The spring 35 maintains a constant compression amount. The piezoelectric ceramic 100 is subjected to stable pressure on its side. Under this pressure, the adhesive is cured and the adhesive layer thickness is uniform. The adhesive is cured under constant temperature conditions and then naturally cooled to room temperature after curing.

[0052] (5) After curing, the reverse pressure adjustment component 37 and the spring 35 rebound, the pressure shaft 31 separates from the piezoelectric ceramic 100, the pressure is completely released, and the ceramic is quickly taken out through the piezoelectric ceramic taking slot 15 to complete the entire pressure adjustment and bonding process.

[0053] like Figure 8 As shown, multiple pressure-adjustable piezoelectric ceramic bonding devices with the above-mentioned structures are installed side by side on the fixing rod 200 and the fixing base 300 to achieve simultaneous bonding and curing of multiple piezoelectric ceramics 100, ensuring that multiple firmly bonded and stable piezoelectric ceramics 100 are obtained.

[0054] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.

Claims

1. A piezoceramic adhesive device with adjustable pressure, characterized in that include: The mounting base is provided with a piezoelectric ceramic mounting groove for mounting piezoelectric ceramics; An elastic fixing mechanism is fixed on one side of the mounting base to press the piezoelectric ceramic, so that the piezoelectric ceramic is tightly attached to the piezoelectric ceramic mounting groove; A pressure regulating mechanism is installed on the other side of the mounting base to apply pressure to the side of the piezoelectric ceramic. The pressure regulating mechanism includes a pressure shaft, a pressure shaft base, a spring, a spring guide pin, and a pressure regulating component. The pressure shaft base is slidably disposed on the mounting base. The pressure shaft base has a groove. One end of the pressure shaft is restricted within the groove. The spring guide pin is fixedly disposed within the groove. A spring is provided between the pressure shaft and the spring guide pin. The pressure regulating component is disposed on the mounting base and abuts against the pressure shaft base.

2. The pressure-adjustable piezoelectric ceramic bonding device according to claim 1, characterized in that, The elastic fixing mechanism includes a spring plate mounting base and a plurality of spring plates. The spring plate mounting base is fixed to the mounting base by mounting base fixing screws, and the spring plates are fixed to the spring plate mounting base by the spring plate fixing screws.

3. A piezoceramic adhesive device with adjustable pressure according to claim 2, characterized in that The bottom of the spring mounting base is provided with a first groove, which is adapted to the width of the mounting base.

4. A piezoceramic adhesive device with adjustable pressure according to claim 2, characterized in that The mounting base has a mounting seat for mounting the spring mounting seat on one side of the piezoelectric ceramic mounting groove.

5. A piezoceramic bonding device with adjustable pressure according to claim 1, characterized in that One end of the pressure shaft is constrained within the slot by the pressure shaft baffle and baffle fixing screws.

6. A piezoceramic bonding device with adjustable pressure according to claim 1, characterized in that The mounting base has two opposing positioning blocks on either side of the piezoelectric ceramic mounting groove in the width direction, which are used to limit the position of the pressure adjustment mechanism. A gap is provided between the two positioning blocks to allow the pressure shaft to pass through.

7. A piezoceramic bonding device with adjustable pressure according to claim 1, characterized in that The bottom of the pressure shaft base is provided with a second groove, which is adapted to the width of the mounting base.

8. A piezoceramic bonding device with adjustable pressure according to claim 1, characterized in that An overflow groove is provided in the piezoelectric ceramic mounting groove corresponding to the adhesive application point of the piezoelectric ceramic.

9. A piezoceramic bonding device with adjustable pressure according to claim 1, characterized in that The mounting base has a piezoelectric ceramic removal slot at the bottom for removing the piezoelectric ceramic after it has been bonded and cured.

10. A piezoceramic bonding device with adjustable pressure according to claim 1, characterized in that The pressure regulating component is a pressure adjusting screw, which is used to adjust the force on the piezoelectric ceramic by rotating the pressure adjusting screw.

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