A wafer cleaning apparatus for multiple specifications

Abstract

This application relates to the field of wafer cleaning technology, specifically disclosing a wafer cleaning apparatus for multiple specifications, comprising: multiple fixture bodies and connectors; a lifting handle is provided on the top of each fixture body; a support rod is provided on the bottom of each fixture body; the support rod is provided with a support groove and a connecting hole; the bottom of the support groove is sealed and opens in a first direction; the two ends of the connector are respectively connected to the connecting holes of two fixture bodies, so that a placement area for placing wafers is formed between the support grooves of the two fixture bodies, and the connector can adjust the distance between the two fixture bodies. In this solution, after the two fixture bodies are connected by the connector, the wafer can be placed in the support groove, and the distance between the two support grooves can be adjusted by the connector to accommodate wafers of different sizes. When manual handling is required, the fixture body can be lifted by pulling the handle, improving the convenience of manual transfer by the operator.

Description

Technical Field

[0001] This application relates to the field of wafer cleaning technology, and more particularly to a wafer cleaning apparatus for multiple specifications. Background Technology

[0002] In semiconductor device manufacturing, wafer cleaning is one of the core processes throughout the entire process, used to remove various contaminants from the wafer surface. Immersion cleaning is one type of wafer cleaning method. The process involves placing the wafer on a fixture, which is then placed into a cleaning tank. An ultrasonic device in the cleaning unit transmits high-frequency vibrations to the cleaning solution, causing tiny bubbles to be generated in the liquid and releasing localized impact force onto the wafer. Combined with the chemical dissolution and complexation effects of the cleaning solution, contaminants such as nanoscale particles, metal ions, and photoresist residue attached to the wafer surface are efficiently removed.

[0003] In practical applications, wafers come in various specifications, while existing tooling is limited to a single type, meaning it can only accommodate wafers of a uniform size. When dealing with wafers of multiple specifications, frequent tooling changes are necessary, which introduces contamination and increases process instability. Furthermore, in laboratory settings, small batches of wafers often require cleaning. Automated cleaning equipment is costly and inefficient, often requiring manual handling of the tooling, which is inconvenient with existing tools. Utility Model Content

[0004] In view of this, the purpose of this application is to provide a wafer cleaning apparatus for multiple specifications, which solves some or all of the above-mentioned problems.

[0005] To achieve the above technical objectives, this application provides a wafer cleaning apparatus for multiple specifications, comprising: multiple tooling bodies and connectors;

[0006] The top of the tooling body is provided with a lifting handle;

[0007] The bottom of the tooling body is provided with a support rod;

[0008] The support rod is provided with a support groove and a connection hole;

[0009] The bottom of the support groove is sealed and opens in the first direction;

[0010] The two ends of the connector are respectively connected to the connection holes of the two tooling bodies, so that a placement area for placing wafers is formed between the support grooves of the two tooling bodies, and the connector can adjust the distance between the two tooling bodies.

[0011] Furthermore, the connecting hole is a threaded hole;

[0012] The connecting component is a threaded rod.

[0013] Furthermore, the connecting hole is a through hole.

[0014] Furthermore, a top connecting rod is provided at the middle of the main body of the tooling along the vertical direction;

[0015] The top connecting rod is provided with a top connecting groove;

[0016] The top groove extends vertically and opens towards the first direction;

[0017] The supporting groove and the top connecting groove are located on the same vertical plane;

[0018] The top groove is used to abut the side of the wafer.

[0019] Furthermore, the top connecting rods are provided on both sides of the main body of the tooling;

[0020] The top connecting rod is an L-shaped rod.

[0021] Furthermore, the supporting rod includes a first rod and a second rod;

[0022] The first rod is provided on both sides of the tooling body;

[0023] The first member is an L-shaped member;

[0024] The second member is disposed between the two first members;

[0025] The support groove is provided on the first rod;

[0026] The connecting hole is provided on the second rod.

[0027] Furthermore, the top groove and the support groove have the same width, which is 2.2 to 2.5 mm.

[0028] Furthermore, the lifting handle is an L-shaped rod.

[0029] Furthermore, it also includes a cleaning tank and an ultrasonic cleaning assembly;

[0030] The cleaning tank is used to place the tooling body inside;

[0031] The ultrasonic cleaning assembly is used to perform ultrasonic cleaning on the objects in the cleaning tank.

[0032] Furthermore, the ultrasonic cleaning assembly is equipped with an adjustment button;

[0033] The adjustment button is used to control the cleaning frequency and cleaning duration of the ultrasonic cleaning component.

[0034] As can be seen from the above technical solutions, this application provides a wafer cleaning apparatus for multiple specifications, including: multiple tooling bodies and connectors; a lifting handle is provided on the top of the tooling body; a support rod is provided on the bottom of the tooling body; a support groove and a connecting hole are provided on the support rod; the bottom of the support groove is sealed and opens in a first direction; the two ends of the connector are respectively connected to the connecting holes of two tooling bodies, so that a placement area for placing wafers is formed between the support grooves of the two tooling bodies, and the connector can adjust the distance between the two tooling bodies.

[0035] In this design, the two fixture bodies are connected by connectors, allowing the wafer to be placed in the support slots. The spacing between the two support slots can be adjusted using the connectors to accommodate wafers of different sizes. When manual handling is required, the fixture body can be lifted by pulling the handle, improving the convenience of manual transfer for workers. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0037] Figure 1 A schematic diagram of a tooling main body for a multi-specification wafer cleaning apparatus provided in an embodiment of this application;

[0038] Figure 2 A schematic diagram of the overall structure of a wafer cleaning apparatus for multiple specifications provided in an embodiment of this application;

[0039] In the diagram: 10. Tooling body; 11. Lifting handle; 12. Top connecting rod; 121. Top connecting groove; 13. Supporting rod; 131. Supporting groove; 132. Connecting hole; 133. First rod; 134. Second rod; 20. Connecting piece. Detailed Implementation

[0040] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments in this application specification, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection claimed in this application.

[0041] In the description of the embodiments of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0042] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a replaceable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0043] Please see Figure 1 and Figure 2 This application provides a wafer cleaning apparatus for multiple specifications, comprising: multiple tooling bodies 10 and connectors 20; a lifting handle 11 is provided on the top of the tooling body 10; a support rod 13 is provided on the bottom of the tooling body 10; a support groove 131 and a connecting hole 132 are provided on the support rod 13; the bottom of the support groove 131 is sealed and opens in a first direction; the two ends of the connector 20 are respectively connected to the connecting holes 132 of two tooling bodies 10, so that a placement area for placing wafers is formed between the support grooves 131 of the two tooling bodies 10, and the connector 20 can adjust the distance between the two tooling bodies 10.

[0044] In this plan, the first direction is as follows: Figure 1 As shown in the x-axis direction. When the connector 20 connects the two tooling bodies 10, the support grooves 131 of the two tooling bodies 10 are arranged facing each other. The connector 20 can be used to adjust the two tooling bodies 10 to move closer or further apart, thereby adjusting the distance between the two support grooves 131 along the first direction to identify wafers of different diameters.

[0045] After the wafer is placed, the operator can lift the fixture body 10 using the handle 11 and then place it into the cleaning tank. The handle 11 allows the operator to lift and move the fixture body 10, avoiding the need for special protective equipment to isolate the cleaning fluid during the transfer of existing fixtures, thus reducing the complexity of the transfer process.

[0046] In one implementation, the support groove 131 can be configured as a groove with a vertical length direction, so that the support groove 131 can provide support for the side of the wafer placed in the support groove 131, thereby improving the stability of the wafer after placement.

[0047] In one implementation, the connector 20 can be a telescopic rod that can extend and retract to adjust the distance between the two tooling bodies 10.

[0048] In one implementation, the number of tooling bodies 10 is multiple, specifically an even number, and they are arranged in pairs to form multiple tooling structures for placing wafers. Each tooling structure may be connected by one or more connectors 20.

[0049] In one embodiment, the connecting hole 132 is a threaded hole; the connecting member 20 is a threaded rod. The connecting member 20 can be a double-ended screw, with opposite screw structures at both ends. This allows the two tooling bodies 10 to be moved closer or further apart by rotating the connecting member 20 after the two tooling bodies 10 are fixed.

[0050] In one embodiment, the connection hole 132 is a through hole.

[0051] The connector 20 can be a bolt structure, so that the threaded rod of the connector 20 can pass through the connecting hole 132 of one tooling body 10 and connect to another tooling body 10. The operator can rotate the connector 20 by rotating the nut end of the connector 20.

[0052] In one embodiment, a top-connecting rod 12 is provided in the middle of the tooling body 10 along the vertical direction; the top-connecting rod 12 is provided with a top-connecting groove 121; the top-connecting groove 121 is through in the vertical direction and opens towards the first direction; the supporting groove 131 and the top-connecting groove 121 are located on the same vertical plane; the top-connecting groove 121 is used to top-connect the side of the wafer.

[0053] In this embodiment, the top connecting rod 12 can reduce the vertical dimensions of the support rod 13 and the support groove 131, so that the top connecting rod 12 and the support rod 13 can form a frame-like structure, thereby reducing the contact area between the tooling structure and the cleaning fluid, thus reducing the area of ​​the tooling structure blocking the wafer, and allowing the wafer to fully contact the cleaning fluid to ensure the cleaning effect.

[0054] Specifically, in this embodiment, the top groove 121 can abut against the side of the wafer to fix the wafer, while avoiding obstruction of the wafer's end face.

[0055] In one implementation, the top groove 121 and the support groove 131 have the same width, which is 2.2 to 2.5 mm, so that the top groove 121 and the support groove 131 can accommodate commonly used wafers with a thickness of 0.5 mm to 2 mm, and space is reserved in the thickness direction of the wafer to reduce wear on the wafer end face while ensuring that the wafer end face is in full contact with the cleaning fluid.

[0056] In one embodiment, top connecting rods 12 are provided on both sides of the tooling body 10; the top connecting rods 12 are L-shaped rods.

[0057] In applications, the lifting handle 11 can also be configured as an L-shaped rod. The top connecting rods 12 are symmetrically arranged on both sides of the lifting handle 11. With the above structure, on the one hand, the tooling structure can carry multiple wafers, and on the other hand, when the operator lifts the lifting handle 11, the risk of the operator coming into contact with the wafers can be reduced, thus reducing the risk of wafer damage and contamination.

[0058] In one implementation, the support rod 13 may be provided with two support grooves 131 to correspond to two top connecting rods 12 simultaneously.

[0059] In one embodiment, the support rod 13 includes a first rod 133 and a second rod 134; the tooling body 10 has a first rod 133 on both sides; the first rod 133 is an L-shaped rod; the second rod 134 is disposed between the two first rods 133; the support groove 131 is disposed on the first rod 133; and the connecting hole 132 is disposed on the second rod 134.

[0060] In this embodiment, two first rods 133 are respectively disposed directly below the two top connecting rods 12. A second rod 134 is disposed directly below the lifting handle 11. The lifting handle 11, the first rods 133, the second rod 134, and the top connecting rods 12 form a frame structure, which can ensure sufficient contact between the cleaning fluid and the wafer. At the same time, during the process of placing the fixture structure into the cleaning tank, the cleaning fluid can pass through the hollow area of ​​the fixture structure and quickly cover the wafer.

[0061] In one embodiment, the device further includes a cleaning tank and an ultrasonic cleaning assembly; the cleaning tank is used for placing the tooling body; the ultrasonic cleaning assembly is used for ultrasonic cleaning of the objects in the cleaning tank.

[0062] In this embodiment, the cleaning tank and ultrasonic cleaning assembly can use the structure of the prior art, so they will not be described in detail in this embodiment.

[0063] Furthermore, the ultrasonic cleaning assembly is equipped with an adjustment button; the adjustment button is used to control the cleaning frequency and cleaning duration of the ultrasonic cleaning assembly.

[0064] Similarly, the method of adjusting the button to control the cleaning frequency and cleaning duration can be the same as the existing electronic control module, so it will not be described in detail in this embodiment.

[0065] The above are merely preferred embodiments of this application and are not intended to limit the present invention. Although the present application has been described in detail with reference to examples, those skilled in the art can still modify the technical solutions described in the foregoing examples or make equivalent substitutions for some of the technical features. However, any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A multi-specification wafer cleaning apparatus, comprising: include: Multiple tooling bodies (10) and connectors (20); The tooling body (10) is provided with a lifting handle (11) on its top. The bottom of the tooling body (10) is provided with a support rod (13). The support rod (13) is provided with a support groove (131) and a connecting hole (132). The bottom of the support groove (131) is sealed and opens in the first direction; The two ends of the connector (20) are respectively connected to the connection holes (132) of the two tooling bodies (10) so that a placement area for placing the wafer is formed between the support grooves (131) of the two tooling bodies (10), and the connector (20) can adjust the distance between the two tooling bodies (10).

2. The apparatus for cleaning wafers of multiple specifications according to claim 1, wherein The connecting hole (132) is a threaded hole; The connector (20) is a threaded rod.

3. The apparatus for cleaning wafers of multiple specifications according to claim 2, wherein The connecting hole (132) is a through hole.

4. The apparatus for cleaning wafers of multiple specifications according to claim 1, wherein The tooling body (10) is provided with a top connecting rod (12) in the middle of the vertical direction. The top connecting rod (12) is provided with a top connecting groove (121); The top groove (121) extends vertically and opens toward the first direction; The supporting groove (131) and the top connecting groove (121) are located on the same vertical plane; The top groove (121) is used to abut the side of the wafer.

5. The apparatus for cleaning wafers of multiple specifications according to claim 4, wherein The tooling body (10) is provided with top connecting rods (12) on both sides. The top connecting rod (12) is an L-shaped rod; The lifting handle (11) is located in the middle of the tooling body (10).

6. The apparatus for cleaning wafers of multiple specifications according to claim 5, wherein The supporting rod (13) includes a first rod (133) and a second rod (134). The tooling body (10) is provided with the first rod (133) on both sides. The first member (133) is an L-shaped member; The second member (134) is disposed between the two first members (133); The support groove (131) is provided on the first rod (133). The connecting hole (132) is provided on the second rod (134).

7. The apparatus for cleaning wafers of multiple specifications as recited in claim 4, wherein The top groove (121) and the support groove (131) have the same width, which is 2.2 to 2.5 mm.

8. The apparatus for cleaning wafers of multiple specifications as recited in claim 1, wherein The lifting handle (11) is an L-shaped rod.

9. The apparatus for cleaning wafers of multiple specifications as recited in claim 1, wherein It also includes a cleaning tank and an ultrasonic cleaning assembly; The cleaning tank is used to place the tooling body inside; The ultrasonic cleaning assembly is used to perform ultrasonic cleaning on the objects in the cleaning tank.

10. The apparatus for cleaning wafers of multiple specifications according to claim 9, wherein, The ultrasonic cleaning component is equipped with an adjustment button. The adjustment button is used to control the cleaning frequency and cleaning duration of the ultrasonic cleaning component.

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