A semiconductor manufacturing apparatus and machine

Abstract

This invention provides a semiconductor manufacturing apparatus and machine tool. The apparatus includes a rotary table, multiple process tank assemblies, and a support mechanism. The rotary table is capable of rotation, and its rotation axis extends vertically. The multiple process tank assemblies are arranged at intervals around the rotation axis. Each process tank assembly includes a tank body, a first driving part, and a connecting part. The tank body includes a main body and a cover. The main body has a process cavity, the upper end of which is open. The main body is connected to the rotary table via the first driving part and can move vertically under the drive of the first driving part. The cover is located above the main body and can be closed onto the upper end of the main body. The cover is connected to the rotary table via the connecting part. The support mechanism includes a suction cup, which is horizontally arranged and located above the rotary table but below the cover. The distance from the suction cup to the rotation axis is adapted to the distance from the tank body to the rotation axis. The apparatus can be used to perform etching or electroless plating operations on single wafers to improve the uniformity of etching or electroless plating and reduce wafer breakage.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing equipment technology, specifically relating to a semiconductor manufacturing apparatus and machine. Background Technology

[0002] One existing wafer-level etching operation involves rotating the wafer, which is held in place by a chuck, while simultaneously moving a nozzle positioned above the wafer from its center to its edge or vice versa, spraying etching solution onto the wafer. This method presents two problems: firstly, the etching amount is inconsistent between the wafer's center and edge, resulting in a wafer that is either upright or inverted; secondly, there is a risk of wafer breakage during rotation.

[0003] Furthermore, in existing technologies, when performing multi-step etching on a wafer or during the wafer cleaning process after etching, the wafer needs to be transferred between different process cavities, and the wafer may break during the transfer process. Utility Model Content

[0004] The purpose of this invention is to provide a semiconductor manufacturing apparatus and machine to solve the aforementioned technical problems.

[0005] To achieve the above objectives, this utility model provides a semiconductor manufacturing apparatus, comprising:

[0006] A rotary table is capable of rotating about a vertically extending axis of rotation.

[0007] Multiple process tank assemblies are arranged at intervals around the rotation axis; each process tank assembly includes a tank body, a first drive unit, and a connecting part; the tank body includes a main body and a cover, the main body being a hollow structure with a process cavity, the upper end of the process cavity being open, the main body being connected to the rotary table via the first drive unit, and being able to move vertically under the drive of the first drive unit; the cover is located above the main body and is used to cover the upper end of the main body to close the opening, the cover being connected to the rotary table via the connecting part; the tank body is provided with a clearance opening, the clearance opening being located at the junction of the main body and the cover; and,

[0008] The support mechanism includes a support arm and a suction cup; the support arm is correspondingly arranged with respect to the clearance opening; the suction cup is disposed on the support arm and arranged horizontally, the suction cup is located above the rotating table and below the cover, and the distance from the suction cup to the rotation axis is adapted to the distance from the groove to the rotation axis.

[0009] Optionally, the joint includes a joint body and a second drive part. The joint body is connected to the rotary table, and the second drive part connects the joint body and the cover. The second drive part body is configured to drive the cover to move in a vertical direction.

[0010] Optionally, the clearance opening is disposed on the main body; or, the clearance opening is disposed on the cover; or, the clearance opening includes a first sub-clearance opening and a second sub-clearance opening, the first sub-clearance opening being located on the main body and the second sub-clearance opening being located on the cover and aligned with the first sub-clearance opening.

[0011] Optionally, the cover is provided with an exhaust port; the semiconductor manufacturing apparatus further includes an exhaust mechanism disposed at the exhaust port.

[0012] Optionally, the support arm includes a first sub-support arm, a second sub-support arm, and a third sub-support arm connected in sequence, with the end of the third sub-support arm away from the second sub-support arm connected to the suction cup; the first sub-support arm is higher than the suction cup.

[0013] Optionally, the process tank assembly further includes a circulation mechanism, which includes an inlet pipe, a drain pipe, a circulation pipe, a pump, and a filter. The outlet end of the inlet pipe is connected to the main body, the inlet end of the drain pipe is connected to the main body, one end of the circulation pipe is connected to the inlet pipe, and the other end is connected to the drain pipe. The pump and the filter are sequentially arranged on the circulation pipe.

[0014] Optionally, one end of the circulation pipe is connected to the inlet pipe via a three-way valve, and the other end is connected to the outlet pipe via a three-way valve.

[0015] Optionally, the circulation mechanism of at least a portion of the process tank assembly further includes a heater disposed on the circulation pipe.

[0016] Optionally, the semiconductor manufacturing apparatus is a wet etching apparatus or a chemical plating apparatus.

[0017] To achieve the above objectives, the present invention also provides a machine tool, including a control unit and a semiconductor manufacturing apparatus as described in any of the preceding claims, wherein the control unit is communicatively connected to the rotary table and the first drive unit, and the control unit is configured to control the rotary table to rotate about the rotation axis and to control the first drive unit to drive the main body to move in the vertical direction.

[0018] Compared with the prior art, the semiconductor manufacturing apparatus and machine of this utility model have the following advantages:

[0019] The aforementioned semiconductor manufacturing apparatus includes a rotary table, multiple process tank assemblies, and a support mechanism. The rotary table is capable of rotating about a rotation axis extending vertically. The multiple process tank assemblies are arranged at intervals around the rotation axis. Each process tank assembly includes a tank body, a first drive unit, and a connecting part. The tank body includes a separate main body and a cover. The main body is a hollow structure with a process cavity, the upper end of which is open to form an opening. The main body is connected to the rotary table via the first drive unit and is capable of rotating vertically under the drive of the first drive unit. The cover is located above the main body and is used to cover the upper end of the main body to close the opening; the cover is connected to the rotating platform through the joint; the groove is provided with a clearance opening, which is located at the junction of the main body and the cover; the support mechanism includes a support arm and a suction cup, the support arm being correspondingly arranged with the clearance opening; the suction cup is disposed on the support arm and arranged horizontally, the suction cup is located above the rotating platform and below the cover, and the distance from the suction cup to the rotation axis is adapted to the distance from the groove to the rotation axis. The semiconductor manufacturing apparatus can be used to perform preset operations on a single wafer. The preset operations are etching or electroless plating. During the preset operation, the process chamber is filled with process liquid, the chuck adsorbs the wafer, and the rotation of the rotary table can align the wafer with different tanks. When the wafer is aligned with any tank, the first driving unit drives the corresponding main body to move up and down to allow the wafer to enter or leave the corresponding process liquid. This operation method can improve the etching uniformity of the wafer when the preset operation is etching and improve the uniformity of the plating layer formed on the wafer surface when the preset operation is electroless plating. On the other hand, it eliminates the need for wafer movement, avoiding the problem of wafer breakage caused by movement. Attached Figure Description

[0020] The accompanying drawings are provided to better understand this utility model and do not constitute an undue limitation on it. Wherein:

[0021] Figure 1 This is a schematic diagram of the structure of a semiconductor manufacturing apparatus according to an embodiment of the present invention;

[0022] Figure 2 This is a partial structural schematic diagram of a semiconductor manufacturing apparatus provided according to an embodiment of the present invention. Only one process tank assembly is shown in the figure, and the suction cup is aligned with the tank body but located outside the process cavity.

[0023] Figure 3This is a partial structural schematic diagram of a semiconductor manufacturing apparatus provided according to an embodiment of the present invention. In the diagram, the cover of a process tank assembly is closed on the upper end of the main body, and the suction cup and the wafer it adsorbs are located inside the process cavity.

[0024] Figure 4 This is a partial structural schematic diagram of a semiconductor manufacturing equipment according to an embodiment of the present invention, in which an avoidance opening is provided on the main body.

[0025] Figure 5 This is a partial structural schematic diagram of a semiconductor manufacturing equipment according to an embodiment of the present invention, wherein the clearance opening in the diagram is provided on the cover;

[0026] Figure 6 This is a partial structural schematic diagram of a semiconductor manufacturing equipment according to an embodiment of the present invention. In the diagram, part of the clearance opening is disposed on the cover and part is disposed on the main body.

[0027] Figure 7 This is a partial structural schematic diagram of a semiconductor manufacturing equipment according to an embodiment of the present invention, showing a circulation mechanism.

[0028] [The reference numerals in the attached drawings are explained as follows]: 100 - Rotary table, 200 - Process tank assembly, 210 - Tank body, 211 - Main body, 2112 - Bottom wall, 2113 - First side wall, 212 - Cover, 2121 - Top wall, 2122 - Second side wall, 2111 - Process cavity, 2101 - Clearance opening, 2101a - First sub-clearance opening, 2101b - Second sub-clearance opening, 220 - First drive unit, 230 - Joint part 231-Joint body, 232-Second drive unit, 240-Circulation mechanism, 241-Inlet pipe, 242-Drain pipe, 243-Circulation pipe, 244-Pump, 245-Filter, 246-Heater, 300-Support mechanism, 310-Support arm, 311-First sub-support arm, 312-Second sub-support arm, 313-Third sub-support arm, 320-Suction cup, 400-Exhaust mechanism, 10-Wafer. Detailed Implementation

[0029] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Therefore, the drawings only show components related to this utility model and are not drawn according to the actual number, shape, and size of the components in implementation. In actual implementation, the type, quantity, and proportion of each component can be arbitrarily changed, and the component layout may also be more complex.

[0030] Furthermore, while each embodiment described below possesses one or more technical features, this does not imply that users of this utility model must simultaneously implement all technical features in any embodiment, or can only separately implement some or all technical features in different embodiments. In other words, provided it is feasible, those skilled in the art can selectively implement some or all technical features in any embodiment, or selectively implement a combination of some or all technical features in multiple embodiments, based on the disclosure of this utility model and depending on design specifications or implementation requirements, thereby increasing the flexibility in implementing this utility model.

[0031] As used herein, the singular forms “a,” “an,” and “the” include plural objects, and the plural form “a plurality” includes two or more objects, unless otherwise expressly indicated. As used herein, the term “or” is generally used to include the meaning of “and / or,” unless otherwise expressly indicated, and the terms “install,” “connect,” and “link” should be interpreted broadly, for example, as a fixed connection, a detachable connection, or an integral connection. Connections can be mechanical or electrical. Connections can be direct or indirect through an intermediate medium, and can represent internal communication between two elements or an interaction between two elements. Relational terms such as “first,” “second,” etc., are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations, nor do they indicate relative importance or implicitly specify the number of indicated technical features. Those skilled in the art will understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0032] One objective of this invention is to provide a semiconductor manufacturing apparatus that can perform preset operations on a single wafer. During these preset operations, the wafer does not need to move, thereby avoiding the problem of wafer breakage due to movement. The preset operation can be an etching operation or a chemical plating operation. When the preset operation is etching, the application of this semiconductor manufacturing apparatus can improve etching uniformity; when the preset operation is chemical plating, the application of this semiconductor manufacturing apparatus can improve the uniformity of the plating layer formed on the wafer surface.

[0033] To make the objectives, advantages, and features of this utility model clearer, the following detailed description is provided in conjunction with the accompanying drawings. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to conveniently and clearly illustrate the objectives of the embodiments of this utility model. The same or similar reference numerals in the drawings represent the same or similar parts.

[0034] like Figures 1 to 6 As shown, the semiconductor manufacturing apparatus provided in this embodiment of the present invention includes a rotary table 100, a process tank assembly 200, and a support mechanism 300.

[0035] The rotary table 100 is configured to rotate, and the rotation axis S of the rotary table 100 extends in the vertical direction when it rotates.

[0036] The number of process tank assemblies 200 is plurality of, and the plurality of process tank assemblies 200 are arranged at intervals around the rotation axis S, preferably at equal intervals. Each process tank assembly 200 includes a tank body 210, a first driving part 220, and a connecting part 230. The tank body 210 includes a split main body 211 and a cover 212. The main body 211 is a hollow structure with a process cavity 2111, the upper end of which is open to form an opening. The main body 211 is connected to the rotary table 100 through the first driving part 220 and is capable of moving vertically under the drive of the first driving part 220. The cover 212 is located above the main body 211 and is used to cover the upper end of the main body 211 to close the opening. The cover 212 is connected to the rotary table 100 through the connecting part 230. The groove 210 is provided with a clearance opening 2101, which is located at the junction of the main body 211 and the cover 212.

[0037] The support mechanism 300 includes a support arm 310 and a suction cup 320. The support arm 310 is correspondingly disposed with respect to the clearance opening 2101. The suction cup 320 is connected to the support arm 310 and is arranged horizontally. The suction cup 320 is located above the rotating table 100 and below the cover 212. The distance from the suction cup 320 to the rotation axis S is adapted to the distance from the groove 210 to the rotation axis S.

[0038] The semiconductor manufacturing apparatus is used to perform a predetermined operation on a single wafer 10. In some cases, the semiconductor manufacturing apparatus is a wet etching apparatus, and correspondingly, the predetermined operation is an etching operation. In other cases, the semiconductor manufacturing apparatus is a chemical plating apparatus, and the predetermined operation is correspondingly a chemical plating operation. During the predetermined operation on the wafer 10 using the semiconductor manufacturing apparatus, the wafer 10 remains stationary to avoid breakage caused by wafer movement. When the predetermined operation is an etching operation, the application of the semiconductor manufacturing apparatus can improve the uniformity of etching; when the predetermined operation is a chemical plating operation, the application of the semiconductor manufacturing apparatus can ensure good uniformity of the plating layer formed on the surface of the wafer 10. It is understood that the process chambers 2111 of each of the process tank assemblies 200 are used to load process liquids suitable for the predetermined operation.

[0039] The following describes the usage of the semiconductor manufacturing apparatus, taking a wet etching apparatus as an example where the predetermined operation is an etching operation.

[0040] When the semiconductor manufacturing apparatus is a wet etching apparatus, the process liquid includes an etching solution and a cleaning solution, and a portion of the process chambers 2111 of the plurality of process tank assemblies 200 is filled with etching solution and another portion is filled with cleaning solution. The wafer 10 is first etched in the process chamber 2111 filled with the etching solution, and then cleaned in the process chamber 2111 filled with the cleaning solution to remove excess etching solution from the wafer 10.

[0041] In a non-limiting embodiment, the semiconductor manufacturing apparatus includes four process tank assemblies 200. For ease of description, the four process tank assemblies 200 are referred to as process tank assembly A, process tank assembly B, process tank assembly C, and process tank assembly D, respectively. Accordingly, the tank body 210 of process tank assembly A is referred to as tank body A, the main body portion 211 as main body portion A, the cover 212 as cover A, the first drive portion 220 as first drive portion A, and the clearance opening 2101 as clearance opening A; the tank body 210 of process tank assembly B is referred to as tank body B, the main body portion 211 as main body portion B, the cover 212 as cover B, and the first drive portion 2101 as first drive portion A; the first drive portion 2101 as first drive portion A, and the first drive portion 2101 as first drive portion A. 20 is referred to as the first driving unit B, and the clearance opening 2101 is referred to as the clearance opening B; the tank body 210 of the process tank assembly C is referred to as the tank body C, the main body 211 is referred to as the main body C, the cover 212 is referred to as the cover C, the first driving unit 220 is referred to as the first driving unit C, and the clearance opening 2101 is referred to as the clearance opening C; the tank body 210 of the process tank assembly D is referred to as the tank body D, the main body 211 is referred to as the main body D, the cover 212 is referred to as the cover D, the first driving unit 220 is referred to as the first driving unit D, and the clearance opening 2101 is referred to as the clearance opening D. The process tank assembly A, the process tank assembly B, the process tank assembly C, and the process tank assembly D are spaced apart around the rotation axis S along a preset direction, where the preset direction is... Figure 1 The etching process can be performed in either a clockwise or counterclockwise direction. Specifically, the process cavity 2111 of the main body A contains a first etching solution, the process cavity 2111 of the main body B contains a second etching solution, the process cavity 2111 of the main body C contains a first cleaning solution, and the process cavity 2111 of the main body D contains a second cleaning solution. The second cleaning solution is different from the first cleaning solution, and the second etching solution is different from the first etching solution. During the etching operation, the wafer 10 is first etched in the first etching solution, then etched in the second etching solution, then cleaned in the first cleaning solution, and finally cleaned in the second cleaning solution.

[0042] Additionally, before the etching operation begins, the cover 212 of each process tank assembly 200 is fitted onto the upper end of the corresponding main body 211, and the chuck 320 is positioned between process tank assembly A and process tank assembly B in the direction about the rotation axis S. Thus, an optional etching operation process includes:

[0043] Step S1: The suction cup 320 adsorbs the wafer 10.

[0044] Step S2: At least the first driving unit A drives the main body A to move vertically downwards to separate the main body A from the cover A; and after or during the vertical downward movement of the main body A, the rotating table 100 rotates about the rotation axis S in the preset direction to align the suction cup 320 with the groove A and the support arm 310 with the clearance opening A. After this step is completed, the main body A is located below the suction cup 320 and the cover A is located above the suction cup 320.

[0045] Step S3: At least the first driving unit A drives the main body A to move vertically upward so that the main body A abuts against the cover A. That is, after this step is completed, the cover A closes on the upper end of the main body A. Furthermore, after this step is completed, the wafer 10 is located in the process cavity 2111 of the main body A and is immersed in the first etching solution, and the support arm 310 partially passes through the clearance opening A.

[0046] Step S4: At least the first driving unit A drives the main body A to move in a vertically downward direction so that the main body A separates from the cover A. This step is performed after a first preset time period following the completion of step S3.

[0047] Step S5: At least the first driving unit B drives the main body B to move vertically downwards to separate the main body B from the cover B. After or during the vertical downward movement of the main body B, the rotating table 100 rotates around the rotation axis S in the preset direction, aligning the suction cup 320 with the groove B and the support arm 310 with the clearance opening B. After the suction cup 320 and the groove A are misaligned, at least the first driving unit A drives the main body A to move vertically upwards until the main body A abuts against the cover A. After this step is completed, the main body B is located below the suction cup 320, the cover B is located above the suction cup 320, and the cover A covers the upper end of the main body A.

[0048] Step S6: At least the first driving unit B drives the main body B to move vertically upward so that the main body B abuts against the cover B. That is, after this step is completed, the cover B closes on the upper end of the main body B. Furthermore, after this step is completed, the wafer 10 is located in the process cavity 2111 of the main body B and is immersed in the second etching solution, and the support arm 310 partially passes through the clearance opening B.

[0049] Step S7: At least the first driving unit B drives the main body B to move in a vertically downward direction so that the main body B separates from the cover B. This step is performed after a second preset time period following the completion of step S6.

[0050] Step S8: At least the first driving unit C drives the main body C to move vertically downwards to separate the main body C from the cover C. After or during the vertical downward movement of the main body C, the rotating table 100 rotates around the rotation axis S in the preset direction, aligning the suction cup 320 with the groove C and the support arm 310 with the clearance opening C. After the suction cup 320 and the groove B are misaligned, at least the first driving unit B drives the main body B to move vertically upwards until the main body B abuts against the cover B. After this step is completed, the main body C is located below the suction cup 320, the cover C is located above the suction cup 320, and the cover B covers the upper end of the main body B.

[0051] Step S9: At least the first driving unit C drives the main body C to move vertically upward so that the main body C abuts against the cover C. That is, after this step is completed, the cover C closes on the upper end of the main body C. Furthermore, after this step is completed, the wafer 10 is located in the process cavity 2111 of the main body C and is immersed in the first cleaning solution, and the support arm 310 partially passes through the clearance opening C.

[0052] Step S10: At least the first driving unit C drives the main body C to move in a vertically downward direction so that the main body C separates from the cover C. This step is performed after a third preset time period following the completion of step S8.

[0053] Step S11: At least the first driving unit D drives the main body D to move vertically downwards to separate the main body D from the cover D. After or during the vertical downward movement of the main body D, the rotating table 100 rotates about the rotation axis S in the preset direction, aligning the suction cup 320 with the groove D and the support arm 310 with the clearance opening D. After the suction cup 320 and the groove C are misaligned, at least the first driving unit C drives the main body C to move vertically upwards until the main body C abuts against the cover C. After this step is completed, the main body D is located below the suction cup 320, the cover D is located above the suction cup 320, and the cover C covers the upper end of the main body C.

[0054] Step S12: At least the first driving part D drives the main body part D to move vertically upward so that the main body part D abuts against the cover D. That is, after this step is completed, the cover D closes on the upper end of the main body part D. Furthermore, after this step is completed, the wafer 10 is located in the process cavity 2111 of the main body part D and is immersed in the second cleaning solution, and the support arm 310 partially passes through the clearance opening D.

[0055] Step S13: At least the first driving part D drives the main body part D to move in a vertically downward direction so that the main body part D separates from the cover D. This step is performed after a fourth preset time period following the completion of step S12.

[0056] Step S14: Rotate the rotary table 100 around the rotation axis S in the preset direction until the suction cup 320 is between the process groove assembly D and the process groove assembly A, and after the suction cup 320 and the groove body D are misaligned, at least the first driving part D drives the main body part D to move in the vertically upward direction until the main body part D abuts against the cover 212.

[0057] After step S14 is completed, the etching operation of the wafer 10 is finished, and the wafer 10 can be removed from the chuck 320.

[0058] During the etching operation described above, the wafer 10 is horizontally adsorbed onto the chuck 320. By moving the main body 211 of each process tank assembly 200 vertically, the wafer 10 enters or exits the etching solution or cleaning solution. This ensures that different parts of the wafer 10 enter and exit the etching solution or cleaning solution at the same time, thereby achieving consistent etching amounts and improving the etching uniformity of the wafer 10. Furthermore, it avoids vertical movement of the wafer 10, preventing breakage caused by such movement. The rotation of the rotary table 100 around the rotation axis S allows the wafer 10 to be transferred between different process tank assemblies 200, also preventing breakage caused by wafer movement.

[0059] It is understood that the number of process tank assemblies 200 used for loading etching solution can be less than two or more than two, for example, one, three, four or more, depending on the specific needs; and the number of process tank assemblies 200 used for loading cleaning solution can also be less than two or more than two. Furthermore, the type of etching solution, the type of cleaning solution, the first preset time, the second preset time, the third preset time, and the fourth preset time are all determined according to specific requirements, and this utility model does not impose any limitations on them.

[0060] Furthermore, the support arm 310 can be positioned at any suitable location, as long as it remains stationary throughout the etching operation. The phrase "the support arm 310 is correspondingly positioned with respect to the clearance opening 2101" described above refers to the support arm 310 aligning with the corresponding clearance opening 2101 when the suction cup 320 is aligned with any of the grooves 210, so that when the cover 212 of the corresponding groove 210 is closed on the upper end of the main body 211, the support arm 310 partially passes through the clearance opening 2101 of the corresponding groove 210. The purpose of the phrase "the distance from the suction cup 320 to the rotation axis S is adapted to the distance from the groove 210 to the rotation axis S" described above is to enable the suction cup 320 to align with any of the grooves 210.

[0061] It is understood that when the semiconductor manufacturing apparatus is the electroless plating apparatus, a portion of the tanks 210 of the plurality of process tank assemblies 200 is used to hold the plating solution, and another portion is used to hold the cleaning solution. The wafer 10 is first electroless plated in the process tank assembly 200 containing the plating solution, and then cleaned in the process tank assembly 200 containing the cleaning solution to remove residual plating solution from the wafer 10. The specific process of electroless plating is similar to that of etching, and will not be described in detail here.

[0062] The structure of the semiconductor manufacturing apparatus will now be described in further detail.

[0063] like Figure 1 As shown, the rotary table 100 includes a rotary table body 110 and a third drive unit 120. The third drive unit 120 is connected to the rotary table body 110 and is configured to drive the rotary table body 110 to rotate around the rotation axis S.

[0064] The rotary table body 110 can have any suitable shape, and this embodiment of the present invention does not limit it. The third drive unit 120 includes, but is not limited to, a motor.

[0065] like Figure 3As shown, the main body 211 may include a bottom wall 2112 and a first side wall 2113. The first side wall 2113 is annular and connected to the bottom wall 2112, extending vertically upward. The first side wall 2113 and the bottom wall 2112 together define the process cavity 2111. The cover 212 may include a top wall 2121 and a second side wall 2122. The second side wall 2122 is annular and connected to the top wall 2121, extending vertically downward. When the lower end of the second side wall 2122 of the same groove 210 abuts against the upper end of the first side wall 2113, the cover 212 covers the upper end of the main body 211 and closes the opening of the process cavity 2111.

[0066] In some examples, such as Figure 4 As shown, the clearance opening 2101 is disposed on the main body 211, specifically on the first sidewall 2113, and the upper end of the clearance opening 2101 extends to the upper end face of the first sidewall 2113. In other examples, such as Figure 5 As shown, the clearance opening 2101 is provided on the cover 212, specifically on the second sidewall 2122, and the lower end of the clearance opening 2101 extends to the lower end face of the second sidewall 2122. In some other examples, such as Figure 6 As shown, the clearance opening 2101 comprises two parts: a first sub-clearance opening 2101a and a second sub-clearance opening 2101b. The first sub-clearance opening 2101a is disposed on the main body 211, specifically on the first side wall 2113, and its upper end extends to the upper end face of the first side wall 2113. The second sub-clearance opening 2101b is disposed on the cover 212, specifically on the second side wall 2101b. On 122, and the lower end of the second sub-avoidance opening 2101b extends to the lower end face of the second sidewall 2122, the second sub-avoidance opening 2101b and the first sub-avoidance opening 2101a are aligned such that when the cover 212 of the tank body 210 of the same process tank assembly 200 is closed on the upper end of the main body 211, the second sub-avoidance opening 2101b and the first sub-avoidance opening 2101a are joined and connected to form the avoidance opening 2101.

[0067] In a preferred embodiment, the cover 212 is also provided with a vent (not shown in the figure). For example... Figure 2 and Figure 3As shown, the semiconductor manufacturing apparatus further includes an exhaust mechanism 400, which is disposed at the exhaust port. The exhaust mechanism 400 includes at least an exhaust fan for discharging volatile gases from the interior space of the tank 210, thereby maintaining the interior space of the tank 210 under a slight negative pressure to better prevent external contaminants from entering the process chamber 2111. It is understood that the interior space of the tank 210 includes the process chamber 2111.

[0068] Optionally, such as Figures 1 to 3 As shown, the joint 230 includes a joint body 231 and a second drive part 232. The joint body 231 is disposed on the rotary table 100, and the joint body 231 includes at least a column 2311. The column 2311 is preferably disposed on the side of the groove 210 near the rotation axis S to avoid the column colliding with the support mechanism 300 and interfering with the rotation of the rotary table 100. The second drive part 232 is disposed on the joint body 231, for example, at the upper end of the column 2311. It should be understood that the second drive part 232 can be directly disposed at the upper end of the column 2311, or indirectly disposed at the upper end of the column 2311 via a crossbar 2312. The second drive part 232 is also connected to the cover 212 and is configured to drive the cover 212 to move in the vertical direction.

[0069] When there are four process tank assemblies 200, namely process tank assembly A, process tank assembly B, process tank assembly C and process tank assembly D as described above, the second drive unit 232 of process tank assembly A can be referred to as the second drive unit A, the second drive unit 232 of process tank assembly B can be referred to as the second drive unit B, the second drive unit 232 of process tank assembly C can be referred to as the second drive unit C, and the second drive unit 232 of process tank assembly D can be referred to as the second drive unit D.

[0070] Thus, in step S2, the second driving unit A can also drive the cover 212 to move vertically upward so that the main body A separates from the cover A. In step S3, the second driving unit A can also drive the cover A to move vertically downward so that the main body A abuts against the cover A. In step S4, the second driving unit A can also drive the cover A to move vertically upward so that the main body A separates from the cover A. In step S5, the second driving unit B can also drive the cover B to move vertically upward so that the main body B separates from the cover B, and the second driving unit A can also drive the cover A to move vertically downward so that the main body A abuts against the cover A. In step S6, the second driving unit B can also drive the cover B to move vertically downward so that the main body B abuts against the cover B. In step S7, the second driving unit B can also drive the cover B to move vertically upward to separate the main body B from the cover B. In step S8, the second driving unit C can also drive the cover C to move vertically upward to separate the main body C from the cover C, and the second driving unit B can also drive the cover B to move vertically downward to bring the main body B into contact with the cover B. In step S9, the second driving unit C can also drive the cover C to move vertically downward to bring the main body C into contact with the cover C. In step S10, the second driving unit C can also drive the cover C to move vertically upward to separate the main body C from the cover C. In step S11, the second driving unit D can also drive the cover D to move vertically upward to separate the main body D from the cover D, and the second driving unit C can also drive the cover C to move vertically downward to bring the main body C into contact with the cover C. In step S12, the second driving unit D can also drive the cover D to move vertically downward so that the main body D abuts against the cover D. In step S13, the second driving unit D can also drive the cover D to move vertically upward so that the main body D separates from the cover D. In step S14, the first driving unit D can also drive the cover D to move vertically downward so that the main body D abuts against the cover D.

[0071] Both the first drive unit 220 and the second drive unit 232 can be cylinders, or any other suitable linear drive mechanism. This embodiment of the utility model does not limit this.

[0072] Optionally, such as Figure 2 and Figure 3As shown, the support arm 310 includes a first sub-support arm 311, a second sub-support arm 312, and a third sub-support arm 313 connected in sequence. The first sub-support arm 311 can extend horizontally, the second sub-support arm 312 can extend vertically or be inclined relative to the horizontal plane, and the third sub-support arm 313 is connected to the lower end of the second sub-support arm 312 and is lower than the first sub-support arm 311. The suction cup 310 is connected to the end of the third sub-support arm 313 away from the second support arm 312.

[0073] It is understood that when the clearance opening 2101 is provided on the main body 211, the first support arm 311 can always be lower than the cover 212, and the first support arm 311 is higher than the main body 211 when the cover 212 is separated from the main body 211. When the clearance opening 2101 is at least partially provided on the cover 212, the first support arm 311 can be lower than the cover 212 when the cover 212 is separated from the main body 211.

[0074] Optionally, such as Figure 7 As shown, each of the process tank assemblies 200 further includes a circulation mechanism 240. The circulation mechanism 240 includes an inlet pipe 241, a drain pipe 242, a circulation pipe 243, a pump 244, and a filter 245. The outlet end of the inlet pipe 241 is connected to the main body 211 and communicates with the process chamber 2111. The inlet end of the drain pipe 242 is connected to the main body 211 and communicates with the process chamber 2111. One end of the circulation pipe 242 is connected to the inlet pipe 241, and the other end is connected to the drain pipe 242. The pump 244 and the filter 245 are sequentially arranged on the circulation pipe 243. The pump 244 is used to draw a portion of the process liquid in the drain pipe 242 back to the inlet pipe 241 and further pump it into the inlet pipe 341 to realize the circulation of the process liquid; the filter 245 is used to filter the process liquid flowing from the drain pipe 242 to the inlet pipe 241.

[0075] Preferably, one end of the circulation pipe 243 is connected to the inlet pipe 241 via a three-way valve (not shown in the figure), and the other end is connected to the outlet pipe 242 via another three-way valve (not shown in the figure). The opening and closing of the three-way valves can control the operation or shutdown of the circulation mechanism 240. That is, when both three-way valves are open, the circulation mechanism 240 operates to circulate the process liquid in the process chamber 2111; when both three-way valves are closed, the circulation mechanism 240 stops operating, allowing for the replacement of the process liquid in the process chamber 2111.

[0076] Optionally, at least a portion of the circulation mechanism 240 of the process tank assembly 200 further includes a heater 246 disposed on the circulation pipe 243 for heating the process liquid in the circulation pipe 243, thereby heating the process liquid in the process chamber 2111.

[0077] The second objective of this utility model is to provide a machine tool, which includes a controller and a semiconductor production apparatus as described above. The controller is communicatively connected to the rotary table 100 and the first drive unit 220. The controller is configured to control the rotary table 100 to rotate around the rotation axis S and to control the first drive unit 220 to drive the main body 211 to move in the vertical direction.

[0078] It can be understood that when the rotary table 100 includes the rotary table body 110 and the third drive unit 120, the controller being communicatively connected to the rotary table 100 means that the controller is communicatively connected to the third drive unit 120.

[0079] When the joint 230 includes the second drive unit 232, the controller is also communicatively connected to the second drive unit 232 and is configured to control the operation of the second drive unit 232 to drive the cover 212 to move in the vertical direction.

[0080] While the present invention has been disclosed above, it is not limited thereto. Those skilled in the art can make various modifications and variations to the present invention without departing from its spirit and scope. Therefore, if such modifications and variations fall within the scope of the claims of the present invention and their equivalents, the present invention also intends to include such modifications and variations.

Claims

1. A semiconductor production apparatus characterized by comprising: The semiconductor production device comprises: a rotating table capable of rotating around a rotating axis extending in a vertical direction; a plurality of process tank assemblies arranged at intervals around the rotating axis; each of the process tank assemblies comprises a tank body, a first driving part and a joint part; the tank body comprises a main body part and a cover, the main body part is a hollow structure with a process cavity, the process cavity is open at an upper end, the main body part is connected with the rotating table through the first driving part and is capable of moving in a vertical direction under the driving of the first driving part; the cover is located above the main body part and is used for covering the upper end of the main body part to close the opening, the cover is connected with the rotating table through the joint part; an avoiding opening is arranged on the tank body and is located at the joint of the main body part and the cover; and a supporting mechanism comprising a supporting arm and a suction disc; the supporting arm is arranged corresponding to the avoiding opening; the suction disc is arranged on the supporting arm and is arranged horizontally, the suction disc is located above the rotating table and is lower than the cover, and the distance from the suction disc to the rotating axis is adapted to the distance from the tank body to the rotating axis.

2. The semiconductor production apparatus according to Claim 1, wherein The joint part comprises a joint part body and a second driving part, the joint part body is connected with the rotating table, and the second driving part connects the joint part body and the cover, and the second driving part body is configured to drive the cover to move in a vertical direction.

3. The semiconductor production apparatus according to Claim 1, wherein The avoiding opening is arranged on the main body part, or the avoiding opening is arranged on the cover, or the avoiding opening comprises a first sub-avoiding opening and a second sub-avoiding opening, the first sub-avoiding opening is arranged on the main body part, and the second sub-avoiding opening is arranged on the cover and is aligned with the first sub-avoiding opening.

4. The semiconductor production apparatus according to Claim 1, wherein An exhaust opening is arranged on the cover; the semiconductor production device further comprises an exhaust mechanism arranged at the exhaust opening.

5. The semiconductor production apparatus according to Claim 1, wherein The supporting arm comprises a first sub-supporting arm, a second sub-supporting arm and a third sub-supporting arm connected in sequence, one end of the third sub-supporting arm away from the second sub-supporting arm is connected with the suction disc; the first sub-supporting arm is higher than the suction disc.

6. The semiconductor production apparatus according to Claim 1, wherein The process tank assembly further comprises a circulating mechanism, the circulating mechanism comprises an inlet pipe, an outlet pipe, a circulating pipe, a pump and a filter, the outlet end of the inlet pipe is connected with the main body part, the inlet end of the outlet pipe is connected with the main body part, one end of the circulating pipe is connected with the inlet pipe and the other end is connected with the outlet pipe, the pump and the filter are arranged on the circulating pipe in sequence.

7. The semiconductor production apparatus according to Claim 6, wherein One end of the circulating pipe is connected with the inlet pipe through a three-way valve and the other end is connected with the outlet pipe through a three-way valve.

8. The semiconductor production apparatus according to Claim 6, wherein The circulating mechanism of at least part of the process tank assemblies further comprises a heater arranged on the circulating pipe.

9. The semiconductor producing apparatus according to any one of claims 1 to 8, wherein The semiconductor production device is a wet etching device or a chemical plating device.

10. A machine, characterized in that, The semiconductor production device comprises a control part and a semiconductor production device as claimed in any one of claims 1-9, the control part is communicatively connected with the rotating table and the first driving part, and the control part is configured to control the rotating table to rotate around the rotating axis and control the first driving part to drive the main body part to move in a vertical direction.

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