Wafer transport arm and wafer adapter

Abstract

This utility model discloses a wafer transport arm and a wafer adapter. The wafer transport arm includes a body, two adsorption arms, a first air path system, a second air path system, and an adsorption element. The two adsorption arms are spaced apart at one end of the body. The first air path system includes a first air channel disposed within the body and a first air hole disposed on the surface of the body that carries the wafer, with the first air hole communicating with the first air channel. The second air path system includes a second air channel disposed within the body and the adsorption arms and a second air hole disposed on the surface of the adsorption arms that carries the wafer, with the second air hole communicating with the second air channel. The first and second air path systems are independent of each other. The adsorption element communicates and cooperates with the first and second air holes to adsorb and abut the wafer. Through the independent first and second air path systems, and in conjunction with the adsorption element, wafers at different processing stages can be adsorbed and fixed respectively, effectively improving the adaptability to carrying wafers at different processing stages.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor equipment technology, specifically relating to a wafer transport arm and a wafer adapter. Background Technology

[0002] During wafer fabrication, wafers typically need to be transferred using wafer adapters to move them from one processing stage to another. Specifically, this involves using a wafer transport arm to carry and transfer the wafer. Wafer fabrication comprises multiple stages, and existing wafer transport arms are only compatible with one of these stages, resulting in low adaptability and hindering wafer production efficiency.

[0003] Therefore, in order to address the above-mentioned technical problems, it is necessary to provide a wafer transport arm and a wafer adapter. Utility Model Content

[0004] The purpose of this invention is to provide a wafer transport arm and a wafer adapter, which can solve the problem of low adaptability of the wafer transport arm to different processing stages of wafer production.

[0005] To achieve the above objectives, a specific embodiment of this utility model provides a wafer transport arm, the technical solution of which is as follows:

[0006] A wafer transport arm includes a body, two adsorption arms, a first air path system, a second air path system, and an adsorption element. The two adsorption arms are spaced apart at one end of the body. The first air path system includes a first air channel disposed within the body and a first air hole disposed on the surface of the body that carries the wafer, the first air hole communicating with the first air channel. The second air path system includes a second air channel disposed within the body and the adsorption arms and a second air hole disposed on the surface of the adsorption arms that carries the wafer, the second air hole communicating with the second air channel. The first air path system and the second air path system are independent of each other. The adsorption element communicates and cooperates with the first air hole and the second air hole to adsorb and abut the wafer.

[0007] In one or more embodiments of this utility model, a plurality of first air holes are provided, and the plurality of first air holes are distributed on a preset arc path. The first air channel includes a first adsorption section and a first connecting section that are interconnected. The center line of the first adsorption section coincides with the preset arc path. The first connecting section is connected to a first vacuum hole. The preset arc path is an arc cut from the circle corresponding to the wafer product structure.

[0008] In one or more embodiments of this utility model, the plurality of first pores are divided into two symmetrically arranged groups, the first adsorption section is provided with two corresponding sections, the first connecting section connects the two sections of the first adsorption section, and the connection position between the first connecting section and the first adsorption section is located at the center of the first adsorption section, and the first connecting section is located on the side of the first adsorption section opposite to the adsorption arm.

[0009] In one or more embodiments of this utility model, the adsorption arm is equipped with an auxiliary component that can hold the wafer. The auxiliary component is located on the preset arc path. The auxiliary component cooperates with the adsorption component to hold the wafer against a preset plane parallel to the plane of the main body.

[0010] In one or more embodiments of this utility model, both adsorption arms are provided with the auxiliary component, and each adsorption arm is provided with at least one of the auxiliary components.

[0011] In one or more embodiments of the present invention, the second air passage includes a second adsorption section and a second connecting section that are interconnected. The second adsorption section is connected to the second air hole. The second adsorption section extends from the adsorption arm to the body. The second connecting section is located in the body and is connected to a second vacuum hole.

[0012] In one or more embodiments of this utility model, both adsorption arms are provided with the second air hole, the second adsorption section is provided with two sections, and the second connecting section connects the two sections of the second adsorption section.

[0013] In one or more embodiments of this utility model, the second connecting segment is offset relative to the first air passage in a direction away from the adsorption arm.

[0014] In one or more embodiments of this utility model, the adsorption arm is provided with a groove, and the bottom of the groove has a second air hole.

[0015] A specific embodiment of this utility model provides a wafer adapter, the technical solution of which is as follows:

[0016] A wafer adapter, comprising the wafer transport arm described above.

[0017] Compared with the prior art, the wafer transport arm of this utility model can provide a negative pressure environment through the first air passage system located in the main body or the second air passage system located in the main body and the adsorption arm during use. In conjunction with the adsorption element, it can adsorb and fix wafers at different processing stages, thereby effectively improving the adaptability of wafer carrying at different processing stages and improving wafer production efficiency. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the front structure of the wafer transport arm in one embodiment of the present invention;

[0020] Figure 2 This is a schematic diagram of the back air path system of the wafer transport arm in one embodiment of the present invention;

[0021] Figure 3 This is a schematic diagram of the wafer transport arm and the wafer processing product in one embodiment of the present invention.

[0022] Explanation of key figure labels:

[0023] 1. Body; 2. Adsorption arm; 21. Groove; 31. First air channel; 311. First adsorption section; 312. First connecting section; 32. First air hole; 33. First vacuum hole; 41. Second air channel; 411. Second adsorption section; 412. Second connecting section; 42. Second air hole; 43. Second vacuum hole; 5. Adsorption component; 6. Auxiliary component; 100. Wafer; 200. Circular film; 300. Iron ring. Detailed Implementation

[0024] To enable those skilled in the art to better understand the technical solutions in this disclosure, the technical solutions in the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments in this disclosure, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this disclosure.

[0025] Reference Figure 1 and Figure 2In one embodiment of this utility model, the wafer transport arm includes a body 1, two adsorption arms 2, a first air path system, a second air path system, and an adsorption component 5. The two adsorption arms 2 are spaced apart at one end of the body 1. The first air path system includes a first air channel 31 disposed within the body 1 and a first air hole 32 disposed on the surface of the body 1 that carries the wafer; the first air hole 32 communicates with the first air channel 31. The second air path system includes a second air channel 41 disposed within the body 1 and the adsorption arms 2 and a second air hole 42 disposed on the surface of the adsorption arms 2 that carries the wafer; the second air hole 42 communicates with the second air channel 41. The first and second air path systems are independent of each other. The adsorption component 5 communicates and cooperates with the first air hole 32 and the second air hole 42 to adsorb and abut the wafer. The adsorption component 5 can be a suction cup, which is fixed at the first air hole 32 and the second air hole 42 to form a negative pressure environment, adsorbing and fixing the wafer located on the wafer transport arm to prevent it from falling off during transport.

[0026] In this embodiment, the first and second air path systems are independent of each other, and therefore can operate independently for different wafer processing stages. Thus, the wafer transport arm of this application effectively enhances its adaptability to wafer carrying at different processing stages and improves wafer production efficiency.

[0027] Reference Figure 1 In this embodiment, one processing stage can fix the wafer product through a first gas path system. In this stage, the wafer product is combined with... Figure 3 A wafer 100 is placed on a circular film 200, which is fixed to an outer iron ring 300. Specifically, multiple first vents 32 are provided, and all the first vents 32 are distributed along a preset arc path. The first air channel 31 includes a first adsorption section 311 and a first connecting section 312 that are interconnected. The centerline of the first adsorption section 311 coincides with the preset arc path, and the first connecting section 312 is connected to a first vacuum hole 33. The preset arc path is an arc cut from the circle corresponding to the wafer product structure. In this embodiment, it is specifically an arc cut from the circular structure corresponding to the outer iron ring 300. Therefore, the outer iron ring 300 can be adsorbed and fixed by the multiple first vents 32 and the adsorption element 5, thereby indirectly supporting the wafer located in the film. In this embodiment, the deformation of the film that may be caused by adsorption can be reduced by adsorbing and fixing the outer iron ring, further ensuring the accuracy of wafer processing. The first vacuum hole 33 can be connected to a vacuum pump to form a negative pressure environment for adsorbing wafer processing products.

[0028] Furthermore, the multiple first pores 32 are divided into two symmetrically arranged groups, and the first adsorption section 311 is correspondingly provided with two sections. The first connecting section 312 connects the two sections of the first adsorption section 311, and the connection position between the first connecting section 312 and the first adsorption section 311 is located at the center of the first adsorption section 311. The first connecting section 312 is located on the side of the first adsorption section 311 facing away from the adsorption arm 2. In this embodiment, six first pores 32 are provided as an example for illustration. In other embodiments, the number of first pores 32 can also be five, four, seven, etc., and this application does not impose a specific limitation on the number. The symmetrical arrangement of the two groups of pores can ensure the firmness of the adsorption of wafer processing products, reduce the possibility of them falling off during the transfer process, and ensure processing efficiency.

[0029] Reference Figure 1 and Figure 3 The adsorption arm 2 is equipped with an auxiliary component 6 that can hold the wafer. The auxiliary component 6 is located on a preset arc path and cooperates with the adsorption component 5 to hold the wafer against a preset plane parallel to the plane of the main body 1. The auxiliary component 6 ensures that the wafer is positioned on the preset plane. In this embodiment, the auxiliary component 6 can also be a suction cup to ensure that its height matches that of the suction cup located at the first air hole 32. Simultaneously, the auxiliary component 6 can provide a certain amount of friction to ensure the stability of the areas of the wafer processing product not adsorbed, reducing the possibility of the wafer processing product detaching. Since the auxiliary component 6 is located on the preset arc path, in this embodiment, the auxiliary component 6 also contacts the iron ring 300 to support the iron ring 300 at different positions.

[0030] Reference Figure 1 In one optional embodiment, both adsorption arms 2 are provided with auxiliary components 6, and each adsorption arm 2 is provided with at least one auxiliary component 6. This application does not impose a specific limitation on the number of auxiliary components 6 in each adsorption arm 2.

[0031] Reference Figure 1 and Figure 2 In this embodiment, another processing stage can be achieved by fixing the wafer product through a second gas path system. In this stage, the wafer is fixed by the adsorption element 5 located at the adsorption arm 2. Specifically, the second gas path 41 includes a second adsorption section 411 and a second connecting section 412 that are interconnected. The second adsorption section 411 is connected to a second air hole 42 and extends from the adsorption arm 2 to the body 1. The second connecting section 412 is located on the body 1 and is connected to a second vacuum hole 43. The second vacuum hole 43 can also be connected to a vacuum device to create a negative pressure environment for adsorbing the wafer product processed in this stage.

[0032] Reference Figure 1 and Figure 2Both adsorption arms 2 are provided with second vents 42, and the second adsorption section 411 is provided with two corresponding sections. A second connecting section 412 connects the two sections of the second adsorption section 411. By providing second vents 42 in both adsorption arms 2, the stability of wafer fixation can be ensured. The adsorption arm 2 is provided with a groove 21, and the bottom of the groove 21 has a second vent 42. Therefore, during operation, the inside of the groove 21 can provide a negative pressure environment, enhancing the adsorption and fixation effect of the wafer at this stage.

[0033] Reference Figure 2 The second connecting section 412 is offset relative to the first air passage 31 in a direction away from the adsorption arm 2. This arrangement allows the first connecting section 312 and the second connecting section 412 to be arranged side-by-side, with a unified connection to the vacuum pump in their parallel area. It is understood that in other embodiments, the arrangement of the first air passage 31 and the second air passage 41 can also be adjusted, as long as they remain independent of each other; this application does not impose specific limitations in this regard.

[0034] Reference Figure 1 In one embodiment of this utility model, a wafer adapter is also disclosed, including the aforementioned wafer transport arm. It is understood that the wafer adapter equipped with the aforementioned wafer transport arm can be applied to different stages of wafer processing and production, improving its adaptability and wafer production efficiency.

[0035] It will be apparent to those skilled in the art that this disclosure is not limited to the details of the exemplary embodiments described above, and that this disclosure can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of this disclosure is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this disclosure. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0036] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A wafer transport arm, comprising: include: Ontology(1); Two adsorption arms (2) are spaced apart at one end of the body (1); The first gas path system includes a first gas channel (31) disposed in the body (1) and a first gas hole (32) disposed on the surface of the body (1) that carries the wafer, wherein the first gas hole (32) is connected to the first gas channel (31); The second gas path system includes a second gas channel (41) disposed in the body (1) and the adsorption arm (2) and a second gas hole (42) disposed on the surface of the adsorption arm (2) that carries the wafer. The second gas hole (42) is connected to the second gas channel (41). The first gas path system and the second gas path system are independent of each other. The adsorption element (5) is connected and cooperates with the first pore (32) and the second pore (42) to adsorb and abut the wafer.

2. The wafer transport arm according to claim 1, characterized in that, The first air hole (32) is provided in multiple ways, and the multiple first air holes (32) are distributed on a preset arc path. The first air channel (31) includes a first adsorption section (311) and a first connecting section (312) that are interconnected. The center line of the first adsorption section (311) coincides with the preset arc path. The first connecting section (312) is connected to a first vacuum hole (33). The preset arc path is an arc cut from the circle corresponding to the wafer product structure.

3. The wafer handling arm of claim 2, wherein, The first pores (32) are divided into two symmetrically arranged groups. The first adsorption section (311) is provided with two sections. The first connecting section (312) connects the two sections of the first adsorption section (311). The connection position between the first connecting section (312) and the first adsorption section (311) is located at the center of the first adsorption section (311). The first connecting section (312) is located on the side of the first adsorption section (311) facing away from the adsorption arm (2).

4. The wafer handling arm of claim 2, wherein, The adsorption arm (2) is equipped with an auxiliary component (6) that can hold the wafer. The auxiliary component (6) is located on the preset arc path. The auxiliary component (6) cooperates with the adsorption component (5) to hold the wafer against a preset plane parallel to the plane of the main body (1).

5. The wafer handling arm of claim 4, wherein, Both adsorption arms (2) are provided with the auxiliary component (6), and each adsorption arm (2) is provided with at least one of the auxiliary components (6).

6. The wafer handling arm of claim 1, wherein, The second air passage (41) includes a second adsorption section (411) and a second connecting section (412) that are interconnected. The second adsorption section (411) is connected to the second air hole (42). The second adsorption section (411) extends from the adsorption arm (2) to the body (1). The second connecting section (412) is located in the body (1) and is connected to a second vacuum hole (43).

7. The wafer handling arm of claim 6, wherein, Both adsorption arms (2) are provided with the second air hole (42), and the second adsorption section (411) is provided with two sections. The second connecting section (412) connects the two sections of the second adsorption section (411).

8. The wafer handling arm of claim 6, wherein, The second connecting segment (412) is offset relative to the first airway (31) in a direction away from the adsorption arm (2).

9. The wafer handling arm of claim 1, wherein, The adsorption arm (2) is provided with a groove (21), and the bottom of the groove (21) is provided with the second air hole (42).

10. A wafer adapter, comprising: Includes the wafer transport arm as described in any one of claims 1-9.

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