A non-contact wafer chuck

Abstract

This utility model discloses a non-contact wafer chuck, relating to the field of wafer chuck technology. The non-contact wafer chuck includes a base, a mounting plate fixedly connected to the top of the base, and first synchronous wheels rotatably connected to each of the four corners of the top of the base. A lifting mechanism is provided at the top of the mounting plate, and a fixing mechanism is provided at the top of the base. This utility model, through the cooperation of the lifting mechanism, fixing mechanism, and ejection mechanism, achieves the effect of avoiding damage to the wafer. The lifting mechanism, in conjunction with the ejection mechanism, places the wafer on the fixing mechanism. Then, the fixing mechanism, in conjunction with the ejection mechanism, adsorbs and fixes the wafer using a vacuum adsorption method. Through the air channels of the lower component and the ring of air holes of the upper component, only the edges of the wafer are adsorbed, avoiding contact with the center, thereby fixing the wafer to the stepped plate and ensuring that the wafer is not damaged during processing or transport.

Description

Technical Field

[0001] This utility model relates to the field of wafer chuck technology, specifically a non-contact wafer chuck. Background Technology

[0002] In the semiconductor manufacturing process, wafer fixation and transport are critical steps. Traditional contact wafer chucks are prone to causing physical damage to the wafer surface. Especially for thin wafers, contact friction or pressure may cause wafer warping or breakage, affecting product yield.

[0003] For example, a wafer chuck described in patent CN219677245U includes a chuck body and multiple pads. The level and height of the wafer can be adjusted by adjusting the height of the pads. In addition, the height of the pads can be adjusted by hand using knurled screws. However, it does not effectively fix the wafer, which causes the wafer to shake during processing or transport, resulting in damage to the wafer. Furthermore, contact friction or pressure may cause the wafer to warp or break, affecting product yield.

[0004] Based on this, a non-contact wafer chuck is now provided, which can eliminate the drawbacks of existing devices. Utility Model Content

[0005] The purpose of this invention is to provide a non-contact wafer chuck to solve the problems in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A non-contact wafer chuck includes a base, a mounting plate fixedly connected to the top of the base, a first synchronous wheel rotatably connected to each of the four corners of the top of the base, a lifting mechanism provided at the top of the mounting plate, and a fixing mechanism provided at the top of the base.

[0008] Based on the above technical solutions, this utility model also provides the following optional technical solutions:

[0009] Preferably, the lifting mechanism includes a motor, the output end of which is fixedly connected to a second synchronous pulley. A synchronous belt is meshed with the outer circumferential surface of the second synchronous pulley. The inner circumferential surface of the synchronous belt meshes with a first synchronous pulley. A tensioning pulley is drivenly connected to the outer circumferential surface of the synchronous belt near the mounting plate. The tensioning pulley is rotatably connected to the mounting plate via a rotating shaft. Connecting blocks are fixedly connected to the corresponding outer walls of the synchronous belt. Guide sliders are fixedly connected to the outer walls of the connecting blocks. A guide rail is slidably connected to a groove at the bottom end of the guide slider. The bottom end of the guide rail is fixedly connected to the top end of the base.

[0010] Preferably, the sliding connection between the guide rail and the guide slider is T-shaped.

[0011] Preferably, a fixing plate is inserted into a slot on the outer wall of the guide slider, and a roller is fixedly connected to the outer wall of the fixing plate, with the outer wall of the roller fitting against the inclined surface of the outer wall of the guide slider.

[0012] Preferably, the fixing mechanism includes a support base, the bottom end of which is fixedly connected to the middle of the top end of the base, a vacuum pump is installed inside the support base, a top plate is slidably connected to the outer wall of the support base, the bottom end of the top plate is fixedly connected to the top end of the roller, telescopic rods are evenly distributed and fixedly connected to the bottom end of the top plate, the bottom ends of the telescopic rods are fixedly connected to the top end of the base, a support plate is fixedly connected to the top end of the support base, a partition is fixedly connected to the top end of the support plate, a placement plate is fixedly connected to the top end of the partition, and an ejection mechanism is evenly arranged on the inner wall of the support plate.

[0013] Preferably, the outer wall of the partition is provided with an air passage.

[0014] Preferably, the outer wall of the placement plate is uniformly and fixedly connected with stepped plates, the stepped plates are provided with vertically penetrating vent holes, the lower end of which is connected to the air duct, and the vacuum pump of the support base is connected to the air duct through a pipeline.

[0015] Preferably, the ejection mechanism includes a sleeve, the outer wall of which is fixedly connected to an installation groove on the outer wall of the support plate, and an ejection rod is slidably connected to the inner wall of the sleeve. The outer wall of the ejection rod passes through the outer wall of the partition and is slidably connected to a sliding groove on the outer wall of the placement plate. An O-ring is provided between the ejection rod and the sliding groove.

[0016] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0017] This invention achieves the effect of avoiding damage to the wafer by using a lifting mechanism, a fixing mechanism, and an ejection mechanism in combination. The lifting mechanism and the ejection mechanism place the wafer on the fixing mechanism, and then the fixing mechanism and the ejection mechanism adsorb and fix the wafer. Vacuum adsorption is used, with the air channel of the lower component and the air hole of the upper component working together to adsorb only the edge of the wafer, avoiding contact with the middle, thereby fixing the wafer on the stepped plate and ensuring that the wafer is not damaged during processing or transportation. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0019] Figure 2 This is a cross-sectional structural diagram of the present invention.

[0020] Figure 3This is a schematic diagram of the lifting mechanism of this utility model.

[0021] Figure 4 This is a schematic diagram of the fixing mechanism of this utility model.

[0022] Figure reference numerals: 1. Base; 11. Mounting plate; 12. First synchronous pulley; 2. Lifting mechanism; 21. Motor; 22. Second synchronous pulley; 23. Synchronous belt; 24. Tensioning pulley; 25. Connecting block; 26. Guide slider; 27. Fixing plate; 28. Roller; 29. ​​Guide rail; 3. Fixing mechanism; 31. Support base; 32. Top plate; 33. Telescopic rod; 34. Support plate; 35. Partition plate; 36. Air passage; 37. Placement plate; 38. Stepped plate; 4. Ejection mechanism; 41. Sleeve; 42. Ejection rod. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments.

[0024] In one embodiment, such as Figures 1-4 As shown, a non-contact wafer chuck includes a base 1, a mounting plate 11 fixedly connected to the top of the base 1, a first synchronous wheel 12 rotatably connected to each of the four corners of the top of the base 1, a lifting mechanism 2 provided at the top of the mounting plate 11, and a fixing mechanism 3 provided at the top of the base 1.

[0025] In this embodiment, the wafer is placed on the fixing mechanism 3 by the lifting mechanism 2 and the ejection mechanism 4. Then, the wafer is adsorbed and fixed by the fixing mechanism 3 and the ejection mechanism 4. The vacuum adsorption method is adopted, and the lower part air channel 36 cooperates with the upper part air hole to adsorb only the edge of the wafer, avoiding contact in the middle, and ensuring that the wafer is not damaged during processing or transportation.

[0026] In an optional embodiment, such as Figure 2 and Figure 3As shown, the lifting mechanism 2 includes a motor 21. A second synchronous pulley 22 is fixedly connected to the output end of the motor 21. A synchronous belt 23 is meshed with the outer circumferential surface of the second synchronous pulley 22. The inner circumferential surface of the synchronous belt 23 meshes with the first synchronous pulley 12. A tensioning pulley 24 is drivenly connected to the outer circumferential surface of the synchronous belt 23 near the mounting plate 11. The tensioning pulley 24 is rotatably connected to the mounting plate 11 via a rotating shaft. Connecting blocks 25 are fixedly connected to the corresponding outer walls of the synchronous belt 23. Guide sliders 26 are fixedly connected to the outer walls of the connecting blocks 25. A guide rail 29 is slidably connected to a groove at the bottom end of the guide slider 26. The bottom end of the guide rail 29 is fixedly connected to the top end of the base 1. Motor 21 drives the second synchronous pulley 22 to rotate, which in turn drives the synchronous belt 23 to move synchronously. The synchronous belt 23 drives the first synchronous pulley 12 to rotate. At the same time, the synchronous belt 23 drives the connecting block 25 to move, and the connecting block 25 drives the guide slider 26 to move synchronously. The guide slider 26 slides on the guide rail 29, and the roller 28 moves upward on the inclined surface of the guide slider 26. The roller 28 drives the fixing plate 27 and the top plate 32 to move upward, which extends the telescopic rod 33. The telescopic rod 33 pushes the ejector rod 42 upward, and the ejector rod 42 slides on the inner wall of the sleeve 41. In this way, the ejector rod 42 pushes the wafer upward, completing the auxiliary positioning.

[0027] In an optional embodiment, such as Figure 2 and Figure 3 As shown, the sliding connection between the guide rail 29 and the guide slider 26 is T-shaped. The guide rail 29 limits the guide slider 26 to prevent it from deviating during movement.

[0028] In an optional embodiment, such as Figure 2 and Figure 3 As shown, a slot is provided on the outer wall of the guide slider 26 to which a fixing plate 27 is inserted. A roller 28 is fixedly connected to the outer wall of the fixing plate 27. The outer wall of the roller 28 is in contact with the inclined surface of the outer wall of the guide slider 26. Through the contact between the roller 28 and the inclined surface of the guide slider 26, the roller 28 moves up and down on the inclined surface of the guide slider 26.

[0029] In an optional embodiment, such as Figure 2 and Figure 4As shown, the fixing mechanism 3 includes a support base 31, the bottom end of which is fixedly connected to the middle of the top of the base 1. A vacuum pump is installed inside the support base 31. A top plate 32 is slidably connected to the outer wall of the support base 31. The bottom end of the top plate 32 is fixedly connected to the top of the roller 28. Telescopic rods 33 are evenly distributed and fixedly connected to the bottom end of the top plate 32. The bottom end of the telescopic rods 33 is fixedly connected to the top of the base 1. A support plate 34 is fixedly connected to the top of the support base 31. A partition 35 is fixedly connected to the top of the support plate 34. A placement plate 37 is fixedly connected to the top of the partition 35. An ejection mechanism 4 is evenly arranged on the inner wall of the support plate 34. An air passage 36 is opened on the outer wall of the partition 35. The top plate 32 is lifted upward by the lifting mechanism 2, which drives the telescopic rods 33 to extend, so that the top plate 32 lifts the ejection mechanism 4 upward, so that the ejection mechanism 4 can lift the wafer to complete the auxiliary positioning.

[0030] In an optional embodiment, such as Figure 2 and Figure 4 As shown, step plates 38 are evenly distributed and fixedly connected to the outer wall of the placement plate 37. The step plates 38 are provided with vertically penetrating vent holes, and the lower end is connected to the air channel 36. The vacuum pump of the support base 31 is connected to the air channel 36 through the pipeline. When the vacuum pump is started, a negative pressure is formed through the lower air channel 36 and the upper air hole to adsorb the edge of the wafer and fix it on the step plate 38. The 2mm step in the middle of the step plate 38 is used to prevent the thin wafer from contacting the surface of the placement plate 37 due to warping, keeping it in a non-contact state and ensuring that the wafer is not damaged during processing or transportation.

[0031] In an optional embodiment, such as Figures 1-4 As shown, the ejection mechanism 4 includes a sleeve 41. The outer wall of the sleeve 41 is fixedly connected to the mounting groove opened on the outer wall of the support plate 34. An ejection rod 42 is slidably connected to the inner wall of the sleeve 41. The outer wall of the ejection rod 42 passes through the outer wall of the partition plate 35 and is slidably connected to the sliding groove opened on the outer wall of the placement plate 37. An O-ring is provided between the ejection rod 42 and the sliding groove. The telescopic rod 33 pushes the ejection rod 42 upward, so that the ejection rod 42 slides on the inner wall of the sleeve 41, thereby making the ejection rod 42 push the wafer upward to complete the auxiliary positioning.

[0032] The above embodiment discloses a non-contact wafer chuck. During wafer inspection, a robotic arm places the wafer onto a placement plate 37. Simultaneously, a motor 21 drives a second synchronous pulley 22 to rotate, causing the second synchronous pulley 22 to drive a synchronous belt 23 to move synchronously. The synchronous belt 23 drives a first synchronous pulley 12 to rotate, and the synchronous belt 23 also drives a connecting block 25 to move. The connecting block 25 drives a guide slider 26 to move synchronously, causing the guide slider 26 to slide on a guide rail 29. This causes a roller 28 to move upwards on the inclined surface of the guide slider 26. The roller 28 drives a fixed plate 27 and a top plate 32 to move upwards, causing a telescopic rod 33 to extend. The telescopic rod 33 then pushes up an ejector rod 42, causing the ejector rod 42 to slide on the inner wall of a sleeve 41. This causes the ejector rod 42 to lift the wafer upwards, completing the auxiliary positioning. Then, the vacuum pump is activated, and a negative pressure is formed through the lower air channel 36 and the upper air hole to adsorb the edge of the wafer and fix it on the step plate 38. The 2mm step in the middle of the step plate 38 is used to prevent the thin wafer from contacting the surface of the placement plate 37 due to warping, keeping it in a non-contact state and ensuring that the wafer is not damaged during processing or transportation. In summary, the lifting mechanism 2 and the ejector mechanism 4 are used to place the wafer on the fixing mechanism 3. Then, the fixing mechanism 3 and the ejector mechanism 4 are used to adsorb and fix the wafer. The vacuum adsorption method is used, and the lower component air channel 36 and the upper component air hole are used to adsorb only the edge of the wafer, avoiding contact in the middle and ensuring that the wafer is not damaged during processing or transportation.

[0033] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A non-contact wafer chuck for wafer, comprising a base (1), a mounting plate (11) is fixedly connected to the top end of the base (1), characterized in that, The four corners of the top of the base (1) are rotatably connected to the first synchronous wheel (12), the top of the mounting plate (11) is provided with a lifting mechanism (2), and the top of the base (1) is provided with a fixing mechanism (3).

2. The non-contact wafer chuck of claim 1, wherein, The lifting mechanism (2) includes a motor (21), the output end of which is fixedly connected to a second synchronous pulley (22), the outer circumferential surface of which is meshed with a synchronous belt (23), the inner circumferential surface of which is meshed with a first synchronous pulley (12), the outer circumferential surface of which is close to the mounting plate (11) is connected to a tensioning pulley (24), the tensioning pulley (24) is rotatably connected to the mounting plate (11) through a rotating shaft, the corresponding outer wall of the synchronous belt (23) is fixedly connected to a connecting block (25), the outer wall of which is fixedly connected to a guide slider (26), the bottom end of which is slidably connected to a guide rail (29), the bottom end of which is fixedly connected to the top end of the base (1).

3. The non-contact wafer chuck of claim 2, wherein, The sliding connection between the guide rail (29) and the guide slider (26) is T-shaped.

4. The non-contact wafer chuck of claim 2, wherein, A slot is provided on the outer wall of the guide slider (26) to which a fixing plate (27) is inserted. A roller (28) is fixedly connected to the outer wall of the fixing plate (27). The outer wall of the roller (28) is in contact with the inclined surface of the outer wall of the guide slider (26).

5. The non-contact wafer chuck of claim 1, wherein, The fixing mechanism (3) includes a support base (31), the bottom end of which is fixedly connected to the middle of the top end of the base (1), a vacuum pump is provided inside the support base (31), a top plate (32) is slidably connected to the outer wall of the support base (31), the bottom end of the top plate (32) is fixedly connected to the top end of the roller (28), telescopic rods (33) are evenly distributed and fixedly connected to the bottom end of the top plate (32), the bottom end of the telescopic rods (33) is fixedly connected to the top end of the base (1), a support plate (34) is fixedly connected to the top end of the support base (31), a partition (35) is fixedly connected to the top end of the support plate (34), a placement plate (37) is fixedly connected to the top end of the partition (35), and an ejection mechanism (4) is evenly provided on the inner wall of the support plate (34).

6. The non-contact wafer chuck of claim 5, wherein, The outer wall of the partition (35) is provided with an air passage (36).

7. The non-contact wafer chuck of claim 5, wherein, The outer wall of the placement plate (37) is uniformly and fixedly connected with stepped plates (38). The stepped plates (38) are provided with vertically penetrating vent holes, and the lower end is connected to the air passage (36). The vacuum pump of the support base (31) is connected to the air passage (36) through a pipeline.

8. The non-contact wafer chuck of claim 5, wherein, The ejection mechanism (4) includes a sleeve (41), the outer wall of the sleeve (41) is fixedly connected to the mounting groove opened on the outer wall of the support plate (34), the inner wall of the sleeve (41) is slidably connected to an ejection rod (42), the outer wall of the ejection rod (42) passes through the outer wall of the partition plate (35) and is slidably connected to the sliding groove opened on the outer wall of the placement plate (37), and an O-ring is provided between the ejection rod (42) and the sliding groove.

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