A silicon wafer inspection machine

Abstract

This utility model discloses a silicon wafer inspection machine, including a feeding section, an AOI (Automated Optical Inspection) section, and an IV (Inspection and Inspection) section. The feeding section includes a feeding lifting mechanism, a feeding input guide rail, and a feeding lateral moving arm, which moves laterally between the feeding lifting mechanism and the feeding input guide rail. The AOI inspection section includes a four-station turntable mechanism, a back inspection mechanism, and a front inspection mechanism. The back inspection mechanism is located below the front end of the four-station turntable mechanism, and the front inspection mechanism is located above one side of the four-station turntable mechanism. This silicon wafer inspection machine performs AOI and IV inspections sequentially, testing double-half silicon wafers. It uses a lightweight turntable, which is easier to adjust structurally. The addition of a positioning structure to the conveying structure makes the alignment of the silicon wafers more precise. A steering structure is used to combine AOI and IV inspections on the same production line, improving both capacity and quality.

Description

Technical Field

[0001] This utility model relates to the technical field of testing equipment, and in particular to a silicon wafer testing machine. Background Technology

[0002] After printing, crystalline silicon photovoltaic solar wafers require AOI (Automated Optical Inspection) and IV (Inductively Coupled Inspection) testing. AOI, based on optical principles, detects common defects encountered during printing production. IV testing involves measuring the current and voltage characteristics (IV curve) of the photovoltaic module. Only wafers that pass this test and meet quality standards will proceed to the next stage of production. Existing testing equipment is bulky, and the connection between AOI and IV is inconvenient, hindering production in the workshop. Utility Model Content

[0003] One objective of this invention is to provide a silicon wafer inspection machine that features stable structure, accurate alignment, and convenient inspection and docking, thereby effectively improving yield and production capacity.

[0004] To achieve this objective, the present invention adopts the following technical solution:

[0005] A silicon wafer inspection machine includes a feeding section, an AOI inspection section, and an IV inspection section;

[0006] The feeding section includes a feeding lifting mechanism, a feeding input guide rail, and a feeding transverse moving arm. The feeding transverse moving arm moves laterally between the feeding lifting mechanism and the feeding input guide rail.

[0007] The AOI inspection section includes a four-station turntable mechanism, a back inspection mechanism, and a front inspection mechanism. The back inspection mechanism is located below the front end of the four-station turntable mechanism, and the front inspection mechanism is located above one side of the four-station turntable mechanism.

[0008] The IV detection section includes an IV detection mechanism and detection docking rails, with two sections of the detection docking rails respectively connected to both sides of the IV detection mechanism.

[0009] As a preferred technical solution, the feeding lifting mechanism is provided with a feeding lifting bracket, and the feeding lifting bracket is equipped with several pull-out guide rails. The pull-out guide rails are provided with a feeding position and a paper-separating position, and the feeding position and the paper-separating position move in the vertical direction.

[0010] As a preferred technical solution, the feeding transverse moving arm is equipped with a feeding transverse moving linear module. The driving end of the feeding transverse moving linear module is connected to two sets of paper-separating lifting cylinders and two sets of feeding lifting cylinders. The driving end of the paper-separating lifting cylinder is vertically downward connected to a paper-separating suction nozzle. The driving end of the feeding lifting cylinder is vertically downward connected to a feeding suction plate. A feeding back-blowing pipe is installed on the outside of the feeding suction plate.

[0011] As a preferred technical solution, the four-station turntable mechanism includes a four-station turntable, a backlight detection position, and a defective material discharge position. The backlight detection position is located in front of the four-station turntable, the backlight detection mechanism is located below the backlight detection position, and the defective material discharge position is located behind the four-station turntable. Turntable connecting guide rails are connected to both sides of the four-station turntable. Four sets of rotating arms are distributed around the four-station turntable. The four-station turntable and the rotating arms are integrally formed. A rotating arm suction component is provided at the outer end of the rotating arm. A rotating arm vertical movement adjustment groove is provided in the middle of the rotating arm suction component along the vertical direction. The screw on the rotating arm vertical movement adjustment groove is threadedly connected to the rotating arm.

[0012] As a preferred technical solution, the four-station turntable mechanism is provided with AOI detection input rails and AOI detection output rails on both sides, respectively. A steering mechanism is installed at the front end of the AOI detection input rail, and the front detection mechanism is located above the AOI detection output rail.

[0013] As a preferred technical solution, the steering mechanism includes a steering column, an upper steering plate, and a lower steering plate. The upper steering plate is located above the lower steering plate. A steering shaft is rotatably connected to the front end of the upper steering plate. A steering adsorption support is installed at the lower end of the steering shaft. A steering adsorption plate is installed on the steering adsorption support. Air blowing holes are provided on both sides of the steering adsorption plate. Steering air blowing pipes are installed on both sides of the lower steering plate, and the lower end of the steering air blowing pipes is aligned with the air blowing holes.

[0014] As a preferred technical solution, the IV detection mechanism is provided with an A-side transfer component and a B-side transfer component. Both the A-side transfer component and the B-side transfer component are equipped with a transfer transverse module. The drive end of the transfer transverse module is equipped with a transfer lifting motor, and the drive end of the transfer lifting motor is connected to a transfer adsorption plate.

[0015] As a preferred technical solution, the IV testing mechanism includes a testing base plate and a testing turntable. A set of testing components is arranged on each of the front two sides of the testing turntable. Below each set of testing components, two sets of X-axis testing modules and one set of Y-axis testing modules are arranged. The X-axis testing modules and the Y-axis testing modules are all mounted on the testing base plate. One set of X-axis testing modules is located below the side of the testing turntable, and the other set of X-axis testing modules and the Y-axis testing modules are both located at the front end of the testing base plate.

[0016] As a preferred technical solution, the IV detection section is connected to the EL detection section on the side away from the AOI detection section.

[0017] The beneficial effects of this utility model are as follows: It provides a silicon wafer inspection machine that performs AOI and IV inspections in succession to test double half-wafer silicon wafers. It adopts a lightweight turntable, which is more convenient to adjust in terms of structure. The addition of a positioning structure in the conveying structure makes the alignment of silicon wafers more neat. The AOI and IV are combined on the same production line by using a turning structure, which improves the production capacity and quality. Attached Figure Description

[0018] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments.

[0019] Figure 1 This is a schematic diagram of the overall structure of a silicon wafer inspection machine as described in the embodiment;

[0020] Figure 2 This is a schematic diagram of the feeding section described in the embodiment;

[0021] Figure 3 This is a schematic diagram of the material feeding and lifting mechanism described in the embodiment;

[0022] Figure 4 This is a schematic diagram of the structure of the feeding traverse traveling arm described in the embodiment;

[0023] Figure 5 This is a partial structural diagram of the AOI detection section described in the embodiment;

[0024] Figure 6 This is a schematic diagram of the four-station turntable mechanism described in the embodiment;

[0025] Figure 7 This is a partial structural diagram of the swing arm described in the embodiment;

[0026] Figure 8 This is a schematic diagram of the first structure of the steering mechanism described in the embodiment;

[0027] Figure 9 This is a schematic diagram of the second structure of the steering mechanism described in the embodiment;

[0028] Figure 10 This is a schematic diagram of the first structure of the positioning mechanism described in the embodiment (without a third positioning seat);

[0029] Figure 11 This is a schematic diagram of the second structure of the positioning mechanism described in the embodiment (with a third positioning seat);

[0030] Figure 12 This is a schematic diagram of the combined structure of the IV detection section and the EL detection section described in the embodiment;

[0031] Figure 13 This is a schematic diagram of the IV detection mechanism described in the embodiment;

[0032] Figure 14 This is a schematic diagram of the detection base plate described in the embodiment;

[0033] Figure 15 This is a schematic diagram of the detection component described in the embodiment;

[0034] Figure 16 This is a schematic diagram of the detection turntable described in the embodiment.

[0035] Figures 1 to 16 middle:

[0036] 1. Feeding section; 101. Feeding lifting mechanism; 102. Feeding input guide rail; 103. Feeding transverse travel arm; 104. Feeding lifting bracket; 105. Pull-out guide rail; 106. Feeding position; 107. Paper separator position; 108. Feeding transverse linear module; 109. Paper separator lifting cylinder; 110. Feeding lifting cylinder; 111. Paper separator suction nozzle; 112. Feeding suction plate; 113. Feeding backflushing pipe;

[0037] 2. AOI Inspection Section; 201. Four-station turntable; 202. Backlit inspection position; 203. Defective material discharge position; 204. Turntable connecting guide rail; 205. Rotary arm adsorption component; 206. Rotary arm vertical movement adjustment groove; 207. Turntable motor; 208. Turntable adsorption plate; 209. Turntable air pipe connector; 210. Turntable pneumatic assembly; 211. Backlit dust removal air knife; 212. Defective material drawer; 213. Defective material handle; 214. Anti-adhesion air pipe; 215. AOI inspection input guide rail; 216. AOI inspection output guide rail; 217. Steering mechanism; 218. Steering column; 219. Steering upper plate; 220. Steering lower plate; 221. Steering shaft; 222. Steering adsorption support; 223. Steering adsorption plate; 224. Air blowing hole position; 225. Steering air blowing pipe; 226. Turntable... 227. Steering motor; 228. Steering drive wheel; 229. Steering driven wheel; 230. Steering belt; 231. Steering sensor; 232. Steering sensor plate; 233. Air blowing mounting block; 233. Air blowing adjustment groove; 234. Positioning bracket; 235. First positioning seat; 236. Second positioning seat; 237. Positioning synchronous pulley; 238. Positioning synchronous belt; 239. First outer positioning strip; 240. First inner positioning strip; 241. Second outer positioning strip; 242. Second inner positioning strip; 243. First groove; 244. Second groove; 245. Positioning platform; 246. Positioning motor; 247. Positioning transverse slide rail; 248. Positioning sensor; 249. Positioning sensor plate; 250. Rear positioning strip; 251. Positioning steering wheel; 252. Positioning guide rod; 253. Positioning bearing;

[0038] 3. IV Detection Section; 301. Detection Base Plate; 302. Detection Turntable; 303. X-axis Detection Module; 304. Y-axis Detection Module; 305. Detection Adjustment Motor; 306. Detection Adjustment Nut Seat; 307. Detection Adjustment Bearing; 308. Detection Moving Plate; 309. Detection Lifting Seat; 310. Detection Upper Support; 311. Detection Lower Support; 312. Detection Lifting Motor; 313. Detection Lifting Slide Rail; 314. Probe Row; 315. Fiberglass Board; 316. Direct Drive Motor; 317. Dual Adsorption Station; 318. Detection Adsorption Strip; 319. Detection Nozzle; 320. IV Detection Mechanism; 321. Detection Docking Guide Rail; 322. Transfer and Transverse Module; 323. Transfer Lifting Motor; 324. Transfer Adsorption Plate;

[0039] 4. EL detection section. Detailed Implementation

[0040] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0041] like Figures 1 to 16As shown in this embodiment, a silicon wafer inspection machine includes a loading section 1, an AOI inspection section 2, and an IV inspection section 3. The loading section 1 includes a loading lifting mechanism 101, a loading input guide rail 102, and a loading transverse moving arm 103, which moves laterally between the loading lifting mechanism 101 and the loading input guide rail 102. The AOI inspection section 2 includes a four-station turntable 201 mechanism, a back inspection mechanism, and a front inspection mechanism. The back inspection mechanism is located below the front end of the four-station turntable 201 mechanism, and the front inspection mechanism is located above one side of the four-station turntable 201 mechanism. The IV inspection section 3 includes an IV inspection mechanism 320 and an inspection docking guide rail 321, with two sections of the inspection docking guide rail 321 connected to both sides of the IV inspection mechanism 320.

[0042] The loading lifting mechanism 101 stores the silicon wafers, and the loading transverse moving arm 103 moves the silicon wafers into the loading input guide rail 102. First, the wafers enter the four-station turntable 201 mechanism for back-side inspection AOI, then the front-side inspection AOI, and then, driven by the IV inspection mechanism 320, the wafers undergo IV testing in front of the IV inspection mechanism 320. Finally, qualified products are output.

[0043] The feeding lifting mechanism 101 is equipped with a feeding lifting bracket 104, and a number of pull-out guide rails 105 are installed on the feeding lifting bracket 104. The pull-out guide rails 105 are equipped with feeding positions 106 and paper-separating positions 107, and the feeding positions 106 and paper-separating positions 107 move in the vertical direction.

[0044] Place the silicon wafer and spacer paper into the pull-out guide rail 105, push the pull-out guide rail 105 into the loading lifting bracket 104. In the vertical direction, the loading transverse moving arm 103 picks up the silicon wafer and the spacer paper at the same time. When the loading transverse moving arm 103 returns to the loading position 106, the spacer paper is moved to the spacer paper position 107. In this way, one silicon wafer and one spacer paper are picked up and placed in sequence.

[0045] The feeding transverse moving arm 103 is equipped with a feeding transverse moving linear module 108. The driving end of the feeding transverse moving linear module 108 is connected to two sets of paper-separating lifting cylinders 109 and two sets of feeding lifting cylinders 110. The driving end of the paper-separating lifting cylinder 109 is vertically downward connected to a paper-separating suction nozzle 111. The driving end of the feeding lifting cylinder 110 is vertically downward connected to a feeding suction plate 112. A feeding back-blowing pipe 113 is installed on the outside of the feeding suction plate 112.

[0046] During the input of silicon wafers, the loading lateral linear module 108 controls the lateral movement, and two sets of paper-separating lifting cylinders 109 and two sets of loading lifting cylinders 110 simultaneously realize the input of double half wafers. The paper-separating suction nozzle 111 adsorbs the paper, and the loading suction plate 112 adsorbs the silicon wafer. In order to prevent the silicon wafer from sticking to the loading suction plate 112, air is blown downward through the loading back-blowing pipe 113 to detach the silicon wafer from the loading suction plate 112.

[0047] The four-station turntable 201 mechanism includes a four-station turntable 201, a backlight detection position 202, and a defective material discharge position 203. The backlight detection position 202 is located in front of the four-station turntable 201, and the defective material discharge position 203 is located behind the four-station turntable 201. Turntable connecting guide rails 204 are connected to both sides of the four-station turntable 201. Four sets of rotating arms are distributed around the four-station turntable 201. The four-station turntable 201 and the rotating arms are integrally formed. The outer end of the rotating arm is provided with a rotating arm adsorption component 205. The middle part of the rotating arm adsorption component 205 is provided with a rotating arm vertical movement adjustment groove 206 along the vertical direction. The screw on the rotating arm vertical movement adjustment groove 206 is threadedly connected to the rotating arm.

[0048] Based on the position of the front and rear turntable connecting guide rails 204, the vertical position of the rotating arm adsorption component 205 is adjusted by the vertical adjustment groove 206 of the rotating arm. After determining the height of the adsorbed silicon wafer, it is locked with screws. After the silicon wafer is transported by the front turntable connecting guide rail 204, the rotating arm adsorption component 205 on the rotating arm controls the adsorption of the silicon wafer and turns to the backlight detection position 202 for AOI detection of the back of the silicon wafer. If it is a defective product, it continues to turn to the defective material discharge position 203 at the rear for collection. If it is a good product, the four-station turntable 201 transfers the silicon wafer to the turntable connecting guide rail 204 on the other side for output.

[0049] A turntable motor 207 is installed in the lower middle part of the four-position turntable 201. The turntable motor 207 drives the rotation of the four-position turntable 201 through a synchronous belt and a synchronous pulley. When controlling the direction of the four-position turntable 201, the turntable motor 207 is located below to provide power, and the horizontal direction is achieved by driving the synchronous pulley and the synchronous belt.

[0050] Both sides of the rotating arm adsorption component 205 are fixed with turntable adsorption plates 208. A turntable air pipe connector 209 is installed in the middle of the turntable adsorption plate 208. In addition, a turntable pneumatic assembly 210 is installed in the middle of the four-position turntable 201. The turntable pneumatic assembly 210 is concentrated in the middle of the four-position turntable 201 to save space. It is connected to the turntable air pipe connector 209 and the silicon wafer is adsorbed and transferred through the turntable adsorption plates 208 on the rotating arm adsorption component 205.

[0051] A backlight dust removal air knife 211 is installed at the front end of the backlight detection position 202. The backlight dust removal air knife 211 removes dust from the silicon wafer, which helps to improve the accuracy of AOI detection.

[0052] The defective material discharge position 203 is equipped with a defective material drawer 212. The defective material drawer 212 moves horizontally. A defective material handle 213 is fixed on the outside of the defective material drawer 212. After being identified as defective in AOI inspection, the defective material will be placed in the defective material drawer 212 for storage. The defective material drawer 212 can be pulled out manually through the defective material handle 213 to remove the defective silicon wafer.

[0053] Both the input end of the turntable connecting guide rail 204 and the top of the defective material discharge position 203 are equipped with anti-adhesion air pipes 214. During the silicon wafer transfer process, the downward air blowing through the anti-adhesion air pipes 214 prevents the silicon wafer from continuing to adhere to the original structure.

[0054] The four-station turntable 201 mechanism is provided with AOI detection input rail 215 and AOI detection output rail 216 on both sides respectively. The front end of the AOI detection input rail 215 is equipped with a steering mechanism 217, and the front detection mechanism is located above the AOI detection output rail 216.

[0055] The steering mechanism 217 includes a steering column 218, an upper steering plate 219, and a lower steering plate 220. The upper steering plate 219 is located above the lower steering plate 220. A steering shaft 221 is rotatably connected to the front end of the upper steering plate 219. A steering adsorption support 222 is installed at the lower end of the steering shaft 221. A steering adsorption plate 223 is installed on the steering adsorption support 222. Air blowing holes 224 are provided on both sides of the steering adsorption plate 223. Steering air blowing pipes 225 are installed on both sides of the lower steering plate 220. The lower end of the steering air blowing pipes 225 is aligned with the air blowing holes 224.

[0056] According to the testing requirements, the silicon wafer on one side needs to be rotated. The rotating adsorption plate 223 on the rotating adsorption support 222 picks up the silicon wafer on the lower surface. After the rotation of the rotating shaft 221, the orientation of the silicon wafer is changed. The rotating adsorption plate 223 then releases air to release the silicon wafer. In order to ensure that the silicon wafer does not stick to the rotating adsorption plate 223, the rotating air blowing pipes 225 on both sides start working, blowing air onto the silicon wafer through the air blowing holes 224, so that the silicon wafer detaches from the rotating adsorption plate 223.

[0057] A steering motor 226 is fixed on the upper steering plate 219. The driving end of the steering motor 226 is connected to the steering drive wheel 227. The upper end of the steering shaft 221 is equipped with a steering driven wheel 228. A steering belt 229 is connected between the steering drive wheel 227 and the steering driven wheel 228. The steering motor 226 provides power to the steering drive wheel 227. Driven by the steering belt 229, the steering driven wheel 228 and the steering shaft 221 turn together, realizing the steering action of the silicon wafer.

[0058] A steering sensor 230 is installed on one side of the steering plate 219, and a steering sensor plate 231 is fixed on the upper end of the steering shaft 221. The steering sensor plate 231 is connected to the steering sensor 230. During the steering process, the steering sensor 230 senses the steering sensor plate 231 to ensure that the angle is correct after the steering.

[0059] Air blowing mounting blocks 232 are provided on both sides of the steering lower plate 220. The steering air blowing pipe 225 is fixed to the front end of the air blowing mounting block 232. An air blowing adjustment groove 233 is provided at the rear end of the air blowing mounting block 232. The air blowing adjustment groove 233 is locked to the steering lower plate 220 by internal screws. The position of the screws in the air blowing adjustment groove 233 can be adjusted according to the air blowing position to adjust the front and rear position of the steering air blowing pipe 225.

[0060] The IV testing mechanism 320 is equipped with an A-side transfer assembly and a B-side transfer assembly. Both the A-side transfer assembly and the B-side transfer assembly are equipped with a transfer transverse module 322. The drive end of the transfer transverse module 322 is equipped with a transfer lifting motor 323. The drive end of the transfer lifting motor 323 is connected to a transfer adsorption plate 324. Through the linear transmission of the transfer transverse module 322, the silicon wafers on the guide rail are input into the IV testing mechanism 320, or output from the IV testing mechanism 320 to the guide rail.

[0061] IV testing mechanism 320 includes a testing base plate 301 and a testing turntable 302. A set of testing components is provided on each of the front two sides of the testing turntable 302. Below each set of testing components, there are two sets of X-axis testing modules 303 and one set of Y-axis testing modules 304. The X-axis testing modules 303 and Y-axis testing modules 304 are both mounted on the testing base plate 301. One set of X-axis testing modules 303 is located below the side of the testing turntable 302, and the other set of X-axis testing modules 303 and Y-axis testing modules 304 are both located at the front end of the testing base plate 301.

[0062] Two sets of X-axis detection modules 303 are distributed at the front and rear ends of the detection base plate 301, and combined with a set of Y-axis detection modules 304, the adjustment range is increased, and the adjustment effect in the XYT direction of the detection component is better. After the detection turntable 302 picks up the silicon wafer, the X-axis direction, Y-axis direction and the T-axis direction of the angle can be adjusted by the X-axis detection module 303 and the Y-axis detection module 304 with a large distance.

[0063] Both the X-axis detection module 303 and the Y-axis detection module 304 are equipped with a detection adjustment motor 305. The drive end of the detection adjustment motor 305 is connected to a detection adjustment lead screw. A detection adjustment nut seat 306 is threadedly connected to the detection adjustment lead screw. A detection adjustment bearing 307 is installed on the detection adjustment nut seat 306. The upper end of the detection adjustment bearing 307 is connected to the lower end of the detection assembly. A detection lower slide rail is fixed on the detection base plate 301. The detection adjustment nut seat 306 slides on the detection lower slide rail. An detection upper slide rail is fixed to the lower end of the detection adjustment bearing 307. The upper end of the detection adjustment nut seat 306 slides on the detection upper slide rail. The detection upper slide rail and the detection lower slide rail are perpendicular to each other.

[0064] In controlling the directional adjustment of the X and Y axes, the detection and adjustment motor 305 provides power. When the detection and adjustment screw is rotated, the detection and adjustment nut seat 306 slides along the detection lower slide rail, while the detection and adjustment bearing 307 moves relative to the detection and adjustment nut on the detection upper slide rail according to the power in another direction. This allows the entire detection assembly on the detection and adjustment bearing 307 to achieve alignment adjustment in the X and Y directions. The angle T direction is adjusted jointly by the X-axis detection module 303 and the Y-axis detection module 304.

[0065] The lower end of the detection assembly is provided with a detection moving plate 308. The X-axis detection module 303 and the Y-axis detection module 304 are both connected to the detection moving plate 308. A detection lifting seat 309 is fixed on the detection moving plate 308. The detection lifting seat 309 has an upper detection bracket 310 and a lower detection bracket 311 that move vertically. Specifically, the detection lifting seat 309 is equipped with a detection lifting motor 312 and a detection lifting slide rail 313. The detection lifting motor 312 drives the upper detection bracket 310 and the lower detection bracket 311 to move up and down along the detection lifting slide rail 313 through a lead screw and nut. A probe array 314 is installed on the lower detection bracket 311, and a fiberglass board 315 is installed on the upper detection bracket 310. The fiberglass board 315 presses the silicon wafer down onto the probe array 314, and the energized probe array 314 performs IV detection on the signal on the silicon wafer.

[0066] When the detection turntable 302 moves the adsorbed silicon wafer to the front, the detection lifting motor 312 provides power to drive the detection upper support 310 to move down, while the detection lower support 311 moves up. The probes on the probe row 314 contact the contacts on the silicon wafer. After performing IV detection on the silicon wafer, it can be determined whether the silicon wafer is a good product.

[0067] A direct drive motor 316 is installed below the detection turntable 302, and the drive end of the direct drive motor 316 is vertically connected to the middle of the detection turntable 302. A double adsorption station 317 is set around the detection turntable 302. A detection adsorption strip 318 is installed horizontally in the double adsorption station 317, and detection nozzles 319 are distributed on the detection adsorption strip 318.

[0068] In terms of steering, the direct drive motor 316 controls the rotating detection turntable 302 to rotate, and the dual adsorption station 317 adsorbs the two half pieces for transfer and detection. After the detection is completed, it is determined whether to output to the subsequent guide rail or discharge as a defective product. The direct drive motor 316 is installed below and the wiring and air circuit are integrated above to save space.

[0069] The IV detection section 3 is connected to the EL detection section 4 on the side away from the AOI detection section 2. The EL detection section 4 adopts the structure of the IV detection section 3 described above.

[0070] A positioning mechanism can be added to the silicon wafer transport guide rail of the silicon wafer inspection machine to center the silicon wafer during transport.

[0071] The positioning mechanism includes a positioning bracket 234, a first positioning seat 235, and a second positioning seat 236. Positioning synchronous pulleys 237 are mounted on both sides of the positioning bracket 234, and a positioning synchronous belt 238 is drivingly connected between the positioning synchronous pulleys 237. The first positioning seat 235 and the second positioning seat 236 are respectively fixed to both sides of the positioning synchronous belt 238. The first positioning seat 235 and the second positioning seat 236 move in opposite directions. A first outer positioning strip 239 is fixed to the outer side of the first positioning seat 235, and a first outer positioning strip 239 is fixed to the inner side of the first positioning seat 235. A first inner positioning strip 240 is fixed, a second outer positioning strip 241 is fixed to the outer side of the second positioning seat 236, a second inner positioning strip 242 is fixed to the inner side of the second positioning seat 236, a first groove 243 is provided in the middle of the first inner positioning strip 240, a second groove 244 is provided in the middle of the second inner positioning strip 242, and a positioning platform 245 is provided in the middle of the second groove 244. The first inner positioning strip 240 is located inside the second groove 244, and the positioning platform 245 is located inside the first groove 243.

[0072] When the conveyor moves the two halves of the wafer over, the positioning timing wheel 237 rotates, driving the positioning timing belt 238 to move. The first positioning seat 235 and the second positioning seat 236 on both sides begin to move towards the center. The first outer positioning strip 239 and the second outer positioning strip 241 both move from the outside to the inside. The first inner positioning strip 240 leaves the second groove 244 of the second inner positioning strip 242. At the same time, the positioning platform 245 in the middle of the second inner positioning strip 242 also leaves the first groove 243 of the first inner positioning strip 240, so that the two halves of the silicon wafer on both sides can achieve the centering positioning operation.

[0073] A positioning motor 246 is fixed on one side of the positioning bracket 234. The drive end of the positioning motor 246 is keyed to the positioning synchronous wheel 237. The positioning motor 246 is responsible for providing power to the positioning synchronous wheel 237, so that the positioning synchronous wheel 237 rotates.

[0074] The positioning bracket 234 is provided with a positioning transverse slide rail 247, and both the first positioning seat 235 and the second positioning seat 236 are provided with positioning transverse sliders. The positioning transverse sliders slide on the positioning transverse slide rail 247. On both sides of the positioning bracket 234, the movement of the first positioning seat 235 and the second positioning seat 236 relies on the positioning transverse sliders and the positioning transverse slide rail 247 to reduce friction and ensure the lateral stability of the movement.

[0075] A positioning sensor 248 is installed on one side of the positioning bracket 234, and a positioning sensor 249 is fixed on the second positioning seat 236. The positioning sensor 249 is connected to the positioning sensor 248. When the first positioning seat 235 and the second positioning seat 236 have completed the positioning of the two half-wafers, the positioning sensor 248 stops when it senses the positioning sensor 249 during the outward reset process.

[0076] When positioning the rear end of the conveyor rail, the rear side also needs to be positioned. At this time, a third positioning seat is provided on the positioning bracket 234, a positioning synchronous wheel 237 is installed at the rear end of the positioning bracket 234, a positioning steering wheel 251 is installed in the middle of the positioning bracket 234, the positioning synchronous belt 238 passes through the positioning steering wheel 251, the third positioning seat is fixed at the rear end of the positioning synchronous belt 238, the movement direction of the third positioning seat is perpendicular to that of the first positioning seat 235, and a rear positioning strip 250 is fixed on the third positioning seat.

[0077] As the positioning motor 246 drives the positioning synchronous wheel 237 to rotate, the first positioning seat 235 and the second positioning seat 236 on both sides move towards the middle, while the third positioning seat on the rear moves forward, thus achieving silicon wafer positioning in three directions.

[0078] Positioning guide rods 252 are fixed on the first outer positioning strip 239, the first inner positioning strip 240, the second outer positioning strip 241, the second inner positioning strip 242, and the rear positioning strip 250. Moreover, a positioning bearing 253 rotates on the upper end of the positioning guide rod 252. When each positioning strip positions the double half-wafer, the positioning bearing 253 on the positioning guide rod 252 pushes the edge of the double half-wafer. The rolling positioning bearing 253 effectively protects the structure of the double half-wafer.

[0079] It should be stated that the above-described specific embodiments are merely preferred embodiments of this utility model and the technical principles applied thereto. Within the scope of the technology disclosed in this utility model, any variations or substitutions that are easily conceived by those skilled in the art should be covered within the protection scope of this utility model.

Claims

1. A silicon wafer inspection machine, characterized in that, This includes the material feeding section, the AOI inspection section, and the IV inspection section; The feeding section includes a feeding lifting mechanism, a feeding input guide rail, and a feeding transverse moving arm. The feeding transverse moving arm moves laterally between the feeding lifting mechanism and the feeding input guide rail. The AOI inspection section includes a four-station turntable mechanism, a back inspection mechanism, and a front inspection mechanism. The back inspection mechanism is located below the front end of the four-station turntable mechanism, and the front inspection mechanism is located above one side of the four-station turntable mechanism. The IV detection section includes an IV detection mechanism and detection docking rails, with two sections of the detection docking rails respectively connected to both sides of the IV detection mechanism.

2. The silicon wafer inspection machine according to claim 1, characterized in that, The feeding and lifting mechanism is equipped with a feeding and lifting bracket, and a number of pull-out guide rails are installed on the feeding and lifting bracket. The pull-out guide rails are provided with feeding positions and paper-separating positions, and the feeding positions and the paper-separating positions move in the vertical direction.

3. A silicon wafer inspection machine according to claim 1, characterized in that, The feeding transverse moving arm is equipped with a feeding transverse moving linear module. The driving end of the feeding transverse moving linear module is connected to two sets of paper-separating lifting cylinders and two sets of feeding lifting cylinders. The driving end of the paper-separating lifting cylinder is vertically downward connected to a paper-separating suction nozzle. The driving end of the feeding lifting cylinder is vertically downward connected to a feeding suction plate. A feeding back-blowing pipe is installed on the outside of the feeding suction plate.

4. A silicon wafer inspection machine according to claim 1, characterized in that, The four-station turntable mechanism includes a four-station turntable, a backlight detection position, and a defective material discharge position. The backlight detection position is located in front of the four-station turntable, the backlight detection mechanism is located below the backlight detection position, and the defective material discharge position is located behind the four-station turntable. Turntable connecting guide rails are connected to both sides of the four-station turntable. Four sets of rotating arms are distributed around the four-station turntable. The four-station turntable and the rotating arms are integrally formed. A rotating arm suction component is provided at the outer end of the rotating arm. A rotating arm vertical movement adjustment groove is provided in the middle of the rotating arm suction component along the vertical direction. The screw on the rotating arm vertical movement adjustment groove is threadedly connected to the rotating arm.

5. A silicon wafer inspection machine according to claim 1, characterized in that, The four-station turntable mechanism is provided with AOI detection input rails and AOI detection output rails on both sides respectively. A steering mechanism is installed at the front end of the AOI detection input rail, and the front detection mechanism is located above the AOI detection output rail.

6. A silicon wafer inspection machine according to claim 5, characterized in that, The steering mechanism includes a steering column, an upper steering plate, and a lower steering plate. The upper steering plate is located above the lower steering plate. A steering shaft is rotatably connected to the front end of the upper steering plate. A steering suction support is installed at the lower end of the steering shaft. A steering suction plate is installed on the steering suction support. Air blowing holes are provided on both sides of the steering suction plate. Steering air blowing pipes are installed on both sides of the lower steering plate. The lower end of the steering air blowing pipes is aligned with the air blowing holes.

7. A silicon wafer inspection machine according to claim 1, characterized in that, The IV detection mechanism is equipped with an A-side transfer assembly and a B-side transfer assembly. Both the A-side transfer assembly and the B-side transfer assembly are equipped with a transfer transverse module. The drive end of the transfer transverse module is equipped with a transfer lifting motor, and the drive end of the transfer lifting motor is connected to a transfer adsorption plate.

8. A silicon wafer inspection machine according to claim 1, characterized in that, The IV testing mechanism includes a testing base plate and a testing turntable. A set of testing components is arranged on each of the front two sides of the testing turntable. Below each set of testing components, there are two sets of X-axis testing modules and one set of Y-axis testing modules. The X-axis testing modules and the Y-axis testing modules are all mounted on the testing base plate. One set of X-axis testing modules is located below the side of the testing turntable, and the other set of X-axis testing modules and the Y-axis testing modules are located at the front end of the testing base plate.

9. A silicon wafer inspection machine according to claim 1, characterized in that, The IV detection section is connected to the EL detection section on the side away from the AOI detection section.

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