A GaN power driver IC with a high-efficiency heat dissipation structure

Abstract

This invention discloses a GaN power driver IC with a high-efficiency heat dissipation structure, including a circuit board, a GaN power device, and a driver IC. The upper surface of the circuit board is encapsulated with multiple thermal pads. Ventilation slots are provided on the side of the GaN power device and the driver IC facing the circuit board without affecting the penetration of the housing. Ventilation pipes communicating with the ventilation slots are embedded in the circuit board opposite the thermal pads. The end of the ventilation pipe away from the thermal pads passes through the circuit board and has multiple heat dissipation fins installed in a ring structure. This invention has a simple structure. The bottom of the GaN power device and the driver IC has ventilation slots, and the horizontally exhausted air can quickly remove the heat from the bottom of the GaN power device and the driver IC through the ventilation slots. Furthermore, the GaN power device and the driver IC are also connected to the lower surface through the ventilation pipes, and the heat dissipation fins further increase the contact area with the air and the heat dissipation efficiency.

Description

Technical Field

[0001] This utility model relates to the field of GaN power device and driver IC mounting technology, specifically to a GaN power driver IC with a high-efficiency heat dissipation structure. Background Technology

[0002] GaN power devices are semiconductor power devices based on gallium nitride material, used for efficient power conversion and power control. Driver ICs are integrated circuits specifically designed to control power devices (such as GaN HEMTs), responsible for providing precise gate drive signals. Currently, GaN power devices and driver ICs are generally mounted on circuit boards. Due to their high power and high-frequency switching characteristics, heat dissipation is a challenge. Current heat dissipation structures cannot efficiently dissipate heat, resulting in heat accumulation, which will reduce the lifespan of electronic components over time. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a GaN power driver IC with a high-efficiency heat dissipation structure. The ventilation structure greatly increases the heat dissipation efficiency, thereby solving the problems mentioned in the background art.

[0004] This utility model is achieved through the following technical solution: A GaN power driver IC with a high-efficiency heat dissipation structure includes a circuit board, GaN power devices, and a driver IC. The upper surface of the circuit board is encapsulated with multiple thermal pads. Multiple GaN power devices and driver ICs are provided and respectively mounted on the thermal pads. On the side of the GaN power devices and driver ICs facing the circuit board, ventilation slots are provided without affecting the penetration of the housing. Ventilation pipes communicating with the ventilation slots are embedded in the circuit board opposite to the thermal pads. The end of the ventilation pipe away from the thermal pads passes through the circuit board and is equipped with multiple heat dissipation fins in a ring structure. An air collecting shroud is installed at one end of the circuit board.

[0005] As a preferred technical solution, each thermal pad includes a central copper layer and multiple connecting pads. The central copper layer and connecting pads are both encapsulated on the surface of the circuit board. The connecting pads are evenly distributed on the outer side of the central copper layer and are all positioned opposite to the pins on the GaN power device or driver IC. The pins on the GaN power device and driver IC are soldered and fixed to the connecting pads, and the interior of the connecting pads is connected to the circuit layer in the circuit board.

[0006] As a preferred technical solution, the end of the ventilation duct away from the heat dissipation fins is installed at the center of the central copper layer and penetrates the central copper layer.

[0007] As a preferred technical solution, air guide channels are formed between the surface of the air collector and the circuit board, and between the air collector and the bottom surface of the circuit board. The upper air guide channel is set towards the ventilation slot, and the lower air guide channel is set towards the heat dissipation fins. An air inlet pipe connected to the air guide channel is installed on the outer side of the air collector.

[0008] As a preferred technical solution, the ventilation duct is made of metal and is not in contact with the circuit layer inside the circuit board.

[0009] As a preferred technical solution, the air collection cover is made of insulating plastic material.

[0010] As a preferred technical solution, both ends of the ventilation duct are provided with arc-shaped guide sections.

[0011] The beneficial effects of this utility model are: the utility model has a simple structure, the bottom of the GaN power device and the driver IC is provided with a ventilation slot, and the heat at the bottom of the GaN power device and the driver IC can be quickly removed by the horizontally discharged air through the ventilation slot. In addition, the GaN power device and the driver IC are also connected to the bottom through the ventilation pipe, and the heat dissipation fins can further increase the contact area with the air and the heat dissipation efficiency. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0014] Figure 2 This is a bottom view of the present invention;

[0015] Figure 3 This is a schematic diagram of the structure of this utility model after removing any GaN power device and driver IC;

[0016] Figure 4 This is a side view of the present invention.

[0017] The components include: 1. Circuit board; 2. GaN power device; 3. Ventilation slot; 4. Air collector shroud; 5. Air inlet pipe; 6. Air guide channel; 7. Heat dissipation fins; 8. Ventilation pipe; 9. Central copper layer; 10. Connecting pads; and 11. Driver IC. Detailed Implementation

[0018] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0019] All features disclosed in this specification, or steps in all methods or processes disclosed herein, may be combined in any way, except for mutually exclusive features and / or steps.

[0020] Any feature disclosed in this specification (including any appended claims, abstract, and drawings) may be replaced by other equivalent or similar features for a similar purpose, unless specifically stated otherwise. That is, unless specifically stated otherwise, each feature is merely one example of a series of equivalent or similar features.

[0021] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, this utility model discloses a GaN power driver IC with a high-efficiency heat dissipation structure, including a circuit board 1, a GaN power device 2, and a driver IC 11. The upper surface of the circuit board 1 is encapsulated with multiple thermal pads. The GaN power device 2 and the driver IC 11 are provided with multiple thermal pads and are respectively mounted on the thermal pads. On the side of the GaN power device 2 and the driver IC 11 facing the circuit board 1, ventilation slots 3 are provided without affecting the penetration of the housing. The circuit board 1 is embedded with ventilation pipes 8 that communicate with the ventilation slots 3 at the outlets of the thermal pads. The end of the ventilation pipes 8 away from the thermal pads passes through the circuit board 1 and is equipped with multiple heat dissipation fins 7 in a ring structure. An air collecting shroud 4 is installed at one end of the circuit board 1.

[0022] In this embodiment, each thermal pad includes a central copper layer 9 and multiple connecting pads 10. The central copper layer 9 and the connecting pads 10 are both encapsulated on the surface of the circuit board 1. The connecting pads 10 are evenly distributed on the outer side of the central copper layer 9 and are all arranged opposite to the pins on the GaN power device 2 or the driver IC 11. The pins on the GaN power device 2 and the driver IC 11 are all soldered and fixed on the connecting pads 10, and the interior of the connecting pads 10 is connected to the circuit layer in the circuit board 1.

[0023] In this embodiment, the end of the ventilation pipe 8 away from the heat dissipation fins 7 is installed at the center of the central copper layer 9 and is installed through the central copper layer 9, so that the ventilation pipe can communicate with the ventilation slot, so that vertical convection can be realized and the heat dissipation efficiency can be increased.

[0024] In this embodiment, air guide channels 6 are formed between the surface of the air collector shroud 4 and the circuit board 1, and between the bottom surface of the air collector shroud 4 and the circuit board 1. The upper air guide channel 6 is set towards the ventilation slot 3, and the lower air guide channel 6 is set towards the heat dissipation fins 7. An air inlet pipe 5 communicating with the air guide channel 6 is installed on the outer side of the air collector shroud 4.

[0025] One end of the heat dissipation fins contacts the bottom surface of the circuit board, increasing the contact area with the circuit board and enabling more efficient heat dissipation.

[0026] In this embodiment, the ventilation duct 8 is made of metal material and is not in contact with the circuit layer inside the circuit board 1, thus avoiding the ventilation duct from conducting with the circuit board. Furthermore, the metal material can more efficiently remove heat from the GaN power devices and driver ICs.

[0027] In this embodiment, the air collecting cover 4 is made of insulating plastic material, which avoids electrical contact with the circuit board and increases safety.

[0028] In this embodiment, both ends of the ventilation slot 3 are provided with arc-shaped guide sections, which allow more lateral airflow to enter the ventilation slot.

[0029] Working principle: A flexible hose can be installed on the air intake pipe, which can be connected to the fan. The air generated by the fan is blown into the air intake pipe through the hose until it is discharged from the air guide channel. The discharged air passes laterally through the ventilation slots and heat dissipation fins. The ventilation slots can quickly remove the heat from the bottom of the GaN power devices and driver ICs. Some of the air enters the ventilation pipe and, together with the heat dissipation fins, greatly increases the contact area with the air, which can more efficiently remove the heat from the GaN power devices, driver ICs and circuit boards, ensuring airflow and heat dissipation effect.

[0030] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions conceived without inventive effort should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope defined in the claims.

Claims

1. A GaN power driver IC with a high-efficiency heat dissipation structure, characterized in that: The circuit board (1), GaN power devices (2) and driver IC (11) are included. The upper surface of the circuit board (1) is encapsulated with multiple hot pads. The GaN power devices (2) and driver IC (11) are provided in multiple ways and are respectively mounted on the hot pads. On the side of the GaN power devices (2) and driver IC (11) facing the circuit board (1), ventilation slots (3) are provided without affecting the penetration of the housing. The circuit board (1) is embedded with ventilation pipes (8) that communicate with the ventilation slots (3) at the outlet of the hot pads. The end of the ventilation pipes (8) away from the hot pads passes through the circuit board (1) and is equipped with multiple heat dissipation fins (7) in a ring structure. A fan shroud (4) is installed at one end of the circuit board (1).

2. The GaN power drive IC with high-efficiency heat dissipation structure according to claim 1, characterized in that: Each thermal pad includes a central copper layer (9) and multiple connecting pads (10). The central copper layer (9) and the connecting pads (10) are both encapsulated on the surface of the circuit board (1). The connecting pads (10) are evenly distributed on the outside of the central copper layer (9) and are all positioned opposite to the pins on the GaN power device (2) or the driver IC (11). The pins on the GaN power device (2) and the driver IC (11) are all soldered and fixed on the connecting pads (10), and the interior of the connecting pads (10) is connected to the circuit layer in the circuit board (1).

3. The GaN power drive IC with high-efficiency heat dissipation structure according to claim 2, characterized in that: The end of the ventilation duct (8) away from the heat dissipation fins (7) is installed at the center of the central copper layer (9) and is installed through the central copper layer (9).

4. The GaN power driver IC with high-efficiency heat dissipation structure of claim 1, wherein: Air guide channels (6) are formed between the surface of the air collector shroud (4) and the circuit board (1) and between the bottom surface of the air collector shroud (4) and the circuit board (1). The upper air guide channel (6) is set towards the ventilation slot (3), and the lower air guide channel (6) is set towards the heat dissipation fins (7). An air inlet pipe (5) connected to the air guide channel (6) is installed on the outer side of the air collector shroud (4).

5. The GaN power driver IC with high-efficiency heat dissipation structure of claim 1, wherein: The ventilation duct (8) is made of metal and is not in contact with the circuit layer inside the circuit board (1).

6. The GaN power driver IC with high-efficiency heat dissipation structure of claim 1, wherein: The air collector cover (4) is made of insulating plastic material.

7. The GaN power driver IC with high-efficiency heat dissipation structure of claim 1, wherein: Both ends of the ventilation slot (3) are provided with arc-shaped guide sections.

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