A high-precision wire bonding machine for chips

Abstract

This utility model discloses a high-precision wire bonding machine for chips, relating to the field of chip wire bonding machines. The high-precision wire bonding machine for chips includes a support base, a guide rail body, a template body, a drive unit, and a wire bonding unit. The high-precision wire bonding machine for chips adopts a structure in which the drive unit is located at the bottom of the guide rail body. The drive unit facilitates the raising and lowering of the guide rail body, allowing for wire bonding between the chip and the substrate placed within the template body. Simultaneously, it works in conjunction with a limiting mechanism to facilitate the transfer of the template body. This allows for template body replacement without stopping the machine and effectively prevents the wires at two bonding points from connecting to the substrate, avoiding situations of poor reliability or electrical performance.

Description

Technical Field

[0001] This utility model relates to the field of chip wire bonding machine technology, specifically a high-precision wire bonding machine for chips. Background Technology

[0002] In the current era of rapid development in the semiconductor industry, wire bonding machines, as key packaging equipment, are responsible for connecting the internal circuitry of a chip to its external pins via metal wires. This is a core component in achieving the electrical performance of a chip. Wire bonding machines are constantly being upgraded to achieve higher precision, higher speed, and compatibility with multiple wire diameters, becoming an important piece of equipment to ensure the mass production and performance of chips.

[0003] Existing wire bonding machines, as key packaging equipment, precisely bond metal wires to chip pads and substrates using ultrasonic thermocompression or thermosonic technology to achieve electrical interconnection and signal transmission. However, existing wire bonding machines require loading and unloading of the substrate and chip before and after bonding, necessitating machine downtime, which reduces bonding efficiency. To address these shortcomings, this invention provides a high-precision wire bonding machine for chips, resolving the aforementioned problems. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a chip wire bonding machine that solves the problem that existing chip wire bonding machines require loading and unloading of substrates and chips before and after wire bonding, and that the machine needs to be stopped during the loading and unloading process, which reduces the efficiency of chip wire bonding.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a high-precision wire bonding machine for chips. It includes:

[0006] Support base;

[0007] The guide rail body is mounted on the support base;

[0008] The template body is slidably connected to the guide rail body, and a fixing frame is provided on the template body;

[0009] The drive unit includes a servo motor disposed in the support base, the output end of the servo motor is fixedly connected to a threaded rod, the bottom of the guide rail body is fixedly connected to an adjusting rod, the adjusting rod is threadedly connected to the threaded rod, and the drive unit is used to drive the guide rail body;

[0010] The wire bonding unit is mounted on the support base.

[0011] Preferably, a protective frame is fixedly connected to the back of the support base, a cavity is provided inside the support base, the servo motor is disposed in the cavity, and a control panel is provided on the support base.

[0012] Preferably, the wire bonding unit includes:

[0013] The robotic arm is housed within a protective frame;

[0014] The material handling box is fixedly connected to the robotic arm;

[0015] The welding head is located at one end of the robotic arm;

[0016] A high-resolution camera is mounted on the side of the welding head.

[0017] Preferably, the template body is provided with a card slot.

[0018] Preferably, a hydraulic rod is provided inside the cavity, and a T-shaped adjusting plate is fixedly connected to the output end of the hydraulic rod. Limiting mechanisms are fixedly connected to both ends of the T-shaped adjusting plate, and the limiting mechanisms are engaged with the slots.

[0019] Preferably, a connector is fixedly connected between the fixed frame and the support base.

[0020] Preferably, a connecting rod is fixedly connected to the bottom of the guide rail body, and the connecting rod is slidably connected to the support base.

[0021] Its beneficial effects are as follows:

[0022] This high-precision wire bonding machine for chips adopts a structure with a drive unit at the bottom of the guide rail body. The drive unit facilitates the lifting and lowering of the guide rail body, making it easier to bond the chip placed inside the template body to the substrate. At the same time, it works in conjunction with the limiting mechanism to facilitate the transfer of the template body. On the one hand, it can replace the template body without stopping the machine, and on the other hand, it effectively avoids the wires at the second bonding point from connecting to the substrate, thus avoiding poor reliability or electrical performance. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0025] Figure 2 This is a schematic diagram of the connector structure of this utility model;

[0026] Figure 3 This is a schematic diagram of the drive unit structure of this utility model.

[0027] In the diagram: 1. Support base; 11. Control panel; 12. Protective frame; 13. Cavity; 2. Guide rail body; 21. Connecting rod; 3. Template body; 31. Slot; 4. Connector; 41. Fixing frame; 5. Drive unit; 51. Servo motor; 52. Threaded rod; 53. Adjusting rod; 6. Welding unit; 61. Robotic arm; 62. Material handling box; 63. High-resolution camera; 64. Welding head; 7. Hydraulic rod; 71. T-shaped adjusting plate; 72. Limiting mechanism. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions in the embodiments of this utility model are described clearly and completely. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0029] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0030] This utility model discloses a high-precision wire bonding machine for chips, according to the appendix. Figure 1 As shown, it includes:

[0031] Support base 1, which serves as the basic support structure for the entire high-precision wire bonding machine, provides installation positions for other components and ensures the overall stability of the equipment;

[0032] The guide rail body 2 is set on the support base 1 and provides a sliding track for the template body 3, so that the template body 3 can move linearly on it to realize the positioning of the chip at different positions to meet the needs of wire bonding operation.

[0033] The template body 3 is slidably connected to the guide rail body 2. The template body 3 is provided with a fixing frame 41 and a limiting mechanism 72. The template body 3 is used to place the chip. The fixing frame 41 on it is fixedly connected to the support base 1 through a connector 4, which can help fix the chip position.

[0034] The wire bonding unit 6 is mounted on the support base 1.

[0035] According to the appendix Figure 2 As shown, a protective frame 12 is fixedly connected to the back of the support base 1, a cavity 13 is provided inside the support base 1, the servo motor 51 is located in the cavity 13, and a control panel 11 is provided on the support base 1.

[0036] The template body 3 is provided with a card slot 31.

[0037] A hydraulic rod 7 is installed inside the cavity 13. A T-shaped adjusting plate 71 is fixedly connected to the output end of the hydraulic rod 7. A limiting mechanism 72 is fixedly connected to both ends of the T-shaped adjusting plate 71. The limiting mechanism 72 is engaged with the slot 31.

[0038] A connector 4 is fixedly connected between the fixed frame 41 and the support base 1.

[0039] According to the appendix Figure 3 As shown, the drive unit 5 further includes a servo motor 51 disposed in the support base 1, a threaded rod 52 fixedly connected to the output end of the servo motor 51, an adjusting rod 53 fixedly connected to the bottom of the guide rail body 2, the adjusting rod 53 being threadedly connected to the threaded rod 52, and the drive unit 5 being used to drive the guide rail body 2.

[0040] Wire bonding unit 6 includes:

[0041] The robotic arm 61 is set inside the protective frame 12. The robotic arm 61 facilitates the movement of the welding head 64, the high-resolution camera 63 and the material handling box 62 to a designated position to realize the wire bonding operation function.

[0042] The material handling box 62 is fixedly connected to the robotic arm 61. The material handling box 62 is used to store the materials required for welding, such as welding wire, so that the robotic arm 61 can easily pick up the materials at any time during operation.

[0043] The welding head 64 is located at one end of the robotic arm 61. Based on the positioning information provided by the high-resolution camera 63, the welding head 64 accurately welds the welding wire to the designated position of the chip, thus completing the wire bonding operation.

[0044] A high-resolution camera 63 is located on the side of the soldering head 64. The high-resolution camera 63 is used to acquire high-precision images of the chip and determine the location of the wires to be soldered on the chip through image recognition technology, providing accurate positioning information for the soldering operation and ensuring the accuracy of the soldering.

[0045] A connecting rod 21 is fixedly connected to the bottom of the guide rail body 2, and the connecting rod 21 is slidably connected to the support base 1.

[0046] Working principle: First, the servo motor 51 drives the threaded rod 52 to rotate through the rotation of the output end. The threaded rod 52 is threadedly connected to the adjusting rod 53. When the servo motor 51 drives it to rotate, according to the thread transmission principle, the adjusting rod 53 moves linearly along the threaded rod 52, thereby driving the guide rail body 2 to move. Then, the template body 3 is placed on the guide rail body 2 and located at the bottom of the limiting mechanism 72.

[0047] The robotic arm 61 then begins operation, with its high-resolution camera 63 capturing images of the chip and using image recognition technology to determine the precise location on the chip where wire bonding is required. Based on the positioning information provided by the high-resolution camera 63, the robotic arm 61 adjusts its position and posture, moving the welding head 64 to the wire bonding location on the chip. Simultaneously, the robotic arm 61 retrieves welding wire from the material handling box 62, and the welding head 64 accurately welds the wire to the designated location on the chip. During two-point wire bonding, the drive unit 5 effectively prevents the two welding points from connecting to the substrate, avoiding poor reliability or electrical performance. Finally, the wire bonding operation is completed. The hydraulic rod 7 drives the limiting mechanism 72 to move, which in turn drives the template body 3 to slide within the guide rail body 2, enabling the template body 3 to be replaced without stopping the machine.

[0048] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0049] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A high-precision wire bonder for chips, characterized by, Include: Support base (1); Guide rail body (2), which is provided on the support base (1); Template body (3), which is slidingly connected to the guide rail body (2), and the template body (3) is provided with a fixed frame (41) and a limiting mechanism (72); Drive unit (5), comprising a servo motor (51) provided in the support base (1), the output end of the servo motor (51) being fixedly connected with a threaded rod (52), the bottom of the guide rail body (2) being fixedly connected with an adjusting rod (53), the adjusting rod (53) being threadedly connected with the threaded rod (52), and the drive unit (5) being used for driving the guide rail body (2); Wire welding unit (6), which is provided on the support base (1).

2. The high-precision wire bonder for chips according to claim 1, wherein The back of the support base (1) is fixedly connected with a protection frame (12), the inside of the support base (1) is provided with a cavity (13), the servo motor (51) is provided in the cavity (13), and the support base (1) is provided with a control panel (11).

3. The high-precision wire bonder for chips according to claim 2, wherein The wire welding unit (6) comprises: Mechanical arm (61), which is provided in the protection frame (12); Material processing box (62), which is fixedly connected to the mechanical arm (61); Welding head (64), which is provided at one end of the mechanical arm (61); High-resolution camera (63), which is provided on the side of the welding head (64).

4. The high-precision wire bonder for chips according to claim 2, wherein The template body (3) is provided with a clamping groove (31).

5. The high-precision wire bonder for chips according to claim 4, wherein The cavity (13) is provided with a hydraulic rod (7), the output end of the hydraulic rod (7) is fixedly connected with a T-shaped adjusting plate (71), the limiting mechanism (72) is fixedly connected to both ends of the T-shaped adjusting plate (71), and the limiting mechanism (72) is clamped with the clamping groove (31).

6. The high-precision wire bonder for chips according to claim 1, wherein The fixed frame (41) and the support base (1) are fixedly connected with a connecting piece (4).

7. The high-precision wire bonder for chips according to claim 1, wherein The bottom of the guide rail body (2) is fixedly connected with a connecting rod (21), and the connecting rod (21) is slidingly connected in the support base (1).

Images