A CQFP ceramic housing with a high-density double-sided adhesive-bonded cover plate
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-15
- Publication Date
- 2026-08-14
AI Technical Summary
[0002]传统的金锡盖板金锡封工艺存在显著缺陷：其工艺温度过高，易对封装内部的芯片及键合丝造成热损伤，同时，金锡焊接材料成本昂贵，不利于有效控制产品成本；此外，金属盖板结构更易产生谐振问题，影响器件可靠性；对于高密度陶瓷管壳存在的众多孤岛区域，传统的电镀方式（无论是预先增加电镀线再通过激光蚀刻形成图形，还是采用金丝键合辅助电镀的方法）均会额外增加制造成本和加工周期，而且对产品表面的外观质量也会产生不良影响
本实用新型中，陶瓷盖板胶水粘接的方式采用热压工艺，温度远低于金锡封接的温度，且环氧树脂胶水的价格远低于金锡焊料，有利于低成本实现批量生产。陶瓷盖板不会产生谐振，有利于信号传输。
Smart Images
Figure CN224638444U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of packaging technology, and in particular to a CQFP ceramic housing with a high-density double-sided adhesive-bonded cover plate. Background Technology
[0002] Traditional gold-tin sealing processes with gold-tin covers have significant drawbacks: the process temperature is too high, easily causing thermal damage to the chip and bonding wires inside the package; at the same time, the cost of gold-tin soldering materials is expensive, hindering effective cost control; furthermore, the metal cover structure is more prone to resonance problems, affecting device reliability; for the numerous isolated areas in high-density ceramic housings, traditional electroplating methods (whether pre-adding electroplating lines followed by laser etching to form patterns, or using gold wire bonding to assist electroplating) all increase manufacturing costs and processing time, and also adversely affect the surface appearance quality of the product. Therefore, this paper proposes a CQFP ceramic housing using double-sided adhesive to bond the cover. Utility Model Content
[0003] The purpose of this invention is to provide a CQFP ceramic housing with a high-density double-sided adhesive-bonded cover plate to solve the above-mentioned technical problems.
[0004] To solve the above-mentioned technical problems, this utility model adopts the following technical solution: A CQFP ceramic housing with a high-density double-sided adhesive-bonded cover plate includes an alumina ceramic tube shell, leads welded around the alumina ceramic tube shell, and a first ceramic cover plate and a second ceramic cover plate on both sides of the alumina ceramic tube shell. The first ceramic cover plate has a first epoxy resin layer pre-placed on it and is fixed to one side of the alumina ceramic tube shell by hot pressing. The second ceramic cover plate has a second epoxy resin layer pre-placed on one side and is coated with glue on the opposite side. The glue fixes the second ceramic cover plate to the other side of the alumina ceramic tube shell.
[0005] Preferably, one end of the alumina ceramic tube shell has a groove, and the second ceramic cover plate is fixed in the groove.
[0006] Preferably, the side of the second ceramic cover plate pre-attached with the second epoxy resin adhesive layer faces outward.
[0007] Preferably, the first epoxy resin adhesive layer and the second epoxy resin adhesive layer are in a cured state before hot pressing.
[0008] The beneficial effects of this utility model are: In this invention, the ceramic cover plate is bonded using a hot-pressing process, at a temperature far lower than that of gold-tin bonding. Furthermore, the price of epoxy resin adhesive is significantly lower than that of gold-tin solder, facilitating low-cost mass production. The ceramic cover plate does not generate resonance, which is beneficial for signal transmission. Attached Figure Description
[0009] Figure 1 A schematic diagram of the structure of a CQFP ceramic shell with a cover plate bonded by high-density double-sided adhesive. Figure 2 for Figure 1 The diagram shown is a structural illustration from a bottom view. Figure 3 for Figure 1 The diagram shows the structure after removing the first ceramic cover plate and the first epoxy resin adhesive layer. Figure 4 for Figure 2 The diagram shows the structure after the second ceramic cover plate and the second epoxy resin adhesive layer have been removed. Figure 5 for Figure 1 A breakdown diagram of the structure shown; Reference numerals in the attached drawings: 1. Alumina ceramic tube shell; 2. First ceramic cover plate; 3. Lead wire; 4. Second ceramic cover plate; 5. Groove; 6. First epoxy resin adhesive layer; 7. Adhesive; 8. Second epoxy resin adhesive layer. Detailed Implementation
[0010] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this utility model.
[0011] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
[0012] The specific embodiments of this utility model are described below with reference to the accompanying drawings.
[0013] Example 1 This embodiment presents a CQFP ceramic housing with a cover plate bonded by high-density double-sided adhesive. Please refer to [link / reference]. Figures 1-5The device includes an alumina ceramic shell 1, lead wires 3 welded around the alumina ceramic shell 1, and a first ceramic cover plate 2 and a second ceramic cover plate 4 on both sides. The first ceramic cover plate 2 is hot-pressed to one side of the alumina ceramic shell 1 using a pre-cured first epoxy resin adhesive layer 6. The second ceramic cover plate 4 has a pre-cured second epoxy resin adhesive layer 8 on its outer side and is coated with adhesive 7 on its opposite side, using the adhesive 7 to fix the second ceramic cover plate 4 into a groove 5 at the other end of the alumina ceramic shell 1. In this embodiment, the alumina ceramic shell 1 uses alumina HTCC green ceramic sheet, which undergoes drilling, filling, printing, and cavity creation to achieve the electrical connection and shape of the product. The first ceramic cover plate 2 and the second ceramic cover plate 4 use alumina ceramic with the same coefficient of thermal expansion as the alumina ceramic shell 1, and undergo printing, cavity creation, lamination, green cutting, and sintering to achieve the required cavity structure for the cover plate.
[0014] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0015] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.
Claims
1. A CQFP ceramic housing with a cover plate bonded by high-density double-sided adhesive, characterized in that: The device includes an alumina ceramic tube shell, lead wires welded around the alumina ceramic tube shell, and a first ceramic cover plate and a second ceramic cover plate on both sides of the alumina ceramic tube shell. The first ceramic cover plate has a first epoxy resin layer pre-placed on it and is fixed to one side of the alumina ceramic tube shell by hot pressing. The second ceramic cover plate has a second epoxy resin layer pre-placed on one side and is coated with glue on the opposite side. The glue fixes the second ceramic cover plate to the other side of the alumina ceramic tube shell.
2. The CQFP ceramic package with high density double sided adhesive cover plate according to claim 1, wherein: One end of the alumina ceramic tube shell has a groove, and the second ceramic cover plate is fixed in the groove.
3. The CQFP ceramic package with high density double sided adhesive cover plate according to claim 1, wherein: The side of the second ceramic cover plate with the pre-installed second epoxy resin adhesive layer faces outwards.
4. The CQFP ceramic package with high density double sided adhesive cover plate according to claim 3, wherein: The first and second epoxy resin adhesive layers are in a cured state before hot pressing.